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TWI263685B - Copper alloy with high strength and high conductivity - Google Patents

Copper alloy with high strength and high conductivity

Info

Publication number
TWI263685B
TWI263685B TW093119003A TW93119003A TWI263685B TW I263685 B TWI263685 B TW I263685B TW 093119003 A TW093119003 A TW 093119003A TW 93119003 A TW93119003 A TW 93119003A TW I263685 B TWI263685 B TW I263685B
Authority
TW
Taiwan
Prior art keywords
copper alloy
high strength
high conductivity
strength
conductivity
Prior art date
Application number
TW093119003A
Other languages
Chinese (zh)
Other versions
TW200504229A (en
Inventor
Kazuki Kan
Kazuhiko Fukamachi
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of TW200504229A publication Critical patent/TW200504229A/en
Application granted granted Critical
Publication of TWI263685B publication Critical patent/TWI263685B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2200/00—Crystalline structure
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2202/00—Physical properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

The present invention provides a copper alloy with high strength and high conductivity that has excellent strength and processing properties and is easy to be produced and managed. The invented copper alloy with high strength and high conductivity includes, based on mass%, 0.05 to 1.0% of Cr, 0.05 to 0.25% of Zr, the balance of Cu, and unavoidable impurities, which is characterized in that the ratio of the corresponding grain field Sigma3 to the crystal grain field (in which the difference in orientation for adjacent crystals is larger than 5 degrees) is more than 10%.
TW093119003A 2003-07-09 2004-06-29 Copper alloy with high strength and high conductivity TWI263685B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003272240A JP4087307B2 (en) 2003-07-09 2003-07-09 High strength and high conductivity copper alloy with excellent ductility

Publications (2)

Publication Number Publication Date
TW200504229A TW200504229A (en) 2005-02-01
TWI263685B true TWI263685B (en) 2006-10-11

Family

ID=34209858

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119003A TWI263685B (en) 2003-07-09 2004-06-29 Copper alloy with high strength and high conductivity

Country Status (4)

Country Link
JP (1) JP4087307B2 (en)
KR (1) KR100592205B1 (en)
CN (1) CN100363518C (en)
TW (1) TWI263685B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8715431B2 (en) 2004-08-17 2014-05-06 Kobe Steel, Ltd. Copper alloy plate for electric and electronic parts having bending workability
EP2339038B8 (en) 2006-07-21 2017-01-11 Kabushiki Kaisha Kobe Seiko Sho Copper alloy sheet for electric and electronic part
CN101743333A (en) 2007-08-07 2010-06-16 株式会社神户制钢所 copper alloy sheet
CN101548345A (en) * 2007-08-14 2009-09-30 住友电气工业株式会社 Superconducting tape and its manufacturing method
JP2008088558A (en) * 2007-10-17 2008-04-17 Nikko Kinzoku Kk High-strength and high-conductivity copper alloy with excellent ductility
JP4630323B2 (en) 2007-10-23 2011-02-09 株式会社コベルコ マテリアル銅管 Copper alloy tube for heat exchangers with excellent fracture strength
JP4968533B2 (en) * 2007-11-30 2012-07-04 日立電線株式会社 Copper alloy material for electrical and electronic parts
KR101249107B1 (en) * 2008-03-31 2013-03-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Cu-ni-si alloy to be used in electrically conductive spring material
US8876990B2 (en) 2009-08-20 2014-11-04 Massachusetts Institute Of Technology Thermo-mechanical process to enhance the quality of grain boundary networks
JP4563508B1 (en) * 2010-02-24 2010-10-13 三菱伸銅株式会社 Cu-Mg-P-based copper alloy strip and method for producing the same
CN101818283B (en) * 2010-02-25 2011-12-14 长沙中工新材料有限公司 Copper alloy conducting bar and end ring for high-power frequency-adjustable speed-adjustable asynchronous traction motor and preparation method thereof
US9666325B2 (en) 2011-03-31 2017-05-30 Tohoku University Copper alloy and method of manufacturing copper alloy
TWI571518B (en) * 2011-08-29 2017-02-21 Furukawa Electric Co Ltd Copper alloy material and manufacturing method thereof
JP5869288B2 (en) * 2011-10-14 2016-02-24 三菱伸銅株式会社 Modified cross-section copper alloy sheet with excellent bending workability and low anisotropy and method for producing the same
JP5802150B2 (en) 2012-02-24 2015-10-28 株式会社神戸製鋼所 Copper alloy
JP6736869B2 (en) * 2015-11-09 2020-08-05 三菱マテリアル株式会社 Copper alloy material
CN107046768B (en) * 2016-02-05 2019-12-31 Ｊｘ金属株式会社 Copper foil for flexible printed circuit boards, copper clad laminates using the same, flexible printed circuit boards, and electronic devices
CN107828985A (en) * 2017-11-30 2018-03-23 江西理工大学 Cu Cr Zr Ni Al copper alloys, wire rod and preparation method thereof
JP6900137B1 (en) * 2020-01-14 2021-07-07 古河電気工業株式会社 Copper alloy plate material and its manufacturing method, and members for electrical and electronic parts
CN111621666B (en) * 2020-06-22 2021-05-07 陕西斯瑞新材料股份有限公司 Rolling method of Cu-Cr series alloy plate strip

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122108B2 (en) * 1991-08-21 1995-12-25 日鉱金属株式会社 High-strength and high-conductivity copper alloy for electronic devices with excellent bendability and stress relaxation properties
KR0175968B1 (en) * 1994-03-22 1999-02-18 코오노 히로노리 Copper alloy suited for electrical components and high strength electric conductivity
KR100513943B1 (en) * 2001-03-27 2005-09-09 닛꼬 긴조꾸 가꼬 가부시키가이샤 Copper and copper alloy, and method for production of the same

Also Published As

Publication number Publication date
TW200504229A (en) 2005-02-01
KR100592205B1 (en) 2006-06-26
CN100363518C (en) 2008-01-23
JP2005029857A (en) 2005-02-03
KR20050007139A (en) 2005-01-17
JP4087307B2 (en) 2008-05-21
CN1598021A (en) 2005-03-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees