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WO2009047990A1 - 脆性材料基板、および、脆性材料基板のレーザスクライブ方法、レーザスクライブ装置 - Google Patents

脆性材料基板、および、脆性材料基板のレーザスクライブ方法、レーザスクライブ装置 Download PDF

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Publication number
WO2009047990A1
WO2009047990A1 PCT/JP2008/067486 JP2008067486W WO2009047990A1 WO 2009047990 A1 WO2009047990 A1 WO 2009047990A1 JP 2008067486 W JP2008067486 W JP 2008067486W WO 2009047990 A1 WO2009047990 A1 WO 2009047990A1
Authority
WO
WIPO (PCT)
Prior art keywords
scribe
material substrate
fragile material
laser scribe
scheduled line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067486
Other languages
English (en)
French (fr)
Inventor
Koji Yamamoto
Norifumi Arima
Togo Gonoe
Toru Kumagai
Shuichi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2009536970A priority Critical patent/JP5171838B2/ja
Priority to CN2008801110707A priority patent/CN101821071B/zh
Publication of WO2009047990A1 publication Critical patent/WO2009047990A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

　スクライブ予定ラインに沿って直進性の優れたスクライブラインを形成する方法を提供する。 　スクライブ予定ラインの左右両側近傍の基板状態が相違することによりビームスポットが走査されるときのスクライブ予定ラインの左右両側の熱分布が非対称になる領域に対してレーザビーム照射機構を相対移動する際に、スクライブ予定ラインを中心とする熱分布が左右対称になるようにするための照射面積調整手段４４ｂを、レーザビーム照射機構または基板のいずれかに取り付けた状態で前記レーザビーム照射機構を相対移動させる。
PCT/JP2008/067486 2007-10-11 2008-09-26 脆性材料基板、および、脆性材料基板のレーザスクライブ方法、レーザスクライブ装置 Ceased WO2009047990A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009536970A JP5171838B2 (ja) 2007-10-11 2008-09-26 脆性材料基板のレーザスクライブ方法
CN2008801110707A CN101821071B (zh) 2007-10-11 2008-09-26 脆性材料基板的激光划线方法及激光划线装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-265572 2007-10-11
JP2007265572 2007-10-11

Publications (1)

Publication Number Publication Date
WO2009047990A1 true WO2009047990A1 (ja) 2009-04-16

Family

ID=40549135

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067486 Ceased WO2009047990A1 (ja) 2007-10-11 2008-09-26 脆性材料基板、および、脆性材料基板のレーザスクライブ方法、レーザスクライブ装置

Country Status (5)

Country Link
JP (1) JP5171838B2 (ja)
KR (1) KR101211021B1 (ja)
CN (1) CN101821071B (ja)
TW (1) TWI462792B (ja)
WO (1) WO2009047990A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012031035A (ja) * 2010-08-02 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
JP2014044987A (ja) * 2012-08-24 2014-03-13 Fujitsu Semiconductor Ltd ダイシング方法及びダイシング装置
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
US9755190B2 (en) 2013-04-16 2017-09-05 Samsung Display Co., Ltd. Laser-induced thermal imaging apparatus, method of laser-induced thermal imaging, and manufacturing method of organic light-emitting display apparatus using the method
JP2019169685A (ja) * 2018-03-26 2019-10-03 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
CN115709338A (zh) * 2021-08-23 2023-02-24 广东聚华印刷显示技术有限公司 激光扫描平台以及激光剥离基板的方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
JP6233407B2 (ja) * 2013-03-26 2017-11-22 旭硝子株式会社 ガラス板の加工方法、およびガラス板の加工装置
KR102546692B1 (ko) 2015-03-24 2023-06-22 코닝 인코포레이티드 디스플레이 유리 조성물의 레이저 절단 및 가공
KR102427574B1 (ko) * 2016-01-22 2022-07-29 주식회사 포스코 방향성 전기강판의 자구미세화 방법과 그 장치
CN113399816B (zh) * 2016-09-30 2023-05-16 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
CN107132659B (zh) * 2017-06-29 2020-02-21 联想(北京)有限公司 一种激光光束层产生方法及装置
TWI681241B (zh) * 2018-12-04 2020-01-01 友達光電股份有限公司 顯示裝置製作方法及使用該方法製作的顯示裝置
TW202035321A (zh) * 2019-01-29 2020-10-01 美商康寧公司 用於撓性薄玻璃的自由形式切割的方法及設備
CN112008232A (zh) * 2020-08-11 2020-12-01 华东师范大学 一种覆有ito薄膜的玻璃表面制备周期条纹结构的方法及装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117921A (ja) * 2001-09-29 2003-04-23 Samsung Electronics Co Ltd 非金属基板切断方法
JP2005186100A (ja) * 2003-12-25 2005-07-14 V Technology Co Ltd レーザ加工装置
JP2006143506A (ja) * 2004-11-18 2006-06-08 Sanyo Electric Co Ltd ガラス基板の切断方法
JP2008031021A (ja) * 2006-07-31 2008-02-14 Optrex Corp 基板の切断方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3437760B2 (ja) 1998-03-31 2003-08-18 大崎電気工業株式会社 光ファイバーデバイス保持装置及びその製造方法
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
CN101043992B (zh) * 2004-10-01 2011-03-23 三星钻石工业股份有限公司 脆性材料的划线方法以及划线装置
JP2008044823A (ja) * 2006-08-18 2008-02-28 Seiko Epson Corp 基板の分断方法、電気光学装置の製造方法及びレーザスクライブ装置
JP2008168328A (ja) * 2007-01-15 2008-07-24 Seiko Epson Corp レーザスクライブ装置、基板の分断方法及び電気光学装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117921A (ja) * 2001-09-29 2003-04-23 Samsung Electronics Co Ltd 非金属基板切断方法
JP2005186100A (ja) * 2003-12-25 2005-07-14 V Technology Co Ltd レーザ加工装置
JP2006143506A (ja) * 2004-11-18 2006-06-08 Sanyo Electric Co Ltd ガラス基板の切断方法
JP2008031021A (ja) * 2006-07-31 2008-02-14 Optrex Corp 基板の切断方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012031035A (ja) * 2010-08-02 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP2014044987A (ja) * 2012-08-24 2014-03-13 Fujitsu Semiconductor Ltd ダイシング方法及びダイシング装置
US9755190B2 (en) 2013-04-16 2017-09-05 Samsung Display Co., Ltd. Laser-induced thermal imaging apparatus, method of laser-induced thermal imaging, and manufacturing method of organic light-emitting display apparatus using the method
JP2019169685A (ja) * 2018-03-26 2019-10-03 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
JP7138297B2 (ja) 2018-03-26 2022-09-16 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
CN115709338A (zh) * 2021-08-23 2023-02-24 广东聚华印刷显示技术有限公司 激光扫描平台以及激光剥离基板的方法

Also Published As

Publication number Publication date
KR20100065362A (ko) 2010-06-16
CN101821071B (zh) 2012-10-03
TW200936289A (en) 2009-09-01
TWI462792B (zh) 2014-12-01
JPWO2009047990A1 (ja) 2011-02-17
CN101821071A (zh) 2010-09-01
JP5171838B2 (ja) 2013-03-27
KR101211021B1 (ko) 2012-12-11

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