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WO2003005785A1 - Procede pour le traitement conjoint de cartes a circuits imprimes - Google Patents

Procede pour le traitement conjoint de cartes a circuits imprimes Download PDF

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Publication number
WO2003005785A1
WO2003005785A1 PCT/DE2002/002380 DE0202380W WO03005785A1 WO 2003005785 A1 WO2003005785 A1 WO 2003005785A1 DE 0202380 W DE0202380 W DE 0202380W WO 03005785 A1 WO03005785 A1 WO 03005785A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit boards
printed circuit
connection
adhesive
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2002/002380
Other languages
German (de)
English (en)
Inventor
Robert Gray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2003005785A1 publication Critical patent/WO2003005785A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Definitions

  • the invention relates to a method for common machining ⁇ th of several printed circuit boards, in particular a method in which a plurality of circuit boards in a placement ge ⁇ be jointly fitted with electrical and / or electronic components.
  • the invention is therefore based on the object of providing a method for jointly processing printed circuit boards, so that in particular a joint assembly of two or more printed circuit boards in one in an automatic placement machine performed placement process can be equipped with high accuracy with electrical components.
  • This object is achieved by a method for the joint processing of printed circuit boards, in which printed circuit boards lying on a transport path are lined up in a transport plane, the lined up printed circuit boards are mechanically connected to one another, the connected printed circuit boards are processed together and then the mechanical connection between the printed circuit boards is solved.
  • the method according to the invention is particularly advantageous if the joint processing of the connected printed circuit boards is to be equipped with components, in particular with electrical, i.e. electronic and / or electro-mechanical components.
  • the invention thus creates the possibility of equipping smaller circuit boards quickly and precisely with electrical components.
  • the printed circuit boards are strung together in such a way that their mutually facing edges run essentially parallel. This has the advantage that the circuit boards to be processed can be lined up precisely.
  • the mutually facing edges of the circuit boards to be connected can also be aligned perpendicular, parallel and / or at an angle to the transport path. According to the invention, printed circuit boards which have a non-rectangular shape can therefore also be assembled together.
  • the mechanical connection of the interconnected printed circuit boards is established by means of a soldered connection.
  • soldered connection strips can be used for the solder connection according to the invention.
  • the use of ner solder connection, in particular a solder connection with one or more soldered connection strips has the advantage that a precise and stable connection between the circuit boards is guaranteed.
  • the plates can release of the mechanical connection between the conductor ⁇ according to the invention be made of one or of a plurality of solder joints formed between the circuit board and a connecting strip by cutting through the connecting strips and / or heating.
  • the mechanical connection of the interconnected printed circuit boards is established by means of a clamp connection.
  • One or more clamping elements can be used for the clamp connection according to the invention.
  • the use of a clamp connection has the advantage that the circuit boards to be connected do not have to be changed by the temporary connection. In this way, even those points on the printed circuit boards which have to be kept temporarily free for the fastening of the clamping connection and in particular for the fastening of the clamping elements, after the circuit boards have been separated, for further manual assembly with components or for the manual fastening of contact pins and / or plugs can be used.
  • the clamping elements are fed by means of an oscillating conveyor device to the location of the transport path at which the printed circuit boards are mechanically connected to one another by means of the clamping connection.
  • the automatic feeding of the clamping elements required for the clamping connection is an important prerequisite for being able to carry out the method according to the invention fully automatically and thus to equip printed circuit boards with electrical components quickly and inexpensively.
  • G emäß a further embodiment of the invention is in connecting the printed circuit boards, a gap between the composites ⁇ kept free NEN circuit boards. This gap can be used, for example, for the clamping connection to be released by means of a spreading device which is inserted into the gap between the connected printed circuit boards.
  • the circuit boards can be separated on the transport route, which also simplifies automated separation of the circuit boards.
  • the clamping elements are collected after loosening the mechanical connection and reused for a new mechanical connection of further printed circuit boards.
