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WO2008050791A1 - Plaque de micropuce et procédé de production de cette plaque - Google Patents

Plaque de micropuce et procédé de production de cette plaque Download PDF

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Publication number
WO2008050791A1
WO2008050791A1 PCT/JP2007/070704 JP2007070704W WO2008050791A1 WO 2008050791 A1 WO2008050791 A1 WO 2008050791A1 JP 2007070704 W JP2007070704 W JP 2007070704W WO 2008050791 A1 WO2008050791 A1 WO 2008050791A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
polyolefin
microchip plate
microchip
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/070704
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English (en)
Japanese (ja)
Inventor
Yoshinao Taniguchi
Yoshihiro Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2008541006A priority Critical patent/JP4693907B2/ja
Publication of WO2008050791A1 publication Critical patent/WO2008050791A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
    • B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9241—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force or the mechanical power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles

Definitions

  • the present invention relates to a microchip plate and a manufacturing method thereof, and more particularly to a microchip suitable for performing various chemical processes on a chip and a manufacturing method thereof.
  • FIG. 4 and FIG. 5 show an example of a conventional microchip plate.
  • the microchip plate 21 joins a resin-made second material 23 in which minute flow channel-like channels 24 and holes 25 are formed to a resin-made thin flat plate-like first material 22. Is formed.
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2005-77218
  • the present invention has been made in view of these points. By bonding an adhesive sheet between a first resin material and a second material and bonding the two materials, the temperature at the time of bonding can be reduced. It is an object of the present invention to provide a microchip plate and a method for manufacturing the microchip plate which are suitable for mass production with a short manufacturing time by reducing the pressure and contact pressure, eliminating the occurrence of channel crushing and cracking.
  • Another object of the present invention is to provide a microchip plate with low fluorescence by using a low fluorescence olefin resin as a main material.
  • a microchip plate according to the present invention includes a first material formed of polyolefin and a second material formed of polyolefin and having a channel formed on the opposite surface. And an adhesive sheet formed of an elastomeric polyolefin, the adhesive sheet being interposed between the first material and the second material, and joining the two materials.
  • the microchip plate manufacturing method for manufacturing the microchip plate of the present invention thus formed includes a first material formed of polyolefin, a channel formed on the opposing surface and formed of polyolefin.
  • An adhesive sheet formed of elastomer-like polyolefin is interposed between the second material on which the first material and the second material are formed, and the first material and the second material are pressed against each other. And both materials are joined by the adhesive sheet.
  • the first material and the second material are formed using an adhesive sheet made of olefin-based resin.
  • the material can be firmly bonded.
  • the first material and the second material can be joined using an adhesive sheet, it is possible to lower the temperature at the time of joining and lower the pressure contact pressure. It is possible to obtain a microchip plate that does not generate cracks and is suitable for mass production with a short manufacturing time and a manufacturing method thereof.
  • the first material, the second material, and the adhesive sheet are a cyclic polyolefin polymer, a chain polyolefin polymer, a cyclic polyolefin polymer, and a chain. It is preferably one of the copolymers with a glassy polyolefin. The combination of these materials provides stronger adhesion than other cases.
  • the molecular weight of the polyolefin in the adhesive sheet may be tens of thousands of force, etc., 5 million, more preferably 1 million force, etc. It is good to be in the range.
  • the adhesiveness is further improved due to the low molecular weight, and the first material and the second material are joined by the adhesive sheet. Can be surely performed.
  • the polyolefin of the adhesive sheet does not have a peak derived from a benzene ring or a double bond in the IR spectrum, and is 1705 cm. — 1, 1745 cm— 1, 1546 cm— 1, 1250 cm— 1 and 950 cm—1 It should be formed so as not to have a peak in the vicinity.
  • the fluorescence of the adhesive sheet can be further reduced.
  • the adhesive sheet is heated to a room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material and the second material are heated.
  • preparative 30 ⁇ 500kgf / cm 2 preferably may pressure Caro to 30 ⁇ 300kgf / cm 2.
  • a microchip plate with improved adhesion can be produced. If the temperature is in the range of 50 to 90 ° C, there will be no effect of heat on the first and second materials.
  • the adhesive sheet formed separately from both materials before joining the first material and the second material is the adhesive sheet formed separately from both materials before joining the first material and the second material? It is good to apply in advance to the facing surface of either one of the two materials.
  • the structure of the adhesive sheet is formed separately from both materials before joining the first material and the second material. Or by selecting to apply in advance to the opposing surface of either material.
  • the microchip plate according to the present invention includes a first material made of polyolefin, a second material made of polyolefin and having a channel formed on the opposite surface, polyolefin and PDMS. And an adhesive sheet that is interposed between the first material and the second material to join the two materials together.
  • the microchip plate manufacturing method for manufacturing the microchip plate of the present invention thus formed includes a first material formed of polyolefin, a channel formed on the opposing surface and formed of polyolefin.
  • An adhesive sheet formed of a mixture of polyolefin and PDMS is interposed between the second material on which the material is formed, and the adhesive sheet is heated and the first material and the second material are pressed against each other. Both materials are joined by the adhesive sheet.
  • the microchip plate according to the present invention formed as described above is manufactured by the above-described manufacturing method, it is possible to reduce the temperature at the time of bonding and the pressure contact pressure. Therefore, it is possible to obtain a microchip plate and a method for manufacturing the microchip plate that are free from crushing of channels and cracks, have a short manufacturing time, and are suitable for mass production.
  • the adhesive sheet is heated to a room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material and the second material are heated. And the 30 ⁇ 500kgf / c m 2
  • the caloric pressure is preferably 30 to 300 kgf / cm 2 .
  • microchip plate manufacturing method of the present invention in addition to the above-described function, a microchip plate with improved adhesion can be manufactured.
  • the adhesive sheet is formed separately from the two materials before joining the first material and the second material, or by pre-applying to the opposite surface of either material. It ’s the power to do.
  • the adhesive sheet may be formed by mixing PDMS in an amount of 10 wt% to 80 wt% with respect to polyolefin.
  • the adhesive strength of the adhesive sheet and low fluorescence can be further improved by adjusting the mixing ratio of PDMS to polyolefin. And can be adjusted.
  • the first material and the second material may be polyolefins having a cyclic molecular structure.
  • the first material and the second material can be satisfactorily bonded by the adhesive sheet, and the overall low Fluorescence can be satisfied.
