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WO2013135791A1 - Procédé, dispositif et système pour une commutation de puissance - Google Patents

Procédé, dispositif et système pour une commutation de puissance Download PDF

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Publication number
WO2013135791A1
WO2013135791A1 PCT/EP2013/055189 EP2013055189W WO2013135791A1 WO 2013135791 A1 WO2013135791 A1 WO 2013135791A1 EP 2013055189 W EP2013055189 W EP 2013055189W WO 2013135791 A1 WO2013135791 A1 WO 2013135791A1
Authority
WO
WIPO (PCT)
Prior art keywords
bus bar
electronic component
busbar
carrier material
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2013/055189
Other languages
German (de)
English (en)
Inventor
Tobias Steckermeier
Roland Brey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of WO2013135791A1 publication Critical patent/WO2013135791A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the invention relates to an electronic power circuit.
  • the invention relates to a method of manufacturing an electronic power circuit, a power rail for the electronic power circuit, and a system of multiple power rails for the power circuit.
  • An electronic power circuit includes a circuit board or other substrate and an electronic device exposed to currents of such high power that it heats up during operation.
  • the power circuit therefore further comprises a sufficiently sized busbar, on the one hand to ensure an electrical connection to the electronic component, and on the other hand dissipate accumulating heat.
  • the busbar is wholly or partially within the carrier material.
  • a recess must be introduced into the carrier material, which corresponds exactly to the dimensions of the busbar. In the region of the recess, other elements, in particular an electrical connection running within the carrier material, can not be carried out.
  • Adjacent busbars must maintain a predetermined minimum distance so that remaining structures of the carrier material survive the production process without damage. At the same time, the bus bar must not be too thin, so that a sufficient side surface is available for connection to the carrier material. In some variants, the busbar must be glued to the substrate, which can require a considerable manufacturing effort. Often need to after the gluing excess adhesive residues are removed, which can contribute to further increased manufacturing costs.
  • the bus bar is glued to an upper or lower surface of the carrier material or fastened by means of a pin or a rivet. If the busbar is located with respect to the carrier material on the opposite side of the electronic component, an additional element, such as the rivet, must be used for the electrical and thermal connection of the electronic component. If the busbar lies between the carrier material and the electronic component, an automatic assembly by means of a surface placement machine can be impeded by the additional height of the busbar. In addition, the vertical elements of this variant can lead to mechanical difficulties in further processing.
  • a method for producing an electronic power circuit described here comprises steps of placing a first electronic component on the surface a substrate, placing a bus bar on the surface of the substrate, placing a second electronic device on the surface of the bus bar, and heating that array to solder the electronic components, the bus bar, and the substrate together.
  • the bus bar can be treated as an electrical component that is placed on the surface of the carrier material when the circuit is assembled.
  • the assembly for example by means of a placement machine, can thereby be substantially simplified. Due to the simplified assembly can a
  • the first electronic component and the busbar can find in the same plane contact with the surface of the carrier material, which can simplify the assembly.
  • bus bars can be mounted close to each other on the surface of the substrate.
  • the thickness or vertical height of the busbar can be chosen flexibly.
  • the thickness of the carrier material can be varied or maintained independently of this.
  • a number of critical dimensions of the bus bar and substrate can be reduced.
  • a tolerance chain between the busbar and the first electronic component can be improved, since both elements are installed by means of the same process on the carrier material.
  • An electrical and thermal connection between the second electronic component and the busbar can be improved, since no additional element such as a cutout, a microvia, a rivet or a pin for the electrical and mechanical connection of the second electronic component to the busbar is required.
  • the surface of the carrier material can be flat before placement, whereby a preparation of the carrier material, for example by attaching soft solder at planned contact points between the carrier material and the busbar or the carrier material and the first electronic component, can be relieved.
  • a preparation of the carrier material for example by attaching soft solder at planned contact points between the carrier material and the busbar or the carrier material and the first electronic component, can be relieved.
  • An electrical (and mechanical) connection between the two elements can be made automatically.
  • An additional connecting element such as a rivet or a vertical pin, are not needed. Manually executed steps can be dispensed with as far as possible, so that the method is particularly suitable for automated industrial mass production.
  • solder is applied in the form of solder paste on the substrate before it is placed on the first electronic component or the busbar.
  • solder paste can be printed in one operation on the flat surface of the substrate, for example in screen printing technique.
  • a molded part made of soft solder can be attached to the busbar before the second electronic component is placed on it.
