WO2008050791A1 - Microchip plate and process for producing the same - Google Patents

Abstract

[PROBLEMS] To provide a microchip plate which is obtained by bonding a first resinous material to a second resinous material through an adhesive sheet interposed therebetween. The bonding is conducted at a lower temperature and a lower pressing pressure to thereby eliminate channel collapse and cracking. The microchip plate can be produced in a short time and is suitable for mass-production. Also provided is a process for producing the microchip plate. [MEANS FOR SOLVING PROBLEM] The microchip plate is characterized by comprising: a first material (2) made of a polyolefin; a second material (3) made of a polyolefin and having channels (4) formed in the surface thereof facing the material (2); and an adhesive sheet (6) made of a low-molecular polyolefin, the adhesive sheet (6) being made of an elastomeric polyolefin and interposed between the first material (2) and the second material (3) to bond the two materials.

Description

 Specification

 Microchip plate and manufacturing method thereof

 Technical field

 TECHNICAL FIELD [0001] The present invention relates to a microchip plate and a manufacturing method thereof, and more particularly to a microchip suitable for performing various chemical processes on a chip and a manufacturing method thereof.

 Background art

 [0002] With recent advances in microchemical technology, it is frequently used on the chip for chemical reactions including complex formation reactions, organic synthesis, solvent extraction, cell culture, and chemical reaction control. In particular, it is called a biochip, and microchip plates are used for DNA testing.

[0003] Various types of manufacturing methods have been proposed for this type of microchip plate (see Patent Document 1).

 FIG. 4 and FIG. 5 show an example of a conventional microchip plate.

 [0005] The microchip plate 21 joins a resin-made second material 23 in which minute flow channel-like channels 24 and holes 25 are formed to a resin-made thin flat plate-like first material 22. Is formed.

 [0006] When DNA is detected in the microchip plate 21, a liquid sample containing DNA is put into the channel 24 through the hole 25, and the DNA contains the detection DNA containing the phosphor and the channel 24. It is detected by irradiating light through the first material 2 2 and the second material 23 whether or not they are tied together.

 [0007] From the usage method described above, in the microchip, the flow path through which the sample flows is ensured, and the microchip itself is low fluorescent so as not to cause noise of fluorescence to be measured. Required.

 [0008] Patent Document 1: Japanese Unexamined Patent Publication No. 2005-77218

 Disclosure of the invention

 Problems to be solved by the invention

However, in the conventional microchip plate 21 shown in FIG. 4 and FIG. Because the first material 22 and the second material 23 were pressed and hot-melted by press while raising the temperature until the softening point of the resin was reached, usually around 100 ° C to 130 ° C, Fig. 6 As shown, the channel 24 is crushed (see the shaded area in Fig. 6), the position of the channel 24 is displaced, and cracks 26 occur in both materials 22 and 23, causing leakage of liquid material in the channel 24. There was a problem to induce.

 [0010] In addition, the hot melt bonding operation for manufacturing one microchip plate 21 requires 30 to 40 minutes, and there is a disadvantage that mass productivity is poor.

 [0011] Furthermore, when bonding is performed by interposing an adhesive between the two materials 22 and 23, the adhesive enters the channel 24, or the adhesive itself exhibits fluorescence, and a satisfactory product specification There was an inconvenience that it could not be obtained.

 [0012] The present invention has been made in view of these points. By bonding an adhesive sheet between a first resin material and a second material and bonding the two materials, the temperature at the time of bonding can be reduced. It is an object of the present invention to provide a microchip plate and a method for manufacturing the microchip plate which are suitable for mass production with a short manufacturing time by reducing the pressure and contact pressure, eliminating the occurrence of channel crushing and cracking.

 Another object of the present invention is to provide a microchip plate with low fluorescence by using a low fluorescence olefin resin as a main material.

 Means for solving the problem

 [0014] In order to achieve the above object, a microchip plate according to the present invention includes a first material formed of polyolefin and a second material formed of polyolefin and having a channel formed on the opposite surface. And an adhesive sheet formed of an elastomeric polyolefin, the adhesive sheet being interposed between the first material and the second material, and joining the two materials And

[0015] The microchip plate manufacturing method for manufacturing the microchip plate of the present invention thus formed includes a first material formed of polyolefin, a channel formed on the opposing surface and formed of polyolefin. An adhesive sheet formed of elastomer-like polyolefin is interposed between the second material on which the first material and the second material are formed, and the first material and the second material are pressed against each other. And both materials are joined by the adhesive sheet.

