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WO2003005785A1 - Method for the combined processing of printed circuit boards - Google Patents

Method for the combined processing of printed circuit boards Download PDF

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Publication number
WO2003005785A1
WO2003005785A1 PCT/DE2002/002380 DE0202380W WO03005785A1 WO 2003005785 A1 WO2003005785 A1 WO 2003005785A1 DE 0202380 W DE0202380 W DE 0202380W WO 03005785 A1 WO03005785 A1 WO 03005785A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit boards
printed circuit
connection
adhesive
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2002/002380
Other languages
German (de)
French (fr)
Inventor
Robert Gray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2003005785A1 publication Critical patent/WO2003005785A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Definitions

  • the invention relates to a method for common machining ⁇ th of several printed circuit boards, in particular a method in which a plurality of circuit boards in a placement ge ⁇ be jointly fitted with electrical and / or electronic components.
  • the invention is therefore based on the object of providing a method for jointly processing printed circuit boards, so that in particular a joint assembly of two or more printed circuit boards in one in an automatic placement machine performed placement process can be equipped with high accuracy with electrical components.
  • This object is achieved by a method for the joint processing of printed circuit boards, in which printed circuit boards lying on a transport path are lined up in a transport plane, the lined up printed circuit boards are mechanically connected to one another, the connected printed circuit boards are processed together and then the mechanical connection between the printed circuit boards is solved.
  • the method according to the invention is particularly advantageous if the joint processing of the connected printed circuit boards is to be equipped with components, in particular with electrical, i.e. electronic and / or electro-mechanical components.
  • the invention thus creates the possibility of equipping smaller circuit boards quickly and precisely with electrical components.
  • the printed circuit boards are strung together in such a way that their mutually facing edges run essentially parallel. This has the advantage that the circuit boards to be processed can be lined up precisely.
  • the mutually facing edges of the circuit boards to be connected can also be aligned perpendicular, parallel and / or at an angle to the transport path. According to the invention, printed circuit boards which have a non-rectangular shape can therefore also be assembled together.
  • the mechanical connection of the interconnected printed circuit boards is established by means of a soldered connection.
  • soldered connection strips can be used for the solder connection according to the invention.
  • the use of ner solder connection, in particular a solder connection with one or more soldered connection strips has the advantage that a precise and stable connection between the circuit boards is guaranteed.
  • the plates can release of the mechanical connection between the conductor ⁇ according to the invention be made of one or of a plurality of solder joints formed between the circuit board and a connecting strip by cutting through the connecting strips and / or heating.
  • the mechanical connection of the interconnected printed circuit boards is established by means of a clamp connection.
  • One or more clamping elements can be used for the clamp connection according to the invention.
  • the use of a clamp connection has the advantage that the circuit boards to be connected do not have to be changed by the temporary connection. In this way, even those points on the printed circuit boards which have to be kept temporarily free for the fastening of the clamping connection and in particular for the fastening of the clamping elements, after the circuit boards have been separated, for further manual assembly with components or for the manual fastening of contact pins and / or plugs can be used.
  • the clamping elements are fed by means of an oscillating conveyor device to the location of the transport path at which the printed circuit boards are mechanically connected to one another by means of the clamping connection.
  • the automatic feeding of the clamping elements required for the clamping connection is an important prerequisite for being able to carry out the method according to the invention fully automatically and thus to equip printed circuit boards with electrical components quickly and inexpensively.
  • G emäß a further embodiment of the invention is in connecting the printed circuit boards, a gap between the composites ⁇ kept free NEN circuit boards. This gap can be used, for example, for the clamping connection to be released by means of a spreading device which is inserted into the gap between the connected printed circuit boards.
  • the circuit boards can be separated on the transport route, which also simplifies automated separation of the circuit boards.
  • the clamping elements are collected after loosening the mechanical connection and reused for a new mechanical connection of further printed circuit boards.
  • the recycling of clamping elements already used means that the method according to the invention can be carried out inexpensively.
  • the mechanical connection of the circuit boards which are lined up is produced by means of an adhesive connection.
  • Either one or more adhesive strips or alternatively one or more drops of viscous adhesive can be used for the adhesive connection according to the invention.
  • an adhesive connection which has one or more adhesive strips can be released by severing the adhesive strips, melting the adhesive strips and / or by heating one or more adhesive points which are formed between the printed circuit board and the adhesive strips.
  • an adhesive connection which has one or more drops of liquid adhesive can be detached by heating the adhesive drops.
  • the two circuit boards after heating the adhesive connection Zvi ⁇ rule two arranged along the transport path circuit boards, the two circuit boards using a multipart transport path separated from one another, wherein the split transport path at least ke a first Operastrek- and a second leg, which second section is arranged immediately downstream relative to the first section and the second section is operated at least at times at a higher transport speed than the first section.
  • the separation of two circuit boards proves to be particularly advantageous if, from the point in time at which a first of the two circuit boards to be separated is on the first section and the other of the two circuit boards to be separated is on the second section, the transport on the first section is stopped for a predetermined period of time.
  • the separation of the two printed circuit boards is additionally carried out by a stop device which prevents the first printed circuit board from being transposed in the direction of the second partial section while the first partial section is stopped. is ported.
  • FIG. 1 shows a transport route on which two printed circuit boards lying in the transport plane are temporarily connected to one another by means of a soldered connection.
  • FIG. 2 shows how, in accordance with an exemplary embodiment of the invention, two printed circuit boards are connected to one another by means of two clamping elements.
  • FIG. 3 shows how clamping elements are fed by means of an oscillating conveyor device to the location of the transport route at which the printed circuit boards are connected to one another.
  • FIG. 4 shows how, according to an embodiment of the invention, two printed circuit boards connected by means of clamping elements are separated from one another by using a spreading device.
  • FIG. 5 shows how, according to a further exemplary embodiment of the invention, two printed circuit boards are connected to one another by means of an adhesive connection which has three drops of viscous adhesive.
  • Figure 6 shows how three drops of adhesive are cured by exposure to ultraviolet light.
  • FIG. 7 shows how an adhesive connection consisting of drops of adhesive is released by heating the drops of adhesive.
  • FIG. 8 shows how two printed circuit boards are separated from one another by using a multi-part transport route, in which the upstream one is arranged
  • Part of the transport route is temporarily stopped.
  • a stop device is used which ensures that the next of the two printed circuit boards remains on the stopped part of the transport route.
  • FIG. 1 shows how, according to a first exemplary embodiment of the invention, two printed circuit boards 101, 102 lying on a transport route 100 in the transport plane are temporarily mechanically connected to one another by means of a soldered connection.
  • the printed circuit boards 101, 102 rest with their left edge region on a left transport belt 103 and with their right edge region on a right transport belt 104.
  • the circuit boards 101, 102 are transported from left to right.
  • the direction of transport of the printed circuit boards 101, 102 is indicated by the arrow 105.
  • the transport route 100 is divided into five work areas, a first work area 111, a second work area 112, a third work area 113, a fourth work area 114 and a fifth work area 115.
  • the two printed circuit boards 101, 102 which are located one behind the other on the transport route 100, are strung together. Either the rear circuit board 101 is pushed forward relative to the two transport belts 103, 104 or the front circuit board 102 is moved relative to the two transport belts 103, 104 towards the rear. ten moved.
  • the shifting of the printed circuit boards 101 and 102 is indicated in FIG. 1 by the arrows 121 and 122, respectively.
  • solder paste 123 is applied to the two mutually facing edge regions of the printed circuit boards 101, 102 at two predetermined locations. As can be seen from FIG. 1, the solder paste 123, which is applied to each of the two predetermined locations, simultaneously covers part of the circuit board 101 and part of the circuit board 102.
  • the two printed circuit boards 101, 102 partially provided with solder paste in the mutually facing circuit board edge areas are now transported from the work area 112 into the work area 113.
  • Metallic connecting strips 124 are deposited there in each case on the predetermined locations provided with solder paste 123.
  • the metallic connecting strips 124 are each of such a size that the predetermined locations covered with the solder paste 123 are just covered.
  • the two metallic connecting strips 124 are heated, so that the solder paste 123 located between connecting strips 124 and printed circuit boards 101, 102 melts. After the solder paste 123 and the connecting strips 124 have cooled, the two printed circuit boards 101, 102 are firmly connected to one another by means of the soldered metallic connecting strips 125.
  • the two printed circuit boards 101, 102 which are firmly connected by means of a solder connection can now be carried out in a placement process, not shown, which is preferably carried out in an automatic placement machine is carried out with components.
  • the two printed circuit boards 101, 102 can furthermore be connected both electrically and mechanically to the components applied to the respective printed circuit board 101, 102 by means of a soldering method suitable for the corresponding component assembly.
  • the two are fitted with components and ge ⁇ optionally soldered circuit boards 101, 102 transported from the working area 114 in the work area 115th
  • the mechanical connection with ⁇ is solved means of the soldered connection strip 125 and the two printed circuit boards 101, 102 are separated from each other by the printed circuit board 101 in the overall by the arrows 126 marked direction and the circuit board 102 in the by the arrows 127 marked direction is shifted.
  • the mechanical connection is released according to the invention by cutting through the two soldered-on connection strips 125.
  • Another possibility of releasing the mechanical connection between the two printed circuit boards 101, 102 is to heat the two soldered-on connection strips 125 to such an extent that that between the soldered-on connection strips 125 and the solder located on the two printed circuit boards 101, 102 melts again.
  • soldering method for the electrical and mechanical connection of the assembled components to the printed circuit boards 101, 102 can also take place after the two printed circuit boards 101, 102 have been separated in the work area 115.
  • the method according to the invention for jointly processing printed circuit boards is not limited to the temporary connection of two printed circuit boards.
  • several printed circuit boards arranged in a row or an arrangement with both PCBs arranged side by side as well as side by side are temporarily mechanically connected to one another.
  • FIG. 2 shows the mechanical connection of two printed circuit boards 201, 202 by means of a clamping connection, which is produced by means of two clamping units 205.
  • the two printed circuit boards located on a transport path 200 201, 202 lie on ⁇ gene with its left edge portion on the left-side transport belt 203 and with its right-hand edge region on the right-side transport belt 204th
  • the two clamping elements 205 are positioned on a support element 207 and are lifted from the latter upwards into the plane of the two printed circuit boards 201, 202. Exact height positioning of the two clamping elements 205 is ensured by the two stop cylinders 206, against which the clamping elements 205 abut at the end of the lifting movement of the support element 207.
  • the clamping elements 205 have a cross section, which can be described, for example, by two square U-shapes.
  • the two U-shapes are connected to each other in such a way that the two open sides of the two U-shapes face away from each other.
  • a small angular projection 205a is provided on each U-shaped leg of the holders 205.
  • the clamping elements 205 are designed in such a way that two mutually opposite U-shaped legs, each with a projection 205a, are formed at such a large distance from one another that when the printed circuit boards 201, 202 are inserted, there is a clamping effect between the clamping elements 205 and the two Printed circuit boards 201, 202 is achieved.
  • the two printed circuit boards 201, 202 are mechanically connected to one another by displacing the printed circuit board 201 in the direction of the arrow 208 and the printed circuit board 202 in the direction of the arrow 209.
  • the clamp connection can also be produced with one or with three or more clamp elements 205.
  • the use of exactly two clamping elements 205 according to the invention for the clamping connection according to the invention between the two printed circuit boards 201, 202 is a good compromise between maximum stability of the mechanical connection, which is ensured by a larger number of clamping elements 205, and the desire to have as few clamping elements 205 as possible for reasons of cost to be used for the mechanical connection between the two printed circuit boards 201, 202.
  • FIG. 3 shows a feed device 300 by means of which clamping elements 305 are fed to the location of the transport route at which the printed circuit boards are connected to one another by a clamp connection.
  • the feed device 300 has a left feed channel 301, a right feed channel 302 and a support element 307.
  • the clamping elements 305 are transported from a storage container (not shown) via the left feed channel 301 and the right feed channel 302 to the support element 307, which can be raised or lowered by means of a lifting device 308.
  • the direction of supply of the clamping elements 305 is indicated by the arrows 309.
  • the 301, 302 is based on the so-called vibratory conveyor principle.
  • the two feed channels 301, 302 are set in vibration, so that the clamping elements 305 are transported along the feed channels 301, 302 which run at an incline.
  • the transport of the clamping elements 305 along the two supply channels 301, 302 therefore presupposes that the storage container (not shown) for the clamping elements 305 lies higher than the end of the left supply channel 301 or the end of the right supply channel 302, which ends each facing the support member 307.
  • the support element with the clamping elements 305 lying thereon is moved upwards by means of the lifting device 308 until the two clamping elements 305 located on the supporting element 307 are just in the plane of the printed circuit boards 201, 202 (see FIG. 2).
  • FIG. 4 illustrates how, according to an exemplary embodiment of the invention, two printed circuit boards 401, 402 mechanically connected to one another by means of a clamping connection can be separated from one another by using a spreading device 411 according to the invention.
  • a spreading device 411 there are two means of a clamping connection with each other composites ⁇ ne circuit boards 401, 402 on a transport path 400.
  • the two interconnected printed circuit boards 401, 402 are located on a left-side transport belt 403 and a right conveyor belt 404.
  • the left transport belt 403 and the right transport belt 404 are each divided into two transport belts. Due to the perspective representation of FIG. 4, this division can only be seen in the right transport belt 404.
  • the two connected printed circuit boards 401, 402 are positioned on the transport path 400 in such a way that the printed circuit board 401 lies on part of the left transport belt 403 and on part of the right transport transport 404 and the circuit board 402 lies on the other part of the transport belts 403, 404.
  • the clamping elements 405 are designed such that a small gap remains free between the mutually facing edges of the printed circuit boards 401, 402.
  • a spreading device 411 is inserted into the gap between the two printed circuit boards 401, 402.
  • the spreading device has at least two wedges 412, 413 which run at an angle to the transport plane and which are arranged in such a way that the clamping connection between the two printed circuit boards 401, 402 by displacing the wedges against one another le 412, 413 is solved parallel to the transport level.
  • a Ver ⁇ push the wedge 412 along a parting direction 414 results in a shift of the circuit board 401 relative to the transport path 400 in the separating direction 414.
  • a displacement of the wedge 413 leads along an
  • the clamping elements 405 can be caught in a storage container 420 for clamping elements 405, must be ensured be that after the circuit boards 401, 402 have been separated, the clamping elements 405 do not remain clamped to one of the two circuit boards 401, 402.
  • clamping elements 405 are connected to the lower sections of the two stop cylinders 406 via a magnetic interaction and / or a toothing and thus a displacement of the clamping elements 405 relative to the clamping element holders 406 in a direction parallel or antiparallel to the separating directions 414, 415 is prevented.
  • the magnetic field which holds the clamping elements 405 on the stop cylinders 406 is then switched off, so that the clamping elements 405 fall into the storage container 420.
  • the magnetic field can easily be switched off, for example, if an electromagnet is used to generate the magnetic field.
  • clamping elements 405 can also be connected to the stop cylinders 406 by means of a vacuum, in which case the stop cylinders 406 must have a hollow interior and a downward opening through which the clamping elements 405 are sucked in. In this case, a vacuum system is also required, which is connected to the stop cylinders 406.
  • FIG. 5 shows how printed circuit boards can be connected to one another by means of an adhesive connection.
  • a trans port route 500 there are two printed circuit boards 501, 502, each of which rests with its left edge area on a left transport belt 503 and with its right edge area on a right transport belt 504.
  • the two printed circuit boards 501, 502 are strung together in such a way that a small gap remains free between the two mutually facing edges of the printed circuit boards 501, 502.
  • the two PCBs 501, 502 lined up with one another are positioned on the transport path 500 such that the gap or the abutting edges of the two PCBs 501, 502 are positioned directly below dosing devices 506.
  • the dosing devices 506 are filled with a viscous adhesive, which can be dispensed in a precisely determinable amount, so that adhesive drops 505 are applied between the two printed circuit boards 501, 502, the adhesive drops 505 connecting the two printed circuit boards 501, 502 to be connected to one another.
  • the number of adhesive drops 505 is equal to the number of metering devices 506. It should also be noted here that in principle any number of adhesive drops 505 can be used for the adhesive connection between the two printed circuit boards 501, 502.
  • Figure 6 shows how the adhesive bond applied in Figure 5 can be cured.
  • the two connected printed circuit boards 601, 602 are transported further along the transport path 600 after the adhesive has been applied, so that the adhesive drops 605 applied by the metering devices 606 are cured by means of electromagnetic radiation.
  • the Glue drop 605 hardened with UV light.
  • electromagnetic radiation in other spectral ranges can also be used.
  • the heating device comprises six heating elements 710, a heat reflector 711 being arranged above each of two heating elements, which on the one hand prevents the surroundings above the transport path 700 from being unnecessarily heated and which also ensures that those of the
  • the amount of heat generated by heating elements 710 is preferably radiated in the direction of the circuit boards 701, 702 to be separated.
  • the viscous adhesive used is designed in such a way that the cured adhesive drops 605 shown in FIG. 6 become liquid under the influence of heat and the adhesive effect is significantly reduced.
  • the heating of the glue droplets 705 and the subsequent spreading of the drop of glue 705 is indicated in figure 7 in that the adhesive bead 705 each cover a substantially larger area than the previously cured Kl 'ebstofftropfen 605 (see Figure 6).
  • the loosening of the adhesive connection shown in FIG. 7 between the two printed circuit boards 701, 702 can simultaneously be connected to a soldering process for the assembled components.
  • the amount of heat given off by the heating elements 710 is responsible not only for releasing the adhesive connection but also for melting the solder paste between the assembled components and printed circuit boards 701, 702.
  • Figure 8 shows how, according to the invention after heating the adhesive connection between two printed circuit boards 801, 802 in the ⁇ the circuit boards 801, 802 are separated from each other, wherein a two-part transport path is used the 800th
  • the two-part transport route 800 has a first part 810 and a second part 820, which is arranged directly downstream relative to the first section 810.
  • the two are separated to be separated circuit boards 801, 802 in that from the time at which the Lei ⁇ terplatte 801 on the first part 810 of the transport path
  • the transport on the first partial route 810 is stopped for a predetermined period of time. Within this time span, the transport is continued on the second section 820, so that the printed circuit board 802 continues to move in the transport direction indicated by the arrow 821 and at the same time the printed circuit board
  • the separation of the two circuit boards 801, 802 is additionally ensured by a stop device 830, which prevents the circuit board 801 from being transported in the direction of the second section 820 while the first section 810 is stopped.
  • the stop device 830 works in such a way that immediately after the first section 820 has stopped, the stop device 830 is lifted up into the transport plane in which the two printed circuit boards 801, 802 to be separated are also located.
  • the printed circuit board 801 would abut the printed circuit board 801 on the stop element 803 and thus not drawn from the circuit board 802 onto the section 820.
  • Printed circuit boards can be separated from one another after the adhesive connection has been released using the expansion device according to the invention described with reference to FIG.
  • a spreading device can also be used for separating printed circuit boards which were previously mechanically connected to one another by means of a soldered connection.
  • the separation of printed circuit boards according to the invention explained with reference to FIG. 8 can be used by means of a multi-part transport path and / or by means of a stop device for the separation of printed circuit boards which were previously mechanically connected to one another by means of a soldered connection and / or a clamp connection.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The invention relates to a method for the combined processing of printed circuit boards. According to the invention, printed circuit boards (101, 102) are lined up next to each other in a transport plane on a transport section (100), said printed circuit boards (101, 102) are mechanically connected to each other, the connected printed circuit boards (101, 102) are processed in a combined manner, and the mechanical connection between the printed circuit boards (101, 102) is then undone. According to preferred forms of embodiment of the invention, the mechanical connection between the printed circuit boards (101, 102) is produced by means of a soldered joint (125), a clamped joint and/or an adhesive joint. The inventive method can be carried out in a fully automated manner.