  • the two materials are joined by interposing an adhesive sheet between the first material and the second material made of resin. It is possible to lower the temperature at the time of joining and lower the pressure contact pressure, eliminating the occurrence of channel crushing and cracking, and suitable for mass production with a short manufacturing time and a manufacturing method thereof It has an excellent effect that it can be obtained.
  • the present invention has an excellent effect when it is possible to obtain a microchip plate with low fluorescence by using a low-fluorescence olefin resin as a main material.
  • FIG. 1 is a cross-sectional view showing an embodiment of a microchip plate according to the present invention, (a) is a cross-sectional view showing a state before joining, and (b) is a cross-sectional view showing after joining.
  • FIG. 3 Diagram showing the fluorescence amount of the chip when the depth of focus is changed after bonding as a microchip plate chip
  • FIG. 4 is a perspective view showing a conventional microchip plate.
  • FIG. 6 is a plan view showing a state where a crack or the like of a conventional microchip plate has occurred.
  • the polyolefin used here is a cyclic olefin-based polymer such as ZEONEX (manufactured by ZEON), ARTON (manufactured by Nippon Synthetic Rubber), Topas (manufactured by polyplastic), or a chain olefin-based polymer such as polyethylene polypropylene, or It is a copolymer of cyclic olefin and chain olefin.
  • FIG. 1 shows a first embodiment of the microchip plate and the manufacturing method thereof according to the present invention, where FIG. 1 (a) shows the state before joining, and FIG. 1 (b) shows the joining. Indicates the later state.
  • the microchip plate 1 of the present embodiment has a second material in which channels 4 and holes (not shown) in the form of microchannels are formed with respect to the first flat plate-like material 2 made of resin. 3 is bonded using a low molecular weight polyolefin thin adhesive sheet 6! /.
  • the thickness of the first material 2 is about 20 ⁇ m, and is formed of a resin made of polyolefin.
  • the depth and width of the channel 4 formed in the second material 3 are about 50 to about 100 m, respectively, and the thickness of the second material 3 is about twice the depth of the recess 8a. is there.
  • This second material 3 is It is formed of a resin made of polyolefin, more preferably a norbornene-based cyclic polyolefin, and is formed by integral molding of the resin so as to provide a channel 4 and a port (not shown).
  • Table 1 shows the results of evaluating the adhesive strength of the first material 2, the second material 3, and the adhesive sheet 6 and the fluorescence intensity of the material by selecting the material of the second material 3. As can be seen from Table 1, by forming the second material 3 with a norbornene-based cyclic polyolefin, it is possible to increase adhesive strength and satisfy low fluorescence.
  • Adhesive sheet 6 has a thickness of 1 to 500 111, more preferably, before compression bonding of both materials 1 and 2
  • the material is formed of a single low molecular weight polyolefin resin.
  • the molecular weight of the polyolefin in the adhesive sheet 6 may be in the range of tens of thousands of force, 5 million, and more preferably in the range of 1 million to 2 million. If the molecular weight is less than tens of thousands, it cannot exert adhesiveness. If the molecular weight exceeds 5,000,000, it will be inconvenient to make a gel or elastomer at room temperature! /, Etc.
  • the polyolefin of the adhesive sheet 6 has a peak force derived from a benzene ring or a double bond in the IR spectrum, 1705cm-1, 1745cm-1 1546cm—1, 1250cm—1 and 950cm—has peaks near 1 It is good to form so as not to.
  • polyolefin is an acrylic carbonyl near 1 745 cm-1, an ester-based carbonyl near 1705 cm-1, an ionomer structure near 1546 cm-1, 1250 cm-1, and a 950 cm-1 vicinity. This is because the terminal bull emits fluorescence.
  • FIG. 2 Three types of polyolefins A, B, and C with adjusted locations of these peak values were prepared, and the IR spectrum was measured as shown in Fig. 2. The focal depth was changed after bonding as microchip plate chip 1.
  • Figure 3 shows the results of measuring the amount of fluorescence from the chip at that time.
  • both the raw materials 2 and 3 and the adhesive sheet 6 are made of a resin material, the mutual bonding is firmly performed, and the microchip plate 1 becomes higher quality.
