TW200711779A - Soldering filler - Google Patents
Soldering fillerInfo
- Publication number
- TW200711779A TW200711779A TW095123144A TW95123144A TW200711779A TW 200711779 A TW200711779 A TW 200711779A TW 095123144 A TW095123144 A TW 095123144A TW 95123144 A TW95123144 A TW 95123144A TW 200711779 A TW200711779 A TW 200711779A
- Authority
- TW
- Taiwan
- Prior art keywords
- soldering
- soldering filler
- filler
- lamps
- give
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title abstract 4
- 239000000945 filler Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 239000006023 eutectic alloy Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/04—Electrodes; Screens; Shields
- H01J61/06—Main electrodes
- H01J61/073—Main electrodes for high-pressure discharge lamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses a soldering filler for producing soldered joints, in particular for soldering high-temperature components in lamps, and a method for its production. According to the invention, the soldering filler has an essentially eutectic alloy and is formed by a sintering process to give a shaped part.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005030112A DE102005030112A1 (en) | 2005-06-28 | 2005-06-28 | filler alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200711779A true TW200711779A (en) | 2007-04-01 |
Family
ID=37188916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095123144A TW200711779A (en) | 2005-06-28 | 2006-06-27 | Soldering filler |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE102005030112A1 (en) |
| TW (1) | TW200711779A (en) |
| WO (1) | WO2007000142A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1914242A1 (en) | 2006-10-19 | 2008-04-23 | Sanofi-Aventis | Novel anti-CD38 antibodies for the treatment of cancer |
| US8285439B2 (en) | 2009-04-07 | 2012-10-09 | Ford Global Technologies, Llc | System and method for performing vehicle diagnostics |
| US8692722B2 (en) | 2011-02-01 | 2014-04-08 | Phoenix Contact Development and Manufacturing, Inc. | Wireless field device or wireless field device adapter with removable antenna module |
| CN114457248B (en) * | 2021-12-22 | 2023-06-09 | 重庆材料研究院有限公司 | Preparation method of molybdenum-ruthenium alloy wire for high-temperature brazing |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816795A (en) * | 1981-07-20 | 1983-01-31 | Toho Kinzoku Kk | Brazing material |
| JPS6035780B2 (en) * | 1981-08-19 | 1985-08-16 | 東邦金属株式会社 | End hat for magnetron |
| JPS58100991A (en) * | 1981-12-08 | 1983-06-15 | Toho Kinzoku Kk | Joining method for high melting point metal |
| JPS6091531A (en) * | 1983-10-25 | 1985-05-22 | Matsushita Electronics Corp | Manufacture of cathode supporting structure for magnetron |
| JP3363816B2 (en) * | 1999-01-26 | 2003-01-08 | 浜松ホトニクス株式会社 | Discharge tube electrode and discharge tube using the same |
-
2005
- 2005-06-28 DE DE102005030112A patent/DE102005030112A1/en not_active Withdrawn
-
2006
- 2006-06-22 WO PCT/DE2006/001066 patent/WO2007000142A1/en not_active Ceased
- 2006-06-27 TW TW095123144A patent/TW200711779A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007000142A1 (en) | 2007-01-04 |
| DE102005030112A1 (en) | 2007-01-18 |
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