Description

Beschreibungdescription

Verfahren zum gemeinsamen Bearbeiten von LeiterplattenProcess for joint processing of printed circuit boards

Die Erfindung betrifft ein Verfahren zum gemeinsamen Bearbei¬ ten von mehreren Leiterplatten, insbesondere ein Verfahren, bei dem mehrere Leiterplatten in einem Bestückautomaten ge¬ meinsam mit elektrischen und/oder elektronischen Bauelementen bestückt werden.The invention relates to a method for common machining ¬ th of several printed circuit boards, in particular a method in which a plurality of circuit boards in a placement ge ¬ be jointly fitted with electrical and / or electronic components.

Aufgrund der in den letzten Jahren erreichten Miniaturisierung von elektronischen Bauelementen werden zunehmend komplexe elektronische Schaltungen auf relativ kleinen Leiterplatten untergebracht. Kleine Leiterplatten haben jedoch den Nachteil, dass deren Handhabung für eine Bestückung mittels modernen Bestückautomaten gegenüber größeren Leiterplatten komplizierter ist. Die Verwendung von relativ kleinen Leiterplatten hat ferner den Nachteil, dass die Effizienz der Bestückung mit elektrischen Bauelementen insbesondere bei Be- stückautomaten, welche auch für die Bestückung von größeren Leiterplatten geeignet sind, erheblich kleiner ist. Dies liegt daran, dass eine präzise Bestückung in dem in größeren Bestückautomaten vorhandenen Bestückfeldern im Rahmen eines einzigen Bestückvorgangs nur für eine einzelne zu bestückende Leiterplatte gewährleistet werden kann. Die gleichzeitige Bestückung von zwei oder mehreren Leiterplatten mittels eines einzigen Bestückvorgangs ist bisher nicht möglich, da eine präzise Handhabung und Fixierung von zwei oder mehreren Leiterplatten nicht möglich ist und somit die Präzision redu- ziert ist, mit der die einzelnen Bauelemente auf die gewünschten AufSetzpositionen aufgesetzt werden.Due to the miniaturization of electronic components that has been achieved in recent years, increasingly complex electronic circuits are being accommodated on relatively small printed circuit boards. However, small circuit boards have the disadvantage that their handling for assembly using modern placement machines is more complicated than larger circuit boards. The use of relatively small circuit boards also has the disadvantage that the efficiency of the assembly with electrical components, in particular in the case of automatic placement machines, which are also suitable for the assembly of larger circuit boards, is considerably lower. This is due to the fact that a precise assembly in the assembly fields present in larger assembly machines can only be guaranteed for a single circuit board as part of a single assembly process. The simultaneous assembly of two or more circuit boards by means of a single assembly process has so far not been possible, since precise handling and fixing of two or more circuit boards is not possible, and thus the precision with which the individual components are placed on the desired mounting positions is reduced become.

