[go: up one dir, main page]

WO2008105332A1 - Sheetlike laminate - Google Patents

Sheetlike laminate Download PDF

Info

Publication number
WO2008105332A1
WO2008105332A1 PCT/JP2008/053028 JP2008053028W WO2008105332A1 WO 2008105332 A1 WO2008105332 A1 WO 2008105332A1 JP 2008053028 W JP2008053028 W JP 2008053028W WO 2008105332 A1 WO2008105332 A1 WO 2008105332A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
insulating layer
insulating
sheetlike laminate
needlelike
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053028
Other languages
French (fr)
Japanese (ja)
Inventor
Takatsugu Fukaishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2009501216A priority Critical patent/JP5520042B2/en
Publication of WO2008105332A1 publication Critical patent/WO2008105332A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

[PROBLEMS] To provide a sheetlike laminate exhibiting an excellent insulation effect even if a resin coating layer on the surface of a conductive layer is made thin. [MEANS FOR SOLVING PROBLEMS] A tape body (2a) as a sheetlike laminate comprises a substrate (11), a first conductive layer (black print layer) (12), a first insulating layer (13), a second conductive layer (black print layer) (14), a second insulating layer (15), and a white print layer (16). The first insulating layer (13) and the second insulating layer (15) are formed of an electrically insulating elastic resin composition which elongates along the surface of a needlelike material such as a metal terminal when the needlelike material goes through the insulating layer.
PCT/JP2008/053028 2007-02-28 2008-02-22 Sheetlike laminate Ceased WO2008105332A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009501216A JP5520042B2 (en) 2007-02-28 2008-02-22 Adhesive tape

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-049162 2007-02-28
JP2007049162 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105332A1 true WO2008105332A1 (en) 2008-09-04

Family

ID=39721167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053028 Ceased WO2008105332A1 (en) 2007-02-28 2008-02-22 Sheetlike laminate

Country Status (3)

Country Link
JP (1) JP5520042B2 (en)
CN (1) CN101616797A (en)
WO (1) WO2008105332A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103231570A (en) * 2013-04-11 2013-08-07 合肥京东方光电科技有限公司 A thin film layer and a manufacturing method thereof, a substrate for display, and a liquid crystal display
JPWO2017109883A1 (en) * 2015-12-24 2018-10-04 株式会社寺岡製作所 Double-sided adhesive tape

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114953A (en) * 1993-10-01 1995-05-02 G & H Technol Inc Avoidance device of electric excessive stress pulse
JP2005060435A (en) * 2003-08-14 2005-03-10 Three M Innovative Properties Co Double-sided pressure-sensitive adhesive sheet
JP2006089537A (en) * 2004-09-21 2006-04-06 Sekisui Chem Co Ltd Adhesive tape for LCD panel fixing
JP2006301169A (en) * 2005-04-19 2006-11-02 Konica Minolta Opto Inc Liquid crystal display device, method for manufacturing liquid crystal display device, and adhesive layer used therefor
WO2007141939A1 (en) * 2006-06-06 2007-12-13 Sekisui Chemical Co., Ltd. Light blocking adhesive tape

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684566B2 (en) * 2004-03-25 2011-05-18 新日鐵化学株式会社 Laminate for ultrasonic bonding and ultrasonic bonding method using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114953A (en) * 1993-10-01 1995-05-02 G & H Technol Inc Avoidance device of electric excessive stress pulse
JP2005060435A (en) * 2003-08-14 2005-03-10 Three M Innovative Properties Co Double-sided pressure-sensitive adhesive sheet
JP2006089537A (en) * 2004-09-21 2006-04-06 Sekisui Chem Co Ltd Adhesive tape for LCD panel fixing
JP2006301169A (en) * 2005-04-19 2006-11-02 Konica Minolta Opto Inc Liquid crystal display device, method for manufacturing liquid crystal display device, and adhesive layer used therefor
WO2007141939A1 (en) * 2006-06-06 2007-12-13 Sekisui Chemical Co., Ltd. Light blocking adhesive tape

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103231570A (en) * 2013-04-11 2013-08-07 合肥京东方光电科技有限公司 A thin film layer and a manufacturing method thereof, a substrate for display, and a liquid crystal display
CN103231570B (en) * 2013-04-11 2016-03-30 合肥京东方光电科技有限公司 A kind of film layer and its manufacturing method, substrate for display, liquid crystal display
JPWO2017109883A1 (en) * 2015-12-24 2018-10-04 株式会社寺岡製作所 Double-sided adhesive tape

Also Published As

Publication number Publication date
JP5520042B2 (en) 2014-06-11
CN101616797A (en) 2009-12-30
JPWO2008105332A1 (en) 2010-06-03

Similar Documents

Publication Publication Date Title
WO2007096096A3 (en) Biomedical surface electrode
WO2010028007A3 (en) Electrically conductive tape for walls and ceilings
TW200701264A (en) Inductor
ATE439683T1 (en) CIRCUIT ARRANGEMENT WITH CONNECTION DEVICE AND PRODUCTION METHOD THEREOF
WO2008081904A1 (en) Engraved plate and base material having conductor layer pattern using the engraved plate
WO2008097724A3 (en) Passivation layer for a circuit device and method of manufacture
WO2007092296A3 (en) Transparent composite conductors having high work function
WO2008133737A3 (en) Electrochromic device
WO2007092808A3 (en) Direct wire attach
WO2009021741A8 (en) Organic electronic components
SG141415A1 (en) Flexible printed circuit board
WO2009150546A3 (en) Interior trim piece with electrical circuit path made from conductive ink/paint, and production process
WO2011063082A3 (en) Surface-modified adhesives
MY166609A (en) Connector assembly and method of manufacture
WO2011118911A3 (en) Pad for touch panel and touch panel using same
WO2009075079A1 (en) Circuit board, circuit board manufacturing method, and cover ray film
WO2009001946A1 (en) Touch panel, and touch panel type display device
TW200733824A (en) Wiring circuit board
MX2012000843A (en) Enhanced bus bar system for aircraft transparencies.
TW200739612A (en) Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
WO2007122227A3 (en) Piezo actuator comprising a multilayer encapsulation, and method for the production thereof
TW201130093A (en) Substrate for mounting element, and method for manufacturing the substrate
WO2008105332A1 (en) Sheetlike laminate
WO2006094040A3 (en) A method for pattern metalization of substrates
GB2466163A (en) Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880005598.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08711802

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009501216

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08711802

Country of ref document: EP

Kind code of ref document: A1