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WO2012171565A1 - Système de contact électrique servant à relier des circuits imprimés - Google Patents

Système de contact électrique servant à relier des circuits imprimés Download PDF

Info

Publication number
WO2012171565A1
WO2012171565A1 PCT/EP2011/060009 EP2011060009W WO2012171565A1 WO 2012171565 A1 WO2012171565 A1 WO 2012171565A1 EP 2011060009 W EP2011060009 W EP 2011060009W WO 2012171565 A1 WO2012171565 A1 WO 2012171565A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
contact
slot
region
contact device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/060009
Other languages
German (de)
English (en)
Inventor
Andre Frank
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to PCT/EP2011/060009 priority Critical patent/WO2012171565A1/fr
Publication of WO2012171565A1 publication Critical patent/WO2012171565A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a contact device for producing an electrical connection between running on a first circuit board and a second circuit board Lei ⁇ terbahnen, the first circuit board with their Porterbah- NEN electrically connected contact surfaces, which provided for establishing the electrical contact with on the second circuit board and are electrically connectable to the conductor tracks of the second circuit board electrically connected contact portions.
  • Contact devices for electrically connecting two printed circuit boards are frequently used in electrical devices.
  • two printed circuit boards usually in orthogonal alignment with one another, are connected to one another via contact devices both electrically and mechanically.
  • the contact devices are usually approved ⁇ det as contact strips to simultaneously multiple electrical connections Zvi ⁇ be able to manufacture the two circuit boards rule. If the device and thus the circuit boards therein are exposed to high mechanical loads, it may damage the contact device and thus the electrical connections. Additional measures to increase the mechanical robustness of the contact device are required.
  • a contact device of the type mentioned is known for example from US 5,151,046, which describes a contact ⁇ bar for connecting two circuit boards.
  • US 5,151,046, which describes a contact ⁇ bar for connecting two circuit boards.
  • the contact elements specifically for For by forming so-called overload areas form ⁇ .
  • US 4,715,819 also goes from a two-part Druckleis ⁇ te forth, the parts are hingedly connected to each other. In this way, the angle between the circuit boards connected via this contact strip can be changed as desired, so that a mechanical load on the electrical connections is avoided.
  • the invention is therefore the object of a contact ⁇ device of the type mentioned in such a way that, despite simple and cost-effective production mechanical loads, in particular twisting at the junction of both circuit boards record.
  • a Greinrich- device of the type mentioned in which the contact ⁇ device is formed as part of the first circuit board and has a connection region in which the contact surfaces are arranged, and the connection region of at least one in the first circuit board is provided, which forms in each case in the region of its ends paragraphs, through which the connection region is tapered to webs.
  • the contact device according to the invention is determined by the Kursin- least one passage slot (that is an elongated, continuous through the board opening and a correspondingly shaped slot from ⁇ contour) is formed such that the electrical ⁇ cal and mechanical connection point of the two printed circuit boards te is mechanically decoupled along two spatial axes within certain limits of the remaining first circuit board, as formed by the formation of the webs at both ends of the connection region in the first circuit board as it were a mechanically movable part of the first circuit board, the linear movements and rotational movements of the PCB allows each other and thus allows a mechanical mobility of the two circuit boards in two spatial axes. Since the contact device is also part of the first circuit board, fall apart from the introduction of at least one passage slot no further costs, so that the contact device according to the invention can be produced inexpensively by their simple design structure.
  • An advantageous embodiment of the contact device according to the invention provides that when manufactured contact between the first and the second circuit board, the contact surfaces of the first circuit board are connected via a solder connection with the corresponding contact portions of the second circuit board.
  • the advantage of this embodiment is that a direct electrical and mechanical connection can be produced between the two printed circuit boards, as kei ⁇ nerlei further connecting element (for example, a power strip) is necessary. As a result, the cost of the contact device can be kept low. According to a further advantageous embodiment of the contact device according to the invention it is provided that electrical connection lines between the contact surfaces and the conductor tracks of the first circuit board are guided over the webs.
  • the webs can also be used as a carrier according to finely formed connecting lines or conductor tracks, which are usually in the form of printed conductors. be form, serve.
  • the electrical conductor tracks of the first printed circuit board are guided on and into the webs formed by the slot contour.
  • a further advantageous embodiment of the invention shown SEN contact means also provides for, that a slit-shaped slot is to the vertical connection of the two printed circuit boards in the connection area is provided which is adapted to receive the end face of the second circuit board, wherein the contact surfaces are so arranged at the slot, that their position corresponds to the position of the contact ⁇ sections of the second printed circuit board when scho ⁇ in the slot scho ⁇ surrounded second circuit board, are arranged on ⁇ the sides of the slot in the longitudinal direction of the slot extending through slots, and the connection area tapered paragraphs are arranged to each other in the region of the ends of the slot, so that the webs in the region of the ends of the slot and extending in the longitudinal direction are formed.
  • an orthogonal connection of the two circuit boards can be made.
  • the passage slots introduced on both sides of the slot provided for this purpose form webs in the end area of the slot, the flexibility of which facilitates the mechanical decoupling of the slot
  • the passage slots are mirror-symmetrical to one another, the axis of symmetry running along the slot.
  • the slot extends into the webs, so that at least in some areas of the webs two separated by the slot part webs are formed.
  • This advantageous embodiment also further increases the flexibility of the webs and thus of the connecting region, so that the mobility of the connection of the two printed circuit boards continues to increase.
  • connection region has holes arranged on both sides of the slot.
  • the conductor tracks and the contact portions connected to these are arranged on the front and the back of the second circuit board, and the Kon ⁇ contact areas are arranged in the connection region of the first circuit board on both sides of the slot.
  • connection region comprises a contact strip adapted to receive a, is set corresponding Ste ⁇ sugar strip which is connected to the second circuit board.
  • the contact device according to the invention is also suitable for the frontal electrical connection of two printed circuit boards.
  • the connection area is arranged on an end face of the first circuit board to the end-side connection of both circuit boards, and the contact surfaces along this end face are such that their position at frontally applied to the first circuit board contact portions of the second printed circuit board respectively corresponds to the position of the Maisab ⁇ sections of the second circuit board.
  • the contact portions of the two ⁇ th printed circuit board is formed by SMD components, which are electrically connected with one end to the conductor tracks of the second circuit board and be connectable with the other end with the contact surfaces of the connection area.
  • connection surfaces may correspond in size and shape to the contact surfaces or deviate from it. From a mechanical point of view, the required minimum surface area of the connection surfaces results from the concrete requirements for the paths and angles of rotation to be tolerated, the geometrical dimensions of the webs, the printed circuit board thickness and the printed circuit board material.
  • the invention also relates to a printed circuit board with a contact device according to one of claims 1 to 12.
  • Figure 1 is a schematic representation of orthogonally interconnected printed circuit boards
  • Figure 2 is a detailed view of exporting approximately ⁇ example of a contact device in a plan view
  • FIG. 3 shows the contact device according to FIG.
  • Figure 4 shows a second embodiment of a
  • Figure 5 shows an embodiment of a Maisin ⁇ direction, which is suitable for the frontal connection of two circuit boards.
  • a contact device is required, which has a mechanical flexibility so that it can absorb the mechanical loads without damaging the electrical connections occurs.
  • a cost-effective contact device is described based on embodiments, which allows a mechanically flexible connection of the two circuit boards.
  • FIG. 1 shows a first embodiment in which a first printed circuit board 10 is connected orthogonally to a second Lei ⁇ terplatte 11.
  • a first printed circuit board 10 is connected orthogonally to a second Lei ⁇ terplatte 11.
  • two identically constructed ⁇ contact devices 12 with which on the one hand, a mechanical connection of the two circuit boards 10,11 generated and on the other hand, an electrical connection between the two printed circuit boards 10, 11 extending conductor tracks is made.
  • the circuit boards 10, 11 and the contact means 12 are indicated only schematically; For example, no traces on the two circuit boards 10, 11 are shown for clarity.
  • FIG. 2 shows a partial section of the printed circuit board 10, which has the contact device 12.
  • the contact device 12 is thus formed as part of the printed circuit board 10.
  • the contact device 12 includes a connecting portion 20 which has a slit-shaped slot 21 and disposed on both sides of the slot 22 to contact surfaces ⁇ .
  • the connection region 20 is delimited by passage slots 23 which extend along the longitudinal direction of the slot 21 and form shoulders 24 in the region of the ends 20a of the connection region 20, through which the connection region 20 tapers to webs 25.
  • the paragraphs 24 are aligned with each other, so that the webs 25 in the region of the ends of the slot 21 and extending in the longitudinal direction are formed.
  • the throughputs Transitional slits formed mirror-symmetrical to each other, where ⁇ at the axis of symmetry 27 along the slot 21 ver ⁇ runs.
  • Both the slot 21 and the passage slots 23 can be introduced by conventional production methods (eg milling, laser cutting) in the printed circuit board material of the first circuit board 10, so that the contact device 12 is not an additional structural component and thus can be produced inexpensively.
  • the slot 21 serves to receive an end face 31 of the second printed circuit board 11, as can be seen in detail in FIG.
  • the projection has contact portions 32, the position of which in the plug-in ⁇ place 21 inserted second circuit board 11 respectively corresponds to the position of the contact surfaces 22 of the first circuit board 10.
  • the contact sections 32 are electrically connected to interconnects 37, which are shown only schematically in FIG. 3 and run on the second circuit board 11.
  • FIG. 3 shows highly schematically electrical connections 33, which are formed between the contact surfaces 22 and conductor tracks 34 which run on the first printed circuit board 10 and are indicated only by dashed lines in FIG. 3 and are guided over the webs 25. For the sake of clarity, only two contact surfaces with electrical are shown in FIG. 3
  • connections 33 In the real structure all contact surfaces 22 are provided with correspondingly narrow and possibly in several layers superimposed electrical connections 33.
  • the contact devices 12 allow a direct connection between the two printed circuit boards 10, 11.
  • the contact devices 12 allow a direct connection between the two printed circuit boards 10, 11.
  • a direct solder connection between the contact surfaces 22 and the contact portions 32 allows a secure electrical connection between the two circuit boards 10, 11.
  • Known disadvantages of connectors such as the change of the electrical transition parameters with each insertion cycle, the sensitivity to mechanical stress (vibration, vibration ), a low current carrying capacity, a junction for high-frequency signals by sudden change in the line impedance form, etc., are completely excluded.
  • a fastening hook can optionally also 13 (see FIG.
  • Such a hook 13 also serves to relieve the contact device 12 during the transport of the assembled circuit boards 10, 11, or during the removal of the assembled circuit boards 10, 11 from a device housing.
  • the contact device 12 allows pivoting of the inserted second circuit board 11, as indicated by arrows 35 in Figure 3. This is made possible by the fact that the by the course of the webs formed by ⁇ through slots 23 and the slot 21 25 - as indicated in Figure 2 by a double arrow 26 - constitute qua ⁇ si an axis of rotation for the connection area 20, as they, because of their smaller width a high mechanical
  • the contact device 12 also allows a rectilinear deflection of the inserted second printed circuit board 11 along the arrows 36 shown in FIG.
  • the number of electrical connections that is to say the number of poles of the contact device 12
  • the layout of the first printed circuit board 10 can group electrical connections at a plurality of favorable locations of the first printed circuit board 10.
  • the contact device 12 is also adapted to receive a contact ⁇ bar, which is soldered to the contact surfaces 22 and into which the end face of the second circuit board can be inserted. In this way, a releasable electrical connection can be created.
  • the flexibility afforded by the webs 25 also comes into connection via the contact strip, which can thus be of relatively simple design, since it does not take its own measures to increase the flexibility of the connection between the links Bring PCBs.
  • FIG. 4 shows a second embodiment of a contact device 40 is shown, which is provided on an only indicated portion of a first circuit board 41.
  • the slot 42 is extended into the webs 44 formed by the passage slots 43, so that four partial webs 44a and 44b are formed.
  • a spreading of the slot 42 is made possible, so that the slot in its width can adapt to the thickness tolerances of the second circuit board 45.
  • additional holes 47 may be provided, in which a suitable tool for ⁇ spread on the slot 42 can intervene during insertion of the end face 46.
  • connection region 52 is to be dimensioned such that during spreading and subsequent expansion no air gap is created by a permanent curvature of the connection region 52.
  • connection regions 52 For electrical reasons, it may be advantageous to place electronic components on the connection regions 52 (e.g., line drivers).
  • electronic components e.g., line drivers
  • connection areas 52 can assume any size.
  • Figure 4 shows in addition to corresponding to the contact portions 32 are arranged contact pads 48 formed wider connecting surfaces 49, which are connected when soldering with correspondingly arranged wider Horsabschnit ⁇ th and 50 generate a mechanical reinforcement.
  • electrical connections can also be made via the connecting surfaces 49 and connecting sections 50.
  • run-off surfaces 51 may be provided which serve to drain the solder during soldering and possibly provide for a balanced solder deposit at all connecting surfaces ⁇ 49th
  • the drainage surfaces 51 are not intended for electrical connections. They serve as drainage areas for the solder of the selective soldering process and ensure a consistent quality (balanced solder deposits) of each ⁇ wells last solder (controlled demolition of Minilötwelle).
  • FIG. 5 shows a further exemplary embodiment of a contact device 60 which is used for the frontal connection of a first printed circuit board 61 to a second printed circuit board 62 serves.
  • the circuit boards 61, 62 thus lie in a plane and directly to each other.
  • only one through-slot 64 is introduced at the edge of the first printed circuit board 61 to delimit a connecting region 63, resulting in two webs 65.
  • contact surfaces 66 which are electrically connected to conductor tracks on the first printed circuit board 61 are applied to the connecting region 63.
  • the Kunststoffflä ⁇ chen 66 correspondingly arranged contact portions brought up ⁇ .
  • 62 SMD components 67 eg O-ohm resistors
  • Her left in the figure 5 end face 68 forms the direct ⁇ te connection of the two printed circuit boards 61, 62 from the contact portions.
  • the first and second circuit board 61, 62 are arranged so that the contact surfaces 66 are corresponding to the Maisab ⁇ sections by the SMD components 67 with their projecting beyond the edge of the board edge 68 on the contact surfaces 66 of the first circuit board 61 rest.
  • the end faces 68 of the SMD components 67 are connected in a subsequent soldering process (eg, selective miniature wave) with the contact surfaces 66 of the first circuit board 61.
  • Rotational movements of the two circuit boards 61, 62 around their conjunction line around, are made by the turning ability of the Ver ⁇ binding region 63 in the first circuit board 61 ⁇ light, so that the soldered connections between the circuit boards 61, 62 are not damaged. If the two printed circuit boards in a device assembly own constructive requirements / fasteners, so slight differences in height between them can be compensated by the mechanical mobility of the webs 65.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne un système de contact (12, 40, 60) destiné à établir une liaison électrique entre des pistes conductrices (34, 37) qui s'étendent sur un premier circuit imprimé (10, 41, 61) et sur un deuxième circuit imprimé (11, 45, 62). Le premier circuit imprimé (10, 41, 61) avec ses pistes conductrices (34) comporte des surfaces de contact (22, 48, 66) reliées électriquement qui sont prévues pour établir le contact électrique avec le deuxième circuit imprimé (11, 45, 62) et qui peuvent être reliées électriquement à des segments de contact (32) reliés électriquement aux pistes conductrices (37) du deuxième circuit imprimé (11, 45, 62). L'invention vise à réaliser un tel système de contact de telle manière que, malgré une fabrication simple et économique, il soit capable de supporter des sollicitations mécaniques, en particulier des torsions au niveau du point d'assemblage des deux circuits imprimés. A cet effet, le système de contact (12, 40, 60) est réalisé en tant que partie du premier circuit imprimé (10, 41, 61) et comporte une zone de liaison (20, 52, 63) dans laquelle les surfaces de contact (22, 48, 66) sont disposées. La zone de liaison (20, 52, 63) est délimitée par au moins une fente de passage (23, 43, 64), prévue dans le premier circuit imprimé (10, 41, 61), laquelle présente respectivement au niveau de ses extrémités respectivement des décrochements (24) qui rétrécissent la zone de liaison (20, 52, 63) sous forme de traverses (25, 44, 62). L'invention concerne également un circuit imprimé doté d'un tel système de contact.
PCT/EP2011/060009 2011-06-16 2011-06-16 Système de contact électrique servant à relier des circuits imprimés Ceased WO2012171565A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/060009 WO2012171565A1 (fr) 2011-06-16 2011-06-16 Système de contact électrique servant à relier des circuits imprimés

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/060009 WO2012171565A1 (fr) 2011-06-16 2011-06-16 Système de contact électrique servant à relier des circuits imprimés

Publications (1)

Publication Number Publication Date
WO2012171565A1 true WO2012171565A1 (fr) 2012-12-20

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202016104297U1 (de) * 2016-08-04 2017-11-08 Weidmüller Interface GmbH & Co. KG Leiterplattenanordnung mit einer Kontaktvorrichtung zur leitenden Verbindung der Leiterplatten der Leiterplattenanordnung nach Art eines Bussystems
EP3829272A4 (fr) * 2018-07-26 2021-09-29 Mitsubishi Electric Corporation Carte de circuit imprimé
CN114205999A (zh) * 2020-09-18 2022-03-18 和硕联合科技股份有限公司 电路板搭接结构
US11664615B2 (en) * 2018-08-07 2023-05-30 Tyco Electronics Japan G.K. Circuit board having terminal, and circuit board assembly

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1054515B (de) * 1956-04-26 1959-04-09 Fuba Fabrikation Funktechnisch Gedruckte Verdrahtung oder gedruckte Schaltung mit Leitungskreuzungen
US2894241A (en) * 1956-03-28 1959-07-07 United Carr Fastener Corp Right-angle printed wire connector
US4715819A (en) 1984-04-12 1987-12-29 Hosiden Electronics Co., Ltd. Connector for printed board connection
US5151046A (en) 1991-09-27 1992-09-29 Amp Incorporated Electrical terminal which has overstress protection
US6496384B1 (en) * 2001-09-21 2002-12-17 Visteon Global Technologies, Inc. Circuit board assembly and method of fabricating same
EP1496728A1 (fr) * 2003-07-10 2005-01-12 Delphi Technologies, Inc. Assemblage d'un circuit avec une plaquette structuré ayant une flexibilité pour le montage de composants
DE202006020076U1 (de) * 2006-04-06 2007-10-04 Behr-Hella Thermocontrol Gmbh Leiterkartenanordnung
WO2008046188A1 (fr) * 2006-10-10 2008-04-24 Tir Technology Lp Carte de circuit imprimé avec flexibilité régionale
WO2009062539A1 (fr) * 2007-11-12 2009-05-22 Osram Gesellschaft mit beschränkter Haftung Platine et sa fabrication
DE202011002439U1 (de) * 2011-02-07 2011-05-12 Tq-Systems Gmbh Mechatronische formschlüssige 3D-Leiterplattenerweiterung

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2894241A (en) * 1956-03-28 1959-07-07 United Carr Fastener Corp Right-angle printed wire connector
DE1054515B (de) * 1956-04-26 1959-04-09 Fuba Fabrikation Funktechnisch Gedruckte Verdrahtung oder gedruckte Schaltung mit Leitungskreuzungen
US4715819A (en) 1984-04-12 1987-12-29 Hosiden Electronics Co., Ltd. Connector for printed board connection
US5151046A (en) 1991-09-27 1992-09-29 Amp Incorporated Electrical terminal which has overstress protection
US6496384B1 (en) * 2001-09-21 2002-12-17 Visteon Global Technologies, Inc. Circuit board assembly and method of fabricating same
EP1496728A1 (fr) * 2003-07-10 2005-01-12 Delphi Technologies, Inc. Assemblage d'un circuit avec une plaquette structuré ayant une flexibilité pour le montage de composants
DE202006020076U1 (de) * 2006-04-06 2007-10-04 Behr-Hella Thermocontrol Gmbh Leiterkartenanordnung
WO2008046188A1 (fr) * 2006-10-10 2008-04-24 Tir Technology Lp Carte de circuit imprimé avec flexibilité régionale
WO2009062539A1 (fr) * 2007-11-12 2009-05-22 Osram Gesellschaft mit beschränkter Haftung Platine et sa fabrication
DE202011002439U1 (de) * 2011-02-07 2011-05-12 Tq-Systems Gmbh Mechatronische formschlüssige 3D-Leiterplattenerweiterung

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202016104297U1 (de) * 2016-08-04 2017-11-08 Weidmüller Interface GmbH & Co. KG Leiterplattenanordnung mit einer Kontaktvorrichtung zur leitenden Verbindung der Leiterplatten der Leiterplattenanordnung nach Art eines Bussystems
EP3829272A4 (fr) * 2018-07-26 2021-09-29 Mitsubishi Electric Corporation Carte de circuit imprimé
US11664615B2 (en) * 2018-08-07 2023-05-30 Tyco Electronics Japan G.K. Circuit board having terminal, and circuit board assembly
CN114205999A (zh) * 2020-09-18 2022-03-18 和硕联合科技股份有限公司 电路板搭接结构

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