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TW200726567A - Solder alloy, solder ball and solder joint using the same - Google Patents

Solder alloy, solder ball and solder joint using the same

Info

Publication number
TW200726567A
TW200726567A TW095141999A TW95141999A TW200726567A TW 200726567 A TW200726567 A TW 200726567A TW 095141999 A TW095141999 A TW 095141999A TW 95141999 A TW95141999 A TW 95141999A TW 200726567 A TW200726567 A TW 200726567A
Authority
TW
Taiwan
Prior art keywords
solder
same
alloy
joint
ball
Prior art date
Application number
TW095141999A
Other languages
English (en)
Inventor
Masayoshi Date
Masaru Fujiyoshi
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Publication of TW200726567A publication Critical patent/TW200726567A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW095141999A 2005-11-15 2006-11-14 Solder alloy, solder ball and solder joint using the same TW200726567A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005330578 2005-11-15

Publications (1)

Publication Number Publication Date
TW200726567A true TW200726567A (en) 2007-07-16

Family

ID=37837233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141999A TW200726567A (en) 2005-11-15 2006-11-14 Solder alloy, solder ball and solder joint using the same

Country Status (4)

Country Link
EP (1) EP1785498A3 (zh)
JP (1) JP2007160401A (zh)
KR (1) KR100813574B1 (zh)
TW (1) TW200726567A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN101780608B (zh) * 2010-04-12 2011-09-21 天津市恒固科技有限公司 一种含Si和Ge的SnAgCu系无铅焊料
CN103028863B (zh) * 2011-09-29 2016-01-20 郴州金箭焊料有限公司 一种高抗氧化无铅焊料
JP6004253B2 (ja) * 2012-05-17 2016-10-05 三菱マテリアル株式会社 ペースト用はんだ合金粉末、ペースト及びこれを用いたはんだバンプ
JP6004254B2 (ja) * 2012-05-17 2016-10-05 三菱マテリアル株式会社 ペースト用はんだ合金粉末、ペースト及びこれを用いたはんだバンプ
EP2944400A4 (en) * 2013-01-11 2016-10-05 Senju Metal Industry Co CU BALL
JP2016068123A (ja) * 2014-09-30 2016-05-09 住友金属鉱山株式会社 Ａｕ−Ｓｎ−Ａｇ系はんだ合金及びこれを用いて封止若しくは接合された電子機器並びに該電子機器を搭載した電子装置
JP5850199B1 (ja) * 2015-06-29 2016-02-03 千住金属工業株式会社 はんだ材料、はんだ継手およびはんだ材料の検査方法
JP6892568B2 (ja) * 2015-12-21 2021-06-23 ニホンハンダ株式会社 表面性に優れたＳｎを主成分とするはんだ合金の選別方法
JP6928284B1 (ja) * 2020-02-14 2021-09-01 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH106075A (ja) * 1996-06-13 1998-01-13 Nippon Handa Kk 無鉛ハンダ合金
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JPH11226776A (ja) * 1997-12-12 1999-08-24 Topy Ind Ltd 耐酸化性に優れた無鉛はんだ
JP4445046B2 (ja) * 1998-02-06 2010-04-07 株式会社日本スペリア社 無鉛はんだ合金
JP2000343273A (ja) * 1999-06-01 2000-12-12 Fuji Electric Co Ltd はんだ合金
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
JP2005103645A (ja) * 2004-10-29 2005-04-21 Hitachi Metals Ltd はんだボールおよびその製造方法

Also Published As

Publication number Publication date
KR100813574B1 (ko) 2008-03-17
EP1785498A2 (en) 2007-05-16
KR20070051729A (ko) 2007-05-18
JP2007160401A (ja) 2007-06-28
EP1785498A3 (en) 2007-11-28

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