  • the recycling of clamping elements already used means that the method according to the invention can be carried out inexpensively.
  • the mechanical connection of the circuit boards which are lined up is produced by means of an adhesive connection.
  • Either one or more adhesive strips or alternatively one or more drops of viscous adhesive can be used for the adhesive connection according to the invention.
  • an adhesive connection which has one or more adhesive strips can be released by severing the adhesive strips, melting the adhesive strips and / or by heating one or more adhesive points which are formed between the printed circuit board and the adhesive strips.
  • an adhesive connection which has one or more drops of liquid adhesive can be detached by heating the adhesive drops.
  • the two circuit boards after heating the adhesive connection Zvi ⁇ rule two arranged along the transport path circuit boards, the two circuit boards using a multipart transport path separated from one another, wherein the split transport path at least ke a first Operastrek- and a second leg, which second section is arranged immediately downstream relative to the first section and the second section is operated at least at times at a higher transport speed than the first section.
  • the separation of two circuit boards proves to be particularly advantageous if, from the point in time at which a first of the two circuit boards to be separated is on the first section and the other of the two circuit boards to be separated is on the second section, the transport on the first section is stopped for a predetermined period of time.
  • the separation of the two printed circuit boards is additionally carried out by a stop device which prevents the first printed circuit board from being transposed in the direction of the second partial section while the first partial section is stopped. is ported.
  • FIG. 1 shows a transport route on which two printed circuit boards lying in the transport plane are temporarily connected to one another by means of a soldered connection.
  • FIG. 2 shows how, in accordance with an exemplary embodiment of the invention, two printed circuit boards are connected to one another by means of two clamping elements.
  • FIG. 3 shows how clamping elements are fed by means of an oscillating conveyor device to the location of the transport route at which the printed circuit boards are connected to one another.
  • FIG. 4 shows how, according to an embodiment of the invention, two printed circuit boards connected by means of clamping elements are separated from one another by using a spreading device.
  • FIG. 5 shows how, according to a further exemplary embodiment of the invention, two printed circuit boards are connected to one another by means of an adhesive connection which has three drops of viscous adhesive.
  • Figure 6 shows how three drops of adhesive are cured by exposure to ultraviolet light.
  • FIG. 7 shows how an adhesive connection consisting of drops of adhesive is released by heating the drops of adhesive.
  • FIG. 8 shows how two printed circuit boards are separated from one another by using a multi-part transport route, in which the upstream one is arranged
  • Part of the transport route is temporarily stopped.
  • a stop device is used which ensures that the next of the two printed circuit boards remains on the stopped part of the transport route.
  • FIG. 1 shows how, according to a first exemplary embodiment of the invention, two printed circuit boards 101, 102 lying on a transport route 100 in the transport plane are temporarily mechanically connected to one another by means of a soldered connection.
  • the printed circuit boards 101, 102 rest with their left edge region on a left transport belt 103 and with their right edge region on a right transport belt 104.
  • the circuit boards 101, 102 are transported from left to right.
  • the direction of transport of the printed circuit boards 101, 102 is indicated by the arrow 105.
  • the transport route 100 is divided into five work areas, a first work area 111, a second work area 112, a third work area 113, a fourth work area 114 and a fifth work area 115.
  • the two printed circuit boards 101, 102 which are located one behind the other on the transport route 100, are strung together. Either the rear circuit board 101 is pushed forward relative to the two transport belts 103, 104 or the front circuit board 102 is moved relative to the two transport belts 103, 104 towards the rear. ten moved.
  • the shifting of the printed circuit boards 101 and 102 is indicated in FIG. 1 by the arrows 121 and 122, respectively.
  • solder paste 123 is applied to the two mutually facing edge regions of the printed circuit boards 101, 102 at two predetermined locations. As can be seen from FIG. 1, the solder paste 123, which is applied to each of the two predetermined locations, simultaneously covers part of the circuit board 101 and part of the circuit board 102.
  • the two printed circuit boards 101, 102 partially provided with solder paste in the mutually facing circuit board edge areas are now transported from the work area 112 into the work area 113.
  • Metallic connecting strips 124 are deposited there in each case on the predetermined locations provided with solder paste 123.