  • both materials 2 and 3 are made of glass, it is necessary to perform some kind of pretreatment such as hydrophilic treatment on the adhesive sheet 6.
  • pretreatment is not necessary. The process is simple and can be manufactured in a short time.
  • adhesive sheet 6 is applied in advance to the opposing surface of either material 2 or 3 with force S formed separately from first material 2 and second material 4 before joining. May be formed.
  • both the raw materials 2, 3 and the adhesive sheet 6 are heated by a hot press (not shown) to heat the adhesive sheet 6 to a state where it can be elastically deformed and gradually compressed.
  • the heating temperature of the adhesive sheet 6 at this time is room temperature to 100 ° C, preferably 50 to 90 ° C.
  • room temperature for example, 15 ° C., the same applies hereinafter
  • the pressure applied to the first material 2 and the second material 3 by the gas is 30 to 500 kgf / cm 2, preferably 30 to 300 kgf / cm 2 . If the calo pressure force is lower than 30 kgf / cm 2 , the adhesive force of the adhesive sheet 6 will be weak, and if it exceeds 500 kgf / cm 2 , the channel 4 may be deformed.
  • the pressing amount of the adhesive sheet 6 at the time of pressing is about! To 50% of the sheet thickness from the upper surface. If the amount to be pushed in is less than 1% of the sheet thickness, the adhesive strength of the adhesive sheet 6 becomes weak, and if it exceeds 50%, the channel 4 is deformed or the adhesive sheet 6 bites into the channel 4 and flows. There is a risk of changing the cross-sectional area of the road.
  • the heating temperature should be about 70 ° C and the caloric pressure should be 30 to 100 kgf / cm 2 .
  • the temperature was about 70 ° C, a pressure or equal to 100 ⁇ 300kgf / cm 2.
  • the microchip plate 1 is manufactured by the above-described manufacturing method, the temperature at the time of bonding is lowered and the pressure contact pressure is lowered so that the channel 4 is crushed or cracked. Occurrence is eliminated, and it is suitable for mass productivity with a short manufacturing time.
  • the microchip plate chip 1 is manufactured using the three types of polyolefins A, B, and C in which the locations where the peak values of the IR spectrum are adjusted as the adhesive sheet 6 are adjusted. Then, as shown in FIG. 3, a microchip plate chip 1 having a low fluorescence intensity in the order of decreasing peak value (in the order of polyolefin C, B, A) was obtained.
  • the adhesive sheet 6 is heated to room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material 2 and the second material 3 are heated to 30 to 500 kgf / cm 2, preferably 30 to 300 kgf / cm 2.
  • the microchip plate 1 in which the first material and the second material are firmly bonded to each other can be manufactured by producing the microchip plate 1 by applying the pressure to the pressure.
  • the bonding strength was obtained when this adherend was bonded to an olefin-based material.
  • the sheet showed a strength of 1.080 N / mm, but was 0.274 N / mm for acrylic and 0.140 N / mm for polycarbonate.
  • the bonding strength is increased.
  • S, acrylic, and polycarbonate are subjected to surface treatment such as corona treatment and UV irradiation. Strength was not obtained.
  • FIG. 1 which is the same as the first embodiment.
  • the microchip plate 1 of the present embodiment has a second material in which channels 4 and holes (not shown) in the form of microchannels are formed with respect to the first flat plate-like material 2 made of resin. 3 is formed by bonding with a thin polyolefin / !, adhesive sheet 6! /.
  • the thickness of the first material 2 is about 20 ⁇ m, and is formed of a resin made of polyolefin.
  • the depth and width of the channel 4 formed in the second material 3 are about 50 to about 100 m, respectively, and the thickness of the second material 3 is about twice the depth of the recess 8a. is there.
  • the second material 3 is formed of a polyolefin resin, more preferably a norbornene-based cyclic polyolefin, and is formed by integral molding of the resin so as to provide a channel 4 and a port (not shown). . By forming the second material 3 with calebornene-based cyclic polyolefin, it is possible to increase the adhesive strength and satisfy low fluorescence.
