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WO2009051240A1 - 鉛フリーはんだ - Google Patents

鉛フリーはんだ Download PDF

Info

Publication number
WO2009051240A1
WO2009051240A1 PCT/JP2008/068895 JP2008068895W WO2009051240A1 WO 2009051240 A1 WO2009051240 A1 WO 2009051240A1 JP 2008068895 W JP2008068895 W JP 2008068895W WO 2009051240 A1 WO2009051240 A1 WO 2009051240A1
Authority
WO
WIPO (PCT)
Prior art keywords
soft solder
lead
free soft
strength
reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068895
Other languages
English (en)
French (fr)
Inventor
Naoyuki Hamada
Osamu Takagi
Kenji Higashi
Yorinobu Takigawa
Tokuteru Uesugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishikawa Metal Co Ltd
Osaka Metropolitan University
Original Assignee
Ishikawa Metal Co Ltd
Osaka Prefecture University PUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishikawa Metal Co Ltd, Osaka Prefecture University PUC filed Critical Ishikawa Metal Co Ltd
Priority to JP2009538176A priority Critical patent/JPWO2009051240A1/ja
Publication of WO2009051240A1 publication Critical patent/WO2009051240A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　鉛フリーはんだとして、Ｓｎ－３Ａｇ－０．５Ｃｕ組成のはんだが、有力視されているが、斯かる組成のはんだは、高温環境に曝されるとＡｇ３Ｓｎ粒子の粗大化が起こるので、強度信頼性に課題がある。 本発明の鉛フリーはんだは、Ａｇ含有量の低減により強度信頼性の向上を図り、且つ、Ａｇ含有量の低減による強度低下をＺｎの添加によって補償したものであり、Ａｇ０．０１から１．５質量％と、Ｃｕ０．０１から１．０質量％と、Ｚｎ０．１から１．０質量％と、残部がＳｎからなる鉛フリーはんだである。
PCT/JP2008/068895 2007-10-17 2008-10-17 鉛フリーはんだ Ceased WO2009051240A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009538176A JPWO2009051240A1 (ja) 2007-10-17 2008-10-17 鉛フリーはんだ

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007270570 2007-10-17
JP2007-270570 2007-10-17
JP2008243037 2008-09-22
JP2008-243037 2008-09-22

Publications (1)

Publication Number Publication Date
WO2009051240A1 true WO2009051240A1 (ja) 2009-04-23

Family

ID=40567501

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068895 Ceased WO2009051240A1 (ja) 2007-10-17 2008-10-17 鉛フリーはんだ

Country Status (3)

Country Link
JP (1) JPWO2009051240A1 (ja)
TW (1) TW200927357A (ja)
WO (1) WO2009051240A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101780607A (zh) * 2010-03-17 2010-07-21 华南理工大学 一种用于电子封装组装钎焊的无铅钎料及其制备方法
WO2012023440A1 (ja) * 2010-08-18 2012-02-23 新日鉄マテリアルズ株式会社 半導体実装用半田ボール及び電子部材
CN102806429A (zh) * 2011-05-30 2012-12-05 日立电线株式会社 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件
CN104070299A (zh) * 2013-03-26 2014-10-01 昆山市天和焊锡制造有限公司 一种抗老化光伏焊带之焊锡料
KR20150050440A (ko) 2013-10-30 2015-05-08 가부시키가이샤 다무라 세이사쿠쇼 솔더 페이스트용 플럭스 및 솔더 페이스트
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
CN106624430A (zh) * 2016-11-30 2017-05-10 安徽华众焊业有限公司 焊锡膏
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
CN113399859A (zh) * 2021-05-27 2021-09-17 西安理工大学 一种Sn-Zn-Cu系无铅钎料及其制备方法
CN115383344A (zh) * 2022-06-06 2022-11-25 桂林航天工业学院 In-48Sn-xCuZnAl复合钎料及其制备方法与应用
CN116174993A (zh) * 2023-02-24 2023-05-30 东莞市千岛金属锡品有限公司 一种纳米二氧化钛掺杂的Sn-Ag-Cu-X四元焊料及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160011242A (ko) * 2012-10-09 2016-01-29 알파 메탈즈, 인코포레이티드 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜
CN106181109B (zh) * 2016-08-16 2018-12-28 镇江市锶达合金材料有限公司 一种高性能绿色钎焊材料