  • the metallic connecting strips 124 are each of such a size that the predetermined locations covered with the solder paste 123 are just covered.
  • the two metallic connecting strips 124 are heated, so that the solder paste 123 located between connecting strips 124 and printed circuit boards 101, 102 melts. After the solder paste 123 and the connecting strips 124 have cooled, the two printed circuit boards 101, 102 are firmly connected to one another by means of the soldered metallic connecting strips 125.
  • the two printed circuit boards 101, 102 which are firmly connected by means of a solder connection can now be carried out in a placement process, not shown, which is preferably carried out in an automatic placement machine is carried out with components.
  • the two printed circuit boards 101, 102 can furthermore be connected both electrically and mechanically to the components applied to the respective printed circuit board 101, 102 by means of a soldering method suitable for the corresponding component assembly.
  • the two are fitted with components and ge ⁇ optionally soldered circuit boards 101, 102 transported from the working area 114 in the work area 115th
  • the mechanical connection with ⁇ is solved means of the soldered connection strip 125 and the two printed circuit boards 101, 102 are separated from each other by the printed circuit board 101 in the overall by the arrows 126 marked direction and the circuit board 102 in the by the arrows 127 marked direction is shifted.
  • the mechanical connection is released according to the invention by cutting through the two soldered-on connection strips 125.
  • Another possibility of releasing the mechanical connection between the two printed circuit boards 101, 102 is to heat the two soldered-on connection strips 125 to such an extent that that between the soldered-on connection strips 125 and the solder located on the two printed circuit boards 101, 102 melts again.
  • soldering method for the electrical and mechanical connection of the assembled components to the printed circuit boards 101, 102 can also take place after the two printed circuit boards 101, 102 have been separated in the work area 115.
  • the method according to the invention for jointly processing printed circuit boards is not limited to the temporary connection of two printed circuit boards.
  • several printed circuit boards arranged in a row or an arrangement with both PCBs arranged side by side as well as side by side are temporarily mechanically connected to one another.
  • FIG. 2 shows the mechanical connection of two printed circuit boards 201, 202 by means of a clamping connection, which is produced by means of two clamping units 205.
  • the two printed circuit boards located on a transport path 200 201, 202 lie on ⁇ gene with its left edge portion on the left-side transport belt 203 and with its right-hand edge region on the right-side transport belt 204th
  • the two clamping elements 205 are positioned on a support element 207 and are lifted from the latter upwards into the plane of the two printed circuit boards 201, 202. Exact height positioning of the two clamping elements 205 is ensured by the two stop cylinders 206, against which the clamping elements 205 abut at the end of the lifting movement of the support element 207.
  • the clamping elements 205 have a cross section, which can be described, for example, by two square U-shapes.
  • the two U-shapes are connected to each other in such a way that the two open sides of the two U-shapes face away from each other.
  • a small angular projection 205a is provided on each U-shaped leg of the holders 205.
  • the clamping elements 205 are designed in such a way that two mutually opposite U-shaped legs, each with a projection 205a, are formed at such a large distance from one another that when the printed circuit boards 201, 202 are inserted, there is a clamping effect between the clamping elements 205 and the two Printed circuit boards 201, 202 is achieved.
  • the two printed circuit boards 201, 202 are mechanically connected to one another by displacing the printed circuit board 201 in the direction of the arrow 208 and the printed circuit board 202 in the direction of the arrow 209.
  • the clamp connection can also be produced with one or with three or more clamp elements 205.
  • the use of exactly two clamping elements 205 according to the invention for the clamping connection according to the invention between the two printed circuit boards 201, 202 is a good compromise between maximum stability of the mechanical connection, which is ensured by a larger number of clamping elements 205, and the desire to have as few clamping elements 205 as possible for reasons of cost to be used for the mechanical connection between the two printed circuit boards 201, 202.
  • FIG. 3 shows a feed device 300 by means of which clamping elements 305 are fed to the location of the transport route at which the printed circuit boards are connected to one another by a clamp connection.
  • the feed device 300 has a left feed channel 301, a right feed channel 302 and a support element 307.
  • the clamping elements 305 are transported from a storage container (not shown) via the left feed channel 301 and the right feed channel 302 to the support element 307, which can be raised or lowered by means of a lifting device 308.