Der Erfindung liegt somit die Aufgabe zugrunde, ein Verfahren zum gemeinsamen Bearbeiten von Leiterplatten zu schaffen, so dass insbesondere eine gemeinsame Bestückung von zwei oder mehreren Leiterplatten in einem in einem Bestückautomaten durchgeführten Bestückvorgang mit hoher Genauigkeit mit elektrischen Bauelementen bestückt werden können.The invention is therefore based on the object of providing a method for jointly processing printed circuit boards, so that in particular a joint assembly of two or more printed circuit boards in one in an automatic placement machine performed placement process can be equipped with high accuracy with electrical components.

Diese Aufgabe wird gelöst durch ein Verfahren zum gemeinsamen Bearbeiten von Leiterplatten, bei dem auf einer Transportstrecke in einer Transportebene liegende Leiterplatten aneinandergereiht werden, die aneinandergereihten Leiterplatten mechanisch miteinander verbunden werden, die verbundenen Leiterplatten gemeinsam bearbeitet werden und danach die me- chanische Verbindung zwischen den Leiterplatten gelöst wird.This object is achieved by a method for the joint processing of printed circuit boards, in which printed circuit boards lying on a transport path are lined up in a transport plane, the lined up printed circuit boards are mechanically connected to one another, the connected printed circuit boards are processed together and then the mechanical connection between the printed circuit boards is solved.

Das erfindungsgemäße Verfahren ist insbesondere dann von Vorteil, wenn die gemeinsame Bearbeitung der verbundenen Leiterplatten eine Bestückung mit Bauelementen, insbesondere eine Bestückung mit elektrischen, d.h. elektronischen und/oder elektro echanisehen Bauelementen, aufweist. Die Erfindung schafft somit die Möglichkeit, auch kleinere Leiterplatten schnell und präzise mit elektrischen Bauelementen zu bestük- ken.The method according to the invention is particularly advantageous if the joint processing of the connected printed circuit boards is to be equipped with components, in particular with electrical, i.e. electronic and / or electro-mechanical components. The invention thus creates the possibility of equipping smaller circuit boards quickly and precisely with electrical components.

Gemäß einer Ausführungsform der Erfindung werden die Leiterplatten derart aneinandergereiht, dass ihre einander zugewandten Kanten im wesentlichen parallel verlaufen. Dies hat den Vorteil, dass die zu bearbeitenden Leiterplatten präzise aneinandergereiht werden können.According to one embodiment of the invention, the printed circuit boards are strung together in such a way that their mutually facing edges run essentially parallel. This has the advantage that the circuit boards to be processed can be lined up precisely.

Die einander zugewandten Kanten der zu verbindenden Leiterplatten können ferner senkrecht, parallel und/oder winklig zu der Transportstrecke ausgerichtet werden. Damit können erfin- dungsgemäß auch Leiterplatten gemeinsam bestückt werden, welche eine nicht-rechteckige Form aufweisen.The mutually facing edges of the circuit boards to be connected can also be aligned perpendicular, parallel and / or at an angle to the transport path. According to the invention, printed circuit boards which have a non-rectangular shape can therefore also be assembled together.

Gemäß einer bevorzugten Ausführungsform der Erfindung wird die mechanische Verbindung der aneinandergereihten Leiter- platten mittels einer Lötverbindung hergestellt. Für die erfindungsgemäße Lötverbindung können ein oder mehrere aufgelötete Verbindungsstreifen verwendet werden. Die Verwendung ei- ner Lötverbindung, insbesondere eine Lötverbindung mit einem oder mit mehreren aufgelöteten Verbindungsstreifen hat den Vorteil, dass eine präzise und stabile Verbindung zwischen den Leiterplatten gewährleistet wird.According to a preferred embodiment of the invention, the mechanical connection of the interconnected printed circuit boards is established by means of a soldered connection. One or more soldered connection strips can be used for the solder connection according to the invention. The use of ner solder connection, in particular a solder connection with one or more soldered connection strips has the advantage that a precise and stable connection between the circuit boards is guaranteed.

Das Lösen der mechanischen Verbindung zwischen den Leiter¬ platten kann erfindungsgemäß durch ein Durchtrennen der Verbindungsstreifen und/oder ein Erhitzen von einer oder von mehreren Lötstellen erfolgen, welche zwischen Leiterplatte und Verbindungsstreifen ausgebildet sind.The plates can release of the mechanical connection between the conductor ¬ according to the invention be made of one or of a plurality of solder joints formed between the circuit board and a connecting strip by cutting through the connecting strips and / or heating.

Gemäß einer weiteren bevorzugten Ausführungsform der Erfindung wird die mechanische Verbindung der aneinandergereihten Leiterplatten mittels einer Klemmverbindung hergestellt. Für die erfindungsgemäße Klemmverbindung können eine oder mehrere Klemmelemente verwendet werden. Die Verwendung einer Klemmverbindung hat den Vorteil, dass die zu verbindenden Leiterplatten durch die temporäre Verbindung nicht verändert werden müssen. Damit können auch diejenigen Stellen der Leiterplat- ten, welche Stellen für die Befestigung der Klemmverbindung und insbesondere für die Befestigung der Klemmelemente vorübergehend freigehalten werden müssen, nach dem Trennen der Leiterplatten für eine weitere manuelle Bestückung mit Bauelementen oder für die manuelle Befestigung von Kontaktstif- ten und/oder Steckern verwendet werden.According to a further preferred embodiment of the invention, the mechanical connection of the interconnected printed circuit boards is established by means of a clamp connection. One or more clamping elements can be used for the clamp connection according to the invention. The use of a clamp connection has the advantage that the circuit boards to be connected do not have to be changed by the temporary connection. In this way, even those points on the printed circuit boards which have to be kept temporarily free for the fastening of the clamping connection and in particular for the fastening of the clamping elements, after the circuit boards have been separated, for further manual assembly with components or for the manual fastening of contact pins and / or plugs can be used.

Gemäß einer Ausführungsform der Erfindung werden die Klemmelemente mittels einer Schwingfördervorrichtung an die Stelle der Transportstrecke zugeführt, an der die Leiterplatten mit- tels der Klemmverbindung mechanisch miteinander verbunden werden. Die automatische Zuführung der für die Klemmverbindung erforderlichen Klemmelemente stellt eine wichtige Voraussetzung dar, um das erfindungsgemäße Verfahren vollautomatisch durchführen zu können und somit Leiterplatten schnell und kostengünstig mit elektrischen Bauelementen zu bestücken. Gemäß einer weiteren Ausführungsform der Erfindung wird beim Verbinden der Leiterplatten ein Spalt zwischen den verbunde¬ nen Leiterplatten freigehalten. Dieser Spalt kann beispielsweise dazu verwendet werden, dass die Klemmverbindung mittels einer Spreizvorrichtung gelöst wird, welche in den Spalt zwischen den verbundenen Leiterplatten eingeführt wird. Somit kann erfindungsgemäß das Trennen der Leiterplatten auf der Transportstrecke erfolgen, wodurch auch ein automatisiertes Trennen der Leiterplatten vereinfacht wird.According to one embodiment of the invention, the clamping elements are fed by means of an oscillating conveyor device to the location of the transport path at which the printed circuit boards are mechanically connected to one another by means of the clamping connection. The automatic feeding of the clamping elements required for the clamping connection is an important prerequisite for being able to carry out the method according to the invention fully automatically and thus to equip printed circuit boards with electrical components quickly and inexpensively. G emäß a further embodiment of the invention is in connecting the printed circuit boards, a gap between the composites ¬ kept free NEN circuit boards. This gap can be used, for example, for the clamping connection to be released by means of a spreading device which is inserted into the gap between the connected printed circuit boards. Thus, according to the invention, the circuit boards can be separated on the transport route, which also simplifies automated separation of the circuit boards.

Gemäß einer weiterentwickelten Ausführungsform der Erfindung werden die Klemmelemente nach dem Lösen der mechanischen Verbindung gesammelt und für ein erneutes mechanisches Verbinden von weiteren Leiterplatten wiederverwendet. Die Wiederverwer- tung von bereits verwendeten Klemmelementen führt dazu, dass das erfindungsgemäße Verfahren kostengünstig durchgeführt werden kann.According to a further developed embodiment of the invention, the clamping elements are collected after loosening the mechanical connection and reused for a new mechanical connection of further printed circuit boards. The recycling of clamping elements already used means that the method according to the invention can be carried out inexpensively.

Gemäß einer weiteren bevorzugten Ausführungsform der Erfin- düng wird die mechanische Verbindung der aneinandergereihten Leiterplatten mittels einer Klebeverbindung hergestellt. Für die erfindungsgemäße Klebeverbindung können entweder ein oder mehrere Klebestreifen oder alternativ ein oder mehrere Tropfen aus zähflüssigem Klebstoff verwendet werden. Das Lösen einer Klebeverbindung, welche ein oder mehrere Klebestreifen aufweist, kann erfindungsgemäß durch ein Durchtrennen der Klebestreifen, durch ein Schmelzen der Klebestreifen und/oder durch ein Erwärmen von einer oder von mehreren Klebestellen, welche zwischen Leiterplatte und Klebestreifen ausgebildet sind, erfolgen. Das Lösen einer Klebeverbindung, welche einen oder mehrere Tropfen aus flüssigem Klebstoff aufweist, kann erfindungsgemäß durch ein Erhitzen der Klebstofftropfen erfolgen. Das Lösen der Klebeverbindung durch den Einsatz von thermischer Energie, welche zum Schmelzen der Klebestreifen, zum Erwärmen von einer oder von mehreren zwischen Leiterplatte und Klebestreifen ausgebildeten Klebestreifen oder zum Erhitzen der Klebstofftropfen führt, ermöglicht eine einfache Trennung der Leiterplatten. Eine derartige einfache Trennung der Leiterplatten kann auf derselben Transportstrecke automa¬ tisiert erfolgen. Zusammenfassend schafft das eine Klebever¬ bindung verwendende erfindungsgemäße Verfahren die vorteil- hafte Möglichkeit, Leiterplatten kostengünstig und auf einfa¬ che Weise temporär miteinander zu verbinden und somit den Leiterplattennutzen insbesondere von kleinen Leiterplatten zu erhöhen.According to a further preferred embodiment of the invention, the mechanical connection of the circuit boards which are lined up is produced by means of an adhesive connection. Either one or more adhesive strips or alternatively one or more drops of viscous adhesive can be used for the adhesive connection according to the invention. According to the invention, an adhesive connection which has one or more adhesive strips can be released by severing the adhesive strips, melting the adhesive strips and / or by heating one or more adhesive points which are formed between the printed circuit board and the adhesive strips. According to the invention, an adhesive connection which has one or more drops of liquid adhesive can be detached by heating the adhesive drops. The release of the adhesive connection through the use of thermal energy, which leads to the melting of the adhesive strips, to the heating of one or more adhesive strips formed between the printed circuit board and the adhesive strips, or to the heating of the adhesive drops, enables a simple one Separation of the circuit boards. Such a simple separation of the PCB can be made on the same transport path tisiert automatic ¬. In summary, creates a bond Klebever ¬ use the method of the invention Advantageous chance PCB cost and to increase simp ¬ che way temporarily to connect with each other and thus the PCB panels especially small circuit boards.

