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WO2008133073A1 - Conductive paste, and printed circuit board and planar heat generating body each using the same - Google Patents

Conductive paste, and printed circuit board and planar heat generating body each using the same Download PDF

Info

Publication number
WO2008133073A1
WO2008133073A1 PCT/JP2008/057246 JP2008057246W WO2008133073A1 WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1 JP 2008057246 W JP2008057246 W JP 2008057246W WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive paste
circuit board
printed circuit
heat generating
generating body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057246
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuhiro Abe
Keiko Taga
Hiroshi Tachika
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP2008523466A priority Critical patent/JPWO2008133073A1/en
Publication of WO2008133073A1 publication Critical patent/WO2008133073A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
    • H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is a conductive paste which is excellent in electrical conductivity, adhesion and bending resistance. This conductive paste exhibits excellent PTC characteristics even though it has low resistivity. Specifically disclosed is a conductive paste containing 40-200 parts by mass of a spherical carbon particle per 100 parts by mass of a resin containing a polyester resin and/or a polyurethane resin. This conductive paste is characterized in that the polyester resin and/or the polyurethane resin has a number average molecular weight of not less than 3000 and a glass transition temperature of from -40˚C to 30˚C. Also specifically disclosed are a printed circuit board and a planar heat generating body, each using such a conductive paste.
PCT/JP2008/057246 2007-04-18 2008-04-14 Conductive paste, and printed circuit board and planar heat generating body each using the same Ceased WO2008133073A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008523466A JPWO2008133073A1 (en) 2007-04-18 2008-04-14 Conductive paste, printed circuit using the same, and planar heating element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007109189 2007-04-18
JP2007-109189 2007-04-18

Publications (1)

Publication Number Publication Date
WO2008133073A1 true WO2008133073A1 (en) 2008-11-06

Family

ID=39925531

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057246 Ceased WO2008133073A1 (en) 2007-04-18 2008-04-14 Conductive paste, and printed circuit board and planar heat generating body each using the same

Country Status (3)

Country Link
JP (1) JPWO2008133073A1 (en)
KR (1) KR20100015580A (en)
WO (1) WO2008133073A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012128028A1 (en) * 2011-03-18 2012-09-27 住友精化株式会社 Metal paste composition
KR20160118263A (en) 2014-02-06 2016-10-11 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor
JP2018041692A (en) * 2016-09-09 2018-03-15 東洋紡株式会社 Expandable conductive composition and method for producing three-dimensional printed wiring board
WO2019039511A1 (en) * 2017-08-24 2019-02-28 東洋紡株式会社 Conductive paste, stretchable conductor and electronic component using same, and wearable electronic device
KR20210000486A (en) * 2019-06-25 2021-01-05 주식회사 토우테크 PTC Carbon Ink Composition And Planar Heating Film Using It

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101316762B1 (en) * 2011-09-29 2013-10-10 (주)오리엔탈드림 Mesh heating element and method for manufacturing it
KR101276726B1 (en) * 2013-01-07 2013-06-19 김윤정 Preparation of flexible carbon fiber
KR101947518B1 (en) * 2016-03-30 2019-05-10 (재)울산테크노파크 Paste compositions Fabrication method of High-temperature PTC having self-switch function
KR101970911B1 (en) * 2018-02-02 2019-04-22 영남대학교 산학협력단 Method of manufacturing a flexible and elastic substrate having electric circuit
KR102170762B1 (en) * 2018-11-22 2020-10-27 주식회사 렉스바 Heating film module
KR102342365B1 (en) * 2020-07-13 2021-12-22 동국성신(주) The conposition for heating apparatus of heating plate's heater, and the heating apparatus using the conposition, and the heating plate's heater having the heating apparatus
KR102584801B1 (en) * 2021-01-27 2023-10-06 주식회사 파루인쇄전자 Heating pad comprising plane heater, and manufacturing method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02272702A (en) * 1989-04-14 1990-11-07 Tokyo Cosmos Electric Co Ltd Ptc resistor
JPH0696843A (en) * 1992-06-22 1994-04-08 Nippon Carbon Co Ltd Temperature self-control conductive composition, temperature self-control surface heating element and temperature self-control pipe heater
JP2001011354A (en) * 1999-07-02 2001-01-16 Honny Chem Ind Co Ltd Printing ink for self-temperature controlled heater
JP2002260442A (en) * 2001-03-06 2002-09-13 Toyobo Co Ltd Conductive paste
JP2005259546A (en) * 2004-03-12 2005-09-22 Toyobo Co Ltd Conductive paste for rotary screen printing apparatus and conductor circuit using the same
JP2006085978A (en) * 2004-09-15 2006-03-30 Toyobo Co Ltd Conductive resin composition and planar heating element using this

