TW200936289A - Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus - Google Patents

Abstract

Provided is a method for forming a scribe line excellent in linearity along a scribe-scheduled line. A laser beam irradiating mechanism is relatively moved such that irradiation area adjusting means (44b) is attached to the laser beam irradiating mechanism or a substrate. The irradiation area adjusting means (44b) makes the heat distribution along a scribe-scheduled line transversely symmetric, when the laser beam irradiating mechanism is moved relative to the region, in which the heat distribution on the two transverse sides of the scribe-scheduled line when the beam spot is scanned becomes asymmetric due to the difference in the substrate states near the two transverse sides of the scribe-scheduled line.

Description

200936289 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a laser scribing method and a laser scribing method for forming a scribe line by irradiating a laser beam onto a brittle material substrate and then cooling it so that a vertical crack occurs on the substrate A scribing method and a scribing apparatus for irradiating laser light to form an edge of a brittle material substrate in the vicinity of a coating film of a brittle material substrate coated with a coating film such as a transparent conductive film or a brittle material substrate . Here, the brittle material substrate means a glass substrate, a ceramic of a sintered material, a single crystal germanium, a semiconductor wafer, a ceramic substrate, a sapphire substrate, or the like. Further, the brittle material substrate includes a bonding board which is bonded to the substrate in addition to the single board formed of the substrate. [Prior Art] It is known that a brittle substrate such as a glass substrate or a sapphire substrate is used, and a heating point (also referred to as a beam spot) formed on a substrate by irradiation of a laser beam is relatively moved along a predetermined line of a predetermined line on a substrate. A laser scribing method in which a substrate is heated and a cooling point formed by the ejection of the refrigerant is moved as follows the trajectory of the heating point to cool the substrate, thereby forming a scribe line on a predetermined line (refer to, for example, Patent Document 1) . Such laser scribing is based on the formation of a vertical crack based on the compressive stress generated around the heating point and the tensile stress generated around the cooling point. At this time, a scoring (initial crack) is formed on the end surface of the substrate by using a tool such as a scribing wheel before the vertical crack is formed, and then the heating point generated by scanning the laser beam and the cooling point generated by the refrigerant are started by using the scoring as a starting point. Thereby, the vertical cracks which are saturated in the thick direction of the substrate 5 200936289 progress in the direction of the surface of the substrate. Generally, when the laser marking is applied, the shape of the laser beam is rounded and symmetrical (circle, ellipse, long circle, etc.), and the illumination position is positioned so that the center of the beam point is lined by the scribe line before scanning the mine. Shoot the beam. The specific light, in the circle of the circle, is the center of the circle, in the ellipse or the oblong: light: the point is the center of the beam point in the left-right direction, the center line of the front-rear direction, that is, the intersection of the long axis and the short axis. Scan in such a way that it moves on the scribe line. Further, the brittle material 9 such as a glass substrate subjected to laser scribing is provided so that the obstacle is not present near the predetermined line of the line to be scanned. Under such conditions, the laser scribing process is performed such that the thermal stresses occurring in the regions on the left and right sides of the traveling line (i.e., the predetermined line of the scribe line) moving at the center of the clip beam point are equal and move at the center of the beam spot. The thermal stress near the lower line of the traveling line is the largest, and as a result, the crack due to the thermal stress is formed near the lower side of the traveling line (near the line below the predetermined line). [Patent Document 1] Japanese Patent Laid-Open No. 3027768 SUMMARY OF THE INVENTION A conventional laser scribing method is based on the fact that a factor including a predetermined line forming a scribe line on the line near the §hai line without obstructing the irradiation of the laser is present. premise. It is considered to be a substance that hinders the cause, such as being present on the substrate and different from the case of only the substrate, which abnormally absorbs or reflects the irradiated laser beam. If the substance is present in the vicinity of the predetermined line on the substrate, the amount of thermal energy that is absorbed in the substrate on the left and right sides of the line when the center of the laser beam moves on the line is different. As a result, the change in the thermal stress occurring in the near-lined line attached to 200936289 is also different on the line. At this point, the resulting crack will not coincide with the position of the predetermined line. Specifically, in the following cases, the crack and the line to be scribed may not coincide. (First condition) A substance that hinders the heating effect by the laser light is present as a foreign matter on the substrate. In a specific example, a substrate for a flat panel display (FPD), which is a flat display, is used. In the film formation process in which a TFT element or the like is formed, a film component which is not formed in the vicinity of a predetermined line of a scribe line is mistakenly attached or should be First, the condition in which the removed film component remains in the vicinity of the predetermined line of the scribe line is processed. In each case, when the bismuth component has an optical characteristic that is greatly affected by the laser beam irradiated onto the substrate, the film component exists in the vicinity of the scribe line and is (b) onto the substrate by a laser beam. When the influence of the heat influence is greatly different, the position of the crack formed by the laser heating and cooling is deviated from the position of the predetermined line of the scribe line. (Second condition) A transparent conductive film formed as a functional member is provided on the substrate, and it is necessary to draw a line near the conductive film as much as possible to form a crack. For example, it is conceivable to take into consideration the size of the substrate after the division and the resulting size of the display surface to produce the above demand. In such a transparent conductive crucible, the laser beam irradiated to the substrate is reflected, and the film component exists in the vicinity of the predetermined line of the scribe line and the influence of the laser beam irradiated onto the substrate on the heat of the substrate greatly differs between the lines on the line The position of the crack formed by the laser heating and cooling also deviates from the position of the predetermined line of the scribe line. (3rd condition) 200936289 It is necessary to scribe the vicinity of the substrate end as close as possible to the substrate end to form a crack. For example, it is conceivable to take into consideration the size of the substrate and the size of the display screen obtained as a result of the above-mentioned demand. At this time, there is a substrate end near the predetermined line of the scribe line, and one of the laser beams is not irradiated onto the substrate, and the influence of the heat on the substrate is greatly different when the left and right sides of the line are substantially different, and the crack formed by the laser heating and cooling is formed. The position also deviates from the position of the line to be scribed. That is, if foreign matter is asymmetrically present in the vicinity of the predetermined line, the laser light is irradiated to the foreign matter portion, and one portion of the laser light is reflected and absorbed by the foreign matter. As a result, the irradiation area of the substrate is different from the left and right scribe lines, and the energy absorbed by the substrate is erroneous. Further, an IT0 film may be applied as a transparent conductive film on a glass substrate or the like. The ruthenium film has a characteristic of reflecting light of a wavelength of a C 〇 2 laser. Therefore, when the glass substrate is irradiated with a c 〇 2 laser and one portion is reflected on the surface of the IT0 film, the glass substrate region on the lower side of the ITO film is substantially unirradiated and the energy absorbed by the substrate is reduced, and the temperature rise is suppressed. On the other hand, when the coating film has the property of absorbing the wavelength light of the laser beam, the glass substrate region on the lower side of the coating film substantially increases the absorption energy, and the temperature rise is accelerated. Further, the thickness of the coating film formed in the vicinity of the predetermined line of the scribe line may also change the energy absorbed. Further, when the film thickness of the coating film is close to the wavelength of the laser light, multiple reflection occurs, and when the relationship between the wavelength of the laser light and the film thickness of the coating film satisfies a specific condition, even if it is a coating film having absorption characteristics, absorption is also performed. May become extremely small 200936289 and absorb energy changes. On the other hand, even in the case of a coating film having a reflection property, when the relationship between the wavelength of the laser light and the thickness of the coating film satisfies a specific condition, the absorption may become extremely large and absorb energy. If the asymmetric arrangement of the foreign matter such as the coating film in the vicinity of the predetermined line is caused to affect the energy absorbed by the substrate, the heat distribution generated on the substrate is also on the predetermined line. The left and right sides become asymmetric in the substrate. The heat distribution of the enthalpy also becomes asymmetric around the line to be scribed. If the heat distribution is asymmetrical, the thermal stress change caused by the laser injection after the laser irradiation is also asymmetric around the predetermined line of the scribe line, and as a result, the position where the scribe line (crack) is actually formed is from the scribe line. The predetermined line deviates. Further, when a scribe line is formed in the vicinity of the end portion of the substrate, if the laser beam is moved along the predetermined line of the scribe line near the end portion and irradiated, the beam spot on the end side of the substrate is irradiated only to the substrate. At the end, one is exposed from the base, and the results are different. The projected lines on the left and right sides are different in the area of illumination, and the absorbed energy is also different. The distribution of thermal stress is still around the line of the line. Become asymmetric. As a result, the position where the scribe line (crack) is formed is actually deviated from the predetermined line of the scribe line. A specific example in which a scribe line or a scribe line formed at the end of the substrate is formed in the vicinity of a predetermined line of scribe line in the presence of a foreign object asymmetrically is described with reference to the drawing. π Figure 14 shows the laser scribing method from! A piece of the glass substrate is cut out and a unit display substrate U is cut out. The center of the beam point P of an oblong shape (the center line of the left-right direction, that is, the intersection of the long axis and the center line of the rear direction, that is, the short axis) is set with respect to the mother substrate A set to the laser scribing device The way of moving on the line s is scanned 9 200936289 for local twisting, sending the refrigerant (not drawing _ following the beam black) through the trajectory of the way to say that 1 is not figured to cool. c (foreign matter) exists in the domain with transparent conductive The film or the like is covered with a predetermined line of the film area. "Scanning laser: the vicinity of the edge ci of the east film two domain C is irradiated to the line of the line = the beam point p' beam point p is also the part, The coating film region c near the line S. There is a portion of the packet (4) where the existence of the region c and the 4th beam point P of the covered money domain 0 are the same, that is, the absorption of heat caused by the 埶', , and the shot is different (also Ο point: ή The difference is that the heat distribution on the surface of the substrate when the left and right beams k of the predetermined line S are scribed is asymmetrical. The upper line T1 coincides with the predetermined line s with respect to the line where the beam point p and the coating film area c do not coincide with each other, and the scribe line is removed from the area where the beam point p and the coating film region are pre-intersected. The area c deviates away from the predetermined line S. Therefore, 'between the formed line and the line T2.

