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IL187704A0 - Polishing pad comprising magnetically sensitive particles and method for the use thereof - Google Patents

Polishing pad comprising magnetically sensitive particles and method for the use thereof

Info

Publication number
IL187704A0
IL187704A0 IL187704A IL18770407A IL187704A0 IL 187704 A0 IL187704 A0 IL 187704A0 IL 187704 A IL187704 A IL 187704A IL 18770407 A IL18770407 A IL 18770407A IL 187704 A0 IL187704 A0 IL 187704A0
Authority
IL
Israel
Prior art keywords
polishing pad
magnetically sensitive
sensitive particles
particles
magnetically
Prior art date
Application number
IL187704A
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of IL187704A0 publication Critical patent/IL187704A0/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
IL187704A 2005-06-21 2007-11-27 Polishing pad comprising magnetically sensitive particles and method for the use thereof IL187704A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/158,185 US20060286906A1 (en) 2005-06-21 2005-06-21 Polishing pad comprising magnetically sensitive particles and method for the use thereof
PCT/US2006/020194 WO2007001700A2 (en) 2005-06-21 2006-05-24 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Publications (1)

Publication Number Publication Date
IL187704A0 true IL187704A0 (en) 2008-08-07

Family

ID=37441575

Family Applications (1)

Application Number Title Priority Date Filing Date
IL187704A IL187704A0 (en) 2005-06-21 2007-11-27 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Country Status (8)

Country Link
US (1) US20060286906A1 (en)
EP (1) EP1915234A2 (en)
JP (1) JP2008546551A (en)
KR (1) KR20080020629A (en)
CN (1) CN101203355A (en)
IL (1) IL187704A0 (en)
TW (1) TW200704477A (en)
WO (1) WO2007001700A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2005336407B2 (en) * 2005-09-16 2012-06-28 Pasquale Catalfamo Abrasive body
DE102007015502A1 (en) * 2007-03-30 2008-10-02 Advanced Micro Devices, Inc., Sunnyvale CMP system with an eddy current sensor of lower height
WO2008154178A1 (en) 2007-06-06 2008-12-18 Novus International Inc. Dietary supplements for promotion of growth, repair, and maintenance of bone and joints
US7458885B1 (en) * 2007-08-15 2008-12-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same
TWI444248B (en) * 2007-08-15 2014-07-11 羅門哈斯電子材料Ｃｍｐ控股公司 Chemical mechanical polishing method
US8221196B2 (en) * 2007-08-15 2012-07-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same
CN102159361B (en) * 2008-07-18 2014-11-05 3M创新有限公司 Polishing pad with floating units and methods of making and using same
JP5710353B2 (en) * 2011-04-15 2015-04-30 富士紡ホールディングス株式会社 Polishing pad and manufacturing method thereof
BR112014029690A2 (en) * 2012-06-28 2017-06-27 Dow Global Technologies Llc composite material
WO2015026614A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Polishing pad with porous interface and solid core, and related apparatus and methods
KR101632718B1 (en) * 2013-09-30 2016-06-22 주식회사 엘지화학 Poly-urethane mounting pad
US20150298284A1 (en) * 2014-04-21 2015-10-22 Applied Materials, Inc. Polishing System with Front Side Pressure Control
EP3192844B1 (en) * 2016-01-12 2021-02-24 Eoswiss Engineering Sarl Method and device for chemical mechanical polishing
KR102742227B1 (en) * 2017-02-10 2024-12-13 엘지이노텍 주식회사 Magnetic sheet and wireless power receiving apparatus including the same
WO2019139586A1 (en) * 2018-01-11 2019-07-18 Intel Corporation Magnetic polishing pad and platen structures for chemical mechanical polishing
US20220023991A1 (en) * 2018-11-27 2022-01-27 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
CN109759966B (en) * 2019-02-22 2023-07-28 华侨大学 Manufacturing method of flexible polishing particle magnetic arrangement polishing disc
JP7264775B2 (en) * 2019-09-03 2023-04-25 エヌ・ティ・ティ・アドバンステクノロジ株式会社 Optical connector polishing pad
CN110788743B (en) * 2019-09-23 2021-11-09 湖南科技大学 Magnetic field controllable slow-release magnetic substance thickening fluid flow polishing pad and polishing method
JP7105334B2 (en) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド Polishing pad and method for manufacturing semiconductor device using the same
CN112608597B (en) * 2020-12-04 2022-03-04 四川大学 High-energy-storage-density polymer composite material and preparation method thereof
US11787008B2 (en) * 2020-12-18 2023-10-17 Applied Materials, Inc. Chemical mechanical polishing with applied magnetic field
JP7751399B2 (en) * 2021-04-02 2025-10-08 株式会社荏原製作所 Polishing pad, polishing device, and polishing method
CN113263438A (en) * 2021-05-20 2021-08-17 湘潭大学 Bearing head for controlling polishing pressure and using method thereof
US20240355627A1 (en) * 2023-04-24 2024-10-24 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US496218A (en) * 1893-04-25 Combined rail-joint and tie
US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US5578238A (en) * 1992-10-30 1996-11-26 Lord Corporation Magnetorheological materials utilizing surface-modified particles
US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3270282B2 (en) * 1994-02-21 2002-04-02 株式会社東芝 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JP3313505B2 (en) * 1994-04-14 2002-08-12 株式会社日立製作所 Polishing method
WO1995029039A1 (en) * 1994-04-22 1995-11-02 Kabushiki Kaisha Toshiba Separation type grinding surface plate and grinding apparatus using same
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
JP3305557B2 (en) * 1995-04-10 2002-07-22 大日本印刷株式会社 Polishing tape, method for producing the same, and coating agent for the polishing tape
US5838447A (en) * 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5915915A (en) * 1996-03-07 1999-06-29 Komag, Incorporated End effector and method for loading and unloading disks at a processing station
JP3471520B2 (en) * 1996-04-30 2003-12-02 富士通株式会社 Method of manufacturing magnetoresistive head and method of manufacturing magnetoresistive head
US5872633A (en) * 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
JPH10180611A (en) * 1996-12-24 1998-07-07 Takahiro Imahashi Magnetic grinding method and device based on generation of plurality of alternating fields
US6033293A (en) * 1997-10-08 2000-03-07 Lucent Technologies Inc. Apparatus for performing chemical-mechanical polishing
US6083839A (en) * 1997-12-31 2000-07-04 Intel Corporation Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
US6602380B1 (en) * 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US6719615B1 (en) * 2000-10-10 2004-04-13 Beaver Creek Concepts Inc Versatile wafer refining
US6224474B1 (en) * 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
US6059638A (en) * 1999-01-25 2000-05-09 Lucent Technologies Inc. Magnetic force carrier and ring for a polishing apparatus
US6297159B1 (en) * 1999-07-07 2001-10-02 Advanced Micro Devices, Inc. Method and apparatus for chemical polishing using field responsive materials
US6884153B2 (en) * 2000-02-17 2005-04-26 Applied Materials, Inc. Apparatus for electrochemical processing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6436828B1 (en) * 2000-05-04 2002-08-20 Applied Materials, Inc. Chemical mechanical polishing using magnetic force
US6358118B1 (en) * 2000-06-30 2002-03-19 Lam Research Corporation Field controlled polishing apparatus and method
US20020016139A1 (en) * 2000-07-25 2002-02-07 Kazuto Hirokawa Polishing tool and manufacturing method therefor
US6383065B1 (en) * 2001-01-22 2002-05-07 Cabot Microelectronics Corporation Catalytic reactive pad for metal CMP
US6623331B2 (en) * 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
JP2004527905A (en) * 2001-03-14 2004-09-09 ユニバーシティー オブ マサチューセッツ Nano manufacturing
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
US6776688B2 (en) * 2002-10-21 2004-08-17 Texas Instruments Incorporated Real-time polishing pad stiffness-control using magnetically controllable fluid
KR100506934B1 (en) * 2003-01-10 2005-08-05 삼성전자주식회사 Polishing apparatus and the polishing method using the same
US6935929B2 (en) * 2003-04-28 2005-08-30 Micron Technology, Inc. Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US6998166B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
US20050241239A1 (en) * 2004-04-30 2005-11-03 Chien-Min Sung Abrasive composite tools having compositional gradients and associated methods

Also Published As

Publication number Publication date
TW200704477A (en) 2007-02-01
CN101203355A (en) 2008-06-18
JP2008546551A (en) 2008-12-25
US20060286906A1 (en) 2006-12-21
KR20080020629A (en) 2008-03-05
WO2007001700A2 (en) 2007-01-04
EP1915234A2 (en) 2008-04-30
WO2007001700A3 (en) 2007-02-22

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