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002239780A (ja) * 2001-02-09 2002-08-28 Nippon Steel Corp ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
JP2003094195A (ja) * 2001-06-28 2003-04-02 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP2003326386A (ja) * 2002-05-13 2003-11-18 Matsushita Electric Ind Co Ltd 無鉛はんだ合金
JP2004261863A (ja) * 2003-01-07 2004-09-24 Senju Metal Ind Co Ltd 鉛フリーはんだ
JP2005254298A (ja) * 2004-03-12 2005-09-22 Nippon Steel Corp 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材
WO2006011204A1 (ja) * 2004-07-29 2006-02-02 Senju Metal Industry Co., Ltd 鉛フリーはんだ合金
JP2006289493A (ja) * 2005-03-17 2006-10-26 Tamura Kaken Co Ltd Ｓｎ−Ｚｎ系はんだ、鉛フリーはんだ、そのはんだ加工物、ソルダーペースト及び電子部品はんだ付け基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002239780A (ja) * 2001-02-09 2002-08-28 Nippon Steel Corp ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
JP2003094195A (ja) * 2001-06-28 2003-04-02 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP2003326386A (ja) * 2002-05-13 2003-11-18 Matsushita Electric Ind Co Ltd 無鉛はんだ合金
JP2004261863A (ja) * 2003-01-07 2004-09-24 Senju Metal Ind Co Ltd 鉛フリーはんだ
JP2005254298A (ja) * 2004-03-12 2005-09-22 Nippon Steel Corp 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材
WO2006011204A1 (ja) * 2004-07-29 2006-02-02 Senju Metal Industry Co., Ltd 鉛フリーはんだ合金
JP2006289493A (ja) * 2005-03-17 2006-10-26 Tamura Kaken Co Ltd Ｓｎ−Ｚｎ系はんだ、鉛フリーはんだ、そのはんだ加工物、ソルダーペースト及び電子部品はんだ付け基板

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101780607A (zh) * 2010-03-17 2010-07-21 华南理工大学 一种用于电子封装组装钎焊的无铅钎料及其制备方法
WO2012023440A1 (ja) * 2010-08-18 2012-02-23 新日鉄マテリアルズ株式会社 半導体実装用半田ボール及び電子部材
CN102666002A (zh) * 2010-08-18 2012-09-12 新日铁高新材料株式会社 半导体安装用钎料球和电子部件
KR101355694B1 (ko) * 2010-08-18 2014-01-28 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 실장용 땜납 볼 및 전자 부재
JP5413926B2 (ja) * 2010-08-18 2014-02-12 新日鉄住金マテリアルズ株式会社 半導体実装用半田ボール及び電子部材
CN102666002B (zh) * 2010-08-18 2014-09-10 新日铁住金高新材料株式会社 半导体安装用钎料球和电子部件
US9024442B2 (en) 2010-08-18 2015-05-05 Nippon Steel & Sumikin Materials Co., Ltd. Solder ball for semiconductor packaging and electronic member using the same
CN102806429B (zh) * 2011-05-30 2016-01-20 日立金属株式会社 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件
CN102806429A (zh) * 2011-05-30 2012-12-05 日立电线株式会社 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件
JP2012245554A (ja) * 2011-05-30 2012-12-13 Hitachi Cable Ltd Ｐｂフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品
US10661393B2 (en) 2011-08-17 2020-05-26 Honeywell International Inc. Lead-free solder compositions
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
CN104070299A (zh) * 2013-03-26 2014-10-01 昆山市天和焊锡制造有限公司 一种抗老化光伏焊带之焊锡料
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
KR20150050440A (ko) 2013-10-30 2015-05-08 가부시키가이샤 다무라 세이사쿠쇼 솔더 페이스트용 플럭스 및 솔더 페이스트
CN106624430A (zh) * 2016-11-30 2017-05-10 安徽华众焊业有限公司 焊锡膏
CN113399859A (zh) * 2021-05-27 2021-09-17 西安理工大学 一种Sn-Zn-Cu系无铅钎料及其制备方法
CN115383344A (zh) * 2022-06-06 2022-11-25 桂林航天工业学院 In-48Sn-xCuZnAl复合钎料及其制备方法与应用
CN115383344B (zh) * 2022-06-06 2024-02-06 桂林航天工业学院 In-48Sn-xCuZnAl复合钎料及其制备方法与应用
CN116174993A (zh) * 2023-02-24 2023-05-30 东莞市千岛金属锡品有限公司 一种纳米二氧化钛掺杂的Sn-Ag-Cu-X四元焊料及其制备方法

Also Published As

Publication number Publication date
TW200927357A (en) 2009-07-01
JPWO2009051240A1 (ja) 2011-03-03

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