Entsprechend einer weiteren bevorzugten Ausführungsform der Erfindung werden nach dem Erhitzen der Klebeverbindung zwi¬ schen zwei entlang der Transportstrecke angeordneten Leiterplatten die beiden Leiterplatten unter Verwendung einer mehrteiligen Transportstrecke voneinander getrennt, wobei die mehrteilige Transportstrecke zumindest einer erste Teilstrek- ke und eine zweite Teilstrecke aufweist, die zweite Teilstrecke unmittelbar stromabwärts relativ zu der ersten Teilstrecke angeordnet ist und die zweite Teilstrecke zumindest zeitweise mit einer höheren Transportgeschwindigkeit als die erste Teilstrecke betrieben wird. Besonders vorteilhaft erweist sich das Trennen zweier Leiterplatten, wenn ab dem Zeitpunkt, an dem sich eine erste der beiden zu trennenden Leiterplatten auf der ersten Teilstrecke und die andere der beiden zu trennenden Leiterplatten auf der zweiten Teilstrek- ke befindet, der Transport auf der ersten Teilstrecke für eine vorbestimmte Zeitspanne angehalten wird. Somit können zwei Leiterplatten voneinander getrennt werden, ohne dass die beiden zu trennenden Leiterplatten von der Transportstrecke entfernt werden müssen. Dies eröffnet wiederum die Möglichkeit, auch das Trennen der Leiterplatten im Rahmen eines voll automatisierten Verfahrens durchzuführen.According to a further preferred embodiment of the invention, after heating the adhesive connection Zvi ¬ rule two arranged along the transport path circuit boards, the two circuit boards using a multipart transport path separated from one another, wherein the split transport path at least ke a first Teilstrek- and a second leg, which second section is arranged immediately downstream relative to the first section and the second section is operated at least at times at a higher transport speed than the first section. The separation of two circuit boards proves to be particularly advantageous if, from the point in time at which a first of the two circuit boards to be separated is on the first section and the other of the two circuit boards to be separated is on the second section, the transport on the first section is stopped for a predetermined period of time. Thus, two circuit boards can be separated from one another without the two circuit boards to be separated having to be removed from the transport path. This in turn opens up the possibility of also cutting the printed circuit boards as part of a fully automated process.

Gemäß einer weiteren weiterentwickelten Ausführungsform der Erfindung wird das Trennen der beiden Leiterplatten zusätz- lieh durch eine Stoppvorrichtung durchgeführt, welche verhindert, dass während dem Anhalten der ersten Teilstrecke die erste Leiterplatte in Richtung der zweiten Teilstrecke trans- portiert wird. Damit wird erfindungsgemäß gewährleistet, dass selbst bei einem nicht vollständigen Lösen der Klebeverbin¬ dung zwischen den beiden zu trennenden Leiterplatten eine zuverlässige Trennung der Leiterplatten erfolgt. Dies stellt wiederum eine wichtige Voraussetzung dar, um das erfindungs¬ gemäße Verfahren mit geringer Ausfallrate automatisiert durchzuführe .According to a further developed embodiment of the invention, the separation of the two printed circuit boards is additionally carried out by a stop device which prevents the first printed circuit board from being transposed in the direction of the second partial section while the first partial section is stopped. is ported. Thus, according to the invention ensures that even with a non-complete dissolution of the dung Klebeverbin ¬ takes place between the two printed circuit boards to be separated a reliable separation of the circuit boards. This in turn represents an important prerequisite for carrying out the method according to the invention with a low failure rate in an automated manner.

Weitere Vorteile und Merkmale der vorliegenden Erfindung er- geben sich aus der folgenden beispielhaften Beschreibung von derzeit bevorzugten Ausführungsformen.Further advantages and features of the present invention result from the following exemplary description of currently preferred embodiments.

Figur 1 zeigt eine Transportstrecke, auf welcher zwei in der Transportebene liegende Leiterplatten temporär mit- tels einer Lötverbindung miteinander verbunden werden.FIG. 1 shows a transport route on which two printed circuit boards lying in the transport plane are temporarily connected to one another by means of a soldered connection.

Figur 2 zeigt, wie entsprechend einem Ausführungsbeispiel der Erfindung zwei Leiterplatten mittels zwei Klemmele- enten miteinander verbunden werden.FIG. 2 shows how, in accordance with an exemplary embodiment of the invention, two printed circuit boards are connected to one another by means of two clamping elements.

Figur 3 zeigt, wie Klemmelemente mittels einer Schwingfördervorrichtung an die Stelle der Transportstrecke zugeführt werden, an der die Leiterplatten miteinander verbunden werden.FIG. 3 shows how clamping elements are fed by means of an oscillating conveyor device to the location of the transport route at which the printed circuit boards are connected to one another.

Figur 4 zeigt, wie entsprechend einer Ausführungsform der Erfindung zwei mittels Klemmelemente verbundene Leiterplatten durch den Einsatz einer Spreizvorrichtung voneinander getrennt werden.FIG. 4 shows how, according to an embodiment of the invention, two printed circuit boards connected by means of clamping elements are separated from one another by using a spreading device.

Figur 5 zeigt, wie entsprechend einem weiteren Ausführungsbeispiel der Erfindung zwei Leiterplatten mittels einer Klebeverbindung miteinander verbunden werden, welche drei Tropfen aus zähflüssigem Klebstoff aufweist . Figur 6 zeigt, wie drei Klebstofftropfen durch die Bestrahlung mit ultraviolettem Licht ausgehärtet werden.FIG. 5 shows how, according to a further exemplary embodiment of the invention, two printed circuit boards are connected to one another by means of an adhesive connection which has three drops of viscous adhesive. Figure 6 shows how three drops of adhesive are cured by exposure to ultraviolet light.

Figur 7 zeigt, wie eine aus Klebstofftropfen bestehende Kle- beverbindung durch ein Erhitzen der Klebstofftropfen gelöst wird.FIG. 7 shows how an adhesive connection consisting of drops of adhesive is released by heating the drops of adhesive.

Figur 8 zeigt, wie zwei Leiterplatten voneinander getrennt werden, indem eine mehrteilige Transportstrecke ver- wendet wird, in der der stromaufwärts angeordneteFIG. 8 shows how two printed circuit boards are separated from one another by using a multi-part transport route, in which the upstream one is arranged

Teil der Transportstrecke vorübergehend angehalten wird. Zusätzlich wird eine Stoppvorrichtung verwendet, welche sicherstellt, dass die nachfolgende der beiden Leiterplatten auf dem angehaltenen Teil der Transportstrecke verharrt.Part of the transport route is temporarily stopped. In addition, a stop device is used which ensures that the next of the two printed circuit boards remains on the stopped part of the transport route.

Figur 1 zeigt, wie gemäß einem ersten Ausführungsbeispiel der Erfindung zwei auf einer Transportstrecke 100 in der Transportebene liegende Leiterplatten 101, 102 temporär mittels einer Lötverbindung mechanisch miteinander verbunden werden. Die Leiterplatten 101, 102 liegen mit ihrem linken Randbereich auf einem linken Transportriemen 103 und mit ihrem rechten Randbereich auf einem rechten Transportriemen 104 auf. Der Transport der Leiterplatten 101, 102 erfolgt von links nach rechts. Die Transportrichtung der Leiterplatten 101,102 ist durch den Pfeil 105 angedeutet. Die Transportstrecke 100 ist in fünf Arbeitsbereiche, einen ersten Arbeitsbereich 111, einen zweiten Arbeitsbereich 112, einen dritten Arbeitsbereich 113, einen vierten Arbeitsbereich 114 sowie einen fünften Arbeitsbereich 115 unterteilt. In dem ersten Arbeitsbereich 111 werden die beiden Leiterplatten 101, 102, welche sich hintereinander auf der Transportstrecke 100 befinden, aneinandergereiht. Dabei wird entweder die hintere Leiterplatte 101 relativ zu den beiden Transportriemen 103, 104 nach vorne geschoben oder die vordere Leiterplatte 102 wird relativ zu den beiden Transportriemen 103, 104 nach hin- ten verschoben. Das Verschieben der Leiterplatten 101 bzw. 102 ist in Figur 1 durch die Pfeile 121 bzw. 122 angedeutet.FIG. 1 shows how, according to a first exemplary embodiment of the invention, two printed circuit boards 101, 102 lying on a transport route 100 in the transport plane are temporarily mechanically connected to one another by means of a soldered connection. The printed circuit boards 101, 102 rest with their left edge region on a left transport belt 103 and with their right edge region on a right transport belt 104. The circuit boards 101, 102 are transported from left to right. The direction of transport of the printed circuit boards 101, 102 is indicated by the arrow 105. The transport route 100 is divided into five work areas, a first work area 111, a second work area 112, a third work area 113, a fourth work area 114 and a fifth work area 115. In the first working area 111, the two printed circuit boards 101, 102, which are located one behind the other on the transport route 100, are strung together. Either the rear circuit board 101 is pushed forward relative to the two transport belts 103, 104 or the front circuit board 102 is moved relative to the two transport belts 103, 104 towards the rear. ten moved. The shifting of the printed circuit boards 101 and 102 is indicated in FIG. 1 by the arrows 121 and 122, respectively.

Nach dem Aneinanderreihen der beiden Leiterplatten 101, 102 werden die beiden nun aneinandergereihten LeiterplattenAfter the two printed circuit boards 101, 102 have been lined up, the two printed circuit boards are now lined up

101,102 in den zweiten Arbeitsbereich 112 transportiert. Dort wird in den beiden einander zugewandten Randbereichen der Leiterplatten 101,102 an zwei vorbestimmten Stellen Lotpaste 123 aufgetragen. Wie aus Figur 1 ersichtlich, bedeckt die Lotpaste 123, welche an jeder der beiden vorbestimmten Stellen aufgetragen ist, zugleich einen Teil der Leiterplatte 101 und einen Teil der Leiterplatte 102.101,102 transported into the second work area 112. There, solder paste 123 is applied to the two mutually facing edge regions of the printed circuit boards 101, 102 at two predetermined locations. As can be seen from FIG. 1, the solder paste 123, which is applied to each of the two predetermined locations, simultaneously covers part of the circuit board 101 and part of the circuit board 102.

