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WO2009022724A1 - Composition de résine photosensible et stratifié de celle-ci - Google Patents

Composition de résine photosensible et stratifié de celle-ci Download PDF

Info

Publication number
WO2009022724A1
WO2009022724A1 PCT/JP2008/064585 JP2008064585W WO2009022724A1 WO 2009022724 A1 WO2009022724 A1 WO 2009022724A1 JP 2008064585 W JP2008064585 W JP 2008064585W WO 2009022724 A1 WO2009022724 A1 WO 2009022724A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
mass
laminate
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/064585
Other languages
English (en)
Japanese (ja)
Inventor
Yukimasa Baba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei E Materials Corp
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp, Asahi Kasei EMD Corp filed Critical Asahi Kasei E Materials Corp
Priority to JP2009528148A priority Critical patent/JP5221543B2/ja
Priority to KR1020107002027A priority patent/KR101167537B1/ko
Priority to CN200880102779.0A priority patent/CN101779165B/zh
Publication of WO2009022724A1 publication Critical patent/WO2009022724A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une composition de résine photosensible contenant 20 à 90 % en masse d'un polymère alcalino-soluble (a) contenant un acide carboxylique et ayant un poids équivalent d'acide de 100 à 600 et un poids moléculaire moyen en poids de 5000 à 500 000, 5 à 70 % en masse d'un monomère polymérisable d'addition éthyléniquement insaturé spécifique (b), et 0,01 à 30 % en masse d'un initiateur de photopolymérisation (c).
PCT/JP2008/064585 2007-08-15 2008-08-14 Composition de résine photosensible et stratifié de celle-ci Ceased WO2009022724A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009528148A JP5221543B2 (ja) 2007-08-15 2008-08-14 感光性樹脂組成物及びその積層体
KR1020107002027A KR101167537B1 (ko) 2007-08-15 2008-08-14 감광성 수지 조성물 및 그 적층체
CN200880102779.0A CN101779165B (zh) 2007-08-15 2008-08-14 感光性树脂组合物及其层压体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-211622 2007-08-15
JP2007211622 2007-08-15

Publications (1)

Publication Number Publication Date
WO2009022724A1 true WO2009022724A1 (fr) 2009-02-19

Family

ID=40350777

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064585 Ceased WO2009022724A1 (fr) 2007-08-15 2008-08-14 Composition de résine photosensible et stratifié de celle-ci

Country Status (5)

Country Link
JP (1) JP5221543B2 (fr)
KR (1) KR101167537B1 (fr)
CN (1) CN101779165B (fr)
TW (1) TWI380130B (fr)
WO (1) WO2009022724A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013068936A (ja) * 2011-09-06 2013-04-18 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
JP2013117581A (ja) * 2011-12-01 2013-06-13 Asahi Kasei E-Materials Corp 感光性樹脂組成物
CN103282829A (zh) * 2010-12-24 2013-09-04 旭化成电子材料株式会社 感光性树脂组合物
JP2015135482A (ja) * 2013-12-20 2015-07-27 旭化成イーマテリアルズ株式会社 感光性エレメント、及びその製造方法
KR20180019678A (ko) 2015-08-25 2018-02-26 아사히 가세이 가부시키가이샤 감광성 수지 조성물
WO2018225748A1 (fr) * 2017-06-08 2018-12-13 Jsr株式会社 Composition, procédé de fabrication de film durci, et composant électronique
KR20190105142A (ko) 2015-09-11 2019-09-11 아사히 가세이 가부시키가이샤 감광성 수지 조성물

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2947016B2 (ja) 1993-04-09 1999-09-13 豊田合成株式会社 樹脂製品及びその製造方法
CN103064253B (zh) * 2012-12-05 2015-04-08 北京化工大学常州先进材料研究院 一种含有吖啶类氧化物的感光性组合物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002323761A (ja) * 2001-04-26 2002-11-08 Asahi Kasei Corp 感光性樹脂積層体
JP2006208734A (ja) * 2005-01-27 2006-08-10 Fuji Photo Film Co Ltd パターン形成方法
JP2007101940A (ja) * 2005-10-05 2007-04-19 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
WO2007129589A1 (fr) * 2006-05-09 2007-11-15 Asahi Kasei Emd Corporation Composition de resine photosensible
JP2007304536A (ja) * 2006-04-13 2007-11-22 Hitachi Chem Co Ltd 感光性樹脂組成物
JP2008020629A (ja) * 2006-07-12 2008-01-31 Fujifilm Corp パターン形成材料、並びに、パターン形成装置及びパターン形成方法
WO2008015983A1 (fr) * 2006-08-03 2008-02-07 Asahi Kasei Emd Corporation Composition de résine photosensible et stratifié

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070269738A1 (en) * 2004-07-30 2007-11-22 Hitachi Chemical Company, Ltd. Photosensitive Film, Photosensitive Film Laminate and Photosensitive Film Roll

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002323761A (ja) * 2001-04-26 2002-11-08 Asahi Kasei Corp 感光性樹脂積層体
JP2006208734A (ja) * 2005-01-27 2006-08-10 Fuji Photo Film Co Ltd パターン形成方法
JP2007101940A (ja) * 2005-10-05 2007-04-19 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
JP2007304536A (ja) * 2006-04-13 2007-11-22 Hitachi Chem Co Ltd 感光性樹脂組成物
WO2007129589A1 (fr) * 2006-05-09 2007-11-15 Asahi Kasei Emd Corporation Composition de resine photosensible
JP2008020629A (ja) * 2006-07-12 2008-01-31 Fujifilm Corp パターン形成材料、並びに、パターン形成装置及びパターン形成方法
WO2008015983A1 (fr) * 2006-08-03 2008-02-07 Asahi Kasei Emd Corporation Composition de résine photosensible et stratifié

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103282829A (zh) * 2010-12-24 2013-09-04 旭化成电子材料株式会社 感光性树脂组合物
CN103282829B (zh) * 2010-12-24 2016-08-17 旭化成株式会社 感光性树脂组合物
JP2013068936A (ja) * 2011-09-06 2013-04-18 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
JP2013117581A (ja) * 2011-12-01 2013-06-13 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2015135482A (ja) * 2013-12-20 2015-07-27 旭化成イーマテリアルズ株式会社 感光性エレメント、及びその製造方法
KR20180019678A (ko) 2015-08-25 2018-02-26 아사히 가세이 가부시키가이샤 감광성 수지 조성물
KR20190105142A (ko) 2015-09-11 2019-09-11 아사히 가세이 가부시키가이샤 감광성 수지 조성물
KR20220127382A (ko) 2015-09-11 2022-09-19 아사히 가세이 가부시키가이샤 감광성 수지 조성물
WO2018225748A1 (fr) * 2017-06-08 2018-12-13 Jsr株式会社 Composition, procédé de fabrication de film durci, et composant électronique

Also Published As

Publication number Publication date
KR101167537B1 (ko) 2012-07-20
JP5221543B2 (ja) 2013-06-26
JPWO2009022724A1 (ja) 2010-11-18
CN101779165B (zh) 2014-09-24
CN101779165A (zh) 2010-07-14
TW200921275A (en) 2009-05-16
KR20100027240A (ko) 2010-03-10
TWI380130B (en) 2012-12-21

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