[0016] Since the microchip plate according to the present invention formed as described above is manufactured by the manufacturing method described above, the first material and the second material are formed using an adhesive sheet made of olefin-based resin. The material can be firmly bonded. In addition, since the first material and the second material can be joined using an adhesive sheet, it is possible to lower the temperature at the time of joining and lower the pressure contact pressure. It is possible to obtain a microchip plate that does not generate cracks and is suitable for mass production with a short manufacturing time and a manufacturing method thereof.

[0017] Further, in the microchip plate and the manufacturing method thereof according to the present invention, the first material, the second material, and the adhesive sheet are a cyclic polyolefin polymer, a chain polyolefin polymer, a cyclic polyolefin polymer, and a chain. It is preferably one of the copolymers with a glassy polyolefin. The combination of these materials provides stronger adhesion than other cases.

 [0018] Further, in the microchip plate and the manufacturing method thereof according to the present invention! /, The molecular weight of the polyolefin in the adhesive sheet may be tens of thousands of force, etc., 5 million, more preferably 1 million force, etc. It is good to be in the range.

 According to the microchip plate and the manufacturing method thereof of the present invention, in addition to the above-described action, the adhesiveness is further improved due to the low molecular weight, and the first material and the second material are joined by the adhesive sheet. Can be surely performed.

 [0020] Further, in the microchip plate and the manufacturing method thereof according to the present invention, the polyolefin of the adhesive sheet does not have a peak derived from a benzene ring or a double bond in the IR spectrum, and is 1705 cm. — 1, 1745 cm— 1, 1546 cm— 1, 1250 cm— 1 and 950 cm—1 It should be formed so as not to have a peak in the vicinity.

 [0021] According to the microchip plate and the method of manufacturing the same of the present invention, in addition to the above-described function, the fluorescence of the adhesive sheet can be further reduced.

[0022] Further, in the method of manufacturing a microchip plate according to the present invention! /, The adhesive sheet is heated to a room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material and the second material are heated. preparative 30~500kgf / cm ² preferably may pressure Caro to 30~300kgf / cm ^2. [0023] According to the method for producing a microchip plate of the present invention, in addition to the above-described operation, a microchip plate with improved adhesion can be produced. If the temperature is in the range of 50 to 90 ° C, there will be no effect of heat on the first and second materials.

 [0024] In addition, in the microchip plate and the manufacturing method thereof according to the present invention, is the adhesive sheet formed separately from both materials before joining the first material and the second material? It is good to apply in advance to the facing surface of either one of the two materials.

 [0025] According to the microchip plate and the manufacturing method thereof of the present invention, in addition to the above-described operation, the structure of the adhesive sheet is formed separately from both materials before joining the first material and the second material. Or by selecting to apply in advance to the opposing surface of either material.

 [0026] Further, the microchip plate according to the present invention includes a first material made of polyolefin, a second material made of polyolefin and having a channel formed on the opposite surface, polyolefin and PDMS. And an adhesive sheet that is interposed between the first material and the second material to join the two materials together.

 [0027] The microchip plate manufacturing method for manufacturing the microchip plate of the present invention thus formed includes a first material formed of polyolefin, a channel formed on the opposing surface and formed of polyolefin. An adhesive sheet formed of a mixture of polyolefin and PDMS is interposed between the second material on which the material is formed, and the adhesive sheet is heated and the first material and the second material are pressed against each other. Both materials are joined by the adhesive sheet.

 [0028] Since the microchip plate according to the present invention formed as described above is manufactured by the above-described manufacturing method, it is possible to reduce the temperature at the time of bonding and the pressure contact pressure. Therefore, it is possible to obtain a microchip plate and a method for manufacturing the microchip plate that are free from crushing of channels and cracks, have a short manufacturing time, and are suitable for mass production.

[0029] Further, in the method for producing a microchip plate according to the present invention! /, The adhesive sheet is heated to a room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material and the second material are heated. And the 30 ~ 500kgf / c m ^{2 The} caloric pressure is preferably 30 to 300 kgf / cm ² .

[0030] According to the microchip plate manufacturing method of the present invention, in addition to the above-described function, a microchip plate with improved adhesion can be manufactured.