Die beiden in den einander zugewandten Leiterplatten- Randbereichen zum Teil mit Lotpaste versehenen Leiterplatten 101, 102 werden nun von dem Arbeitsbereich 112 in den Arbeitsbereich 113 transportiert. Dort werden jeweils auf die mit Lotpaste 123 versehenen vorbestimmten Stellen metallische Verbindungsstreifen 124 abgelegt. Die metallischen Verbin- dungsstreifen 124 sind jeweils genau so groß, dass die mit der Lotpaste 123 bestrichenen vorbestimmten Stellen gerade abgedeckt sind.The two printed circuit boards 101, 102 partially provided with solder paste in the mutually facing circuit board edge areas are now transported from the work area 112 into the work area 113. Metallic connecting strips 124 are deposited there in each case on the predetermined locations provided with solder paste 123. The metallic connecting strips 124 are each of such a size that the predetermined locations covered with the solder paste 123 are just covered.

Danach werden die zum Teil mit Lotpaste 123 und mit den me- tallischen Verbindungsstreifen 124 versehenen LeiterplattenThen the printed circuit boards, some of which are provided with solder paste 123 and with the metallic connecting strips 124

101, 102 von dem Arbeitsbereich 113 in den Arbeitsbereich 114 transportiert. Dort werden die beiden metallischen Verbindungsstreifen 124 erwärmt, so dass die zwischen Verbindungsstreifen 124 und Leiterplatten 101, 102 befindliche Lotpaste 123 schmilzt. Nach dem Abkühlen der Lotpaste 123 und der Verbindungsstreifen 124 sind die beiden Leiterplatten 101, 102 mittels der angelöteten metallischen Verbindungsstreifen 125 fest miteinander verbunden.101, 102 transported from the work area 113 into the work area 114. There, the two metallic connecting strips 124 are heated, so that the solder paste 123 located between connecting strips 124 and printed circuit boards 101, 102 melts. After the solder paste 123 and the connecting strips 124 have cooled, the two printed circuit boards 101, 102 are firmly connected to one another by means of the soldered metallic connecting strips 125.

Die beiden mittels einer Lotverbindung fest verbundenen Leiterplatten 101, 102 können nun in einem nicht dargestellten Bestückvorgang, welcher bevorzugt in einem Bestückautomaten durchgeführt wird, mit Bauelementen bestückt werden. Nach der Bestückung können die beiden Leiterplatten 101, 102 ferner mittels eines für die entsprechende Bauelementbestückung ge¬ eigneten Lötverfahren fest mit den auf der jeweiligen Leiter- platte 101, 102 aufgebrachten Bauelemente sowohl elektrisch als auch mechanisch verbunden werden.The two printed circuit boards 101, 102 which are firmly connected by means of a solder connection can now be carried out in a placement process, not shown, which is preferably carried out in an automatic placement machine is carried out with components. After assembly, the two printed circuit boards 101, 102 can furthermore be connected both electrically and mechanically to the components applied to the respective printed circuit board 101, 102 by means of a soldering method suitable for the corresponding component assembly.

Danach werden die beiden mit Bauelementen bestückten und ge¬ gebenenfalls gelöteten Leiterplatten 101, 102 von dem Ar- beitsbereich 114 in den Arbeitsbereich 115 transportiert. In dem Arbeitsbereich 115 wird die mechanische Verbindung mit¬ tels der aufgelöteten Verbindungsstreifen 125 gelöst und die beiden Leiterplatten 101, 102 werden voneinander getrennt, indem die Leiterplatte 101 in die durch die Pfeile 126 ge- kennzeichnete Richtung und die Leiterplatte 102 in die durch die Pfeile 127 gekennzeichnete Richtung verschoben wird. Das Lösen der mechanischen Verbindung erfolgt erfindungsgemäß durch Durchtrennen der beiden aufgelöteten Verbindungsstreifen 125. Eine anderen Möglichkeit die mechanischen Verbindung zwischen den beiden Leiterplatten 101, 102 zu lösen besteht darin, die beiden aufgelöteten Verbindungsstreifen 125 so stark zu erhitzen, dass das zwischen den aufgelöteten Verbindungsstreifen 125 und den beiden Leiterplatten 101, 102 befindliche Lot erneut schmilzt.Thereafter, the two are fitted with components and ge ¬ optionally soldered circuit boards 101, 102 transported from the working area 114 in the work area 115th In the work area 115, the mechanical connection with ¬ is solved means of the soldered connection strip 125 and the two printed circuit boards 101, 102 are separated from each other by the printed circuit board 101 in the overall by the arrows 126 marked direction and the circuit board 102 in the by the arrows 127 marked direction is shifted. The mechanical connection is released according to the invention by cutting through the two soldered-on connection strips 125. Another possibility of releasing the mechanical connection between the two printed circuit boards 101, 102 is to heat the two soldered-on connection strips 125 to such an extent that that between the soldered-on connection strips 125 and the solder located on the two printed circuit boards 101, 102 melts again.

An dieser Stelle sei angemerkt, dass die Anwendung des Lötverfahrens zum elektrischen und mechanischen Verbinden der bestückten Bauelemente mit den Leiterplatten 101, 102 auch nach dem Trennen der beiden Leiterplatten 101, 102 in dem Ar- beitsbereich 115 erfolgen kann.At this point it should be noted that the soldering method for the electrical and mechanical connection of the assembled components to the printed circuit boards 101, 102 can also take place after the two printed circuit boards 101, 102 have been separated in the work area 115.

Ferner sei darauf hingewiesen, dass das erfindungsgemäße Verfahren zum gemeinsamen Bearbeiten von Leiterplatten nicht auf das temporäre Verbinden von zwei Leiterplatten beschränkt ist. So können beispielsweise mehrere in einer Reihe angeordnete Leiterplatten oder auch eine Anordnung mit sowohl hin- tereinander als auch nebeneinander angeordneten Leiterplatten temporär mechanisch miteinander verbunden werden.It should also be pointed out that the method according to the invention for jointly processing printed circuit boards is not limited to the temporary connection of two printed circuit boards. For example, several printed circuit boards arranged in a row or an arrangement with both PCBs arranged side by side as well as side by side are temporarily mechanically connected to one another.

Figur 2 zeigt das mechanische Verbinden zweier Leiterplatten 201, 202 mittels einer Klemmverbindung, welche mittels zwei Klemmeinheiten 205 hergestellt wird. Die beiden auf einer Transportstrecke 200 befindlichen Leiterplatten 201, 202 lie¬ gen mit ihrem linken Randbereich auf dem linken Transportriemen 203 und mit ihrem rechten Randbereich auf dem rechten Transportriemen 204 auf. Die beiden Klemmelemente 205 sind auf einem Stützelement 207 positioniert und werden von diesem von unten nach oben in die Ebene der beiden Leiterplatten 201, 202 gehoben. Eine exakte Höhenpositionierung der beiden Klemmelemente 205 wird durch die beiden Anschlagzylinder 206 gewährleistet, an welche die Klemmelemente 205 am Ende der Hebebewegung des Stützelements 207 anstoßen.FIG. 2 shows the mechanical connection of two printed circuit boards 201, 202 by means of a clamping connection, which is produced by means of two clamping units 205. The two printed circuit boards located on a transport path 200 201, 202 lie on ¬ gene with its left edge portion on the left-side transport belt 203 and with its right-hand edge region on the right-side transport belt 204th The two clamping elements 205 are positioned on a support element 207 and are lifted from the latter upwards into the plane of the two printed circuit boards 201, 202. Exact height positioning of the two clamping elements 205 is ensured by the two stop cylinders 206, against which the clamping elements 205 abut at the end of the lifting movement of the support element 207.

Wie aus Figur 2 ersichtlich, weisen die Klemmelemente 205 einen Querschnitt auf, welcher beispielsweise durch zwei eckige U-Formen beschrieben werden kann. Die beiden U-Formen sind dabei derart miteinander verbunden, dass die beiden offenen Seiten der beiden U-Formen voneinander abgewandt sind. Um eine sichere Verbindung der beiden Leiterplatten 201, 202 zu gewährleisten, ist auf jedem U-förmigen Schenkel der Halte- rungen 205 ein kleiner eckiger Vorsprung 205a vorgesehen. Die Klemmelemente 205 sind dabei derart ausgebildet, dass jeweils zwei einander gegenüberliegende U-förmige Schenkel mit jeweils einem Vorsprung 205a in einem so großen Abstand voneinander ausgebildet sind, dass beim Einschieben der Leiterplat- ten 201, 202 eine Klemmwirkung zwischen den Klemmelementen 205 und den beiden Leiterplatten 201, 202 erzielt wird.As can be seen from FIG. 2, the clamping elements 205 have a cross section, which can be described, for example, by two square U-shapes. The two U-shapes are connected to each other in such a way that the two open sides of the two U-shapes face away from each other. In order to ensure a secure connection of the two printed circuit boards 201, 202, a small angular projection 205a is provided on each U-shaped leg of the holders 205. The clamping elements 205 are designed in such a way that two mutually opposite U-shaped legs, each with a projection 205a, are formed at such a large distance from one another that when the printed circuit boards 201, 202 are inserted, there is a clamping effect between the clamping elements 205 and the two Printed circuit boards 201, 202 is achieved.

Wie ebenfalls aus Figur 2 ersichtlich, werden die beiden Leiterplatten 201, 202 mechanisch miteinander verbunden, indem die Leiterplatte 201 in Richtung des Pfeils 208 und die Leiterplatte 202 in Richtung des Pfeils 209 verschoben wird. An dieser Stelle sei angemerkt, dass die Klemmverbindung ebenso mit einem oder mit drei oder mehreren Klemmelementen 205 hergestellt werden kann. Die erfindungsgemäße Verwendung von genau zwei Klemmelementen 205 für die erfindungsgemäße Klemmverbindung zwischen den beiden Leiterplatten 201, 202 ist ein guter Kompromiss zwischen einer maximalen Stabilität der mechanischen Verbindung, welche durch eine größere Anzahl von Klemmelementen 205 gewährleistet wird und dem Wunsch aus Kostengründen möglichst wenige Klemmelemente 205 für die me- chanische Verbindung zwischen den beiden Leiterplatten 201, 202 zu verwenden.As can also be seen from FIG. 2, the two printed circuit boards 201, 202 are mechanically connected to one another by displacing the printed circuit board 201 in the direction of the arrow 208 and the printed circuit board 202 in the direction of the arrow 209. At this point it should be noted that the clamp connection can also be produced with one or with three or more clamp elements 205. The use of exactly two clamping elements 205 according to the invention for the clamping connection according to the invention between the two printed circuit boards 201, 202 is a good compromise between maximum stability of the mechanical connection, which is ensured by a larger number of clamping elements 205, and the desire to have as few clamping elements 205 as possible for reasons of cost to be used for the mechanical connection between the two printed circuit boards 201, 202.

Figur 3 zeigt eine Zuführungsvorrichtung 300, mittels der Klemmelemente 305 an die Stelle der Transportstrecke zuge- führt werden, an der die Leiterplatten durch eine Klemmverbindung miteinander verbunden werden. Die Zuführungsvorrichtung 300 weist einen linken Zuführungskanal 301, einen rechten Zuführungskanal 302 und ein Stützelement 307 auf. Die Klemmelemente 305 werden von einem Vorratsbehälter (nicht dargestellt) über den linken Zuführungskanal 301 und den rechten Zuführungskanal 302 zu dem Stützelement 307 transportiert, welches mittels einer Hubvorrichtung 308 angehoben oder gesenkt werden kann. Die Zuführungsrichtung der Klemm- elemente 305 ist durch die Pfeile 309 angedeutet. Der Trans- port der Klemmelemente 305 auf den beiden ZuführungskanälenFIG. 3 shows a feed device 300 by means of which clamping elements 305 are fed to the location of the transport route at which the printed circuit boards are connected to one another by a clamp connection. The feed device 300 has a left feed channel 301, a right feed channel 302 and a support element 307. The clamping elements 305 are transported from a storage container (not shown) via the left feed channel 301 and the right feed channel 302 to the support element 307, which can be raised or lowered by means of a lifting device 308. The direction of supply of the clamping elements 305 is indicated by the arrows 309. The transport of the clamping elements 305 on the two feed channels

301, 302 beruht auf dem sog. Schwingförderprinzip. Dabei werden die beiden Zuführungskanäle 301, 302 in Vibration versetzt, so dass die Klemmelemente 305 entlang der in einer Neigung verlaufenden Zuführungskanälen 301, 302 transportiert werden. Damit setzt der Transport der Klemmelemente 305 entlang den beiden Zuführungskanälen 301, 302 voraus, dass der Vorratsbehälter (nicht dargestellt) für die Klemmelemente 305 höher liegt als das Ende von dem linken Zuführungskanal 301 bzw. das Ende von dem rechten Zuführungskanal 302, welche En- den jeweils dem Stützelement 307 zugewandt sind. Nachdem von dem linken Zuführungskanal 301 und dem rechten Zuführungskanal 302 jeweils ein Klemmelement 305 an • das Stützelement 307 übergeben worden ist, wird das Stützelement mit den darauf liegenden Klemmelementen 305 mittels der Hubvorrichtung 308 nach oben verfahren, bis sich die beiden auf dem Stützelement 307 befindlichen Klemmelemente 305 gerade in der Ebene der Leiterplatten 201, 202 befinden (siehe Figur 2) .301, 302 is based on the so-called vibratory conveyor principle. The two feed channels 301, 302 are set in vibration, so that the clamping elements 305 are transported along the feed channels 301, 302 which run at an incline. The transport of the clamping elements 305 along the two supply channels 301, 302 therefore presupposes that the storage container (not shown) for the clamping elements 305 lies higher than the end of the left supply channel 301 or the end of the right supply channel 302, which ends each facing the support member 307. After from the left supply channel 301 and the right supply channel 302 in each case a clamping element 305 to the support member 307 • has been transferred, the support element with the clamping elements 305 lying thereon is moved upwards by means of the lifting device 308 until the two clamping elements 305 located on the supporting element 307 are just in the plane of the printed circuit boards 201, 202 (see FIG. 2).

Figur 4 illustriert, wie gemäß einem Ausführungsbeispiel der Erfindung zwei mittels einer Klemmverbindung mechanisch miteinander verbundene Leiterplatten 401, 402 durch den Einsatz einer erfindungsgemäßen Spreizvorrichtung 411 voneinander getrennt werden können. Wie aus Figur 4 ersichtlich, befinden sich zwei mittels einer Klemmverbindung miteinander verbunde¬ ne Leiterplatten 401, 402 auf einer Transportstrecke 400. Die beiden miteinander verbundenen Leiterplatten 401, 402 liegen auf einem linken Transportriemen 403 und einem rechten Transportriemen 404 auf. Der linke Transportriemen 403 und der rechte Transportriemen 404 sind jeweils in zwei Transportriemen aufgeteilt. Diese Aufteilung ist aufgrund der perspektivischen Darstellung von Figur 4 nur bei dem rechten Transpor- triemen 404 zu erkennen. Um die beiden Leiterplatten 401, 402 voneinander zu trennen, werden die beiden verbundenen Leiterplatten 401, 402 auf der Transportstrecke 400 derart positioniert, dass die Leiterplatte 401 auf einem Teil des linken Transportriemens 403 sowie auf einem Teil des rechten Trans- portrie ens 404 liegt und die Leiterplatte 402 auf dem jeweils anderen Teil der Transportriemen 403, 404 liegt. Wie ferner aus Figur 4 ersichtlich, sind die Klemmelemente 405 derart ausgebildet, dass zwischen den einander zugewandten Kanten der Leiterplatten 401, 402 ein kleiner Spalt frei bleibt. Um die beiden Leiterplatten 401, 402 voneinander zu trennen, wird eine Spreizvorrichtung 411 in den Spalt zwischen den beiden Leiterplatten 401, 402 eingeführt. Gemäß der hier dargestellten Ausführungsform der Erfindung weist die Spreizvorrichtung mindestens zwei winklig zur Transportebene verlaufende Keile 412, 413 auf, welche derart angeordnet sind, dass die Klemmverbindung zwischen den beiden Leiterplatten 401, 402 durch ein gegeneinander Verschieben der Kei- le 412, 413 parallel zur Transportebene gelöst wird. Ein Ver¬ schieben des Keils 412 entlang einer Trennrichtung 414 führt zu einer Verschiebung der Leiterplatte 401 relativ zu der Transportstrecke 400 in die Trennrichtung 414. Dementspre- chend führt ein Verschieben des Keils 413 entlang einerFIG. 4 illustrates how, according to an exemplary embodiment of the invention, two printed circuit boards 401, 402 mechanically connected to one another by means of a clamping connection can be separated from one another by using a spreading device 411 according to the invention. As can be seen from Figure 4, there are two means of a clamping connection with each other composites ¬ ne circuit boards 401, 402 on a transport path 400. The two interconnected printed circuit boards 401, 402 are located on a left-side transport belt 403 and a right conveyor belt 404. The left transport belt 403 and the right transport belt 404 are each divided into two transport belts. Due to the perspective representation of FIG. 4, this division can only be seen in the right transport belt 404. In order to separate the two printed circuit boards 401, 402 from one another, the two connected printed circuit boards 401, 402 are positioned on the transport path 400 in such a way that the printed circuit board 401 lies on part of the left transport belt 403 and on part of the right transport transport 404 and the circuit board 402 lies on the other part of the transport belts 403, 404. As can also be seen from FIG. 4, the clamping elements 405 are designed such that a small gap remains free between the mutually facing edges of the printed circuit boards 401, 402. In order to separate the two printed circuit boards 401, 402 from one another, a spreading device 411 is inserted into the gap between the two printed circuit boards 401, 402. In accordance with the embodiment of the invention shown here, the spreading device has at least two wedges 412, 413 which run at an angle to the transport plane and which are arranged in such a way that the clamping connection between the two printed circuit boards 401, 402 by displacing the wedges against one another le 412, 413 is solved parallel to the transport level. A Ver ¬ push the wedge 412 along a parting direction 414 results in a shift of the circuit board 401 relative to the transport path 400 in the separating direction 414. Correspondingly, a displacement of the wedge 413 leads along an

Trennrichtung 415 zu einer Verschiebung der Leiterplatte 402 relativ zu der Transportstrecke 400 in die Trennrichtung 415. Um zu gewährleisten, dass nach dem Trennen der beiden Leiterplatten 401, 402 die Klemmelemente 405 in einem Vorratsbehäl- ter 420 für Klemmelemente 405 aufgefangen werden können, muss sichergestellt werden, dass nach dem Trennen der Leiterplatten 401, 402 die Klemmelemente 405 nicht an einer der beiden Leiterplatten 401, 402 klemmen bleiben. Dies kann zum Beispiel dadurch erreicht werden, dass die Klemmelemente 405 über eine magnetische Wechselwirkung und/oder eine Verzahnung mit den unteren Abschnitten der beiden Anschlagzylinder 406 verbunden sind und somit eine Verschiebung der Klemmelemente 405 relativ zu den Klemmelementhaltern 406 in einer Richtung parallel oder antiparallel zu den Trennrichtungen 414, 415 verhindert wird. Nach dem Trennen der beiden Leiterplatten 401, 402 wird dann das Magnetfeld abgeschaltet, welches die Klemmelemente 405 an den Anschlagzylindern 406 hält, so dass die Klemmelemente 405 in den Vorratsbehälter 420 fallen. Das Abschalten des Magnetfeldes ist beispielsweise dann einfach möglich, wenn zur Magnetfeld-Erzeugung ein Elektromagnet verwendet wird.Separation direction 415 for a displacement of the circuit board 402 relative to the transport path 400 in the separation direction 415. To ensure that after the separation of the two circuit boards 401, 402, the clamping elements 405 can be caught in a storage container 420 for clamping elements 405, must be ensured be that after the circuit boards 401, 402 have been separated, the clamping elements 405 do not remain clamped to one of the two circuit boards 401, 402. This can be achieved, for example, in that the clamping elements 405 are connected to the lower sections of the two stop cylinders 406 via a magnetic interaction and / or a toothing and thus a displacement of the clamping elements 405 relative to the clamping element holders 406 in a direction parallel or antiparallel to the separating directions 414, 415 is prevented. After the two circuit boards 401, 402 have been separated, the magnetic field which holds the clamping elements 405 on the stop cylinders 406 is then switched off, so that the clamping elements 405 fall into the storage container 420. The magnetic field can easily be switched off, for example, if an electromagnet is used to generate the magnetic field.

An dieser Stelle sei angemerkt, dass die Klemmelemente 405 ebenso über einen Unterdruck an die Anschlagzylinder 406 ge- bunden werden können, wobei dann die Anschlagzylinder 406 einen hohlen Innenraum und eine nach unten durchgehende Öffnung aufweisen müssen, über die die Klemmelemente 405 angesaugt werden. In diesem Fall ist ferner ein Unterdrucksystem erforderlich, welches mit den Anschlagzylindern 406 verbunden ist.At this point it should be noted that the clamping elements 405 can also be connected to the stop cylinders 406 by means of a vacuum, in which case the stop cylinders 406 must have a hollow interior and a downward opening through which the clamping elements 405 are sucked in. In this case, a vacuum system is also required, which is connected to the stop cylinders 406.