  • the molding is attached to the bus bar before it is placed on the substrate.
  • an adhesive is applied between the bus bar and the carrier material prior to heating.
  • the adhesive may be attached to the bus bar or substrate before the bus bar itself is placed on the substrate.
  • the adhesive for example in the form of one or two adhesives points, can serve to fix the busbar until the busbar is soldered to the substrate.
  • a bus bar for connecting an electronic component to a substrate described herein comprises a bottom surface having a planar portion for surface mounting the bus bar to the substrate and a top surface having a planar portion for surface mounting an electronic component to the bus bar.
  • the lower and upper surfaces are provided on opposite sides of the bus bar.
  • the dimensions of the busbar are sufficiently small to allow the busbar to be fitted to the carrier material by means of a placement machine for
  • a plurality of bus bars can be provided on a corresponding tray
  • a recess for receiving a depot of soft solder is arranged in the upper surface of the bus bar Depot may be provided by a preformed piece of soft solder ("preform").
  • preform a preformed piece of soft solder
  • Connection of an electronic component to a carrier material comprises a first and a second of the busbars described above, wherein the first busbar has a lateral projection and the second busbar has a corresponding lateral recess, so that the busbars are directly adjacent to each other while engaging the projection in the recess can be arranged NEN.
  • the recess and the projection are in particular complementary to each other.
  • the first and second bus bars have cross sections which are derived from a common basic shape.
  • the basic shape may in particular comprise a rectangle or a square.
  • the first and second busbars can be on the one or more sides of each other in the manner of puzzle pieces can be applied to each other, in particular to limit each other gapless.
  • electronic components components are referred to, which are used to implement an electronic circuit.
  • the components themselves are electrical or electronic circuit components, for example semiconductor components, capacitors, inductors, lines or connection contacts.
  • a power component in particular a power semiconductor device.
  • Power components are preferably placed on the power rail or power components are preferably placed on the power rail.
  • the second component is a power component, preferably a semiconductor component.
  • At least one of the components, at least one of the components, which has its own housing, and in particular the at least one power component is preferably a surface-mounted device or an SMT component.
  • the power device is set up, a Current of preferably at least 1 A, 5 A, 10 A, or 20 A to lead or switch.
  • At least one of the components is a switch, in particular an electronic switch.
  • at least one of the components and in particular the second component may be a MOSFET, an IGBT, a thyristor, a TRIAC, a transistor or a diode or comprise at least one of these semiconductor components.
  • At least one of the components may be an integrated circuit, in particular a microcontroller, a drive circuit, a processor or a driver circuit, which is set up for outputting control signals to a power component.
  • control signals are provided with currents of preferably less than 1 A, less than 100 mA or less than 10 mA.
  • the components are adapted to the current to be conducted, switched or controlled, in particular by means of line cusps.
  • the first component is preferably an integrated circuit, in particular a microcontroller, a drive circuit, a processor or a driver circuit, or discrete or a passive or active device configured for currents not greater than 1 A, 100 mA or 10 mA.
  • the components comprise at least one passive and / or at least one active circuit component or component.
  • the components comprise at least one discrete and / or at least one integrated circuit component.
  • Figure 1 is an electronic power circuit
  • Figure 2 shows a method for producing the electronic
  • FIG. 3 shows a modular bus bar for the power circuit from FIG. 1;
  • FIG. 4 shows a system of different busbars corresponding to that of FIG. 3.
  • FIG. 1 shows a power circuit 100. A top view is shown in the upper area of the illustration and a longitudinal section through the power circuit 100 in the lower area.
  • the power circuit 100 comprises a carrier material 105, a bus bar 110, a first electronic component 115 and a second electronic component 120.
  • the lower illustration additionally shows a cooling element 122 which, however, is not necessarily part of the power circuit 100.
  • the carrier material 105 preferably comprises a core 125, on the upper surface of which a conductor track 130 is arranged. Another trace 130 may extend on the bottom surface of the core 125, wherein opposing traces 130 may be interconnected in the vertical direction.
  • the bus bar 110 and the first electronic component 115 can be soldered to the conductor track 130 of the carrier material 105 by attaching a soft solder to the upper surface of the carrier material 105, with which lower surfaces of the first electronic component 115 or the bus bar 110 in Kon- stand, and the solder is heated temporarily.
  • the solder is in the form of solder paste 135 by means of a printing process on the upper Surface of the substrate 105 is attached before the bus bar 110 or the first electronic component 115 are placed on it.
  • an adhesive 132 may be used which is applied to the bus bar 110 or the carrier material 105 before the bus bar 110 is placed.
  • the adhesive 132 may be used, for example, to form one or more adhesive dots.