[0031] Further, in the microchip plate and the manufacturing method thereof according to the present invention, is the adhesive sheet formed separately from both materials before joining the first material and the second material?

It is good to apply in advance to the facing surface of either one of the two materials.

[0032] According to the microchip plate of the present invention and the manufacturing method thereof,

In addition, the adhesive sheet is formed separately from the two materials before joining the first material and the second material, or by pre-applying to the opposite surface of either material. It ’s the power to do.

 [0033] Further, in the microchip plate and the manufacturing method thereof according to the present invention, the adhesive sheet may be formed by mixing PDMS in an amount of 10 wt% to 80 wt% with respect to polyolefin.

 [0034] According to the microchip plate and the method for producing the same according to the present invention, in addition to the above-described function, the adhesive strength of the adhesive sheet and low fluorescence can be further improved by adjusting the mixing ratio of PDMS to polyolefin. And can be adjusted.

[0035] In the microchip plate and the manufacturing method thereof according to the present invention, the first material and the second material may be polyolefins having a cyclic molecular structure.

[0036] According to the microchip plate and the method for manufacturing the same according to the present invention, in addition to the above-described action, the first material and the second material can be satisfactorily bonded by the adhesive sheet, and the overall low Fluorescence can be satisfied.

 The invention's effect

[0037] As described above, according to the microchip plate and the method of manufacturing the same according to the present invention, the two materials are joined by interposing an adhesive sheet between the first material and the second material made of resin. It is possible to lower the temperature at the time of joining and lower the pressure contact pressure, eliminating the occurrence of channel crushing and cracking, and suitable for mass production with a short manufacturing time and a manufacturing method thereof It has an excellent effect that it can be obtained. [0038] In addition, the present invention has an excellent effect when it is possible to obtain a microchip plate with low fluorescence by using a low-fluorescence olefin resin as a main material. Brief Description of Drawings

 FIG. 1 is a cross-sectional view showing an embodiment of a microchip plate according to the present invention, (a) is a cross-sectional view showing a state before joining, and (b) is a cross-sectional view showing after joining.

 [Figure 2] Diagram showing the IR spectrum of polyolefin

 [Fig. 3] Diagram showing the fluorescence amount of the chip when the depth of focus is changed after bonding as a microchip plate chip

 FIG. 4 is a perspective view showing a conventional microchip plate.

 [Fig.5] Enlarged sectional view along line 5-5 in Fig.4

 FIG. 6 is a plan view showing a state where a crack or the like of a conventional microchip plate has occurred. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of a microchip plate and a manufacturing method thereof according to the present invention will be described with reference to FIG. 1 and FIG. The polyolefin used here is a cyclic olefin-based polymer such as ZEONEX (manufactured by ZEON), ARTON (manufactured by Nippon Synthetic Rubber), Topas (manufactured by polyplastic), or a chain olefin-based polymer such as polyethylene polypropylene, or It is a copolymer of cyclic olefin and chain olefin.

First Embodiment FIG. 1 shows a first embodiment of the microchip plate and the manufacturing method thereof according to the present invention, where FIG. 1 (a) shows the state before joining, and FIG. 1 (b) shows the joining. Indicates the later state.

 [0042] The microchip plate 1 of the present embodiment has a second material in which channels 4 and holes (not shown) in the form of microchannels are formed with respect to the first flat plate-like material 2 made of resin. 3 is bonded using a low molecular weight polyolefin thin adhesive sheet 6! /.

 [0043] The thickness of the first material 2 is about 20 μm, and is formed of a resin made of polyolefin.

[0044] The depth and width of the channel 4 formed in the second material 3 are about 50 to about 100 m, respectively, and the thickness of the second material 3 is about twice the depth of the recess 8a. is there. This second material 3 is It is formed of a resin made of polyolefin, more preferably a norbornene-based cyclic polyolefin, and is formed by integral molding of the resin so as to provide a channel 4 and a port (not shown). Table 1 shows the results of evaluating the adhesive strength of the first material 2, the second material 3, and the adhesive sheet 6 and the fluorescence intensity of the material by selecting the material of the second material 3. As can be seen from Table 1, by forming the second material 3 with a norbornene-based cyclic polyolefin, it is possible to increase adhesive strength and satisfy low fluorescence.

