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USD404368S - Outer tube for use in a semiconductor wafer heat processing apparatus - Google Patents

Outer tube for use in a semiconductor wafer heat processing apparatus Download PDF

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Publication number
USD404368S
USD404368S US29/082,978 US8297898F USD404368S US D404368 S USD404368 S US D404368S US 8297898 F US8297898 F US 8297898F US D404368 S USD404368 S US D404368S
Authority
US
United States
Prior art keywords
processing apparatus
semiconductor wafer
heat processing
outer tube
wafer heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/082,978
Inventor
Tomohisa Shimazu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMAZU, TOMOHISA
Application granted granted Critical
Publication of USD404368S publication Critical patent/USD404368S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 a perspective view of a outertube for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a bottom plan view thereof; and,
FIG. 5 a cross-sectional view taken along line V-V in FIG. 3 .

Claims (1)

  1. I claim the ornamental design for an outertube for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/082,978 1997-08-20 1998-02-02 Outer tube for use in a semiconductor wafer heat processing apparatus Expired - Lifetime USD404368S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9-65095 1997-08-20
JP6509597 1997-08-20

Publications (1)

Publication Number Publication Date
USD404368S true USD404368S (en) 1999-01-19

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ID=71729421

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/082,978 Expired - Lifetime USD404368S (en) 1997-08-20 1998-02-02 Outer tube for use in a semiconductor wafer heat processing apparatus

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US (1) USD404368S (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD586768S1 (en) * 2006-10-12 2009-02-17 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD590359S1 (en) * 2006-02-20 2009-04-14 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers or the like
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD725053S1 (en) * 2011-11-18 2015-03-24 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD813210S1 (en) * 2016-06-23 2018-03-20 Voxx International Corporation Antenna housing
USD813941S1 (en) * 2015-03-09 2018-03-27 Natural Machines, Inc. Capsule for dispensing flowable 3D printing medium
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD901406S1 (en) * 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587689A (en) 1983-01-12 1986-05-13 Minoru Nakamura Meat packing apparatus
US5046909A (en) 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US5314574A (en) 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5320218A (en) 1992-04-07 1994-06-14 Shinko Electric Co., Ltd. Closed container to be used in a clean room
US5407449A (en) 1992-03-10 1995-04-18 Asm International N.V. Device for treating micro-circuit wafers
US5516732A (en) 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5518360A (en) 1990-11-16 1996-05-21 Kabushiki-Kaisha Watanabe Shoko Wafer carrying device and wafer carrying method
US5536128A (en) 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5658115A (en) 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
US5752796A (en) 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587689A (en) 1983-01-12 1986-05-13 Minoru Nakamura Meat packing apparatus
US5536128A (en) 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5046909A (en) 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US5518360A (en) 1990-11-16 1996-05-21 Kabushiki-Kaisha Watanabe Shoko Wafer carrying device and wafer carrying method
US5658115A (en) 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
US5407449A (en) 1992-03-10 1995-04-18 Asm International N.V. Device for treating micro-circuit wafers
US5320218A (en) 1992-04-07 1994-06-14 Shinko Electric Co., Ltd. Closed container to be used in a clean room
US5314574A (en) 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5516732A (en) 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5752796A (en) 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD590359S1 (en) * 2006-02-20 2009-04-14 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers or the like
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD586768S1 (en) * 2006-10-12 2009-02-17 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD725053S1 (en) * 2011-11-18 2015-03-24 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD813941S1 (en) * 2015-03-09 2018-03-27 Natural Machines, Inc. Capsule for dispensing flowable 3D printing medium
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD813210S1 (en) * 2016-06-23 2018-03-20 Voxx International Corporation Antenna housing
USD845936S1 (en) 2016-06-23 2019-04-16 Voxx International Corporation Antenna housing
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD901406S1 (en) * 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication

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