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WO2008105332A1 - シート状積層体 - Google Patents

シート状積層体 Download PDF

Info

Publication number
WO2008105332A1
WO2008105332A1 PCT/JP2008/053028 JP2008053028W WO2008105332A1 WO 2008105332 A1 WO2008105332 A1 WO 2008105332A1 JP 2008053028 W JP2008053028 W JP 2008053028W WO 2008105332 A1 WO2008105332 A1 WO 2008105332A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
insulating layer
insulating
sheetlike laminate
needlelike
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053028
Other languages
English (en)
French (fr)
Inventor
Takatsugu Fukaishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2009501216A priority Critical patent/JP5520042B2/ja
Publication of WO2008105332A1 publication Critical patent/WO2008105332A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

【課題】導電層表面の樹脂被覆層の厚みを薄くしても優れた絶縁効果を有するシート状積層体を提供することを目的としている。 【解決手段】シート状積層体としてのテープ本体２ａが、基材１１と、第１導電層（黒色印刷層）１２と、第１絶縁層１３と、第２導電層（黒色印刷層）１４と、第２絶縁層１５と、白色印刷層１６とを備え、第１絶縁層１３および第２絶縁層１５が、それぞれ金属端子等の針状材が突き抜けようとするとき、針状材の表面に添設しながら延伸する弾性を備える電気絶縁性樹脂組成物で形成されている構成とした。
PCT/JP2008/053028 2007-02-28 2008-02-22 シート状積層体 Ceased WO2008105332A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009501216A JP5520042B2 (ja) 2007-02-28 2008-02-22 粘着テープ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007049162 2007-02-28
JP2007-049162 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105332A1 true WO2008105332A1 (ja) 2008-09-04

Family

ID=39721167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053028 Ceased WO2008105332A1 (ja) 2007-02-28 2008-02-22 シート状積層体

Country Status (3)

Country Link
JP (1) JP5520042B2 (ja)
CN (1) CN101616797A (ja)
WO (1) WO2008105332A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103231570A (zh) * 2013-04-11 2013-08-07 合肥京东方光电科技有限公司 一种薄膜层及其制作方法、显示用基板、液晶显示器
JPWO2017109883A1 (ja) * 2015-12-24 2018-10-04 株式会社寺岡製作所 両面粘着テープ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114953A (ja) * 1993-10-01 1995-05-02 G & H Technol Inc 電気的過剰ストレス・パルス回避装置
JP2005060435A (ja) * 2003-08-14 2005-03-10 Three M Innovative Properties Co 両面粘着シート
JP2006089537A (ja) * 2004-09-21 2006-04-06 Sekisui Chem Co Ltd 液晶パネル固定用粘着テープ
JP2006301169A (ja) * 2005-04-19 2006-11-02 Konica Minolta Opto Inc 液晶表示装置、液晶表示装置の製造方法、及びそれに用いる粘着層
WO2007141939A1 (ja) * 2006-06-06 2007-12-13 Sekisui Chemical Co., Ltd. 遮光用粘着テープ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684566B2 (ja) * 2004-03-25 2011-05-18 新日鐵化学株式会社 超音波接合用積層板及びこれを使用する超音波接合方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114953A (ja) * 1993-10-01 1995-05-02 G & H Technol Inc 電気的過剰ストレス・パルス回避装置
JP2005060435A (ja) * 2003-08-14 2005-03-10 Three M Innovative Properties Co 両面粘着シート
JP2006089537A (ja) * 2004-09-21 2006-04-06 Sekisui Chem Co Ltd 液晶パネル固定用粘着テープ
JP2006301169A (ja) * 2005-04-19 2006-11-02 Konica Minolta Opto Inc 液晶表示装置、液晶表示装置の製造方法、及びそれに用いる粘着層
WO2007141939A1 (ja) * 2006-06-06 2007-12-13 Sekisui Chemical Co., Ltd. 遮光用粘着テープ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103231570A (zh) * 2013-04-11 2013-08-07 合肥京东方光电科技有限公司 一种薄膜层及其制作方法、显示用基板、液晶显示器
CN103231570B (zh) * 2013-04-11 2016-03-30 合肥京东方光电科技有限公司 一种薄膜层及其制作方法、显示用基板、液晶显示器
JPWO2017109883A1 (ja) * 2015-12-24 2018-10-04 株式会社寺岡製作所 両面粘着テープ

Also Published As

Publication number Publication date
JPWO2008105332A1 (ja) 2010-06-03
CN101616797A (zh) 2009-12-30
JP5520042B2 (ja) 2014-06-11

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