[0045] [Table 1]

[0046] Adhesive sheet 6 has a thickness of 1 to 500 111, more preferably, before compression bonding of both materials 1 and 2

 It is supposed to be 10-100 m! When the film thickness is 100 μm or more, the fluorescence intensity increases because the amount of phosphor in the height direction of the material increases. When the film thickness is 10 πι or less, low fluorescence can be satisfied, but there is a possibility that warpage will occur on the microchip plate after bonding, and the surface roughness will increase, and the bonding work will be increased. It becomes difficult to do. In addition, the material is formed of a single low molecular weight polyolefin resin.

Yes

 [0047] The molecular weight of the polyolefin in the adhesive sheet 6 may be in the range of tens of thousands of force, 5 million, and more preferably in the range of 1 million to 2 million. If the molecular weight is less than tens of thousands, it cannot exert adhesiveness. If the molecular weight exceeds 5,000,000, it will be inconvenient to make a gel or elastomer at room temperature! /, Etc.

[0048] In addition, in order to suppress the fluorescence of the adhesive sheet 6, the polyolefin of the adhesive sheet 6 has a peak force derived from a benzene ring or a double bond in the IR spectrum, 1705cm-1, 1745cm-1 1546cm—1, 1250cm—1 and 950cm—has peaks near 1 It is good to form so as not to. Specifically, in the IR spectrum, polyolefin is an acrylic carbonyl near 1 745 cm-1, an ester-based carbonyl near 1705 cm-1, an ionomer structure near 1546 cm-1, 1250 cm-1, and a 950 cm-1 vicinity. This is because the terminal bull emits fluorescence. Three types of polyolefins A, B, and C with adjusted locations of these peak values were prepared, and the IR spectrum was measured as shown in Fig. 2. The focal depth was changed after bonding as microchip plate chip 1. Figure 3 shows the results of measuring the amount of fluorescence from the chip at that time. The fluorescence labeling method using Cy3 (excitation wavelength: 550 nm, fluorescence wavelength: 570 nm) and Cy5 (excitation wavelength: 649 nm, fluorescence wavelength: 670 nm), which is the mainstream method, was used as the method for measuring the fluorescence value. This time, we show the measurement data of the fluorescence value using the wavelength of Cy3.

 Low / low peak of 1700, 15000, 25000 (see Fig. 2) and low fluorescence intensity in that order (see Fig. 3) .

[0049] If both the raw materials 2 and 3 and the adhesive sheet 6 are made of a resin material, the mutual bonding is firmly performed, and the microchip plate 1 becomes higher quality. For example, if both materials 2 and 3 are made of glass, it is necessary to perform some kind of pretreatment such as hydrophilic treatment on the adhesive sheet 6. However, in the present invention, such pretreatment is not necessary. The process is simple and can be manufactured in a short time.

[0050] Next, a method for manufacturing the microchip plate 1 of the present embodiment will be described.

[0051] As shown in Fig. 1 (a), an adhesive sheet 6 is interposed between the first material 2 and the second material 3. Figure

 1 In (a), adhesive sheet 6 is applied in advance to the opposing surface of either material 2 or 3 with force S formed separately from first material 2 and second material 4 before joining. May be formed.

 [0052] Subsequently, both the raw materials 2, 3 and the adhesive sheet 6 are heated by a hot press (not shown) to heat the adhesive sheet 6 to a state where it can be elastically deformed and gradually compressed.

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[0053] The heating temperature of the adhesive sheet 6 at this time is room temperature to 100 ° C, preferably 50 to 90 ° C. When the temperature is lower than room temperature (for example, 15 ° C., the same applies hereinafter), the adhesive strength of the adhesive sheet 6 becomes weak, and when it exceeds 100 ° C., the channel 4 may be deformed. In addition, hot pre The pressure applied to the first material 2 and the second material 3 by the gas is 30 to 500 kgf / cm ^2, preferably 30 to 300 kgf / cm ² . If the calo pressure force is lower than 30 kgf / cm ² , the adhesive force of the adhesive sheet 6 will be weak, and if it exceeds 500 kgf / cm ² , the channel 4 may be deformed.

 [0054] To explain further, it is desirable that the pressing amount of the adhesive sheet 6 at the time of pressing is about! To 50% of the sheet thickness from the upper surface. If the amount to be pushed in is less than 1% of the sheet thickness, the adhesive strength of the adhesive sheet 6 becomes weak, and if it exceeds 50%, the channel 4 is deformed or the adhesive sheet 6 bites into the channel 4 and flows. There is a risk of changing the cross-sectional area of the road.

[0055] Also, when the opposing surfaces of both materials 2 and 3 are mirror surfaces, to join both materials 2 and 3 while preventing deformation of the channel 4 having a depth and width of about 100 m each, The heating temperature should be about 70 ° C and the caloric pressure should be 30 to 100 kgf / cm ² . In addition, if the opposing surfaces of both materials 2 and 3 are non-mirror surfaces, heating is required to join both materials 2 and 3 while preventing deformation of channel 4 with a depth and width of about 100 m each. the temperature was about 70 ° C, a pressure or equal to 100 ~300kgf / cm ^2.

 [0056] Subsequently, by curing the adhesive sheet 6, the two materials 2 and 3 are removed by the adhesive sheet 6.

 1 Joining as shown in (b), the microchip plate 1 is completed.

 [0057] According to the present embodiment, since the microchip plate 1 is manufactured by the above-described manufacturing method, the temperature at the time of bonding is lowered and the pressure contact pressure is lowered so that the channel 4 is crushed or cracked. Occurrence is eliminated, and it is suitable for mass productivity with a short manufacturing time.

 [0058] Also, according to the present embodiment, the microchip plate chip 1 is manufactured using the three types of polyolefins A, B, and C in which the locations where the peak values of the IR spectrum are adjusted as the adhesive sheet 6 are adjusted. Then, as shown in FIG. 3, a microchip plate chip 1 having a low fluorescence intensity in the order of decreasing peak value (in the order of polyolefin C, B, A) was obtained.

[0059] The adhesive sheet 6 is heated to room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material 2 and the second material 3 are heated to 30 to 500 kgf / cm ^2, preferably 30 to 300 kgf / cm ^2. The microchip plate 1 in which the first material and the second material are firmly bonded to each other can be manufactured by producing the microchip plate 1 by applying the pressure to the pressure. In addition, when the experiment was conducted under these conditions, the bonding strength was obtained when this adherend was bonded to an olefin-based material. The sheet showed a strength of 1.080 N / mm, but was 0.274 N / mm for acrylic and 0.140 N / mm for polycarbonate. At this time, if the olefin-based material is subjected to surface treatment such as corona treatment or UV irradiation, the bonding strength is increased. S, acrylic, and polycarbonate are subjected to surface treatment such as corona treatment and UV irradiation. Strength was not obtained.

 [0060] Second Embodiment

 A second embodiment will be described with reference to FIG. 1 which is the same as the first embodiment.

 [0061] The microchip plate 1 of the present embodiment has a second material in which channels 4 and holes (not shown) in the form of microchannels are formed with respect to the first flat plate-like material 2 made of resin. 3 is formed by bonding with a thin polyolefin / !, adhesive sheet 6! /.

 [0062] The thickness of the first material 2 is about 20 μm, and is formed of a resin made of polyolefin.

 [0063] The depth and width of the channel 4 formed in the second material 3 are about 50 to about 100 m, respectively, and the thickness of the second material 3 is about twice the depth of the recess 8a. is there. The second material 3 is formed of a polyolefin resin, more preferably a norbornene-based cyclic polyolefin, and is formed by integral molding of the resin so as to provide a channel 4 and a port (not shown). . By forming the second material 3 with calebornene-based cyclic polyolefin, it is possible to increase the adhesive strength and satisfy low fluorescence.

[0064] The adhesive sheet 6 has a thickness of 1 to 500 111, more preferably, before compression bonding to both materials 1 and 2

10-100 m! When the film thickness is 100 μm or more, the fluorescence intensity increases because the amount of phosphor in the height direction of the material increases. When the film thickness is 10 πι or less, low fluorescence can be satisfied, but there is a possibility that warpage will occur on the microchip plate after bonding, and the surface roughness will increase, and the bonding work will be increased. It becomes difficult to do. The material is preferably a mixture of 10% to 80% by weight of the mixture of polyolefin and PDMS. When PDMS is mixed, the adhesive strength of the adhesive sheet 6 decreases, and conversely, the low fluorescence of the adhesive sheet 6 improves. Therefore, by adjusting the mixing ratio of polyolefin and PDMS, the adhesive strength and low fluorescence of the adhesive sheet 6 can be appropriately adjusted. [0065] If both the raw materials 2 and 3 and the adhesive sheet 6 are made of a resin material, the mutual bonding is firmly performed, and the microchip plate 1 is further improved in quality. For example, if both materials 2 and 3 are made of glass, it is necessary to perform some kind of pretreatment such as hydrophilic treatment on the adhesive sheet 6. However, in the present invention, such pretreatment is not necessary. The process is simple and can be manufactured in a short time.

 [0066] In the present embodiment, the first material 2 and the second material 3 are preferably made of polyolefin having a cyclic molecular structure. As a result, the first material 2 and the second material 3 can be satisfactorily joined by the adhesive sheet 6, and the overall low fluorescence can be satisfied.

[0067] Next, a method for manufacturing the microchip plate 1 of the present embodiment will be described.

As shown in FIG. 1 (a), an adhesive sheet 6 is interposed between the first material 2 and the second material 3. In Fig. 1 (a), adhesive sheet 6 is applied in advance to the opposing surface of either material 2 or 3 with force S formed separately from first material 2 and second material 4 before joining. May be formed.

 [0069] Subsequently, both the raw materials 2 and 3 and the adhesive sheet 6 are heated by a hot press (not shown) to heat the adhesive sheet 6 to a state where it can be elastically deformed and gradually compressed.

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[0070] The heating temperature of the adhesive sheet 6 at this time is room temperature to 100 ° C, preferably 50 to 90 ° C. If the temperature is lower than room temperature, the adhesive strength of the adhesive sheet 6 becomes weak, and if it exceeds 100 ° C, the channel 4 may be deformed. Furthermore, the caloric pressure applied to the first material 2 and the second material 3 by hot pressing is 30 to 500 kgf / cm ^2, preferably 30 to 300 kgf / cm ² . When the pressure force is less than ¾ Okgf / cm ² , the adhesive force of the adhesive sheet 6 becomes weak, and when it exceeds 500 kgf / cm ² , the channel 4 may be deformed.

[0071] To explain further, it is desirable that the pressing amount of the adhesive sheet 6 at the time of pressing is from about! To 50% of the sheet thickness from the upper surface. If the amount to be pushed in is less than 1% of the sheet thickness, the adhesive strength of the adhesive sheet 6 becomes weak, and if it exceeds 50%, the channel 4 is deformed or the adhesive sheet 6 bites into the channel 4 and flows. There is a risk of changing the cross-sectional area of the road. [0072] If the opposing surfaces of both materials 2 and 3 are mirror surfaces, to join both materials 2 and 3 while preventing deformation of the channel 4 with a depth and width of about 100 m each, The heating temperature should be about 70 ° C and the caloric pressure should be 30 to 100 kgf / cm ² . In addition, if the opposing surfaces of both materials 2 and 3 are non-mirror surfaces, heating is required to join both materials 2 and 3 while preventing deformation of channel 4 with a depth and width of about 100 m each. the temperature was about 70 ° C, a pressure or equal to 100 ~300kgf / cm ^2.

 Subsequently, by curing the adhesive sheet 6, the two materials 2 and 3 are joined together by the adhesive sheet 6 as shown in FIG. 1B, and the microchip plate 1 is completed.

 [0074] According to the present embodiment, since the microchip plate 1 is manufactured by the above-described manufacturing method, the temperature at the time of bonding is lowered and the pressure contact pressure is lowered so that the channel 4 is crushed or cracked. Occurrence is eliminated, and it is suitable for mass productivity with a short manufacturing time.

[0075] Further, the adhesive sheet 6 is heated to room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material 2 and the second material 3 are heated to 30 to 500 kgf / cm ^2, preferably 30 to 300 kgf / cm ^2. The microchip plate 1 in which the first material and the second material are firmly bonded to each other can be manufactured by producing the microchip plate 1 by applying the pressure to the pressure.

 Note that the present invention is not limited to the above-described embodiment, and various modifications can be made as necessary.