  • the direction of supply of the clamping elements 305 is indicated by the arrows 309.
  • the 301, 302 is based on the so-called vibratory conveyor principle.
  • the two feed channels 301, 302 are set in vibration, so that the clamping elements 305 are transported along the feed channels 301, 302 which run at an incline.
  • the transport of the clamping elements 305 along the two supply channels 301, 302 therefore presupposes that the storage container (not shown) for the clamping elements 305 lies higher than the end of the left supply channel 301 or the end of the right supply channel 302, which ends each facing the support member 307.
  • the support element with the clamping elements 305 lying thereon is moved upwards by means of the lifting device 308 until the two clamping elements 305 located on the supporting element 307 are just in the plane of the printed circuit boards 201, 202 (see FIG. 2).
  • FIG. 4 illustrates how, according to an exemplary embodiment of the invention, two printed circuit boards 401, 402 mechanically connected to one another by means of a clamping connection can be separated from one another by using a spreading device 411 according to the invention.
  • a spreading device 411 there are two means of a clamping connection with each other composites ⁇ ne circuit boards 401, 402 on a transport path 400.
  • the two interconnected printed circuit boards 401, 402 are located on a left-side transport belt 403 and a right conveyor belt 404.
  • the left transport belt 403 and the right transport belt 404 are each divided into two transport belts. Due to the perspective representation of FIG. 4, this division can only be seen in the right transport belt 404.
  • the two connected printed circuit boards 401, 402 are positioned on the transport path 400 in such a way that the printed circuit board 401 lies on part of the left transport belt 403 and on part of the right transport transport 404 and the circuit board 402 lies on the other part of the transport belts 403, 404.
  • the clamping elements 405 are designed such that a small gap remains free between the mutually facing edges of the printed circuit boards 401, 402.
  • a spreading device 411 is inserted into the gap between the two printed circuit boards 401, 402.
  • the spreading device has at least two wedges 412, 413 which run at an angle to the transport plane and which are arranged in such a way that the clamping connection between the two printed circuit boards 401, 402 by displacing the wedges against one another le 412, 413 is solved parallel to the transport level.
  • a Ver ⁇ push the wedge 412 along a parting direction 414 results in a shift of the circuit board 401 relative to the transport path 400 in the separating direction 414.
  • a displacement of the wedge 413 leads along an
  • the clamping elements 405 can be caught in a storage container 420 for clamping elements 405, must be ensured be that after the circuit boards 401, 402 have been separated, the clamping elements 405 do not remain clamped to one of the two circuit boards 401, 402.
  • clamping elements 405 are connected to the lower sections of the two stop cylinders 406 via a magnetic interaction and / or a toothing and thus a displacement of the clamping elements 405 relative to the clamping element holders 406 in a direction parallel or antiparallel to the separating directions 414, 415 is prevented.
  • the magnetic field which holds the clamping elements 405 on the stop cylinders 406 is then switched off, so that the clamping elements 405 fall into the storage container 420.
  • the magnetic field can easily be switched off, for example, if an electromagnet is used to generate the magnetic field.
  • clamping elements 405 can also be connected to the stop cylinders 406 by means of a vacuum, in which case the stop cylinders 406 must have a hollow interior and a downward opening through which the clamping elements 405 are sucked in. In this case, a vacuum system is also required, which is connected to the stop cylinders 406.
  • FIG. 5 shows how printed circuit boards can be connected to one another by means of an adhesive connection.
  • a trans port route 500 there are two printed circuit boards 501, 502, each of which rests with its left edge area on a left transport belt 503 and with its right edge area on a right transport belt 504.
  • the two printed circuit boards 501, 502 are strung together in such a way that a small gap remains free between the two mutually facing edges of the printed circuit boards 501, 502.
  • the two PCBs 501, 502 lined up with one another are positioned on the transport path 500 such that the gap or the abutting edges of the two PCBs 501, 502 are positioned directly below dosing devices 506.
  • the dosing devices 506 are filled with a viscous adhesive, which can be dispensed in a precisely determinable amount, so that adhesive drops 505 are applied between the two printed circuit boards 501, 502, the adhesive drops 505 connecting the two printed circuit boards 501, 502 to be connected to one another.
  • the number of adhesive drops 505 is equal to the number of metering devices 506. It should also be noted here that in principle any number of adhesive drops 505 can be used for the adhesive connection between the two printed circuit boards 501, 502.
  • Figure 6 shows how the adhesive bond applied in Figure 5 can be cured.
  • the two connected printed circuit boards 601, 602 are transported further along the transport path 600 after the adhesive has been applied, so that the adhesive drops 605 applied by the metering devices 606 are cured by means of electromagnetic radiation.
  • the Glue drop 605 hardened with UV light.
  • electromagnetic radiation in other spectral ranges can also be used.
  • the heating device comprises six heating elements 710, a heat reflector 711 being arranged above each of two heating elements, which on the one hand prevents the surroundings above the transport path 700 from being unnecessarily heated and which also ensures that those of the
  • the amount of heat generated by heating elements 710 is preferably radiated in the direction of the circuit boards 701, 702 to be separated.
  • the viscous adhesive used is designed in such a way that the cured adhesive drops 605 shown in FIG. 6 become liquid under the influence of heat and the adhesive effect is significantly reduced.
  • the heating of the glue droplets 705 and the subsequent spreading of the drop of glue 705 is indicated in figure 7 in that the adhesive bead 705 each cover a substantially larger area than the previously cured Kl 'ebstofftropfen 605 (see Figure 6).
  • the loosening of the adhesive connection shown in FIG. 7 between the two printed circuit boards 701, 702 can simultaneously be connected to a soldering process for the assembled components.
  • the amount of heat given off by the heating elements 710 is responsible not only for releasing the adhesive connection but also for melting the solder paste between the assembled components and printed circuit boards 701, 702.
  • Figure 8 shows how, according to the invention after heating the adhesive connection between two printed circuit boards 801, 802 in the ⁇ the circuit boards 801, 802 are separated from each other, wherein a two-part transport path is used the 800th
  • the two-part transport route 800 has a first part 810 and a second part 820, which is arranged directly downstream relative to the first section 810.
  • the two are separated to be separated circuit boards 801, 802 in that from the time at which the Lei ⁇ terplatte 801 on the first part 810 of the transport path
  • the transport on the first partial route 810 is stopped for a predetermined period of time. Within this time span, the transport is continued on the second section 820, so that the printed circuit board 802 continues to move in the transport direction indicated by the arrow 821 and at the same time the printed circuit board
  • the separation of the two circuit boards 801, 802 is additionally ensured by a stop device 830, which prevents the circuit board 801 from being transported in the direction of the second section 820 while the first section 810 is stopped.
  • the stop device 830 works in such a way that immediately after the first section 820 has stopped, the stop device 830 is lifted up into the transport plane in which the two printed circuit boards 801, 802 to be separated are also located.
  • the printed circuit board 801 would abut the printed circuit board 801 on the stop element 803 and thus not drawn from the circuit board 802 onto the section 820.
  • Printed circuit boards can be separated from one another after the adhesive connection has been released using the expansion device according to the invention described with reference to FIG.
  • a spreading device can also be used for separating printed circuit boards which were previously mechanically connected to one another by means of a soldered connection.
  • the separation of printed circuit boards according to the invention explained with reference to FIG. 8 can be used by means of a multi-part transport path and / or by means of a stop device for the separation of printed circuit boards which were previously mechanically connected to one another by means of a soldered connection and / or a clamp connection.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé pour le traitement conjoint de cartes à circuits imprimés. Selon le procédé de l'invention, des plaques à circuits imprimés (101, 102) posées sur un segment de transport (100) dans un plan de transport (101, 102) sont rangées les unes à côté des autres, les plaques à circuits imprimés (101, 102) rangées les unes à côté des autres sont reliées mécaniquement les unes aux autres, les plaques à circuits imprimés reliées (101, 102) sont traitées conjointement, la jonction mécanique entre les plaques à circuits imprimés (101, 102) étant ensuite défaite. Selon des modes de réalisation préférés de l'invention, la jonction mécanique entre les plaques à circuits imprimés (101, 102) est produite par une liaison par brasage (125), une liaison par serrage ou une liaison adhésive. Le procédé selon l'invention peut être exécuté de manière entièrement automatique.
PCT/DE2002/002380 2001-07-02 2002-07-01 Procede pour le traitement conjoint de cartes a circuits imprimes Ceased WO2003005785A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2001131945 DE10131945A1 (de) 2001-07-02 2001-07-02 Verfahren zum gemeinsamen Bearbeiten von Leiterplatten
DE10131945.2 2001-07-02