Fig. 15 & shows the vicinity of the substrate end of the mother glass substrate a of the 纟i sheet: a diagram showing an example of the unit display substrate U. The center of the circular beam point p (the beam shape = the long circle or the ellipse as shown in FIG. 14) is opposed to the mother substrate A set on the Thunder scribe device to move on the scribe line s. Insert the local heating, and blow the refrigerant (not shown) to cool the beam by the point where the point P i passes. When the scribe line S is set at a distance d2 from the edge of the substrate to the predetermined line s of the secant line, the distance d2 is smaller than the distance d1 from the edge ci of the coating film region c to the line s of the line 10 200936289. The oblique line portion in the map among the beam spots p irradiated with the substrate eight is not irradiated to the substrate A and is deviated outside the substrate. Therefore, the irradiation area on the left and right sides of the scribe line S is different, and the heat distribution generated by the laser irradiation on the surface of the substrate a becomes asymmetric about the predetermined line s of the scribe line, and is the same as the position where the foreign matter is asymmetric. The problem of shifting occurs. Further, the planned line S of the scribe line and the edge M1 of the substrate A are non-parallel, and the heat distribution generated by the laser irradiation is still underlined when the distance from the scribe line, the line S to the end, and the edge M1 fluctuate. The left and right sides of the predetermined line s become asymmetrical, and the same kind of problem arises. Further, the above problem is caused by the fact that the substrate made of a material other than the glass can avoid the above problem even if it is in the vicinity of the predetermined line of the scribe line, and the first aspect of the present invention affects the foreign matter such as the coating film which hinders the irradiation. Laser scribing is done for the purpose. Supply for use in flat panel displays

The conductive film (such as ιτο film) can be regarded as a foreign matter on the edge substrate such as the m u nozzle plate, and is slashed to a predetermined line in the vicinity thereof. / 〇 仃 仃 仃 仃 加工 加工 ^ ^ 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马

