DE10131945A1 - Verfahren zum gemeinsamen Bearbeiten von Leiterplatten - Google Patents
Verfahren zum gemeinsamen Bearbeiten von LeiterplattenInfo
- Publication number
- DE10131945A1 DE10131945A1 DE2001131945 DE10131945A DE10131945A1 DE 10131945 A1 DE10131945 A1 DE 10131945A1 DE 2001131945 DE2001131945 DE 2001131945 DE 10131945 A DE10131945 A DE 10131945A DE 10131945 A1 DE10131945 A1 DE 10131945A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit boards
- printed circuit
- connection
- adhesive
- transport
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 61
- 239000000853 adhesive Substances 0.000 claims abstract description 60
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 19
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims description 11
- 238000003892 spreading Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 description 15
- 230000008901 benefit Effects 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2001131945 DE10131945A1 (de) | 2001-07-02 | 2001-07-02 | Verfahren zum gemeinsamen Bearbeiten von Leiterplatten |
| PCT/DE2002/002380 WO2003005785A1 (fr) | 2001-07-02 | 2002-07-01 | Procede pour le traitement conjoint de cartes a circuits imprimes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2001131945 DE10131945A1 (de) | 2001-07-02 | 2001-07-02 | Verfahren zum gemeinsamen Bearbeiten von Leiterplatten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10131945A1 true DE10131945A1 (de) | 2003-01-30 |
Family
ID=7690282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2001131945 Withdrawn DE10131945A1 (de) | 2001-07-02 | 2001-07-02 | Verfahren zum gemeinsamen Bearbeiten von Leiterplatten |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE10131945A1 (fr) |
| WO (1) | WO2003005785A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009015742A2 (fr) | 2007-07-30 | 2009-02-05 | Gebr. Schmid Gmbh & Co. | Moyen de retenue, dispositif et procédé pour le transport de substrats, en particulier de plaquettes de circuits imprimés |
| DE102016210879A1 (de) | 2016-06-17 | 2017-12-21 | Gebr. Schmid Gmbh | Klemmrahmen und Transportvorrichtung zum Transport von Substraten |
| WO2019029813A1 (fr) | 2017-08-10 | 2019-02-14 | Gebr. Schmid Gmbh | Cadre de serrage et dispositif de transport servant au transport de substrats |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT12320U1 (de) | 2009-09-03 | 2012-03-15 | Austria Tech & System Tech | Verfahren zum verbinden einer mehrzahl von elementen einer leiterplatte, leiterplatte sowie verwendung eines derartigen verfahrens |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3530231A (en) * | 1969-01-15 | 1970-09-22 | Ibm | Bonding high density interconnection lines |
| JPH01147887A (ja) * | 1987-12-04 | 1989-06-09 | Showa Electric Wire & Cable Co Ltd | 連結式回路基板用材料 |
| WO1995026123A1 (fr) * | 1994-03-23 | 1995-09-28 | Dyconex Patente Ag | Procede de fabrication de cartes a circuit imprime en feuille mince ou de produits semi-finis pour de telles cartes |
| DE19522733A1 (de) * | 1995-06-22 | 1997-01-02 | Schmid Gmbh & Co Geb | Verfahren zum Transport plattenförmiger Gegenstände, insbesondere Leiterplatten |
| DE19600928A1 (de) * | 1996-01-12 | 1997-07-24 | Ibm | Vorrichtung zur Handhabung von Leiterplatten und deren Herstellung |
| JPH1022699A (ja) * | 1996-07-05 | 1998-01-23 | Matsushita Electric Ind Co Ltd | 基板実装方法 |
| US6388325B2 (en) * | 1999-11-02 | 2002-05-14 | Alliedsignal Inc. | Multi-layer interconnect |
-
2001
- 2001-07-02 DE DE2001131945 patent/DE10131945A1/de not_active Withdrawn
-
2002
- 2002-07-01 WO PCT/DE2002/002380 patent/WO2003005785A1/fr not_active Ceased
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009015742A2 (fr) | 2007-07-30 | 2009-02-05 | Gebr. Schmid Gmbh & Co. | Moyen de retenue, dispositif et procédé pour le transport de substrats, en particulier de plaquettes de circuits imprimés |
| WO2009015742A3 (fr) * | 2007-07-30 | 2009-04-30 | Schmid Gmbh & Co Geb | Moyen de retenue, dispositif et procédé pour le transport de substrats, en particulier de plaquettes de circuits imprimés |
| US8256605B2 (en) | 2007-07-30 | 2012-09-04 | Gebr. Schmid Gmbh & Co. | Holding means, device and method for transporting substrates, in particular printed circuit boards |
| CN101784466B (zh) * | 2007-07-30 | 2014-02-12 | 吉布尔.施密德有限责任公司 | 用于传送基板的保持装置、设备和方法 |
| DE102016210879A1 (de) | 2016-06-17 | 2017-12-21 | Gebr. Schmid Gmbh | Klemmrahmen und Transportvorrichtung zum Transport von Substraten |
| WO2019029813A1 (fr) | 2017-08-10 | 2019-02-14 | Gebr. Schmid Gmbh | Cadre de serrage et dispositif de transport servant au transport de substrats |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003005785A1 (fr) | 2003-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8130 | Withdrawal | ||
| 8165 | Unexamined publication of following application revoked |