  • the adhesive sheet 6 has a thickness of 1 to 500 111, more preferably, before compression bonding to both materials 1 and 2
  • the material is preferably a mixture of 10% to 80% by weight of the mixture of polyolefin and PDMS. When PDMS is mixed, the adhesive strength of the adhesive sheet 6 decreases, and conversely, the low fluorescence of the adhesive sheet 6 improves.
  • both the raw materials 2 and 3 and the adhesive sheet 6 are made of a resin material, the mutual bonding is firmly performed, and the microchip plate 1 is further improved in quality.
  • both materials 2 and 3 are made of glass, it is necessary to perform some kind of pretreatment such as hydrophilic treatment on the adhesive sheet 6.
  • pretreatment is not necessary. The process is simple and can be manufactured in a short time.
  • the first material 2 and the second material 3 are preferably made of polyolefin having a cyclic molecular structure. As a result, the first material 2 and the second material 3 can be satisfactorily joined by the adhesive sheet 6, and the overall low fluorescence can be satisfied.
  • an adhesive sheet 6 is interposed between the first material 2 and the second material 3.
  • adhesive sheet 6 is applied in advance to the opposing surface of either material 2 or 3 with force S formed separately from first material 2 and second material 4 before joining. May be formed.
  • both the raw materials 2 and 3 and the adhesive sheet 6 are heated by a hot press (not shown) to heat the adhesive sheet 6 to a state where it can be elastically deformed and gradually compressed.
  • the heating temperature of the adhesive sheet 6 at this time is room temperature to 100 ° C, preferably 50 to 90 ° C. If the temperature is lower than room temperature, the adhesive strength of the adhesive sheet 6 becomes weak, and if it exceeds 100 ° C, the channel 4 may be deformed. Furthermore, the caloric pressure applied to the first material 2 and the second material 3 by hot pressing is 30 to 500 kgf / cm 2, preferably 30 to 300 kgf / cm 2 . When the pressure force is less than 3 ⁇ 4 Okgf / cm 2 , the adhesive force of the adhesive sheet 6 becomes weak, and when it exceeds 500 kgf / cm 2 , the channel 4 may be deformed.
  • the pressing amount of the adhesive sheet 6 at the time of pressing is from about! To 50% of the sheet thickness from the upper surface. If the amount to be pushed in is less than 1% of the sheet thickness, the adhesive strength of the adhesive sheet 6 becomes weak, and if it exceeds 50%, the channel 4 is deformed or the adhesive sheet 6 bites into the channel 4 and flows. There is a risk of changing the cross-sectional area of the road. [0072] If the opposing surfaces of both materials 2 and 3 are mirror surfaces, to join both materials 2 and 3 while preventing deformation of the channel 4 with a depth and width of about 100 m each, The heating temperature should be about 70 ° C and the caloric pressure should be 30 to 100 kgf / cm 2 .
  • both materials 2 and 3 are non-mirror surfaces, heating is required to join both materials 2 and 3 while preventing deformation of channel 4 with a depth and width of about 100 m each.
  • the temperature was about 70 ° C, a pressure or equal to 100 ⁇ 300kgf / cm 2.
  • the two materials 2 and 3 are joined together by the adhesive sheet 6 as shown in FIG. 1B, and the microchip plate 1 is completed.
  • the microchip plate 1 is manufactured by the above-described manufacturing method, the temperature at the time of bonding is lowered and the pressure contact pressure is lowered so that the channel 4 is crushed or cracked. Occurrence is eliminated, and it is suitable for mass productivity with a short manufacturing time.
  • the adhesive sheet 6 is heated to room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material 2 and the second material 3 are heated to 30 to 500 kgf / cm 2, preferably 30 to 300 kgf / cm 2.
  • the microchip plate 1 in which the first material and the second material are firmly bonded to each other can be manufactured by producing the microchip plate 1 by applying the pressure to the pressure.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Micromachines (AREA)