Aim-into the sJ line processing of the scribing method for the purpose. The present invention is based on the invention that the laser &<# mechanism is moved relative to the brittle material substrate to illuminate the ray of the laser beam with the first beam to align the line. The line is pre-lined to cool the substrate. 'Base A# The brittle material base 11 is formed by the pre-twist line along the aforementioned line. 200936289: The laser scribing method 'will shield the laser light into laser light The range of the surface of the substrate to which the laser light is irradiated in a state where the surface of the irradiated surface is symmetrical with respect to the predetermined line of the scribe line and is ruptured to one of the surfaces of the laser beam irradiation mechanism or the substrate The predetermined line of the line illuminates the laser beam in an asymmetric region. Here, the laser beam can be used for the laser beam corresponding to the material of the brittle material substrate, and the excimer laser and the YAG laser can be used. A laser such as a C〇2 laser or a CO laser is suitable for the practice of the present invention. Further, the range of the surface of the substrate on which the laser light is irradiated is an asymmetric region of the scribe line © the pre-twist line. Including near the line of the line The state of the surface of the substrate is the left and right phase I, and the surface of the substrate near the predetermined line is formed asymmetrically by foreign matter such as a coating film, and the shape of the substrate in the vicinity of the left and right sides of the predetermined line is different. According to the invention, the irradiation area adjusting means is mounted on the surface of the laser beam irradiation means or the substrate. When scanning the beam spot of the laser beam along a predetermined line of the scribe line, the range of the surface of the substrate on which the laser light is irradiated is asymmetrical to the area where the line is pre-twisted by the ray line. The range of the surface of the substrate that is shielded to be irradiated with the laser light is symmetrical with respect to the aforementioned pre-twist line. Thereby, the heat distribution on the left and right sides is uniformly symmetrical to the predetermined line of the scribe line. As a result, a line with good straightness can be formed. (Means and Effects for Solving Other Problems) In the above invention, the brittle material substrate can form a coating film region on one surface of the substrate. The coating film region is provided at one of the scanned beam spots through the coating film region. The location. 12 200936289 Here, the factory coating film forming the coating film region is a coating which has a reflection property or an absorption property to the laser beam, and is not particularly limited. Example "" Electrode or non-reflective coating of transparent conductive film (10) ί ίτ〇臈, ^ electrode or metal used for light-reflecting surface _ Ru Shao, silver, gold). As a other example, it is also a functional film. Various protective films and various types of the present invention can form a dicing film in the vicinity of the case 1 without the use of the ruthenium, and as a result, a scribe line having a good straightness can be formed. The heart is straightforward. In the above invention, the beam spot can be scanned by the side of the substrate. According to the present invention, the position of the end edge of the board is set to a position near the base edge, and the method is set to be parallel to the width of the predetermined line of the substrate. Concave; the edge of the substrate near the predetermined line has a beam point of the mechanism, and the second::= condition illumination forms a scribe line from the influence of the laser beam irradiation, and the distance from the predetermined line of the line to the edge of the substrate is straightforward. line. Further, in the above invention, the history product adjustment means may be a beam spot which is shielded in the width direction of the line which is shielded by the expansion of the irradiation surface of the subtraction beam irradiation means so as to pass through the shutter member and restrict the member of the door member. The heat generated by the opening is such that the substrate surface is utilized with respect to the scribe line and the beam spot, and the 俾: is bilaterally symmetrical. The opening of the beam door member in the width direction of the line reduces the expansion of the predetermined beam point of the scribe line (that is, the width of the beam spot, hereinafter referred to as the beam width of 200936289), and the heat distribution generated by the beam spot is determined by the entire line of the scribe line. The substrate is irradiated with respect to the predetermined line of the scribe line. Thereby, a straight line with good straightness can be formed. Further, the shape of the beam spot of the laser beam is preferably a shape in which the heat distribution is symmetrical with respect to the scribe line predetermined line. For example, the shape is generally circular, elliptical or oblong, and the shape of the ytterbium is substantially not symmetrical, for example, it can be formed in a shape that is separated from the left (four) of the singular line and is formed in a bilaterally symmetrical shape. For the beam, f is formed as described above—the beam spot can improve the stress distribution near the predetermined line of the scribe line, so that the vertical crack progresses in the thickness direction of the substrate (refer to w〇2〇〇6/〇38365) In the above invention, the irradiation area adjustment means attached to the brittle material substrate may be constituted by a temporary coating film formed on the opposite side of the coating film region in the vicinity of the predetermined line of the scribe line along the predetermined line of the scribe line. The scribe line is predetermined to be 螅❹ ^ ± j 任一 any one of the left and right sides of the pre-twist line is formed with a coating film 蚪 夹 'clip line to the predetermined line force side to form a temporary coating film to cause reflection and absorption of the laser beam埶it ',,, 疋 响 在 在 在 在 在 在 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Forming can also be 〃, to reflect and The optical properties can be the same or different materials. For example, a transparent τ 〇 film used as an electrode or a non-reflective coating can be formed on the other side as a coating film. The same transparent conductive mold is formed by the temporary 14 200936289 coating film. In the mother substrate for a liquid crystal display panel, a transparent conductive conductive layer is formed with a pattern as a coating film region. However, when the transparent conductive film pattern is formed, a predetermined line is not required to form a transparent conductive film. The temporary coating film can be efficiently formed by simultaneously forming a temporary coating film in a region on the opposite side of the coating film region. According to another aspect of the present invention, a laser scribing apparatus is provided with a laser beam irradiation mechanism, a cooling mechanism, and the laser beam irradiation mechanism and the cooling mechanism are moved relative to the substrate. The scanner mechanism moves the laser beam illumination mechanism relative to the substrate such that the beam spot of the laser beam is scanned along a predetermined line of the substrate set on a predetermined line of the substrate and the substrate is heated at a temperature below the softening point. And a laser scribe line device for a brittle material substrate which is formed by moving a substrate along a trajectory of a beam spot to cool the substrate to form a scribe line along a predetermined line of scribe lines, and has a beam spot in a width direction of the predetermined line of the scribe line The expansion is such that the beam spot is a gate that is symmetrical to the entire length of the predetermined line of the scribe line by the heat distribution generated on the surface by being irradiated onto the substrate. According to the present invention, the beam width of the beam spot is reduced by the shutter, and the heat generated by the beam spot is distributed to the left and right of the predetermined line of the scribe line to be symmetrical with respect to the predetermined line of the scribe line. By this, a straight line with good straightness can be formed. In the scribing device, the shutter has a door width adjusting mechanism for adjusting an expansion of a beam spot in a width direction of a predetermined line of a scribe line, and an expansion of a beam spot in a width direction of a predetermined line of the scribe line is set to a predetermined line from a scribe line. Up to 2 times or less the shortest distance between the coating film region and the substrate edge existing in the vicinity of the predetermined line of the scribe line. 15 200936289 According to the present invention, since the beam spot does not touch the coating film region and the substrate edge when the beam spot is scanned, the heat distribution can be made symmetric by illuminating the beam spot symmetrically along the predetermined line of the scribe line. In the above-described scribing device, the shutter has a door width adjusting mechanism that adjusts the expansion of the beam spot in the width direction of the predetermined line of the scribe line, and further includes a scanning mechanism that relatively moves along the entire length of the predetermined line of the scribe line and captures the image a camera portion of the image information of the coating film region and the edge of the substrate near the planned line of the secant line, based on the image information captured by the camera portion, extracting the shortest distance from the predetermined line of the scribe line to the edge of the film or the edge of the substrate and based on the extraction The shortest distance determines the beam spot width in the width direction of the predetermined line of the scribe line 四 (4) The door width control unit of the adjustment mechanism.

With the present invention, the camera unit is relatively moved relative to the predetermined line of the scribe line by the scanning mechanism and is photographed (four) by the predetermined line of the scribe line covering the film area and the edge of the substrate. The seed width control unit extracts the shortest distance from the predetermined line to the film area or the edge of the substrate from the captured image f. Then, based on the shortest distance extracted, the beam spot width in the width direction of the predetermined line is determined to control the gate width adjusting mechanism to control the beam width. Thereby, the shortest distance to the coating film region existing near the predetermined line of the scribe line and the edge of the substrate can be automatically detected, and the width of the spot to be irradiated can be automatically adjusted. In the scribing device, the shutter has a door width adjusting mechanism for adjusting an expansion of a beam spot in a width direction of a predetermined line of scribe lines, and further includes a predetermined line from a scribe line to a coating film region or a substrate edge The shortest distance is determined by the distance data input unit, the distance data input unit that records the distance data input from the data input unit, and the distance data recorded in the distance record 16 200936289 data record unit and determined based on the read distance data. The beam spot width in the width direction of the predetermined line is scribed to control the gate width control portion of the door width adjusting mechanism. With the present invention, the shortest distance from the predetermined line of the scribe line to the edge of the coating film or the edge of the substrate is input in advance as the distance data, so that the distance data input is recorded. The gate width control unit reads the recorded distance data and determines the beam spot width in the width direction of the predetermined line based on the read distance data to control the shutter width adjusting mechanism. 5 #this' automatically adjusts the width of the irradiated spot as long as it is recorded in advance to the shortest distance between the area of the coating film existing near the predetermined line of the scribe line and the edge of the substrate. [Embodiment] (Embodiment 1) Hereinafter, an embodiment of the present invention will be described based on the drawings.

... ^ Solid X

A schematic diagram of a laser scanning 丨丨蝻酤 τ η and an s 丨 4 4 LS1 in one embodiment. Fig. 2 is a view showing the structure of the control system of the laser beam of Fig. 1 and the green frame of the wire. Fig. 3 is a view showing the construction of an optical holder of a prior art system in which a light adjustment point is incorporated. Bai Qian first explained the overall structure of Leihui • Moon laser marking device LS 1 based on Fig. 1 . A pair of guide rails 3, 4 disposed on the wood of the horizontally added layer 7 are arranged in the front direction of the paper of Fig. 1 (2. MA ah, hereinafter referred to as the Y direction). The sliding platform reciprocates on the two guide rails 3, 4 Between > VL ν . A lead screw 5 is disposed in the Υ direction, and the lead screw 5 is screwed to the struts 6 fixed to the front 10, and the motor is rotated (shown in FIG. 17 200936289 in the Y direction) to reverse the lead screw 5 to make the sliding platform 2 Move along the guide rail 3. On the moon moving platform 2, a water platform seat 7 that reciprocates in the left-right direction of the figure i (hereinafter referred to as the X direction) is disposed along the guide rail 8. The lead screw of the fixed cymbal 7 is screwed with a lead screw shaft rotated by the motor 9, and the forward and reverse rotation of the lead screw causes the slide pedestal 7 to reciprocate in the direction of the guide rail. The pedestal 7 is provided with a rotating platform I] that is rotated by a rotating mechanism, and the rotating platform i2 is horizontally mounted with a brittle material substrate such as a glass substrate, which is an object to be cut (hereinafter, simply referred to as a mother substrate A). . The rotating mechanism n is such that the rotating platform 12 is rotated about a vertical axis 'rotatable to an arbitrary rotation angle with respect to the reference position. X, the parent substrate A, which is the object to be separated, is fixed to the rotary table 12 by, for example, a suction head. Above the rotary table 12, an optical holder 14 connected to the laser oscillator 13 is held by the mounting frame 15. The laser beam emitted by the laser oscillator is a beam point of a predetermined shape (here, a beam point of a substantially oblong shape extending in a predetermined line direction along the scribe line) by an optical system inside the optical holder 14. Irradiation onto the mother substrate A. Further, the optical system of the inner portion of the optical holder 14 will be described later. A CCD camera 20 (21) 9 is disposed above the rotating platform 12 to align the CCD camera 20 (21) 9 to the object to be cut, that is, the substrate is disposed at both ends of the substrate and is normally placed on the rotating platform 12 One of the reference pairs of alignment marks, a pair of CCD cameras 20 (21) are configured to capture the alignment marks separately. Further, in Fig. 1, only the CCD camera 2 on the near side of the paper surface is displayed, and the CCD camera 2 1 on the far side of the paper surface is not displayed. 18 200936289 The optical holder 14 is moved over the control unit 12 of Fig. 2. In general, the use of & in the construction of a rotating platform, due to the laser beam', the central position of the basic device of the twisting device and the "beam spot of the optical holder 14 are on the surface of the object to be processed. "The sergeant usually does not - but the surface of the scorpion hangs | the direction away from the center of the moving optical holder 14 pays s 1 position of the brother-in-law distance. The position coordinates are regarded as the coordinate device side that can illuminate the beam spot, and the position of the other components is assumed to be placed in the position of the poor material. If the position is used as the coordinate data, the offset data I 9 is recorded in the management device. The amount of the mobile data is 5 β β Γ 曰 曰 曰 曰 曰 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 配合 邛14. The movement of the 14th. If the shape of the first beam from the optical holder is a rough figure, with its central coordinate (R to the circle of the eight phoenix feng first bundle of the coordinates of the center, the shape is extended in the direction of travel, 彳The shape of the shape of the beam is symmetrical in the direction of travel, and the position of the priest (Ex, Ey) is the center coordinate of the beam with the long axis and the short axis intersecting.

