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WO2008133073A1 - 導電性ペースト及びこれを用いた印刷回路、面状発熱体 - Google Patents

導電性ペースト及びこれを用いた印刷回路、面状発熱体 Download PDF

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Publication number
WO2008133073A1
WO2008133073A1 PCT/JP2008/057246 JP2008057246W WO2008133073A1 WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1 JP 2008057246 W JP2008057246 W JP 2008057246W WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive paste
circuit board
printed circuit
heat generating
generating body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057246
Other languages
English (en)
French (fr)
Inventor
Kazuhiro Abe
Keiko Taga
Hiroshi Tachika
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP2008523466A priority Critical patent/JPWO2008133073A1/ja
Publication of WO2008133073A1 publication Critical patent/WO2008133073A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
    • H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

【課題】　導電性、密着性、耐屈曲性に優れ、低比抵抗にもかかわらず優れたＰＴＣ特性を発揮する導電性ペーストを提供する。 【解決手段】　ポリエステル系樹脂または／およびポリウレタン系樹脂を含む樹脂１００質量部に対して、球状カーボン粒子４０～２００質量部を含む導電性ペーストにおいて、該ポリエステル系樹脂および／またはウレタン系樹脂の数平均分子量が３０００以上であり、ガラス転移温度が－４０～３０°Cであることを特徴とする導電性ペースト及びこれを用いた印刷回路、面状発熱体に関する。
PCT/JP2008/057246 2007-04-18 2008-04-14 導電性ペースト及びこれを用いた印刷回路、面状発熱体 Ceased WO2008133073A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008523466A JPWO2008133073A1 (ja) 2007-04-18 2008-04-14 導電性ペースト及びこれを用いた印刷回路、面状発熱体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-109189 2007-04-18
JP2007109189 2007-04-18

Publications (1)

Publication Number Publication Date
WO2008133073A1 true WO2008133073A1 (ja) 2008-11-06

Family

ID=39925531

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057246 Ceased WO2008133073A1 (ja) 2007-04-18 2008-04-14 導電性ペースト及びこれを用いた印刷回路、面状発熱体

Country Status (3)

Country Link
JP (1) JPWO2008133073A1 (ja)
KR (1) KR20100015580A (ja)
WO (1) WO2008133073A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012128028A1 (ja) * 2011-03-18 2012-09-27 住友精化株式会社 金属ペースト組成物
KR20160118263A (ko) 2014-02-06 2016-10-11 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 온도 센서용 수지 조성물, 온도 센서용 소자, 온도 센서 및 온도 센서용 소자의 제조 방법
JP2018041692A (ja) * 2016-09-09 2018-03-15 東洋紡株式会社 展延性導電性組成物および三次元プリント配線板の製造方法
WO2019039511A1 (ja) * 2017-08-24 2019-02-28 東洋紡株式会社 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器
KR20210000486A (ko) * 2019-06-25 2021-01-05 주식회사 토우테크 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101316762B1 (ko) * 2011-09-29 2013-10-10 (주)오리엔탈드림 망사발열체 및 그 제조방법
KR101276726B1 (ko) * 2013-01-07 2013-06-19 김윤정 유연성 발열체 원단의 제조방법
KR101947518B1 (ko) * 2016-03-30 2019-05-10 (재)울산테크노파크 셀프 스위치 기능을 부가한 고온용 ptc 페이스트 조성물 제조방법
KR101970911B1 (ko) * 2018-02-02 2019-04-22 영남대학교 산학협력단 도전 회로를 갖춘 굴곡성과 신축성의 기판의 제조 방법
KR102170762B1 (ko) * 2018-11-22 2020-10-27 주식회사 렉스바 누설 전류를 제거할 수 있는 온열 필름모듈
KR102342365B1 (ko) * 2020-07-13 2021-12-22 동국성신(주) 면상발열체 히터의 발열부용 조성물, 상기 조성물을 이용한 발열부 및 상기 발열부를 가지는 면상발열체 히터
KR102584801B1 (ko) * 2021-01-27 2023-10-06 주식회사 파루인쇄전자 면상발열체를 포함하는 발열 패드 및 이의 제조방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02272702A (ja) * 1989-04-14 1990-11-07 Tokyo Cosmos Electric Co Ltd Ｐｔｃ抵抗体
JPH0696843A (ja) * 1992-06-22 1994-04-08 Nippon Carbon Co Ltd 温度自己制御性導電性組成物、温度自己制御性面状発熱体および温度自己制御性パイプ状ヒーター
JP2001011354A (ja) * 1999-07-02 2001-01-16 Honny Chem Ind Co Ltd 自己温度制御ヒーター用印刷インク
JP2002260442A (ja) * 2001-03-06 2002-09-13 Toyobo Co Ltd 導電性ペースト
JP2005259546A (ja) * 2004-03-12 2005-09-22 Toyobo Co Ltd ロータリースクリーン印刷機用導電性ペースト及びそれを用いた導体回路
JP2006085978A (ja) * 2004-09-15 2006-03-30 Toyobo Co Ltd 導電性樹脂組成物及びこれを用いた面状発熱体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5033707B2 (ja) * 1972-12-13 1975-11-01
JP3312600B2 (ja) * 1998-09-17 2002-08-12 扇化学工業株式会社 Ｐｔｃ特性を有する樹脂組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02272702A (ja) * 1989-04-14 1990-11-07 Tokyo Cosmos Electric Co Ltd Ｐｔｃ抵抗体
JPH0696843A (ja) * 1992-06-22 1994-04-08 Nippon Carbon Co Ltd 温度自己制御性導電性組成物、温度自己制御性面状発熱体および温度自己制御性パイプ状ヒーター
JP2001011354A (ja) * 1999-07-02 2001-01-16 Honny Chem Ind Co Ltd 自己温度制御ヒーター用印刷インク
JP2002260442A (ja) * 2001-03-06 2002-09-13 Toyobo Co Ltd 導電性ペースト
JP2005259546A (ja) * 2004-03-12 2005-09-22 Toyobo Co Ltd ロータリースクリーン印刷機用導電性ペースト及びそれを用いた導体回路
JP2006085978A (ja) * 2004-09-15 2006-03-30 Toyobo Co Ltd 導電性樹脂組成物及びこれを用いた面状発熱体

