WO2008133073A1 - Pâte conductrice, et carte de circuit imprimé et corps de génération de chaleur plan utilisant chacun celle-ci - Google Patents
Pâte conductrice, et carte de circuit imprimé et corps de génération de chaleur plan utilisant chacun celle-ci Download PDFInfo
- Publication number
- WO2008133073A1 WO2008133073A1 PCT/JP2008/057246 JP2008057246W WO2008133073A1 WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1 JP 2008057246 W JP2008057246 W JP 2008057246W WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive paste
- circuit board
- printed circuit
- heat generating
- generating body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008523466A JPWO2008133073A1 (ja) | 2007-04-18 | 2008-04-14 | 導電性ペースト及びこれを用いた印刷回路、面状発熱体 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007109189 | 2007-04-18 | ||
| JP2007-109189 | 2007-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008133073A1 true WO2008133073A1 (fr) | 2008-11-06 |
Family
ID=39925531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/057246 Ceased WO2008133073A1 (fr) | 2007-04-18 | 2008-04-14 | Pâte conductrice, et carte de circuit imprimé et corps de génération de chaleur plan utilisant chacun celle-ci |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2008133073A1 (fr) |
| KR (1) | KR20100015580A (fr) |
| WO (1) | WO2008133073A1 (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012128028A1 (fr) * | 2011-03-18 | 2012-09-27 | 住友精化株式会社 | Composition de pâte métallique |
| KR20160118263A (ko) | 2014-02-06 | 2016-10-11 | 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 | 온도 센서용 수지 조성물, 온도 센서용 소자, 온도 센서 및 온도 센서용 소자의 제조 방법 |
| JP2018041692A (ja) * | 2016-09-09 | 2018-03-15 | 東洋紡株式会社 | 展延性導電性組成物および三次元プリント配線板の製造方法 |
| WO2019039511A1 (fr) * | 2017-08-24 | 2019-02-28 | 東洋紡株式会社 | Pâte conductrice, conducteur extensible et composant électronique l'utilisant, et dispositif électronique vestimentaire |
| KR20210000486A (ko) * | 2019-06-25 | 2021-01-05 | 주식회사 토우테크 | 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101316762B1 (ko) * | 2011-09-29 | 2013-10-10 | (주)오리엔탈드림 | 망사발열체 및 그 제조방법 |
| KR101276726B1 (ko) * | 2013-01-07 | 2013-06-19 | 김윤정 | 유연성 발열체 원단의 제조방법 |
| KR101947518B1 (ko) * | 2016-03-30 | 2019-05-10 | (재)울산테크노파크 | 셀프 스위치 기능을 부가한 고온용 ptc 페이스트 조성물 제조방법 |
| KR101970911B1 (ko) * | 2018-02-02 | 2019-04-22 | 영남대학교 산학협력단 | 도전 회로를 갖춘 굴곡성과 신축성의 기판의 제조 방법 |
| KR102170762B1 (ko) * | 2018-11-22 | 2020-10-27 | 주식회사 렉스바 | 누설 전류를 제거할 수 있는 온열 필름모듈 |
| KR102342365B1 (ko) * | 2020-07-13 | 2021-12-22 | 동국성신(주) | 면상발열체 히터의 발열부용 조성물, 상기 조성물을 이용한 발열부 및 상기 발열부를 가지는 면상발열체 히터 |
| KR102584801B1 (ko) * | 2021-01-27 | 2023-10-06 | 주식회사 파루인쇄전자 | 면상발열체를 포함하는 발열 패드 및 이의 제조방법 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02272702A (ja) * | 1989-04-14 | 1990-11-07 | Tokyo Cosmos Electric Co Ltd | Ptc抵抗体 |
| JPH0696843A (ja) * | 1992-06-22 | 1994-04-08 | Nippon Carbon Co Ltd | 温度自己制御性導電性組成物、温度自己制御性面状発熱体および温度自己制御性パイプ状ヒーター |
| JP2001011354A (ja) * | 1999-07-02 | 2001-01-16 | Honny Chem Ind Co Ltd | 自己温度制御ヒーター用印刷インク |
| JP2002260442A (ja) * | 2001-03-06 | 2002-09-13 | Toyobo Co Ltd | 導電性ペースト |