The center position of the beam is also deducted by J. PI Ο Straight "The first position of the holder 14 is not - when the time" is regarded as the amount of position difference, as long as the position of one of them is 'm position It can be quickly obtained by adding the amount of offset. For example, 'the offset of the center position coordinate of the optical holder 14 and the center coordinate of the beam (Rx, Ry) is used as the offset amount, as long as the optically retained bean 14 The position data can be input into the program in advance by using the control data of the device: if necessary, the actual coordinate position of the light beam on the substrate can be obtained by the calculation of the offset amount. τ In addition, the coordinate data of the beam and the above optical are grasped. The holder of the holder 19 200936289 can confirm the current position of the optical holder 14 in the scribing operation and the current position of the center of the beam on the display connected to the control unit. The following description is for simplification, assuming The center position of the beam is aligned with the center position of the optical holder 14. Further, the ampoule 15 is provided with a cooling nozzle 16 adjacent to the optical holder 14 to thereby cool the nozzle 16 to the glass substrate. The nozzle emits cooling medium such as cooling water, atmosphere, and sulphur dioxide gas. This cooling medium is blown until it is close to the optical

The position of the end portion in the longitudinal direction of the beam spot irradiated to the mother substrate a is held, and a cooling point is formed on the surface of the mother substrate A. Further, the scribing wheel 18 is mounted by the up-and-down movement adjustment mechanism π. The scribing wheel 18 is made of sintered diamond or superhard alloy, and has an apex portion which is a v-shaped ridge at the outer peripheral surface and has a vertex as the leading edge of the blade, and can be adjusted to the mother substrate by motion:=. The line (four) is dedicated. Next, the control I: standby position will be described based on Fig. 2 . Yudi i series, first. Laser marking dream

The slide platform 2 and the stage are driven, and the LSI is mounted. The platform drive unit 5 drives the Thunder laser drive unit 52 to drive the Thunder laser drive unit 52, which is a two-position laser (the motor 9 or the like) of the laser beam. Cooling spray 222 opening and closing wide (not shown) nozzle _#53 Widely control the positioning of the wheel scribe rim and the opening width W of the adjustment of the crimping force of the mother substrate 冷. The adjustment of the center portion 5; the drive system 44 is a computer (CPU) control unit 56, each of which is constituted by an input device such as a disk or a mouse (not: control, part 56) By connecting the key (not shown) to the display unit 58 which is configured by various display 20 200936289: display, the necessary message can be displayed on the display! surface and the necessary indication or setting can be input. The seat corresponding to the shortest distance from the scribe line to the coating film area C or the substrate edge M1 is set in advance: the distance data input unit 57 for the two-distance data input, and the record is input: the material input unit 57 The distance data data recording unit 59 reads the distance data recorded in the distance from the data recording unit 59 and determines the expansion of the beam spot in the width direction of the predetermined line of the scribe line, that is, the limit beam spot width W, based on the distance read. The door width of the door panel is adjusted to the opening width of the door width control unit 44. The opening width w〇^ of the door panel can be automatically determined. The following is an explanation of the internal structure of the optical holder! Figure ^ No, optical protection The i 4 has a collecting lens 42 and 43 that deforms the laser beam LB from the laser emitter 13 into a laser beam LC having an elliptical beam spot, and shields the outer portion of the laser beam LC to The limit of the beam width is limited to the threshold 44 of the beam spot LD. In addition, the limit point width of the beam spot V LD is limited to 卩^. Alternatively, as shown in Fig. 4, the center of the long axis direction of the beam spot LD is limited. The line tapping is shielded by the light-shielding portion to form a limit beam width to the right and left to limit the beam spot [D2. At this time, the optical splitting element 41 for shielding the beam spot and the flaw is mounted on the optical path (for example, the seam plate shielding the center line) Thereby, a scribe line which is vertically developed to a deeper position can be formed in the thickness direction of the substrate. Further, as shown in FIG. 4, a beam point which forms a non-irradiated portion which is not irradiated with the laser beam on the scribe line is described in the following. Patent Document 3. This 21 200936289 beam point system is formed by irradiating a laser beam and a refrigerant jet in the direction of the thickness of the brittle I·material substrate when the vertical crack progresses, preventing the internal compressive force field from being formed below the scribe line. So can A completely vertical crack is formed in the thickness direction of the brittle material substrate (refer to WO2006/038365). Fig. 5 is a schematic configuration diagram of a configuration of a five-way shutter 44. The shutter 44 is provided with a transmitted laser beam LC. The base 44a of the window 45 is provided with a shutter plate 441 formed of a light-shielding material (for example, a metal strip). The door panel 4 is composed of two flaps, and each of the flaps is driven by the door drive portion 55. The moving direction (X direction) in which the beam LC is scanned and the vertical direction (γ direction) are arbitrarily moved from the center of the window 45 by an arbitrary moving distance w〇, and can be adjusted to the opening width Wo (wherein the opening width w 〇 = w〇 * 2) Fig. 6 is a side view showing the positional relationship with the shutter 44 when the mother substrate a on which the coating film region c is formed is irradiated with the laser light. Fig. 7 is a plan view showing the positional relationship with the shutter 44 when the mother substrate A having the coating film region C is irradiated with the laser light. The opening width w of the shutter 44b adjusts the distance between the door panel 44b and the beam spot formed on the mother substrate A based on the shortest distance from the scribe line S to the film region C or the substrate edge c1. . 〇 For example, as shown in Fig. 6, the opening width Wo of the shutter plate 44b is adjusted so that one portion of the beam spot LD is not irradiated to the region of the coating film region c composed of the transparent conductive film formed on the mother substrate A. Thereby, the light beam dot on the mother substrate A is located on the predetermined line S of the scribe line, and the beam spot LD can be formed to limit the beam width. Further, 'in Fig. 6' is a simplification of the drawing, and only the door panel 44t> indicates the position of the shutter 44. 22 200936289 A description will be given below with reference to FIG. 1 and FIG. 2 that the movement of the laser scribing device LS1 firstly enters the size of the mother substrate A that is divided into a predetermined size, and the position at which the line is formed (ie, the planned line s). The crimping force of the scribing wheel 18 to the mother substrate A (line load). The position at which the scribe line is formed is set by one pair of cameras 2 〇 (21), and the alignment marks are attached to one of the mother substrates A, and the positioning of the slide table 2 and the pedestal 12 is performed based on image processing. The method of performing such positioning is a well-known technique, such as Japanese Patent No. 3078668, and the detailed description is omitted. Thereafter, the shortest distance from the predetermined line S to the coating film area C or the substrate edge M1 set in advance from the distance input unit 57 is input as the distance data. The distance data recording unit 59 records the distance data input to the distance data input unit 57, reads the distance data recorded in the distance data recording unit 59, and determines the limit beam spot width w to adjust the shutter plate 44b based on the read distance data. The opening width w〇. Further, the distance data recorded in the distance from the data recording unit 59 may be the shortest distance of each predetermined line S of the scribe lines, or may be the minimum shortest distance which can be obtained from the mother substrate of the cymbal. Then, the opening width Wo of the shutter 44b is set such that the long axis of the beam spot LD is superposed on the predetermined line s of the scribe line and as illustrated in FIGS. 6 and 7, one portion of the laser beam is not irradiated to the predetermined line s. The vicinity of the coating film area c. Thereafter, the mother substrate A is fixed to a predetermined position on the rotary table 12. Thereafter, in order to form the initial crack, the upper substrate moving adjustment mechanism 17 moves the mother substrate a in a state where the 23 200936289 :: wheel 18 is lowered, and the laser emitter 13 and the cooling nozzle 驱动 are driven after the initial formation of the substrate end. Then, the beam point of the laser beam is scanned along the scribe line pre-media nozzle to move the mother substrate A to cool and advance the scribe line. At this time, as shown in FIG. 7, the beam spot LC is a limiting beam point ld in a state in which the width of the scribe line s is restricted by the width of the gate line 44b of the line 14 (see FIG. 3, FIG. Therefore, the reflection or absorption of the 丌x heart-surface, r, and the cross-over film area C is affected by

