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TW200743543A - Lead-free solder alloy compound capable of resisting fracturing and damages - Google Patents

Lead-free solder alloy compound capable of resisting fracturing and damages

Info

Publication number
TW200743543A
TW200743543A TW095118539A TW95118539A TW200743543A TW 200743543 A TW200743543 A TW 200743543A TW 095118539 A TW095118539 A TW 095118539A TW 95118539 A TW95118539 A TW 95118539A TW 200743543 A TW200743543 A TW 200743543A
Authority
TW
Taiwan
Prior art keywords
damages
lead
free solder
solder alloy
compound capable
Prior art date
Application number
TW095118539A
Other languages
Chinese (zh)
Other versions
TWI295208B (en
Inventor
chuan-sheng Lv
Fei-Yi Hong
Original Assignee
Liu Chuan Sheng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liu Chuan Sheng filed Critical Liu Chuan Sheng
Priority to TW095118539A priority Critical patent/TW200743543A/en
Publication of TW200743543A publication Critical patent/TW200743543A/en
Application granted granted Critical
Publication of TWI295208B publication Critical patent/TWI295208B/zh

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

Disclosed is a lead-free solder alloy compound capable of resisting fracturing and damages, including: 0.01 to 4.0%wt of Ag, 0.01 to 1.5%wt of Cu, 0.01 to 0.2%wt of In, 0.01 to 0.17%wt of Ni and a remaining %wt of Sn. This invention adds appropriate amounts of In and Ni into an alloy using Sn, Ag and Cu as the base to enhance the ability of resisting fracturing and damages for the lead-free solder alloy.
TW095118539A 2006-05-25 2006-05-25 Lead-free solder alloy compound capable of resisting fracturing and damages TW200743543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095118539A TW200743543A (en) 2006-05-25 2006-05-25 Lead-free solder alloy compound capable of resisting fracturing and damages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095118539A TW200743543A (en) 2006-05-25 2006-05-25 Lead-free solder alloy compound capable of resisting fracturing and damages

Publications (2)

Publication Number Publication Date
TW200743543A true TW200743543A (en) 2007-12-01
TWI295208B TWI295208B (en) 2008-04-01

Family

ID=45068368

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118539A TW200743543A (en) 2006-05-25 2006-05-25 Lead-free solder alloy compound capable of resisting fracturing and damages

Country Status (1)

Country Link
TW (1) TW200743543A (en)

Also Published As

Publication number Publication date
TWI295208B (en) 2008-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees