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WO2007001700A3 - Tampon de polissage comprenant des particules magnétiquement sensibles et son procédé d’utilisation - Google Patents

Tampon de polissage comprenant des particules magnétiquement sensibles et son procédé d’utilisation Download PDF

Info

Publication number
WO2007001700A3
WO2007001700A3 PCT/US2006/020194 US2006020194W WO2007001700A3 WO 2007001700 A3 WO2007001700 A3 WO 2007001700A3 US 2006020194 W US2006020194 W US 2006020194W WO 2007001700 A3 WO2007001700 A3 WO 2007001700A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
magnetically sensitive
polishing
sensitive particles
provides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/020194
Other languages
English (en)
Other versions
WO2007001700A2 (fr
Inventor
Ronald Myers
Abaneshwar Prasad
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Priority to JP2008518179A priority Critical patent/JP2008546551A/ja
Priority to EP06760367A priority patent/EP1915234A2/fr
Publication of WO2007001700A2 publication Critical patent/WO2007001700A2/fr
Publication of WO2007001700A3 publication Critical patent/WO2007001700A3/fr
Priority to IL187704A priority patent/IL187704A0/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

La présente invention concerne des tampons de polissage comprenant un corps de tampon de polissage déformable et des particules magnétiquement sensibles y étant dispersées, une ou plusieurs propriétés du tampon de polissage étant altérées lorsqu'un champ magnétique est appliqué. La présente invention concerne également un système de polissage et un procédé de polissage d’un substrat au moyen d’un tel tampon de polissage.
PCT/US2006/020194 2005-06-21 2006-05-24 Tampon de polissage comprenant des particules magnétiquement sensibles et son procédé d’utilisation Ceased WO2007001700A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008518179A JP2008546551A (ja) 2005-06-21 2006-05-24 磁気感受性粒子を有する研磨パッド、及びその使用方法
EP06760367A EP1915234A2 (fr) 2005-06-21 2006-05-24 Tampon de polissage comprenant des particules magnétiquement sensibles et son procédé d'utilisation
IL187704A IL187704A0 (en) 2005-06-21 2007-11-27 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/158,185 2005-06-21
US11/158,185 US20060286906A1 (en) 2005-06-21 2005-06-21 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Publications (2)

Publication Number Publication Date
WO2007001700A2 WO2007001700A2 (fr) 2007-01-04
WO2007001700A3 true WO2007001700A3 (fr) 2007-02-22

Family

ID=37441575

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/020194 Ceased WO2007001700A2 (fr) 2005-06-21 2006-05-24 Tampon de polissage comprenant des particules magnétiquement sensibles et son procédé d’utilisation

Country Status (8)

Country Link
US (1) US20060286906A1 (fr)
EP (1) EP1915234A2 (fr)
JP (1) JP2008546551A (fr)
KR (1) KR20080020629A (fr)
CN (1) CN101203355A (fr)
IL (1) IL187704A0 (fr)
TW (1) TW200704477A (fr)
WO (1) WO2007001700A2 (fr)

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WO2008154178A1 (fr) 2007-06-06 2008-12-18 Novus International Inc. Compléments alimentaires destinés à favoriser la croissance, la réparation et l'entretien des os et des articulations
US8221196B2 (en) * 2007-08-15 2012-07-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same
US7458885B1 (en) * 2007-08-15 2008-12-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same
TWI444248B (zh) * 2007-08-15 2014-07-11 羅門哈斯電子材料Ｃｍｐ控股公司 化學機械研磨方法
WO2010009420A1 (fr) * 2008-07-18 2010-01-21 3M Innovative Properties Company Tampon de polissage avec éléments flottants, et procédé de fabrication et d'utilisation de ceux-ci
JP5710353B2 (ja) * 2011-04-15 2015-04-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
EP3424995A3 (fr) * 2012-06-28 2019-03-20 Dow Global Technologies Llc Matériau composite, son procédé de production et articles fabriqués à partir de celui-ci
SG11201601175WA (en) * 2013-08-22 2016-03-30 Cabot Microelectronics Corp Polishing pad with porous interface and solid core, and related apparatus and methods
KR101632718B1 (ko) * 2013-09-30 2016-06-22 주식회사 엘지화학 폴리우레탄 지지 패드
US20150298284A1 (en) * 2014-04-21 2015-10-22 Applied Materials, Inc. Polishing System with Front Side Pressure Control
EP3192844B1 (fr) * 2016-01-12 2021-02-24 Eoswiss Engineering Sarl Procédé et dispositif de polissage mécanique chimique
KR102742227B1 (ko) * 2017-02-10 2024-12-13 엘지이노텍 주식회사 자성시트 및 이를 포함하는 무선 전력 수신 장치
WO2019139586A1 (fr) * 2018-01-11 2019-07-18 Intel Corporation Structures de tampon de polissage magnétique et de plaque destinées à un polissage mécano-chimique
KR102777772B1 (ko) * 2018-11-27 2025-03-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
CN109759966B (zh) * 2019-02-22 2023-07-28 华侨大学 一种柔性抛光粒子磁性排布抛光盘的制作方法
JP7264775B2 (ja) * 2019-09-03 2023-04-25 エヌ・ティ・ティ・アドバンステクノロジ株式会社 光コネクタ研磨用パッド
CN110788743B (zh) * 2019-09-23 2021-11-09 湖南科技大学 一种磁场可控的缓释磁性物质稠化液流抛光垫及抛光方法
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
CN112608597B (zh) * 2020-12-04 2022-03-04 四川大学 一种高储能密度聚合物复合材料及其制备方法
US11787008B2 (en) * 2020-12-18 2023-10-17 Applied Materials, Inc. Chemical mechanical polishing with applied magnetic field
JP7751399B2 (ja) * 2021-04-02 2025-10-08 株式会社荏原製作所 研磨パッド、研磨装置、研磨方法
CN113263438A (zh) * 2021-05-20 2021-08-17 湘潭大学 一种用于控制抛光压力的承载头及其使用方法
US20240355627A1 (en) * 2023-04-24 2024-10-24 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation

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US6170149B1 (en) * 1996-04-30 2001-01-09 Fujitsu Limited Magnetoresistive type magnetic head and method of manufacturing the same and apparatus for polishing the same
US6719615B1 (en) * 2000-10-10 2004-04-13 Beaver Creek Concepts Inc Versatile wafer refining

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US6719615B1 (en) * 2000-10-10 2004-04-13 Beaver Creek Concepts Inc Versatile wafer refining

Also Published As

Publication number Publication date
US20060286906A1 (en) 2006-12-21
IL187704A0 (en) 2008-08-07
WO2007001700A2 (fr) 2007-01-04
KR20080020629A (ko) 2008-03-05
CN101203355A (zh) 2008-06-18
TW200704477A (en) 2007-02-01
EP1915234A2 (fr) 2008-04-30
JP2008546551A (ja) 2008-12-25

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