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WO2009047990A1 - Substrat de matériau fragile, procédé de découpe au laser pour le substrat de matériau fragile et appareil de découpe au laser - Google Patents

Substrat de matériau fragile, procédé de découpe au laser pour le substrat de matériau fragile et appareil de découpe au laser Download PDF

Info

Publication number
WO2009047990A1
WO2009047990A1 PCT/JP2008/067486 JP2008067486W WO2009047990A1 WO 2009047990 A1 WO2009047990 A1 WO 2009047990A1 JP 2008067486 W JP2008067486 W JP 2008067486W WO 2009047990 A1 WO2009047990 A1 WO 2009047990A1
Authority
WO
WIPO (PCT)
Prior art keywords
scribe
material substrate
fragile material
laser scribe
scheduled line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067486
Other languages
English (en)
Japanese (ja)
Inventor
Koji Yamamoto
Norifumi Arima
Togo Gonoe
Toru Kumagai
Shuichi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2009536970A priority Critical patent/JP5171838B2/ja
Priority to CN2008801110707A priority patent/CN101821071B/zh
Publication of WO2009047990A1 publication Critical patent/WO2009047990A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

L'invention porte sur un procédé pour former une ligne de découpe ayant une excellente linéarité le long d'une ligne de découpe prévue. Un mécanisme d'irradiation de faisceau laser est déplacé de façon relative de telle sorte que des moyens de réglage de zone d'irradiation (44b) sont fixés au mécanisme d'irradiation de faisceau laser ou à un substrat. Les moyens de réglage de zone d'irradiation (44b) donnent à la distribution de chaleur le long d'une ligne de découpe prévue une symétrie transversale, lorsque le mécanisme d'irradiation de faisceau laser est déplacé par rapport à la région, et la distribution de chaleur sur les deux côtés transversaux de la ligne de découpe prévue lorsque le point de faisceau effectue un balayage devenant asymétrique du fait de la différence des états de substrat au voisinage des deux côtés transversaux de la ligne prévue de découpe prévue.
PCT/JP2008/067486 2007-10-11 2008-09-26 Substrat de matériau fragile, procédé de découpe au laser pour le substrat de matériau fragile et appareil de découpe au laser Ceased WO2009047990A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009536970A JP5171838B2 (ja) 2007-10-11 2008-09-26 脆性材料基板のレーザスクライブ方法
CN2008801110707A CN101821071B (zh) 2007-10-11 2008-09-26 脆性材料基板的激光划线方法及激光划线装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-265572 2007-10-11
JP2007265572 2007-10-11

Publications (1)

Publication Number Publication Date
WO2009047990A1 true WO2009047990A1 (fr) 2009-04-16

Family

ID=40549135

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067486 Ceased WO2009047990A1 (fr) 2007-10-11 2008-09-26 Substrat de matériau fragile, procédé de découpe au laser pour le substrat de matériau fragile et appareil de découpe au laser

Country Status (5)