Claims

The scope of the claims  [1] a first material formed of polyolefin,  A second material formed of polyolefin and having a channel formed on the opposite surface;  An adhesive sheet formed of elastomeric polyolefin! /, An adhesive sheet interposed between the first material and the second material to join the two materials together.  A microchip plate, comprising: [2] The first material, the second material, and the adhesive sheet are one of a cyclic polyolefin polymer, a chain polyolefin polymer, and a copolymer of a cyclic polyolefin system and a chain polyolefin system. The microchip plate according to claim 1, wherein: [3] The microchip plate according to claim 2, wherein the molecular weight of the polyolefin in the adhesive sheet is in the range of tens of thousands to five million, more preferably in the range of one million to two million. Yes  [4] The polyolefin of the adhesive sheet has an IR spectrum! / And a benzene ring! / Does not have a peak derived from a double bond, and 1705 cm—1, 1745 cm—1, 1546 cm—1, 4. The microchip plate according to claim 2, wherein the microchip plate has no peak in the vicinity of 1 250 cm-1 and 950 cm-1.  [5] The adhesive sheet is formed separately from the two materials before joining the first material and the second material! /, The force, the two materials, and the gap between the two materials. The microchip plate according to any one of claims 1 to 4, wherein the microchip plate is pre-applied! /.  [6] Between the first material formed by the polyolefin and the second material formed by the polyolefin and having the channel formed on the opposite surface, formed by the elastomer-like polyolefin! /, A method of manufacturing a microchip plate, comprising: interposing an adhesive sheet, heating the adhesive sheet, compressing the first material and the second material, and joining the two materials with the adhesive sheet. [7] The first material, the second material, and the adhesive sheet are one of a cyclic polyolefin polymer, a chain polyolefin polymer, and a copolymer of a cyclic polyolefin system and a chain polyolefin system. The microchip plate according to claim 6 is manufactured. Manufacturing method.  [8] The manufacturing method of the microphone-tip chip plate according to claim 6 or 7, wherein the molecular weight force of the polyolefin of the adhesive sheet is in the range of tens of thousands to five million, more preferably in the range of one million to two million. Method.  [9] The polyolefin of the adhesive sheet does not have a peak derived from a benzene ring or a double bond in the IR spectrum, and is 1705 cm—1, 1745 cm—1, 1546 cm—1, 1 250 cm—1, and 950 cm—1. 9. The method of manufacturing a microchip plate according to any one of claims 6 to 8, wherein the microchip plate has no near peak. [10] The adhesive sheet is heated to room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material and the second material are 30 to 500 kgf / cm ^2, preferably 30 to 300 kgf / cm ² in pressure. 10. The method of manufacturing a microchip plate according to claim 1, wherein the force is any one of claims 6 to 9.  [11] The adhesive sheet is formed separately from both materials before joining the first material and the second material! The method for producing a microchip plate according to any one of claims 6 to 10, wherein the force is applied in advance! /.  [12] a first material formed of polyolefin,  A second material formed of polyolefin and having a channel formed on the opposite surface;  A microchip plate comprising an adhesive sheet formed of a mixture of polyolefin and PDMS, the adhesive sheet being interposed between the first material and the second material to join the two materials . [13] Before the first material and the second material are joined, the adhesive sheet is formed separately from both materials! 13. The microchip plate according to claim 12, which is pre-applied! /. 14. The microchip plate according to claim 12 or 13, wherein the adhesive sheet is mixed with 10 to 80% by weight of PDMS with respect to polyolefin. [15] The microchip plate according to any one of [12] to [14], wherein the first material and the second material are polyolefins having a cyclic molecular structure.  [16] Adhesion formed by a mixture of polyolefin and PDMS between the first material formed by polyolefin and the second material formed by polyolefin and having a channel formed on the opposite surface A method for producing a microchip plate, comprising: interposing a sheet, heating the adhesive sheet, pressing the first material and the second material against each other, and joining the two materials with the adhesive sheet. [17] The adhesive sheet is heated to room temperature to 100 ° C, preferably 50 to 90 ° C, and the first material and the second material are 30 to 500 kgf / cm ^2, preferably 30 to 300 kgf / cm ² in pressure. The method for producing a microchip plate according to claim 16, wherein:  [18] Before the first material and the second material are joined, the adhesive sheet is formed separately from both materials! /, The force, the both materials, and the gap between the two materials. The microchip plate manufacturing method according to claim 16 or 17, wherein the microchip plate is applied in advance! /. Yes  [19] The microphone mouth chip according to any one of claims 16 to 18, wherein the adhesive sheet is mixed with 10 to 80% by weight of PDMS with respect to polyolefin. Plate manufacturing method. [20] The method for producing a microchip plate according to any one of [16] to [19], wherein the first material and the second material are polyolefins having a cyclic molecular structure. .