[go: up one dir, main page]

WO2008105332A1 - Stratifié de type feuille - Google Patents

Stratifié de type feuille Download PDF

Info

Publication number
WO2008105332A1
WO2008105332A1 PCT/JP2008/053028 JP2008053028W WO2008105332A1 WO 2008105332 A1 WO2008105332 A1 WO 2008105332A1 JP 2008053028 W JP2008053028 W JP 2008053028W WO 2008105332 A1 WO2008105332 A1 WO 2008105332A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
insulating layer
insulating
sheetlike laminate
needlelike
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053028
Other languages
English (en)
Japanese (ja)
Inventor
Takatsugu Fukaishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2009501216A priority Critical patent/JP5520042B2/ja
Publication of WO2008105332A1 publication Critical patent/WO2008105332A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

L'invention vise à proposer un stratifié de type feuille présentant un excellent effet d'isolation même si une couche de revêtement de résine sur la surface d'une couche conductrice est réalisée mince. À cet effet, un corps effilé (2a) en tant que stratifié de type feuille comprend un substrat (11), une première couche conductrice (couche d'impression en noir) (12), une première couche isolante (13), une seconde couche conductrice (couche d'impression en noir) (14), une seconde couche isolante (15) et une couche d'impression en blanc (16). La première couche isolante (13) et la seconde couche isolante (15) sont formées à partir d'une composition de résine élastique électriquement isolante qui s'allonge le long de la surface d'un matériau de type aiguille, tel qu'une borne métallique, lorsque le matériau de type aiguille est amené à passer à travers la couche isolante.
PCT/JP2008/053028 2007-02-28 2008-02-22 Stratifié de type feuille Ceased WO2008105332A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009501216A JP5520042B2 (ja) 2007-02-28 2008-02-22 粘着テープ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-049162 2007-02-28
JP2007049162 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105332A1 true WO2008105332A1 (fr) 2008-09-04

Family

ID=39721167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053028 Ceased WO2008105332A1 (fr) 2007-02-28 2008-02-22 Stratifié de type feuille

Country Status (3)

Country Link
JP (1) JP5520042B2 (fr)
CN (1) CN101616797A (fr)
WO (1) WO2008105332A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103231570A (zh) * 2013-04-11 2013-08-07 合肥京东方光电科技有限公司 一种薄膜层及其制作方法、显示用基板、液晶显示器
JPWO2017109883A1 (ja) * 2015-12-24 2018-10-04 株式会社寺岡製作所 両面粘着テープ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114953A (ja) * 1993-10-01 1995-05-02 G & H Technol Inc 電気的過剰ストレス・パルス回避装置
JP2005060435A (ja) * 2003-08-14 2005-03-10 Three M Innovative Properties Co 両面粘着シート
JP2006089537A (ja) * 2004-09-21 2006-04-06 Sekisui Chem Co Ltd 液晶パネル固定用粘着テープ
JP2006301169A (ja) * 2005-04-19 2006-11-02 Konica Minolta Opto Inc 液晶表示装置、液晶表示装置の製造方法、及びそれに用いる粘着層
WO2007141939A1 (fr) * 2006-06-06 2007-12-13 Sekisui Chemical Co., Ltd. Bande adhésive bloquant la lumière

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684566B2 (ja) * 2004-03-25 2011-05-18 新日鐵化学株式会社 超音波接合用積層板及びこれを使用する超音波接合方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114953A (ja) * 1993-10-01 1995-05-02 G & H Technol Inc 電気的過剰ストレス・パルス回避装置
JP2005060435A (ja) * 2003-08-14 2005-03-10 Three M Innovative Properties Co 両面粘着シート
JP2006089537A (ja) * 2004-09-21 2006-04-06 Sekisui Chem Co Ltd 液晶パネル固定用粘着テープ
JP2006301169A (ja) * 2005-04-19 2006-11-02 Konica Minolta Opto Inc 液晶表示装置、液晶表示装置の製造方法、及びそれに用いる粘着層
WO2007141939A1 (fr) * 2006-06-06 2007-12-13 Sekisui Chemical Co., Ltd. Bande adhésive bloquant la lumière

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103231570A (zh) * 2013-04-11 2013-08-07 合肥京东方光电科技有限公司 一种薄膜层及其制作方法、显示用基板、液晶显示器
CN103231570B (zh) * 2013-04-11 2016-03-30 合肥京东方光电科技有限公司 一种薄膜层及其制作方法、显示用基板、液晶显示器
JPWO2017109883A1 (ja) * 2015-12-24 2018-10-04 株式会社寺岡製作所 両面粘着テープ

Also Published As

Publication number Publication date
CN101616797A (zh) 2009-12-30
JP5520042B2 (ja) 2014-06-11
JPWO2008105332A1 (ja) 2010-06-03

Similar Documents

Publication Publication Date Title
WO2007096096A3 (fr) Électrode de surface biomédicale
WO2010028007A3 (fr) Bande conductrice de l'électricité pour murs et plafonds
TW200701264A (en) Inductor
ATE439683T1 (de) Schaltungsanordnung mit verbindungseinrichtung sowie herstellungsverfahren hierzu
WO2007022226A3 (fr) Conducteurs transparents a base de nanofils
WO2008081904A1 (fr) Plaque gravée et matériau de base ayant un motif de couche conductrice utilisant la plaque gravée
WO2008097724A3 (fr) Couche de passivation pour un dispositif à circuit et procédé de fabrication
WO2007092296A3 (fr) Conducteurs composites transparents ayant un travail de sortie élevé
WO2008133737A3 (fr) Dispositif électrochromique
WO2007092808A3 (fr) Accouplement direct de fils
WO2009021741A8 (fr) Composants électroniques organiques
SG141415A1 (en) Flexible printed circuit board
WO2009150546A3 (fr) Capteurs à commutateur capacitif sur fond de films intramoules décoratifs
WO2011063082A3 (fr) Adhésifs à surface modifiée
MY166609A (en) Connector assembly and method of manufacture
WO2011118911A3 (fr) Pavé pour écran tactile et écran tactile utilisant le pavé
WO2009075079A1 (fr) Carte de circuit imprimé, procédé de fabrication de carte de circuit imprimé, et film de protection photosensible
WO2009085631A3 (fr) Ruban adhésif et procédé de préparation associé
WO2009001946A1 (fr) Écran tactile et dispositif d'affichage de type à écran tactile
TW200733824A (en) Wiring circuit board
MX2012000843A (es) Sistema mejorado de barras colectoras para transparencias de aeronaves.
TW200739612A (en) Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
WO2007122227A3 (fr) Piézo-actionneur comportant un encapsulage multicouche et procédé de fabrication
TW201130093A (en) Substrate for mounting element, and method for manufacturing the substrate
WO2008105332A1 (fr) Stratifié de type feuille

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880005598.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08711802

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009501216

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08711802

Country of ref document: EP

Kind code of ref document: A1