Country Link
JP (1) JP5171838B2 (fr)
KR (1) KR101211021B1 (fr)
CN (1) CN101821071B (fr)
TW (1) TWI462792B (fr)
WO (1) WO2009047990A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012031035A (ja) * 2010-08-02 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
JP2014044987A (ja) * 2012-08-24 2014-03-13 Fujitsu Semiconductor Ltd ダイシング方法及びダイシング装置
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
US9755190B2 (en) 2013-04-16 2017-09-05 Samsung Display Co., Ltd. Laser-induced thermal imaging apparatus, method of laser-induced thermal imaging, and manufacturing method of organic light-emitting display apparatus using the method
JP2019169685A (ja) * 2018-03-26 2019-10-03 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
CN115709338A (zh) * 2021-08-23 2023-02-24 广东聚华印刷显示技术有限公司 激光扫描平台以及激光剥离基板的方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2781296B1 (fr) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Dispositif et procédé de découpe de contours à partir de substrats plats au moyen d'un laser
CN105189381B (zh) 2013-03-26 2018-11-13 Ａｇｃ株式会社 玻璃板的加工方法以及玻璃板的加工装置
WO2016154284A1 (fr) 2015-03-24 2016-09-29 Corning Incorporated Découpe au laser de compositions de verre d'affichage
KR102427574B1 (ko) * 2016-01-22 2022-07-29 주식회사 포스코 방향성 전기강판의 자구미세화 방법과 그 장치
JP6923284B2 (ja) * 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
CN107132659B (zh) * 2017-06-29 2020-02-21 联想(北京)有限公司 一种激光光束层产生方法及装置
TWI681241B (zh) * 2018-12-04 2020-01-01 友達光電股份有限公司 顯示裝置製作方法及使用該方法製作的顯示裝置
TW202035321A (zh) * 2019-01-29 2020-10-01 美商康寧公司 用於撓性薄玻璃的自由形式切割的方法及設備
CN112008232A (zh) * 2020-08-11 2020-12-01 华东师范大学 一种覆有ito薄膜的玻璃表面制备周期条纹结构的方法及装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117921A (ja) * 2001-09-29 2003-04-23 Samsung Electronics Co Ltd 非金属基板切断方法
JP2005186100A (ja) * 2003-12-25 2005-07-14 V Technology Co Ltd レーザ加工装置
JP2006143506A (ja) * 2004-11-18 2006-06-08 Sanyo Electric Co Ltd ガラス基板の切断方法
JP2008031021A (ja) * 2006-07-31 2008-02-14 Optrex Corp 基板の切断方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3437760B2 (ja) 1998-03-31 2003-08-18 大崎電気工業株式会社 光ファイバーデバイス保持装置及びその製造方法
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
EP1803538A1 (fr) * 2004-10-01 2007-07-04 Mitsuboshi Diamond Industrial Co., Ltd. Procede de decoupe d un materiau cassant et appareil de decoupe
JP2008044823A (ja) * 2006-08-18 2008-02-28 Seiko Epson Corp 基板の分断方法、電気光学装置の製造方法及びレーザスクライブ装置
JP2008168328A (ja) * 2007-01-15 2008-07-24 Seiko Epson Corp レーザスクライブ装置、基板の分断方法及び電気光学装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117921A (ja) * 2001-09-29 2003-04-23 Samsung Electronics Co Ltd 非金属基板切断方法
JP2005186100A (ja) * 2003-12-25 2005-07-14 V Technology Co Ltd レーザ加工装置
JP2006143506A (ja) * 2004-11-18 2006-06-08 Sanyo Electric Co Ltd ガラス基板の切断方法
JP2008031021A (ja) * 2006-07-31 2008-02-14 Optrex Corp 基板の切断方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012031035A (ja) * 2010-08-02 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP2014044987A (ja) * 2012-08-24 2014-03-13 Fujitsu Semiconductor Ltd ダイシング方法及びダイシング装置
US9755190B2 (en) 2013-04-16 2017-09-05 Samsung Display Co., Ltd. Laser-induced thermal imaging apparatus, method of laser-induced thermal imaging, and manufacturing method of organic light-emitting display apparatus using the method
JP2019169685A (ja) * 2018-03-26 2019-10-03 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
JP7138297B2 (ja) 2018-03-26 2022-09-16 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
CN115709338A (zh) * 2021-08-23 2023-02-24 广东聚华印刷显示技术有限公司 激光扫描平台以及激光剥离基板的方法

Also Published As

Publication number Publication date
JP5171838B2 (ja) 2013-03-27
TW200936289A (en) 2009-09-01
KR101211021B1 (ko) 2012-12-11
CN101821071B (zh) 2012-10-03
KR20100065362A (ko) 2010-06-16
TWI462792B (zh) 2014-12-01
CN101821071A (zh) 2010-09-01
JPWO2009047990A1 (ja) 2011-02-17

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