Abstract

L'objet de la présente invention est une plaque de micropuce en liant un premier matériau résineux à un second matériau résineux à travers une feuille adhésive interposé entre eux. La liaison est menée à une température plus basse et à une pression de pressage plus basse pour éliminer de ce fait les risques d'effondrement des flancs de rainure et les risques de fissure. La plaque de micropuce peut être produite en peu de temps et est appropriée pour une production en masse. La présente invention concerne également un procédé de production de la plaque de micropuce. La plaque de micropuce selon l'invention comprend : un premier matériau (2) réalisé en polyoléfine ; un second matériau (3) réalisé en polyoléfine qui a des rainures (4) formées sur sa surface qui font face au matériau (2) ; et une feuille adhésive (6) réalisée en polyoléfine de faible poids moléculaire, la feuille adhésive (6) étant réalisée en polyoléfine élastomère et étant interposée entre le premier matériau (2) et le second matériau (3) pour lier les deux matériaux.
PCT/JP2007/070704 2006-10-25 2007-10-24 Plaque de micropuce et procédé de production de cette plaque Ceased WO2008050791A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008541006A JP4693907B2 (ja) 2006-10-25 2007-10-24 バイオチップ用マイクロチッププレートおよびその製造方法

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JP2006289724 2006-10-25
JP2006-289724 2006-10-25

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WO2008050791A1 true WO2008050791A1 (fr) 2008-05-02

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PCT/JP2007/070704 Ceased WO2008050791A1 (fr) 2006-10-25 2007-10-24 Plaque de micropuce et procédé de production de cette plaque

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JP (1) JP4693907B2 (fr)
WO (1) WO2008050791A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011053091A (ja) * 2009-09-02 2011-03-17 Alps Electric Co Ltd 接合部材及びその製造方法
WO2014178439A1 (fr) * 2013-05-02 2014-11-06 アルプス電気株式会社 Élément lié et son procédé de production
JP2017217617A (ja) * 2016-06-08 2017-12-14 住友ベークライト株式会社 流路デバイス
CN109138159A (zh) * 2018-09-04 2019-01-04 沈阳炳恒科技有限公司 一种填充预断警示棒的钢结构连接件

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395286A (ja) * 1989-09-07 1991-04-19 Mitsui Petrochem Ind Ltd 環状オレフィン系樹脂用接着剤
JPH06502210A (ja) * 1990-10-30 1994-03-10 ミネソタ　マイニング　アンド　マニュファクチャリング　カンパニー ヒドロシランで硬化したエチレン性不飽和α−オレフィン重合体ベースの感圧接着剤
JPH06184500A (ja) * 1992-12-18 1994-07-05 Yokohama Rubber Co Ltd:The 高分子材料用接着剤及びその製造方法
JPH07173438A (ja) * 1993-11-05 1995-07-11 Daicel Chem Ind Ltd ホットメルト接着フィルム
JPH11286537A (ja) * 1998-03-31 1999-10-19 Nippon Zeon Co Ltd 有機基含有ノルボルネン系重合体
JP2000039420A (ja) * 1998-07-21 2000-02-08 Asahi Chem Ind Co Ltd 樹脂製マイクロチップ
JP2005225925A (ja) * 2004-02-10 2005-08-25 Jsr Corp キャリアフィルム及びキャリア部材

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395286A (ja) * 1989-09-07 1991-04-19 Mitsui Petrochem Ind Ltd 環状オレフィン系樹脂用接着剤
JPH06502210A (ja) * 1990-10-30 1994-03-10 ミネソタ　マイニング　アンド　マニュファクチャリング　カンパニー ヒドロシランで硬化したエチレン性不飽和α−オレフィン重合体ベースの感圧接着剤
JPH06184500A (ja) * 1992-12-18 1994-07-05 Yokohama Rubber Co Ltd:The 高分子材料用接着剤及びその製造方法
JPH07173438A (ja) * 1993-11-05 1995-07-11 Daicel Chem Ind Ltd ホットメルト接着フィルム
JPH11286537A (ja) * 1998-03-31 1999-10-19 Nippon Zeon Co Ltd 有機基含有ノルボルネン系重合体
JP2000039420A (ja) * 1998-07-21 2000-02-08 Asahi Chem Ind Co Ltd 樹脂製マイクロチップ
JP2005225925A (ja) * 2004-02-10 2005-08-25 Jsr Corp キャリアフィルム及びキャリア部材

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011053091A (ja) * 2009-09-02 2011-03-17 Alps Electric Co Ltd 接合部材及びその製造方法
WO2014178439A1 (fr) * 2013-05-02 2014-11-06 アルプス電気株式会社 Élément lié et son procédé de production
JPWO2014178439A1 (ja) * 2013-05-02 2017-02-23 アルプス電気株式会社 接合部材及びその製造方法
JP2017217617A (ja) * 2016-06-08 2017-12-14 住友ベークライト株式会社 流路デバイス
CN109138159A (zh) * 2018-09-04 2019-01-04 沈阳炳恒科技有限公司 一种填充预断警示棒的钢结构连接件

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