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5033707B2 (en) * 1972-12-13 1975-11-01
JP3312600B2 (en) * 1998-09-17 2002-08-12 扇化学工業株式会社 Resin composition having PTC properties

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02272702A (en) * 1989-04-14 1990-11-07 Tokyo Cosmos Electric Co Ltd Ptc resistor
JPH0696843A (en) * 1992-06-22 1994-04-08 Nippon Carbon Co Ltd Temperature self-control conductive composition, temperature self-control surface heating element and temperature self-control pipe heater
JP2001011354A (en) * 1999-07-02 2001-01-16 Honny Chem Ind Co Ltd Printing ink for self-temperature controlled heater
JP2002260442A (en) * 2001-03-06 2002-09-13 Toyobo Co Ltd Conductive paste
JP2005259546A (en) * 2004-03-12 2005-09-22 Toyobo Co Ltd Conductive paste for rotary screen printing apparatus and conductor circuit using the same
JP2006085978A (en) * 2004-09-15 2006-03-30 Toyobo Co Ltd Conductive resin composition and planar heating element using this

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140038391A (en) * 2011-03-18 2014-03-28 스미토모 세이카 가부시키가이샤 Metal paste composition
JPWO2012128028A1 (en) * 2011-03-18 2014-07-24 住友精化株式会社 Metal paste composition
US9414487B2 (en) 2011-03-18 2016-08-09 Sumitomo Seika Chemicals Co., Ltd. Metal paste composition
WO2012128028A1 (en) * 2011-03-18 2012-09-27 住友精化株式会社 Metal paste composition
KR102011523B1 (en) 2011-03-18 2019-08-16 스미토모 세이카 가부시키가이샤 Metal paste composition
KR20160118263A (en) 2014-02-06 2016-10-11 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor
US10302506B2 (en) 2014-02-06 2019-05-28 Japan Science And Technology Agency Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor
JP7118582B2 (en) 2016-09-09 2022-08-16 東洋紡株式会社 Spreadable conductive composition and method for producing three-dimensional printed wiring board
JP2018041692A (en) * 2016-09-09 2018-03-15 東洋紡株式会社 Expandable conductive composition and method for producing three-dimensional printed wiring board
WO2019039511A1 (en) * 2017-08-24 2019-02-28 東洋紡株式会社 Conductive paste, stretchable conductor and electronic component using same, and wearable electronic device
JPWO2019039511A1 (en) * 2017-08-24 2020-07-30 東洋紡株式会社 Conductive paste, stretchable conductor and electronic parts using the same, clothes-type electronic equipment
JP7147767B2 (en) 2017-08-24 2022-10-05 東洋紡株式会社 Conductive pastes, stretchable conductors and electronic components using them, clothing-type electronic devices
US11469010B2 (en) 2017-08-24 2022-10-11 Toyobo Co., Ltd. Conductive paste, stretchable conductor and electronic component using same, and clothes-type electronic device
KR20210000486A (en) * 2019-06-25 2021-01-05 주식회사 토우테크 PTC Carbon Ink Composition And Planar Heating Film Using It
KR102199895B1 (en) * 2019-06-25 2021-01-08 주식회사 토우테크 PTC Carbon Ink Composition And Planar Heating Film Using It

Also Published As

Publication number Publication date
JPWO2008133073A1 (en) 2010-07-22
KR20100015580A (en) 2010-02-12

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