  • a soft solder in the form of solder paste 135, as described above, can again be provided between the second electronic component 120 and the busbar 110.
  • a molding 140 made of soft solder may be attached to the surface of the bus bar 110 or the lower surface of the second electronic part 120 before the second electronic part 120 is attached to the bus bar 110.
  • the second electronic component 120 is connected to two adjacent busbars 110. Furthermore, the second electronic component 120 comprises a vertical connection for direct contacting with a conductor track 130 of the carrier material 105.
  • the carrier material 105 comprises a recess 145 to allow the cooling element 122, the lower surface of the busbar 110 to contact.
  • the cooling element 122 is usually provided at a place of use of the power circuit 100 and may for example be made in automobile body in a body panel or connected to such.
  • FIG. 2 symbolically shows steps of a method 200 for producing the electronic power circuit 100 from FIG. 1.
  • a soft solder preferably in the form of solder paste 135, is applied to the surface of the carrier material 105.
  • the first electronic component 115 is placed on the surface of the carrier material 105.
  • This step is preferably carried out by means of an SMD placement machine.
  • the busbar 110 is likewise placed on the carrier material 105. This step can also be carried out by the placement machine.
  • an adhesive 132 is also attached to the substrate 105 or the bus bar 110 before the bus bar 110 is placed.
  • busbar 110 can also be placed in front of one or more of the first electronic components 115 on the carrier material 105, it may be advantageous to mount the busbar 110 only late in order not to impair the accessibility of the carrier material 105 by the relatively large busbar 110 ,
  • step 220 soft solder in the form of the molding 140 is applied to the upper surface of the bus bar 110 or the lower surface of the second electronic component 120.
  • solder in another form preferably as printable solder paste 135, may also be used.
  • the second electronic component 120 is placed on the surface of the bus bar 110 in a step 225.
  • the cooling element 122 or a correspondingly shaped spacer can be inserted into the recess 145 before a last step 230 is carried out in which the power circuit 100 heats up is to solder the electronic components 115, 120, the bus bar 110 and the substrate 105 together. After cooling of the power circuit 100, the cooling element 122 can be removed again. With the completion of the soldering process, the power circuit 122 is completed.
  • FIG. 3 shows a modular busbar 305 which can be used as a busbar 110 in the power circuit 100 from FIG. 1 and in particular can be processed by means of the production method 200 shown in FIG. Shown is a three-sided representation, with a front view at the top left, a side view at the top right and at the bottom a top view of the busbar 305.
  • the busbar 305 has in plan view a cross-section or a base surface, which emerges from a rectangle, in particular from a square.
  • a recess 310 and on another side a projection 315 is provided on one side of the base body.
  • the recess 310 and the projection 315 are opposite to each other, but they can also lie in adjacent sides of the rectangular base body.
  • the recess 310 and the projection 315 correspond to one another, so that the projection 315 of a first busbar 305 can engage as precisely as possible in the recess 310 of a second busbar 305.
  • the busbars 305 are preferably without gap to each other.
  • the recess 310 and the projection 315 may also have trapezoids or rounded shapes in the manner of a puzzle piece, as illustrated.
  • the recess and the projection are complementary to one another ausgestaltet, preferably such that they can be pushed into each other.
  • the recess or the recess and the projection have no undercut.
  • a recess 320 for receiving is in the region of the projection 315 of solder in the form of solder paste 135 or a molding 140 is provided.
  • the depression 320 may also be introduced into the busbar 305 in the region of a boundary of the depression 320.
  • FIG. 4 shows a system 400 of different modular busbars 305 in further embodiments 405 to 440.
  • Each of the illustrated busbars 405 to 440 has at least one recess 310 or a projection 315.
  • a basic form of all illustrated busbars 405 to 440 is based on the rectangular or quadratic basic shape which was explained above with reference to FIG.
  • Embodiments 405 and 415 are complementary to one another in that their plan views are mirror-inverted.
  • the recess 310 and the projection 315 lie respectively on adjacent sides of the rectangular main body of the busbars 405 and 415, respectively.
  • the other two sides do not form a corner, but are merged into one another in the form of an arc.
  • the busbar 435 additionally has a vertical recess 445.
  • the rectangular or square basic body is extended in the representation of Figure 4 in the vertical direction, so that the recess 320 does not reduce the body.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une commutation de puissance électronique. Ledit procédé comprend les étapes suivantes consistant à : placer un premier composant électronique sur la surface d'un matériau de support ; placer un rail conducteur sur la surface du matériau de support ; placer un deuxième composant électronique sur la surface du rail conducteur ; et chauffer l'ensemble afin de les braser ensemble. L'invention concerne par ailleurs un rail conducteur et un système de rails conducteurs pour le procédé.
PCT/EP2013/055189 2012-03-16 2013-03-14 Procédé, dispositif et système pour une commutation de puissance Ceased WO2013135791A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012204133.8 2012-03-16
DE102012204133A DE102012204133A1 (de) 2012-03-16 2012-03-16 Verfahren, Vorrichtung und System für eine Leistungsschaltung

Publications (1)

Publication Number Publication Date
WO2013135791A1 true WO2013135791A1 (fr) 2013-09-19

Family

ID=47884330

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/055189 Ceased WO2013135791A1 (fr) 2012-03-16 2013-03-14 Procédé, dispositif et système pour une commutation de puissance

Country Status (2)

Country Link
DE (1) DE102012204133A1 (fr)
WO (1) WO2013135791A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12046531B2 (en) 2018-10-15 2024-07-23 Vitesco Technologies GmbH Semiconductor component arrangement, method for fabrication thereof and heat dissipation device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014218985A1 (de) * 2014-09-22 2016-03-24 Zf Friedrichshafen Ag Anordnung zur Kühlung von Stromschienen
JP6826922B2 (ja) * 2017-03-17 2021-02-10 新電元工業株式会社 発熱部品の実装構造
WO2023037240A1 (fr) 2021-09-08 2023-03-16 Vijay Bolloju Ensemble module de puissance hybride sans substrat et son procédé de fabrication
DE102024204567A1 (de) * 2024-05-17 2025-11-20 Robert Bosch Gesellschaft mit beschränkter Haftung Modul, insbesondere Sicherungsmodul, und Kontaktsystem

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2777734A1 (fr) * 1998-04-15 1999-10-22 Sagem Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte
EP1538670A2 (fr) * 2003-12-05 2005-06-08 Kabushiki Kaisha Toyota Jidoshokki Module à semi-conducteur
JP2008066468A (ja) * 2006-09-06 2008-03-21 Sumitomo Wiring Syst Ltd 回路材および該回路材を収容した車載用の電気接続箱
EP2043412A1 (fr) * 2007-09-28 2009-04-01 catem DEVELEC GmbH & Co. KG Rails conducteurs dotés d'une dissipation de chaleur
WO2011113867A1 (fr) * 2010-03-18 2011-09-22 Continental Automotive Gmbh Unité de circuit à barre collectrice pour la transmission de courant et de chaleur, ainsi que procédé de fabrication de ladite unité de circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2777734A1 (fr) * 1998-04-15 1999-10-22 Sagem Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte
EP1538670A2 (fr) * 2003-12-05 2005-06-08 Kabushiki Kaisha Toyota Jidoshokki Module à semi-conducteur
JP2008066468A (ja) * 2006-09-06 2008-03-21 Sumitomo Wiring Syst Ltd 回路材および該回路材を収容した車載用の電気接続箱
EP2043412A1 (fr) * 2007-09-28 2009-04-01 catem DEVELEC GmbH & Co. KG Rails conducteurs dotés d'une dissipation de chaleur
WO2011113867A1 (fr) * 2010-03-18 2011-09-22 Continental Automotive Gmbh Unité de circuit à barre collectrice pour la transmission de courant et de chaleur, ainsi que procédé de fabrication de ladite unité de circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12046531B2 (en) 2018-10-15 2024-07-23 Vitesco Technologies GmbH Semiconductor component arrangement, method for fabrication thereof and heat dissipation device

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