(1) The entire heat transfer distribution of each of the pre-twisted lines S is bilaterally symmetrical, so that a straight line R can be formed. FIG. 8 is a view showing a state in which a line is drawn along a predetermined line S in the vicinity of the edge of the substrate formed on the mother substrate a. Picture. When the f-line pre-twisted line S is located in the vicinity of the substrate edge M1 of the mother substrate A, the portion (hatched portion) of the beam spot LC is irradiated to the outer surface of the substrate A. At this time, the irradiation will adjust the opening width of the door panel yang = the interval dl between the predetermined line S and the substrate edge Μί and the interval d2 between the predetermined line of the scribe line and the film area C. The shorter one is symmetrical. The limitation of the width W (that is, the DF or d2 is greater than the beam point LD. . . . width). In addition, in FIG. 5, the door material composed of two flaps is used as a door member. γ日日彳彳彳彳生# The Ά1 member is not limited to this configuration, and the shape, movement direction, and number of sheets of the stopper are variable' (known as the second embodiment). Fig. 9 is a perspective view showing a structure of a laser scribing apparatus (1) according to another embodiment of the present invention, and a structure of the control unit of the laser scribing apparatus of Fig. 9. The same components as those in Figs. 2 and 2 are denoted by the same reference numerals, and the description of the common portions will be omitted. The Ray ray shy LS2 is based on the above-described laser scribe line device LS 1 and has a center on the substrate A q 彳 line □ is the center of the photographic area. The surface camera camera > 6 1 is supported by the robot arm 24 so as to be freely movable. The mechanical arm 2 4 is controlled by the camera drive unit 63 of the 1 〇 千 她 她 她 她 她 她 她 。. The camera 6 i corresponds to the type of the coating film, and is suitable for use from an infrared camera or an optical camera (a visible light camera radio camera, etc., so that the coating film region formed on the substrate A can be extracted. The control unit 56 of the LS 2 includes the shortest distance from the predetermined line s to the coating film area C or the substrate edge M1 based on the image information identification pattern captured by the camera, and determines the predetermined line based on the shortest distance extracted. The door width control unit that adjusts the opening width w of the door panel 44b in the width direction is described in Fig. 11. Fig. 11 (a to gH is a portion for taking the camera 61 along the side One line of image information of one of the image information captured when the line is scanned. The respective shooting areas are extended in a direction parallel to the line pre-m S by a long side extending in a direction orthogonal to the predetermined line s. The rectangular area formed by the short side constitutes 'the length of the long side is set to the point width of the beam before the point width is limited' to the center of the shooting area of the camera, and point 0 is the camera '"Standing coordinates (χ0, γ.) 'Set the line of the camera 61 to make the Y-axis overlap 25 200936289 == Line: Guang Bu 'in this substrate... shape-to-" and eight pairs of sides sxn vertical direction set The line is planned to be lined. - As shown in Fig. 4, the X of the shooting area of the camera 61 is overlapped with one side of the substrate A which is parallel to the X axis, and the rear point is set so that the center of the shooting area is 〇 璺 之一 之一 之一 之一 之一 使 使 使 使 使 使 使 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The end point of the overlap of the side surface of the S S ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... The right side of the pre-line S is calculated from the predetermined line s of the scribe line to the shortest distance of the coating film, for example, the most = distance dL of the coating film on the left side of the predetermined line s of the scribe line (Fig. 11 (d)) And the shortest distance dR (Fig. U (f)) to the right side of the predetermined line s of the scribe line and make it as the distance data record. The medium compares the two to obtain a minimum value, and based on the minimum value, determines the limit point width w of the predetermined line S of the photographed line. After that, the determined limit point width w and the shape of the previously input laser beam are input. The distance data from the base base anti-A to the shutter 44 is input into the relational expression, and the door panel 44b is opened: the opening width W〇. By this, the opening width W of the door panel peach can be automatically determined and then scribed. In the second embodiment, the trick width control unit recognizes the coating film located in the vicinity of the predetermined line S based on the image to be imaged, and calculates the shortest distance from the predetermined line S to the coating film. The opening width Wo of the door panel _ 26 200936289 is determined, but the same can be done even if the edge of the substrate is not the coating film. In the second embodiment, the shortest distance from the predetermined line S to the coating film region c or the edge of the substrate M1 is extracted based on the image resource pattern recognition by the camera 61, and the shutter is adjusted based on the shortest distance of the extraction. The configuration of the opening width Wo of 4 inches, but the use of the camera 61 is not limited to the above. For example, as described in the first embodiment, it is possible to preset from the predetermined line s to