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140038391A (ko) * 2011-03-18 2014-03-28 스미토모 세이카 가부시키가이샤 금속 페이스트 조성물
JPWO2012128028A1 (ja) * 2011-03-18 2014-07-24 住友精化株式会社 金属ペースト組成物
US9414487B2 (en) 2011-03-18 2016-08-09 Sumitomo Seika Chemicals Co., Ltd. Metal paste composition
WO2012128028A1 (ja) * 2011-03-18 2012-09-27 住友精化株式会社 金属ペースト組成物
KR102011523B1 (ko) 2011-03-18 2019-08-16 스미토모 세이카 가부시키가이샤 금속 페이스트 조성물
KR20160118263A (ko) 2014-02-06 2016-10-11 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 온도 센서용 수지 조성물, 온도 센서용 소자, 온도 센서 및 온도 센서용 소자의 제조 방법
US10302506B2 (en) 2014-02-06 2019-05-28 Japan Science And Technology Agency Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor
JP7118582B2 (ja) 2016-09-09 2022-08-16 東洋紡株式会社 展延性導電性組成物および三次元プリント配線板の製造方法
JP2018041692A (ja) * 2016-09-09 2018-03-15 東洋紡株式会社 展延性導電性組成物および三次元プリント配線板の製造方法
WO2019039511A1 (ja) * 2017-08-24 2019-02-28 東洋紡株式会社 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器
JPWO2019039511A1 (ja) * 2017-08-24 2020-07-30 東洋紡株式会社 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器
JP7147767B2 (ja) 2017-08-24 2022-10-05 東洋紡株式会社 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器
US11469010B2 (en) 2017-08-24 2022-10-11 Toyobo Co., Ltd. Conductive paste, stretchable conductor and electronic component using same, and clothes-type electronic device
KR20210000486A (ko) * 2019-06-25 2021-01-05 주식회사 토우테크 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름
KR102199895B1 (ko) * 2019-06-25 2021-01-08 주식회사 토우테크 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름

Also Published As

Publication number Publication date
JPWO2008133073A1 (ja) 2010-07-22
KR20100015580A (ko) 2010-02-12

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