Figur 5 zeigt, wie Leiterplatten mittels einer Klebeverbindung miteinander verbunden werden können. Auf einer Trans- portstrecke 500 befinden sich zwei Leiterplatten 501, 502, welche jeweils mit ihrem linken Randbereich auf einem linken Transportriemen 503 und mit ihrem rechten Randbereich auf einem rechten Transportriemen 504 aufliegen. Die beiden Leiter- platten 501, 502 sind derart aneinandergereiht, dass zwischen den beiden einander zugewandten Kanten der Leiterplatten 501, 502 ein kleiner Spalt frei bleibt. Für die mechanische Ver¬ bindung der beiden Leiterplatten 501, 502 mit der hier be¬ schriebenen Klebeverbindung ist die Bildung eines Spaltes zwischen den beiden Leiterplatten 501, 502 allerdings nicht unbedingt erforderlich. Um die beiden aneinandergereihten Leiterplatten 501, 502 miteinander zu verbinden, werden die beiden aneinandergereihten Leiterplatten 501, 502 auf der Transportstrecke 500 derart positioniert, dass der Spalt bzw. die aneinanderanliegenden Kanten der beiden Leiterplatten 501, 502 direkt unterhalb von Dosiervorrichtungen 506 positioniert werden. Die Dosiervorrichtungen 506 sind mit einem zähflüssigen Klebstoff gefüllt, welcher in einer genau bestimmbaren Menge abgegeben werden kann, so dass zwischen den beiden Leiterplatten 501, 502 Klebstofftropfen 505 aufgetragen werden, wobei die Klebstofftropfen 505 die beiden zu verbindenden Leiterplatten 501, 502 miteinander verbinden. Die Anzahl der Klebstofftropfen 505 ist gemäß dem hier beschriebenen Ausführungsbeispiel der Erfindung gleich der Anzahl der Dosiervorrichtungen 506. Auch an dieser Stelle sei angemerkt, dass im Prinzip eine beliebige Anzahl von Klebstofftropfen 505 für die Klebeverbindung zwischen den beiden Leiterplatten 501, 502 verwendet werden kann.FIG. 5 shows how printed circuit boards can be connected to one another by means of an adhesive connection. On a trans port route 500 there are two printed circuit boards 501, 502, each of which rests with its left edge area on a left transport belt 503 and with its right edge area on a right transport belt 504. The two printed circuit boards 501, 502 are strung together in such a way that a small gap remains free between the two mutually facing edges of the printed circuit boards 501, 502. For the mechanical Ver ¬ the two circuit boards 501 bond, 502 signed with the ¬ be here adhesive bonding is the formation of a gap between the two circuit boards 501, 502 but not essential. In order to connect the two PCBs 501, 502 lined up with one another, the two PCBs 501, 502 lined up with one another are positioned on the transport path 500 such that the gap or the abutting edges of the two PCBs 501, 502 are positioned directly below dosing devices 506. The dosing devices 506 are filled with a viscous adhesive, which can be dispensed in a precisely determinable amount, so that adhesive drops 505 are applied between the two printed circuit boards 501, 502, the adhesive drops 505 connecting the two printed circuit boards 501, 502 to be connected to one another. According to the exemplary embodiment of the invention described here, the number of adhesive drops 505 is equal to the number of metering devices 506. It should also be noted here that in principle any number of adhesive drops 505 can be used for the adhesive connection between the two printed circuit boards 501, 502.

Figur 6 zeigt, wie die in Figur 5 aufgetragene Klebeverbindung ausgehärtet werden kann. Wie aus Figur 6 ersichtlich, werden die beiden verbundenen Leiterplatten 601, 602 nach dem Klebstoffauftrag entlang der Transportstrecke 600 weiter transportiert, so dass die von den Dosiervorrichtungen 606 aufgetragenen Klebstofftropfen 605 mittels elektromagnetischer Strahlung ausgehärtet werden. Entsprechend dem hier dargestellten Ausführungsbeispiel der Erfindung werden die Klebstofftropfen 605 mittels UV-Licht ausgehärtet. Abhängig von der Wahl des verwendeten Klebstoffs kann jedoch auch elektromagnetische Strahlung in anderen Spektralbereichen verwendet werden.Figure 6 shows how the adhesive bond applied in Figure 5 can be cured. As can be seen from FIG. 6, the two connected printed circuit boards 601, 602 are transported further along the transport path 600 after the adhesive has been applied, so that the adhesive drops 605 applied by the metering devices 606 are cured by means of electromagnetic radiation. According to the embodiment of the invention shown here, the Glue drop 605 hardened with UV light. Depending on the choice of adhesive used, however, electromagnetic radiation in other spectral ranges can also be used.

Das Lösen einer Klebeverbindung zwischen zwei Leiterplatten wird anhand von Figur 7 erläutert. Nachdem die beiden verbun¬ denen Leiterplatten 701, 702 mit Bauelementen bestückt wur¬ den, werden die beiden nun zu trennenden Leiterplatten 701, 702 entlang der Transportstrecke 700 in eine Position transportiert, in der die beiden zu trennenden Leiterplatten 701, 702 unterhalb einer Heizvorrichtung positioniert sind. Die Heizvorrichtung umfasst gemäß dem hier dargestellten Ausführungsbeispiel der Erfindung sechs Heizelemente 710, wobei über jeweils zwei Heizelemente ein Wärmereflektor 711 angeordnet ist, welcher zum einen verhindert, dass die Umgebung oberhalb der Transportstrecke 700 unnötig erwärmt wird und welcher ferner dafür sorgt, dass die von den Heizelementen 710 erzeugte Wärmemenge bevorzugt in Richtung der zu trennen- den Leiterplatten 701, 702 abgestrahlt wird. Gemäß der Erfindung ist der verwendete zähflüssige Klebstoff derart ausgebildet, dass unter dem Einfluss von Wärme die in Figur 6 dargestellten ausgehärteten Klebstofftropfen 605 flüssig werden und die Klebewirkung deutlich reduziert wird. Das Erhitzen der Klebstofftropfen 705 und das anschließende Verlaufen der Klebstofftropfen 705 ist in Figur 7 dadurch angedeutet, dass die Klebstofftropfen 705 jeweils eine wesentlich größere Fläche bedecken als die zuvor ausgehärteten Kl'ebstofftropfen 605 (siehe Figur 6) . Gemäß einer bevorzugten Ausführungsform der Erfindung kann das in Figur 7 dargestellte Lösen der Klebeverbindung zwischen den beiden Leiterplatten 701, 702 gleichzeitig mit einem Lötvorgang für die bestückten Bauelemente verbunden werden. In diesem Fall ist die von den Heizelementen 710 abgegebene Wärmemenge neben dem Lösen der Klebever- bindung auch für ein Schmelzen der Lotpaste zwischen bestückten Bauelementen und Leiterplatten 701, 702 verantwortlich. Figur 8 zeigt, wie gemäß der Erfindung nach dem Erhitzen der Klebeverbindung zwischen zwei Leiterplatten 801, 802 die bei¬ den Leiterplatten 801, 802 voneinander getrennt werden, wobei eine zweiteilige Transportstrecke 800 verwendet wird. Die zweiteilige Transportstrecke 800 weist einen ersten Teil 810 und einen zweiten Teil 820 auf, welcher unmittelbar stromabwärts relativ zu der ersten Teilstrecke 810 angeordnet ist. Gemäß dem hier beschriebenen Ausführungsbeispiel der Erfindung werden die beiden zu trennenden Leiterplatten 801, 802 dadurch getrennt, dass ab dem Zeitpunkt, an dem sich die Lei¬ terplatte 801 auf dem ersten Teil 810 der TransportstreckeThe detachment of an adhesive connection between two printed circuit boards is explained with reference to FIG. 7. After the two verbun ¬ which printed circuit boards 701, 702 with components WUR equipped ¬, the two will now be transported to be separated circuit boards 701, 702 along the transport path 700 to a position in which the two positioned to be separated circuit boards 701, 702 below a heater are. According to the exemplary embodiment of the invention shown here, the heating device comprises six heating elements 710, a heat reflector 711 being arranged above each of two heating elements, which on the one hand prevents the surroundings above the transport path 700 from being unnecessarily heated and which also ensures that those of the The amount of heat generated by heating elements 710 is preferably radiated in the direction of the circuit boards 701, 702 to be separated. According to the invention, the viscous adhesive used is designed in such a way that the cured adhesive drops 605 shown in FIG. 6 become liquid under the influence of heat and the adhesive effect is significantly reduced. The heating of the glue droplets 705 and the subsequent spreading of the drop of glue 705 is indicated in figure 7 in that the adhesive bead 705 each cover a substantially larger area than the previously cured Kl 'ebstofftropfen 605 (see Figure 6). According to a preferred embodiment of the invention, the loosening of the adhesive connection shown in FIG. 7 between the two printed circuit boards 701, 702 can simultaneously be connected to a soldering process for the assembled components. In this case, the amount of heat given off by the heating elements 710 is responsible not only for releasing the adhesive connection but also for melting the solder paste between the assembled components and printed circuit boards 701, 702. Figure 8 shows how, according to the invention after heating the adhesive connection between two printed circuit boards 801, 802 in the ¬ the circuit boards 801, 802 are separated from each other, wherein a two-part transport path is used the 800th The two-part transport route 800 has a first part 810 and a second part 820, which is arranged directly downstream relative to the first section 810. According to the described embodiment of the invention, the two are separated to be separated circuit boards 801, 802 in that from the time at which the Lei ¬ terplatte 801 on the first part 810 of the transport path

800 und die Leiterplatte 802 auf dem zweiten Teil 820 der Transportstrecke 800 befindet, der Transport auf der ersten Teilstrecke 810 für eine vorbestimmte Zeitspanne angehalten wird. Innerhalb dieser Zeitspanne wird der Transport auf der zweiten Teilstrecke 820 fortgesetzt, so dass sich die Leiterplatte 802 in der mit dem Pfeil 821 angedeuteten Transportrichtung weiter bewegt und gleichzeitig die Leiterplatte800 and the printed circuit board 802 is located on the second part 820 of the transport route 800, the transport on the first partial route 810 is stopped for a predetermined period of time. Within this time span, the transport is continued on the second section 820, so that the printed circuit board 802 continues to move in the transport direction indicated by the arrow 821 and at the same time the printed circuit board

801 in ihrer Position verharrt. Das Trennen der beiden Lei- terplatten 801, 802 wird zusätzlich durch eine Stoppvorrichtung 830 gewährleistet, welche verhindert, dass während dem Anhalten der ersten Teilstrecke 810 die Leiterplatte 801 in Richtung der zweiten Teilstrecke 820 transportiert wird. Die Stoppvorrichtung 830 arbeitet derart, dass unmittelbar nach dem Anhalten der ersten Teilstrecke 820 die Stoppvorrichtung 830 nach oben in die Transportebene gehoben wird, in welcher sich auch die beiden zu trennenden Leiterplatten 801, 802 befinden. Damit würde die Leiterplatte 801 für den Fall, dass der Klebstoff zwischen den beiden Leiterplatten 801, 802 nicht vollständig geschmolzen ist und demzufolge die Verbindung zwischen den beiden Leiterplatten 801, 802 nicht vollständig gelöst wurde, die Leiterplatte 801 an dem Stoppelement 803 anstoßen und somit nicht von der Leiterplatte 802 mit auf die Teilstrecke 820 gezogen werden.801 remains in position. The separation of the two circuit boards 801, 802 is additionally ensured by a stop device 830, which prevents the circuit board 801 from being transported in the direction of the second section 820 while the first section 810 is stopped. The stop device 830 works in such a way that immediately after the first section 820 has stopped, the stop device 830 is lifted up into the transport plane in which the two printed circuit boards 801, 802 to be separated are also located. Thus, in the event that the adhesive between the two printed circuit boards 801, 802 is not completely melted and the connection between the two printed circuit boards 801, 802 has not been completely released, the printed circuit board 801 would abut the printed circuit board 801 on the stop element 803 and thus not drawn from the circuit board 802 onto the section 820.