The shortest distance between the 匕 匕 film area C or the substrate edge M1 is taken as the distance data, and the door panel is adjusted based on the distance data recorded and the distance information based on the image information pattern captured by the camera 6 调整4 outside opening σ width Wo. Further, in the second embodiment, the laser scribing device LS2 includes a pair of CCD cameras 2G for photographing each of the alignment marks attached to the mother substrate A to obtain the positions of the respective scribe lines on the mother substrate A ( 2 i) A configuration of the camera 61 that adjusts the opening width of the shutter 44b along the predetermined line _s of the scribe line. However, the above-mentioned area may be used for both the camera or the camera of the two machines. (Embodiment 3)

The area shape $1 to 2 is symmetrical about the substrate A which is centered on the predetermined line after the laser irradiation is applied to the laser scribing device side, and is attached to the substrate A in this embodiment. Side installation..., body area adjustment wisdom: Feng @ substrate a '5 weeks of jade for laser irradiation, the line is lined with ..., the distribution is bilaterally symmetrical. Fig. U is a view for explaining a method of scribing the irradiation area adjustment hand 27 200936289 on the substrate A side of the present invention. In this example, a coating film region C is formed in a region (mother substrate) LA which is a unit display substrate u. Second, the temporary coating film 71 is formed in advance so that the interval d between the predetermined line S of the scribe line and the edge C1 of the coating film s 'C and the interval D between the predetermined line s of the scribe line and the temporary coating film 71 (hereinafter referred to as It is equidistant for "temporary f white test I set ^ film interval"). ◎ When the unit display substrate U is cut out from the mother substrate A, the mother substrate A is set to a laser scribing device (for example, the laser scribing device LSD' described in i emits laser light. The shape of the predetermined line s is symmetrical with respect to the left and right sides. That is, when one portion of the beam spot LE is reflected in the coating film region C, it is also reflected on the side of the temporary coating film 71. Therefore, it can be made to be a heat distribution centered on the predetermined line s of the scribe line. Fig. 13 is a view showing an example of a temporary coating film which is patterned. C1, C2, C3 'C4 is a coating film area' 72 '73, 74, and 75 are temporary coating films corresponding to the coating film regions. For convenience of description, the coating film regions are displayed in various shapes, but may be the same shape, simple shape, etc. The coating film spacing is equal to the spacing between the predetermined line s of the scribe line and the edge of each of the cladding regions. Further, the shape of the temporary coating film is reflected as close to the predetermined line s of the coating film region C. The shape of the peripheral portion may correspond to the line S of the scribe line as the axis. The width of the temporary coating film The dot width (width) corresponding to the beam spot LE is set to, for example, a range in which the region 76 on the side opposite to the predetermined line S of the scribe line is not irradiated on the side of the temporary coating film 71 across the temporary coating film 71. The formation of the temporary coating film can be simultaneously formed with the formation of the coating film region C

The 2S 200936289 row' may be performed on the substrate on which the coating film region c has been formed, or before the coating film region C is formed. When the temporary coating film 7 is formed of a transparent conductive film of the same material as the coating film region c, the temporary coating film 71 may be formed at the same time when the coating film region c is formed. The manufacturing process is simplified. [Examples] Specific examples of the embodiments of the present invention will be described below. ® (Experiment 1) The opening width Wo of the shutter was adjusted using the laser scribing device LS1 of the present invention on the glass substrate on which the transparent conductive film (IT0 film) was formed, and the results were compared. The experimental conditions are as follows. Substrate size: material is non-test glass 'thickness 〇 5 mm beam spot shape: rounding line speed · 200 mm / sec 挡 door: opening width wo is 0.4mm (limited beam point width is 0.4 mm)' The height of the arrangement (the height from the glass surface) is 3 mm (Experiment 2) The substrate on which the transparent coating film is formed (the glass of IT0 is drawn, the predetermined line of the line is at %, and the temporary coating film of the present invention is formed) The substrate is not formed. The experimental conditions are as follows: , '', ^ Substrate specifications: the material is alkali-free glass, the thickness is 〇, 5 m melon beam spot shape: ellipse! J line speed. 200 mm/sec 29 200936289 The coating film. The material is the reflection of the belt. The results of the experiment are as follows. The positional deviation of the scribe line is greatly reduced in any of the shots, and the condition is improved by the straightness of the beam point to the scribe line. [Table 1 ]

