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MX2007005622A - Aleacion de soldadura libre de plomo. - Google Patents

Aleacion de soldadura libre de plomo.

Info

Publication number
MX2007005622A
MX2007005622A MX2007005622A MX2007005622A MX2007005622A MX 2007005622 A MX2007005622 A MX 2007005622A MX 2007005622 A MX2007005622 A MX 2007005622A MX 2007005622 A MX2007005622 A MX 2007005622A MX 2007005622 A MX2007005622 A MX 2007005622A
Authority
MX
Mexico
Prior art keywords
lead
alloy
solder alloy
free solder
solder
Prior art date
Application number
MX2007005622A
Other languages
English (en)
Inventor
Stanley R Rothschild
Original Assignee
Metallic Resources Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metallic Resources Inc filed Critical Metallic Resources Inc
Publication of MX2007005622A publication Critical patent/MX2007005622A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

Una aleacion de soldadura libre de plomo, incluye una aleacion de cobre-estano, que tambien incluye una cantidad menor de cobalto, que se ha encontrado proporciona una apariencia brillante y reflectora a la aleacion de soldadura. Tambien se describen metodos de soldadura que usan dicha aleacion, asi como una junta de soldadura que incluye dicha aleacion.
MX2007005622A 2004-11-15 2005-11-04 Aleacion de soldadura libre de plomo. MX2007005622A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62800704P 2004-11-15 2004-11-15
US11/247,290 US20060104855A1 (en) 2004-11-15 2005-10-11 Lead-free solder alloy
PCT/US2005/039769 WO2006055259A2 (en) 2004-11-15 2005-11-04 Lead-free solder alloy

Publications (1)

Publication Number Publication Date
MX2007005622A true MX2007005622A (es) 2007-06-18

Family

ID=36386528

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2007005622A MX2007005622A (es) 2004-11-15 2005-11-04 Aleacion de soldadura libre de plomo.

Country Status (4)

Country Link
US (3) US20060104855A1 (es)
EP (1) EP1825011A4 (es)
MX (1) MX2007005622A (es)
WO (1) WO2006055259A2 (es)

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US20060263531A1 (en) * 2003-12-18 2006-11-23 Lichtenhan Joseph D Polyhedral oligomeric silsesquioxanes as glass forming coatings
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CN117082757B (zh) * 2023-08-31 2024-04-12 涟水县苏杭科技有限公司 一种应用于pcb板喷锡的单离子污染控制方法

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Also Published As

Publication number Publication date
EP1825011A4 (en) 2008-01-23
US20170127531A1 (en) 2017-05-04
EP1825011A2 (en) 2007-08-29
US20060104855A1 (en) 2006-05-18
US20090008434A1 (en) 2009-01-08
WO2006055259A3 (en) 2007-02-22
US9587293B2 (en) 2017-03-07
WO2006055259A2 (en) 2006-05-26

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Legal Events

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