| JP2005259546A (ja) * | 2004-03-12 | 2005-09-22 | Toyobo Co Ltd | ロータリースクリーン印刷機用導電性ペースト及びそれを用いた導体回路 |
| JP2006085978A (ja) * | 2004-09-15 | 2006-03-30 | Toyobo Co Ltd | 導電性樹脂組成物及びこれを用いた面状発熱体 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5033707B2 (fr) * | 1972-12-13 | 1975-11-01 | ||
| JP3312600B2 (ja) * | 1998-09-17 | 2002-08-12 | 扇化学工業株式会社 | Ptc特性を有する樹脂組成物 |
-
2008
- 2008-04-14 KR KR1020097021467A patent/KR20100015580A/ko not_active Ceased
- 2008-04-14 JP JP2008523466A patent/JPWO2008133073A1/ja active Pending
- 2008-04-14 WO PCT/JP2008/057246 patent/WO2008133073A1/fr not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02272702A (ja) * | 1989-04-14 | 1990-11-07 | Tokyo Cosmos Electric Co Ltd | Ptc抵抗体 |
| JPH0696843A (ja) * | 1992-06-22 | 1994-04-08 | Nippon Carbon Co Ltd | 温度自己制御性導電性組成物、温度自己制御性面状発熱体および温度自己制御性パイプ状ヒーター |
| JP2001011354A (ja) * | 1999-07-02 | 2001-01-16 | Honny Chem Ind Co Ltd | 自己温度制御ヒーター用印刷インク |
| JP2002260442A (ja) * | 2001-03-06 | 2002-09-13 | Toyobo Co Ltd | 導電性ペースト |
| JP2005259546A (ja) * | 2004-03-12 | 2005-09-22 | Toyobo Co Ltd | ロータリースクリーン印刷機用導電性ペースト及びそれを用いた導体回路 |
| JP2006085978A (ja) * | 2004-09-15 | 2006-03-30 | Toyobo Co Ltd | 導電性樹脂組成物及びこれを用いた面状発熱体 |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140038391A (ko) * | 2011-03-18 | 2014-03-28 | 스미토모 세이카 가부시키가이샤 | 금속 페이스트 조성물 |
| JPWO2012128028A1 (ja) * | 2011-03-18 | 2014-07-24 | 住友精化株式会社 | 金属ペースト組成物 |
| US9414487B2 (en) | 2011-03-18 | 2016-08-09 | Sumitomo Seika Chemicals Co., Ltd. | Metal paste composition |
| WO2012128028A1 (fr) * | 2011-03-18 | 2012-09-27 | 住友精化株式会社 | Composition de pâte métallique |
| KR102011523B1 (ko) | 2011-03-18 | 2019-08-16 | 스미토모 세이카 가부시키가이샤 | 금속 페이스트 조성물 |
| KR20160118263A (ko) | 2014-02-06 | 2016-10-11 | 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 | 온도 센서용 수지 조성물, 온도 센서용 소자, 온도 센서 및 온도 센서용 소자의 제조 방법 |
| US10302506B2 (en) | 2014-02-06 | 2019-05-28 | Japan Science And Technology Agency | Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor |
| JP7118582B2 (ja) | 2016-09-09 | 2022-08-16 | 東洋紡株式会社 | 展延性導電性組成物および三次元プリント配線板の製造方法 |
| JP2018041692A (ja) * | 2016-09-09 | 2018-03-15 | 東洋紡株式会社 | 展延性導電性組成物および三次元プリント配線板の製造方法 |
| WO2019039511A1 (fr) * | 2017-08-24 | 2019-02-28 | 東洋紡株式会社 | Pâte conductrice, conducteur extensible et composant électronique l'utilisant, et dispositif électronique vestimentaire |
| JPWO2019039511A1 (ja) * | 2017-08-24 | 2020-07-30 | 東洋紡株式会社 | 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器 |
| JP7147767B2 (ja) | 2017-08-24 | 2022-10-05 | 東洋紡株式会社 | 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器 |
| US11469010B2 (en) | 2017-08-24 | 2022-10-11 | Toyobo Co., Ltd. | Conductive paste, stretchable conductor and electronic component using same, and clothes-type electronic device |
| KR20210000486A (ko) * | 2019-06-25 | 2021-01-05 | 주식회사 토우테크 | 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름 |
| KR102199895B1 (ko) * | 2019-06-25 | 2021-01-08 | 주식회사 토우테크 | 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100015580A (ko) | 2010-02-12 |
| JPWO2008133073A1 (ja) | 2010-07-22 |
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