Position shift amount (shading) 〇 In addition, in the above-described embodiments 丨 2, although an elliptical beam spot is used, the shape of the beam spot in the present invention is symmetrical with respect to the left-right direction of the predetermined line of the scribe line. Particularly limited. Further, although a glass substrate is used as a target for scribing, the processing object is not limited to the glass substrate. The laser scribing method and the laser scribing skirt of the present invention can be applied to ceramics, sintered materials, single crystal germanium, semiconductor wafers, ceramic substrate 'sapphire substrate' to make the glass substrates adhere to each other. The liquid crystal display substrate is formed by a scribe line of a transmissive liquid crystal display substrate, an organic EL element substrate 'PDp substrate, and a reflective liquid crystal display substrate in which a glass substrate and a ruthenium substrate are bonded together. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a configuration of a laser scribing apparatus according to an embodiment of the present invention. 30 200936289 Figure 2 is a diagram showing the construction of a control system for the laser scribing device of Figure 。. Figure 3 is a diagram illustrating an optical holder forming a beam spot. Fig. 4 is a view showing another example of an optical holder for forming a beam spot. Fig. 5 is a schematic block diagram showing the configuration of a door. Fig. 6 is a side view showing the positional relationship with the shutter when the glass substrate on which the coating film region is formed is irradiated with the laser light. Fig. 7 is a plan view showing the positional relationship with the shutter when the glass substrate on which the coating film region is formed is irradiated with the laser beam. Fig. 8 is a view for explaining a state in which a scribe line is formed along a line near the edge of the substrate formed on the glass substrate. Fig. 9 is a view showing the schematic configuration of a laser scribing apparatus according to another embodiment of the present invention. Figure 10 is! Bei*ffil 9 laser painting j line installed the control of the brother j system. Figure U is a diagram showing a continuous image taken along a predetermined line s of a line as shown in still another embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS A diagram of a laser scribing method according to another embodiment of the present invention. 81 is a diagram of a case where the member does not cover the chess area and the patterned temporary coating film. Fig. 14 shows that the technique is formed in the coating film area on the line of the scribe line. The vicinity of the mother · its & !_,,, 1 map on the soil, / D line to the line to be formed when scanning the beam point. 31 200936289 Figure 1 5 shows the conventional technology lies in the substrate A schematic diagram of a line formed by scanning a beam spot along a predetermined line of a scribe line on a mother substrate on which a predetermined line is formed at a position where the edge Μ1 is extremely short. [Main element symbol description] 2 Sliding platform 12 Rotary platform 13 Laser emitter 14 Optical holder 16 Cooling nozzle 18 Scribing wheel 41 Optical dividing element 42, 43 Condenser lens 44 Door 44b Door panel 51 Platform drive unit 52 Laser drive unit 53 Nozzle drive unit 54 Knife drive unit 55 door drive unit 56 control unit 57 input unit 58 display unit 59 distance data recording unit

32 200936289

61 Camera 62 Door width control unit 71 to 75 Temporary cover film A Glass substrate (mother substrate) C Cover film area D Temporary film gap LD Limit beam spot Wo Opening width W Limit beam spot width

33

Claims (1)

200936289 X. Patent application scope: 1. A laser scribing method for a brittle material substrate, which is to scan a laser beam by moving a laser beam irradiation mechanism relative to a brittle material substrate and irradiating a laser along a predetermined line of the scribe line. Pointing to heat the substrate, and then forming the scribe line along the predetermined line along the scribe line by cooling the substrate along the predetermined line of the scribe line is characterized by: arranging the aforementioned scribe line in a range in which the surface of the substrate on which the laser light is irradiated is irradiated The line is a symmetrical illumination area adjusting means for illuminating the surface of the substrate irradiated by the laser beam in a state in which one of the surfaces of the beam irradiation mechanism or the substrate is irradiated, and the range of the surface where the predetermined line is not symmetric is irradiated to the laser beam. 2' The laser scribing method described in item i of the patent scope, = the material substrate forms a coating film region on one of the surface of the substrate, and the coating film is provided at the portion of the scanned beam spot. Covering the position of the domain «3, as shown in the scope of the patent application, the first line of the beam is scanned and the beam point is scanned. The k-center is the outer side of the substrate: the laser scribing method as described in the scope of the patent application, wherein the secant box: the irradiation area adjustment means of the first beam irradiation mechanism is used to reduce: "the beam of the width direction of the line" The manner in which the point is expanded is configured to block the light, and the opening of the door member is restricted so that the predetermined line of the door member is symmetrical by the predetermined line. The hot knife cloth is a laser scribing method as described in claim 1, wherein the irradiation area adjustment means mounted on the brittle material substrate is formed by a predetermined line along the scribe line. A temporary coating film on the opposite side of the coating film region near the predetermined line is formed. A laser scribing device for a brittle material substrate, comprising: a laser beam irradiation mechanism, a cooling mechanism, and a scanning mechanism for moving the laser beam irradiation mechanism and the cooling mechanism relative to the substrate, so that the laser beam irradiation mechanism is opposite to the laser beam irradiation mechanism The substrate is moved such that the beam spot of the laser beam is scanned along a predetermined line of the substrate and is scanned on a predetermined line of the scribe line to heat the substrate at a temperature below the softening point, and then the cooling mechanism is relatively moved along the trajectory of the beam spot. The substrate is cooled to form a scribe line along a predetermined line of scribe lines, and is characterized in that: the expansion of the beam spot in the width direction of the predetermined line of the scribe line is provided so that the beam spot is caused by the heat distribution generated on the surface by being irradiated to the substrate. A line that is symmetrical about the entire length of the predetermined line. /, such as A, please look for the benefit of the magazine ~ trial teeth J剀xiong clothing, 1 in the above, the broadcast door has the width of the beam line to adjust the width of the line to expand the width of the door width adjustment mechanism, the width of the line The expansion of the beam spot in the direction is set to be twice or less than the shortest distance from the predetermined line of the scribe line to the area of the coating film and the edge of the substrate existing in the vicinity of the predetermined line of the scribe line. 8. If the application for the patent specification is to be adjusted, the full-length relative movement of the door width adjustment mechanism line and the image of the field and the edge of the substrate are recorded in the sixth line of the laser marking device, wherein the line is planned to be The expansion of the beam spot in the width direction is further provided with a camera unit that scans the information about the enveloping area existing near the predetermined line by the scribing line, and extracts the image information based on the photograph taken by the camera unit 35 200936289 The shortest distance predetermined by the scribing is based on the beam spot width in the shortest direction of the scooping to control the dip gate portion. The distance from the line to the cover film region or the edge of the substrate edge determines the width of the width-adjusting mechanism of the predetermined line width control mechanism. 9. The laser marking device as described in claim 6 of the patent application scope, the center door The step width adjusting mechanism ′ having the expansion of the beam spot in the width direction of the predetermined line of the scribe line further has a distance from the predetermined distance from the predetermined line of the scribe line to the edge of the film or the edge of the substrate by the distance input from the data. The data input unit and the record are input distance data from the data input unit. The distance data recording unit reads the distance data recorded in the distance from the data recording unit and determines the beam spot in the width direction of the predetermined line based on the read distance data. The width is to control the door width control portion of the door width adjusting mechanism. Η^一,图: If the next page 36