Publications (1)

Publication Number Publication Date
WO2003005785A1 true WO2003005785A1 (fr) 2003-01-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/002380 Ceased WO2003005785A1 (fr) 2001-07-02 2002-07-01 Procede pour le traitement conjoint de cartes a circuits imprimes

Country Status (2)

Country Link
DE (1) DE10131945A1 (fr)
WO (1) WO2003005785A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011026165A1 (fr) 2009-09-03 2011-03-10 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé permettant de connecter plusieurs éléments d'une carte de circuit imprimé, carte de circuit imprimé et utilisation d'un tel procédé

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007038116A1 (de) 2007-07-30 2009-02-05 Gebr. Schmid Gmbh & Co. Haltemittel, Vorrichtung und Verfahren zum Transport von Substraten, insbesondere Leiterplatten
DE102016210879A1 (de) 2016-06-17 2017-12-21 Gebr. Schmid Gmbh Klemmrahmen und Transportvorrichtung zum Transport von Substraten
WO2019029813A1 (fr) 2017-08-10 2019-02-14 Gebr. Schmid Gmbh Cadre de serrage et dispositif de transport servant au transport de substrats

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US3530231A (en) * 1969-01-15 1970-09-22 Ibm Bonding high density interconnection lines
JPH01147887A (ja) * 1987-12-04 1989-06-09 Showa Electric Wire & Cable Co Ltd 連結式回路基板用材料
WO1995026123A1 (fr) * 1994-03-23 1995-09-28 Dyconex Patente Ag Procede de fabrication de cartes a circuit imprime en feuille mince ou de produits semi-finis pour de telles cartes
DE19522733A1 (de) * 1995-06-22 1997-01-02 Schmid Gmbh & Co Geb Verfahren zum Transport plattenförmiger Gegenstände, insbesondere Leiterplatten
DE19600928A1 (de) * 1996-01-12 1997-07-24 Ibm Vorrichtung zur Handhabung von Leiterplatten und deren Herstellung
JPH1022699A (ja) * 1996-07-05 1998-01-23 Matsushita Electric Ind Co Ltd 基板実装方法
WO2001033630A2 (fr) * 1999-11-02 2001-05-10 Alliedsignal Inc. Substrat d"interconnexion multicouche

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3530231A (en) * 1969-01-15 1970-09-22 Ibm Bonding high density interconnection lines
JPH01147887A (ja) * 1987-12-04 1989-06-09 Showa Electric Wire & Cable Co Ltd 連結式回路基板用材料
WO1995026123A1 (fr) * 1994-03-23 1995-09-28 Dyconex Patente Ag Procede de fabrication de cartes a circuit imprime en feuille mince ou de produits semi-finis pour de telles cartes
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Publication number Priority date Publication date Assignee Title
WO2011026165A1 (fr) 2009-09-03 2011-03-10 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé permettant de connecter plusieurs éléments d'une carte de circuit imprimé, carte de circuit imprimé et utilisation d'un tel procédé
US8863375B2 (en) 2009-09-03 2014-10-21 AT & S Austria Technologie & Sytemtechnik Aktiengesellschaft Method for connecting a plurality of elements of a circuit board

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