Es sei ferner darauf hingewiesen, dass selbstverständlich auch zwei mittels einer Klebeverbindung temporär verbundenen Leiterplatten nach dem Lösen der Klebeverbindung mit der anhand von Figur 4 beschriebenen erfindungsgemäßen Spreizvorrichtung voneinander getrennt werden können. Eine derartige Spreizvorrichtung kann ebenso für das Trennen von Leiterplat- ten eingesetzt werden, welche zuvor mittels einer Lötverbindung mechanisch miteinander verbunden waren.It should also be pointed out that two are of course also temporarily connected by means of an adhesive connection Printed circuit boards can be separated from one another after the adhesive connection has been released using the expansion device according to the invention described with reference to FIG. Such a spreading device can also be used for separating printed circuit boards which were previously mechanically connected to one another by means of a soldered connection.

Entsprechend kann die anhand von Figur 8 erläuterte erfin- dungsgemäße Trennung von Leiterplatten mittels einer mehrtei- ligen Transportstrecke und/oder mittels einer Stoppvorrichtung für das Trennen von Leiterplatten eingesetzt werden, welche zuvor mittels einer Lötverbindung und/oder einer Klemmverbindung mechanisch miteinander verbunden waren. Correspondingly, the separation of printed circuit boards according to the invention explained with reference to FIG. 8 can be used by means of a multi-part transport path and / or by means of a stop device for the separation of printed circuit boards which were previously mechanically connected to one another by means of a soldered connection and / or a clamp connection.

Claims

Patentansprüche claims 1. Verfahren zum gemeinsamen Bearbeiten von Leiterplatten, bei dem1. Process for the common processing of printed circuit boards, in which • auf einer Transportstrecke in einer Transportebene liegende Leiterplatten aneinander gereiht werden,PCBs lying in a transport plane on a transport route are lined up, • die aneinander gereihten Leiterplatten mechanisch mitein- ander verbunden werden,The mechanically connected circuit boards are mechanically connected to one another, • die verbundenen Leiterplatten gemeinsam bearbeitet werden und danach• the connected circuit boards are processed together and afterwards • die mechanische Verbindung zwischen den Leiterplatten gelöst wird.• the mechanical connection between the circuit boards is released. 2. Verfahren gemäß Anspruch 1, bei dem die gemeinsame Bearbeitung der verbundenen Leiterplatten eine Bestückung mit Bauelementen aufweist.2. The method according to claim 1, wherein the joint processing of the connected printed circuit boards has an assembly with components. 3. Verfahren gemäß einem der Ansprüche 1 bis 2, bei dem die Leiterplatten derart aneinander gereiht werden, dass ihre einander zugewandten Kanten im wesentlichen parallel verlaufen.3. The method according to any one of claims 1 to 2, wherein the circuit boards are lined up in such a way that their mutually facing edges run substantially parallel. 4. Verfahren gemäß Anspruch 3, bei dem einander zugewandten Kanten4. The method according to claim 3, wherein the mutually facing edges • senkrecht,• vertical, • parallel und/oder• in parallel and / or • winklig zu der Transportstrecke ausgerichtet werden.• be aligned at an angle to the transport route. 5. Verfahren gemäß einem der Ansprüche 1 bis 4, bei dem die mechanische Verbindung der aneinander gereihten Leiterplatten mittels einer Lötverbindung hergestellt wird. 5. The method according to any one of claims 1 to 4, wherein the mechanical connection of the strung circuit boards is made by means of a soldered connection. 6. Verfahren gemäß Anspruch 5, bei dem für die Lötverbindung ein oder mehrere aufgelötete Verbindungsstreifen verwendet werden.6. The method according to claim 5, wherein one or more soldered connection strips are used for the soldered connection. 7. Verfahren gemäß Anspruch 6, bei dem die Lötverbindung gelöst wird durch7. The method according to claim 6, wherein the solder joint is released by • Durchtrennen der Verbindungsstreifen und/oder• Cut through the connecting strips and / or • Erhitzen von einer oder von mehreren Lötstellen, welche zwischen Leiterplatte und Verbindungsstreifen ausgebildet sind.• Heating one or more solder joints, which are formed between the printed circuit board and the connecting strip. 8. Verfahren gemäß einem der Ansprüche 1 bis 4, bei dem die mechanische Verbindung der aneinander gereihten Leiterplatten mittels einer Klemmverbindung hergestellt wird.8. The method according to any one of claims 1 to 4, wherein the mechanical connection of the strung circuit boards is made by means of a clamp connection. 9. Verfahren gemäß Anspruch 8, bei dem für die Klemmverbindung eine oder mehrere Klemmelemente verwendet werden.9. The method according to claim 8, in which one or more clamping elements are used for the clamping connection. 10. Verfahren gemäß Anspruch 9, bei dem die Klemmelemente mittels einer Schwingfördervorrichtung an die Stelle der10. The method according to claim 9, wherein the clamping elements by means of a vibratory conveyor in place of Transportstrecke zugeführt werden, an der die Leiterplatten mittels der Klemmverbindung miteinander verbunden werden.Transport route are supplied, on which the circuit boards are connected to each other by means of the clamp connection. 11. Verfahren gemäß einem der Ansprüche 8 bis 10, bei dem beim Verbinden der Leiterplatten ein Spalt' zwischen den verbundenen Leiterplatten freigehalten wird.11. The method according to any one of claims 8 to 10, in which a gap 'is kept clear between the connected printed circuit boards when connecting the printed circuit boards. 12. Verfahren gemäß Anspruch 11, bei dem die Klemmverbindung mittels einer Spreizvorrichtung gelöst wird, welche in den Spalt zwischen den verbundenen Leiterplatten eingeführt wird.12. The method according to claim 11, wherein the clamping connection is released by means of a spreading device which is inserted into the gap between the connected printed circuit boards. 13. Verfahren gemäß einem der Ansprüche 9 bis 12, bei dem die Klemmelemente nach dem Lösen der mechanischen Verbindung gesammelt und für ein erneutes mechanisches Verbinden von wei- teren Leiterplatten wiederverwendet werden. 13. The method according to any one of claims 9 to 12, in which the clamping elements are collected after loosening the mechanical connection and reused for a new mechanical connection of further printed circuit boards. 14. Verfahren gemäß einem der Ansprüche 1 bis 4, bei dem die mechanische Verbindung der aneinander gereihten Leiterplatten mittels einer Klebeverbindung hergestellt wird.14. The method according to any one of claims 1 to 4, wherein the mechanical connection of the strung circuit boards is made by means of an adhesive connection. 15. Verfahren gemäß Anspruch 14, bei dem für die Klebeverbin¬ dung ein oder mehrere Klebestreifen verwendet werden.15. The method according to claim 14, used in the for Klebeverbin ¬ dung one or more adhesive strips. 16. Verfahren gemäß Anspruch 15, bei dem die Klebeverbindung . gelöst wird durch • Durchtrennen der Klebestreifen,16. The method according to claim 15, wherein the adhesive connection. is solved by • cutting through the adhesive strips, • Schmelzen der Klebestreifen, und/oder• melting the adhesive strips, and / or • Erwärmen von einer oder von mehreren Klebestellen, welche zwischen Leiterplatte und Klebestreifen ausgebildet sind.• Heating one or more glue points, which are formed between the circuit board and the adhesive strip. 17. Verfahren gemäß Anspruch 14, bei dem für die Klebeverbindung ein oder mehrere Tropfen aus zähflüssigem Klebstoff verwendet werden.17. The method according to claim 14, in which one or more drops of viscous adhesive are used for the adhesive connection. 18. Verfahren gemäß Anspruch 17, bei dem die Klebeverbindung durch Erhitzen der Klebstoff-Tropfen gelöst wird.18. The method according to claim 17, wherein the adhesive connection is released by heating the adhesive drops. 19. Verfahren gemäß Anspruch 18, bei dem nach dem Erhitzen der Klebeverbindung zwischen zwei entlang der Transportstrecke angeordneten Leiterplatten die beiden Leiterplatten unter Verwendung einer mehrteiligen Transportstrecke voneinander getrennt werden, wobei19. The method according to claim 18, in which after heating the adhesive connection between two printed circuit boards arranged along the transport path, the two printed circuit boards are separated from one another using a multipart transport path, wherein • eine mehrteilige Transportstrecke mit zumindest einer ersten Teilstrecke und einer zweiten Teilstrecke verwendet wird, • die zweite Teilstrecke unmittelbar stromabwärts relativ zu der ersten Teilstrecke angeordnet ist, und• a multi-part transport route with at least one first section and a second section is used, • the second section is arranged directly downstream relative to the first section, and • die zweite Teilstrecke zumindest zeitweise mit einer höheren Transportgeschwindigkeit als die erste Teilstrecke betrieben wird.• The second section is operated at least at times at a higher transport speed than the first section. 20. Verfahren gemäß Anspruch 19, bei dem ab dem Zeitpunkt, an dem sich eine erste der beiden zu trennenden Leiterplatten auf der ersten Teilstrecke und die andere der beiden zu trennenden Leiterplatten auf der zweiten Teilstrecke befindet, der Transport auf der ersten Teilstrecke für eine vorbestimmte Zeitspanne angehalten wird.20. The method according to claim 19, in which from the time at which a first of the two printed circuit boards to be separated on the first section and the other of the two circuit boards to be separated on the second section, the transport on the first section is stopped for a predetermined period of time. 21. Verfahren gemäß Anspruch 20, bei dem das Trennen der beiden Leiterplatten zusätzlich durch eine Stoppvorrichtung durchgeführt wird, welche verhindert, dass während dem Anhalten der ersten Teilstrecke die erste Leiterplatte in Richtung der zweiten Teilstrecke transportiert wird. 21. The method according to claim 20, wherein the separation of the two circuit boards is additionally carried out by a stop device which prevents the first circuit board from being transported in the direction of the second section during the stopping of the first section.
PCT/DE2002/002380 2001-07-02 2002-07-01 Method for the combined processing of printed circuit boards Ceased WO2003005785A1 (en)

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