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TW200602279A - Scribing apparatus and scribing method employing scribing apparatus - Google Patents

Scribing apparatus and scribing method employing scribing apparatus

Info

Publication number
TW200602279A
TW200602279A TW094102891A TW94102891A TW200602279A TW 200602279 A TW200602279 A TW 200602279A TW 094102891 A TW094102891 A TW 094102891A TW 94102891 A TW94102891 A TW 94102891A TW 200602279 A TW200602279 A TW 200602279A
Authority
TW
Taiwan
Prior art keywords
scribing
substrate
planed
scribe
line
Prior art date
Application number
TW094102891A
Other languages
Chinese (zh)
Other versions
TWI344947B (en
Inventor
Takeki Nishisaka
Koji Yamamoto
Masato Matsumoto
Noboru Hanesaka
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200602279A publication Critical patent/TW200602279A/en
Application granted granted Critical
Publication of TWI344947B publication Critical patent/TWI344947B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Liquid Crystal (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)

Abstract

This invention is to provide a scribing apparatus capable of forming a stable scribing line rising a scribing speed under keeping a depth of a blind crack. The scribing apparatus is the one for forming cracks along a planed scribe forming line on which a scribe line is formed on the surface of a substrate and is provided with a means of irradiating for continuously irradiating under relatively moving a laser beam to the substrate so as a beam spot with a lower temperature than a softening temperature of the substrate to be formed and a means of cooling for cooling vicinity of a region of the surface of the substrate heated by the irradiation means and the irradiation means irradiates the laser beam of which the beam spot is approximately rectangular and the longitudinal axis is parallel to the planed scribe forming line so that the planed scribe forming line should be positioned at an approximate center of the width in the direction perpendicularly crossing to the planed scribe forming line to the substrate.
TW094102891A 2004-02-02 2005-01-31 Scribing apparatus and scribing method employing scribing apparatus TW200602279A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004059787A JP4615231B2 (en) 2004-02-02 2004-02-02 Scribing apparatus and scribing method using the apparatus

Publications (2)

Publication Number Publication Date
TW200602279A true TW200602279A (en) 2006-01-16
TWI344947B TWI344947B (en) 2011-07-11

Family

ID=34909178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102891A TW200602279A (en) 2004-02-02 2005-01-31 Scribing apparatus and scribing method employing scribing apparatus

Country Status (2)

Country Link
JP (1) JP4615231B2 (en)
TW (1) TW200602279A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406828B (en) * 2007-09-27 2013-09-01 Mitsuboshi Diamond Ind Co Ltd Method for processing brittle material substrates
CN115697621A (en) * 2020-05-28 2023-02-03 通快机床欧洲股份公司 Laser cutting method and laser cutting equipment

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8624157B2 (en) * 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
JP5185557B2 (en) * 2007-03-30 2013-04-17 三菱重工業株式会社 Equipment for improving residual stress in pipes
US20090085254A1 (en) * 2007-09-28 2009-04-02 Anatoli Anatolyevich Abramov Laser scoring with flat profile beam
JP5074272B2 (en) * 2008-04-15 2012-11-14 株式会社リンクスタージャパン Processing apparatus and cutting method for brittle material substrate
JP5220465B2 (en) * 2008-04-15 2013-06-26 株式会社リンクスタージャパン Processing apparatus and processing method for brittle material substrate
US9302346B2 (en) * 2009-03-20 2016-04-05 Corning, Incorporated Precision laser scoring
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (en) 2010-08-31 2015-12-21 Corning Inc Methods of separating strengthened glass substrates
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
CN106830658B (en) * 2016-12-26 2019-04-16 上海科弦精密工具有限公司 A kind of plane mirror cutter
CN112123591B (en) * 2020-09-11 2022-06-14 湖北华恒景利建材有限公司 Evaporate and press aerated concrete block end skin resection device
CN114454240B (en) * 2022-04-11 2022-06-17 中国空气动力研究与发展中心高速空气动力研究所 Scribing device and scribing method for shock tube diaphragm

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JPS62104692A (en) * 1985-11-01 1987-05-15 Fuji Electric Corp Res & Dev Ltd Laser beam device
JPH0390826A (en) * 1989-09-04 1991-04-16 Toshiba Corp Laser beam measuring and monitoring device
JP2520052B2 (en) * 1990-04-19 1996-07-31 松下電工株式会社 Energy beam joining method
JPH079177A (en) * 1993-06-25 1995-01-13 Honda Motor Co Ltd Laser beam shaping equipment
JPH09155851A (en) * 1995-12-07 1997-06-17 Sumitomo Heavy Ind Ltd Fine ceramic machining apparatus
JPH1058177A (en) * 1996-08-20 1998-03-03 Sony Corp Laser processing machine
US6635849B1 (en) * 1999-03-05 2003-10-21 Mitsubishi Denki Kabushiki Kaisha Laser beam machine for micro-hole machining
JP4112745B2 (en) * 1999-06-02 2008-07-02 松下電器産業株式会社 Laser line patterning method
JP2001209003A (en) * 2000-01-26 2001-08-03 Mitsubishi Heavy Ind Ltd Laser beam machining device
JP2003112281A (en) * 2001-09-28 2003-04-15 Matsushita Electric Ind Co Ltd Laser processing equipment and production equipment using it
JP4408607B2 (en) * 2002-06-11 2010-02-03 三星ダイヤモンド工業株式会社 Scribing method and scribing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406828B (en) * 2007-09-27 2013-09-01 Mitsuboshi Diamond Ind Co Ltd Method for processing brittle material substrates
CN115697621A (en) * 2020-05-28 2023-02-03 通快机床欧洲股份公司 Laser cutting method and laser cutting equipment

Also Published As

Publication number Publication date
JP4615231B2 (en) 2011-01-19
JP2005212473A (en) 2005-08-11
TWI344947B (en) 2011-07-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees