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WO2007001700A3 - Polishing pad comprising magnetically sensitive particles and method for the use thereof - Google Patents

Polishing pad comprising magnetically sensitive particles and method for the use thereof Download PDF

Info

Publication number
WO2007001700A3
WO2007001700A3 PCT/US2006/020194 US2006020194W WO2007001700A3 WO 2007001700 A3 WO2007001700 A3 WO 2007001700A3 US 2006020194 W US2006020194 W US 2006020194W WO 2007001700 A3 WO2007001700 A3 WO 2007001700A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
magnetically sensitive
polishing
sensitive particles
provides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/020194
Other languages
French (fr)
Other versions
WO2007001700A2 (en
Inventor
Ronald Myers
Abaneshwar Prasad
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Priority to EP06760367A priority Critical patent/EP1915234A2/en
Priority to JP2008518179A priority patent/JP2008546551A/en
Publication of WO2007001700A2 publication Critical patent/WO2007001700A2/en
Publication of WO2007001700A3 publication Critical patent/WO2007001700A3/en
Priority to IL187704A priority patent/IL187704A0/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention provides polishing pads comprising a deformable polishing pad body and magnetically sensitive particles dispersed therein, wherein one or more properties of the polishing pad are altered when in the presence of an applied magnetic field. The invention further provides a polishing system and a method for polishing a substrate involving such a polishing pad.
PCT/US2006/020194 2005-06-21 2006-05-24 Polishing pad comprising magnetically sensitive particles and method for the use thereof Ceased WO2007001700A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP06760367A EP1915234A2 (en) 2005-06-21 2006-05-24 Polishing pad comprising magnetically sensitive particles and method for the use thereof
JP2008518179A JP2008546551A (en) 2005-06-21 2006-05-24 Polishing pad having magnetically sensitive particles and method of using the same
IL187704A IL187704A0 (en) 2005-06-21 2007-11-27 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/158,185 2005-06-21
US11/158,185 US20060286906A1 (en) 2005-06-21 2005-06-21 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Publications (2)

Publication Number Publication Date
WO2007001700A2 WO2007001700A2 (en) 2007-01-04
WO2007001700A3 true WO2007001700A3 (en) 2007-02-22

Family

ID=37441575

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/020194 Ceased WO2007001700A2 (en) 2005-06-21 2006-05-24 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Country Status (8)

Country Link
US (1) US20060286906A1 (en)
EP (1) EP1915234A2 (en)
JP (1) JP2008546551A (en)
KR (1) KR20080020629A (en)
CN (1) CN101203355A (en)
IL (1) IL187704A0 (en)
TW (1) TW200704477A (en)
WO (1) WO2007001700A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2622553A1 (en) * 2005-09-16 2007-03-22 Pasquale Catalfamo Abrasive body
DE102007015502A1 (en) * 2007-03-30 2008-10-02 Advanced Micro Devices, Inc., Sunnyvale CMP system with an eddy current sensor of lower height
MX2009013265A (en) 2007-06-06 2010-01-25 Novus Int Inc Dietary supplements for promotion of growth, repair, and maintenance of bone and joints.
US7458885B1 (en) * 2007-08-15 2008-12-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same
US8221196B2 (en) * 2007-08-15 2012-07-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same
TWI444248B (en) * 2007-08-15 2014-07-11 羅門哈斯電子材料Ｃｍｐ控股公司 Chemical mechanical polishing method
US20110183583A1 (en) * 2008-07-18 2011-07-28 Joseph William D Polishing Pad with Floating Elements and Method of Making and Using the Same
JP5710353B2 (en) * 2011-04-15 2015-04-30 富士紡ホールディングス株式会社 Polishing pad and manufacturing method thereof
CN104508033B (en) * 2012-06-28 2017-06-13 陶氏环球技术有限责任公司 Composite, its preparation method and product prepared therefrom
CN105518832B (en) * 2013-08-22 2018-06-08 嘉柏微电子材料股份公司 Polishing pad having porous interface and solid core, and related apparatus and methods
KR101632718B1 (en) * 2013-09-30 2016-06-22 주식회사 엘지화학 Poly-urethane mounting pad
US20150298284A1 (en) * 2014-04-21 2015-10-22 Applied Materials, Inc. Polishing System with Front Side Pressure Control
EP3192844B1 (en) * 2016-01-12 2021-02-24 Eoswiss Engineering Sarl Method and device for chemical mechanical polishing
KR102742227B1 (en) * 2017-02-10 2024-12-13 엘지이노텍 주식회사 Magnetic sheet and wireless power receiving apparatus including the same
WO2019139586A1 (en) * 2018-01-11 2019-07-18 Intel Corporation Magnetic polishing pad and platen structures for chemical mechanical polishing
WO2020109947A1 (en) * 2018-11-27 2020-06-04 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
CN109759966B (en) * 2019-02-22 2023-07-28 华侨大学 Manufacturing method of flexible polishing particle magnetic arrangement polishing disc
JP7264775B2 (en) * 2019-09-03 2023-04-25 エヌ・ティ・ティ・アドバンステクノロジ株式会社 Optical connector polishing pad
CN110788743B (en) * 2019-09-23 2021-11-09 湖南科技大学 Magnetic field controllable slow-release magnetic substance thickening fluid flow polishing pad and polishing method
JP7105334B2 (en) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド Polishing pad and method for manufacturing semiconductor device using the same
CN112608597B (en) * 2020-12-04 2022-03-04 四川大学 High-energy-storage-density polymer composite material and preparation method thereof
US11787008B2 (en) * 2020-12-18 2023-10-17 Applied Materials, Inc. Chemical mechanical polishing with applied magnetic field
JP7751399B2 (en) * 2021-04-02 2025-10-08 株式会社荏原製作所 Polishing pad, polishing device, and polishing method
CN113263438A (en) * 2021-05-20 2021-08-17 湘潭大学 Bearing head for controlling polishing pressure and using method thereof
US20240355627A1 (en) * 2023-04-24 2024-10-24 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6146243A (en) * 1996-12-24 2000-11-14 Imahashi Mfg., Co., Ltd. Method and apparatus for finishing works magnetically by generating alternating magnetic fields
US6170149B1 (en) * 1996-04-30 2001-01-09 Fujitsu Limited Magnetoresistive type magnetic head and method of manufacturing the same and apparatus for polishing the same
US6719615B1 (en) * 2000-10-10 2004-04-13 Beaver Creek Concepts Inc Versatile wafer refining

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US496218A (en) * 1893-04-25 Combined rail-joint and tie
US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US5578238A (en) * 1992-10-30 1996-11-26 Lord Corporation Magnetorheological materials utilizing surface-modified particles
US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3270282B2 (en) * 1994-02-21 2002-04-02 株式会社東芝 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JP3313505B2 (en) * 1994-04-14 2002-08-12 株式会社日立製作所 Polishing method
KR100213855B1 (en) * 1994-04-22 1999-08-02 니시무로 타이조 Separate type polishing table and polishing device using the same
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JP3305557B2 (en) * 1995-04-10 2002-07-22 大日本印刷株式会社 Polishing tape, method for producing the same, and coating agent for the polishing tape
US5838447A (en) * 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5915915A (en) * 1996-03-07 1999-06-29 Komag, Incorporated End effector and method for loading and unloading disks at a processing station
US5872633A (en) * 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US6033293A (en) * 1997-10-08 2000-03-07 Lucent Technologies Inc. Apparatus for performing chemical-mechanical polishing
US6083839A (en) * 1997-12-31 2000-07-04 Intel Corporation Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
US6602380B1 (en) * 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US6224474B1 (en) * 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
US6059638A (en) * 1999-01-25 2000-05-09 Lucent Technologies Inc. Magnetic force carrier and ring for a polishing apparatus
US6297159B1 (en) * 1999-07-07 2001-10-02 Advanced Micro Devices, Inc. Method and apparatus for chemical polishing using field responsive materials
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6884153B2 (en) * 2000-02-17 2005-04-26 Applied Materials, Inc. Apparatus for electrochemical processing
US6436828B1 (en) * 2000-05-04 2002-08-20 Applied Materials, Inc. Chemical mechanical polishing using magnetic force
US6358118B1 (en) * 2000-06-30 2002-03-19 Lam Research Corporation Field controlled polishing apparatus and method
US20020016139A1 (en) * 2000-07-25 2002-02-07 Kazuto Hirokawa Polishing tool and manufacturing method therefor
US6383065B1 (en) * 2001-01-22 2002-05-07 Cabot Microelectronics Corporation Catalytic reactive pad for metal CMP
US6623331B2 (en) * 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
US7189435B2 (en) * 2001-03-14 2007-03-13 University Of Massachusetts Nanofabrication
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
US6776688B2 (en) * 2002-10-21 2004-08-17 Texas Instruments Incorporated Real-time polishing pad stiffness-control using magnetically controllable fluid
KR100506934B1 (en) * 2003-01-10 2005-08-05 삼성전자주식회사 Polishing apparatus and the polishing method using the same
US6935929B2 (en) * 2003-04-28 2005-08-30 Micron Technology, Inc. Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US6998166B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
US20050241239A1 (en) * 2004-04-30 2005-11-03 Chien-Min Sung Abrasive composite tools having compositional gradients and associated methods

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6170149B1 (en) * 1996-04-30 2001-01-09 Fujitsu Limited Magnetoresistive type magnetic head and method of manufacturing the same and apparatus for polishing the same
US6146243A (en) * 1996-12-24 2000-11-14 Imahashi Mfg., Co., Ltd. Method and apparatus for finishing works magnetically by generating alternating magnetic fields
US6719615B1 (en) * 2000-10-10 2004-04-13 Beaver Creek Concepts Inc Versatile wafer refining

Also Published As

Publication number Publication date
TW200704477A (en) 2007-02-01
WO2007001700A2 (en) 2007-01-04
US20060286906A1 (en) 2006-12-21
CN101203355A (en) 2008-06-18
KR20080020629A (en) 2008-03-05
JP2008546551A (en) 2008-12-25
IL187704A0 (en) 2008-08-07
EP1915234A2 (en) 2008-04-30

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