TWI295208B - - Google Patents
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- TWI295208B TWI295208B TW95118539A TW95118539A TWI295208B TW I295208 B TWI295208 B TW I295208B TW 95118539 A TW95118539 A TW 95118539A TW 95118539 A TW95118539 A TW 95118539A TW I295208 B TWI295208 B TW I295208B
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- 239000000203 mixture Substances 0.000 claims description 48
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 29
- 229910045601 alloy Inorganic materials 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 15
- 229910052738 indium Inorganic materials 0.000 claims description 13
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 19
- 238000012360 testing method Methods 0.000 description 12
- 239000011135 tin Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910001128 Sn alloy Inorganic materials 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Description
.1295208 九、發明說明： 【發明所屬之技術領域】 本發明疋有關於一種無錯銲錫合金組成物，特別是指 一種以錫、銀、銅為基質，並具有較佳耐摔落破壞效果之 無斜銲錫合金組成物。 【先前技術】 ψ ‘ 在已知的技藝中，錫（Sn)-銀（Ag)-銅（Cu)系合 φ 金廣泛被運用在電子零件的構裝上，隨著電子元件微小i 之需求，製作出輕、薄、短、小的電子元件已成為主流趨 勢，然而，電子元件的體積一旦縮小，在使用上比較容易 因為不慎摔落，而造成元件内部銲錫接點之剝離，並導致 凡件線路斷路等情況，因此，製造出耐摔落破 錫合金組成物成為當前的重要課題。…^ 目刖已知Sn-Ag-Cu系合金在接合界面特性與摔落可靠 度有密切關係，習知技術通常是改變Sn、Ag、Cu間的成分 # 比例來改善銲點耐摔落破壞的功能，以合計100重量份且 其中含有3重量份之銀，以及0·5重量份之銅的Sn-3.0Ag_ _ u、、且成物並配合銅基板為例，其耐摔落破壞（即摔落壽 ， °卩，央文為droPPing Hfe)的平均次數為37·6次，以Sn_ 〜 3.〇Ag-l.〇cu力組成物為例，其耐摔落破壞的平均次數為 32·7次，顯然改變合金中各基質的組成比例，對於耐摔落 破壞特性及銲點可靠度有一定的影響。而本案發明人則是 針對Sn-Ag’Cu系合金的組成作改良，而在該組成物中添加 其他的金屬元素，並進行摔落特性分析，以製造出具有良 .1295208 好耐摔落破壞特性的無鉛銲錫合金組成物。 【發明内容】 因此，本發明之目的，即在提供一種添加銦、鎳元素 於其中，並提升耐摔落破壞效果之無鉛銲錫合金組成物。 於是，本發明無鉛銲錫合金組成物包含： 0·01〜4.0重量份之銀（Ag); 〇·〇1〜1.5重量份之銅（cu);.1295208 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to an error-free solder alloy composition, in particular to a substrate based on tin, silver and copper, and having better resistance to falling damage. No oblique solder alloy composition. [Prior Art] ψ ' In the known art, tin (Sn)-silver (Ag)-copper (Cu) alloy φ gold is widely used in the construction of electronic components, with the demand for electronic components The production of light, thin, short, and small electronic components has become a mainstream trend. However, once the size of electronic components is reduced, it is easier to use because of accidental fall, which causes the solder joints inside the components to peel off and cause In the case of broken lines, etc., it has become an important issue to manufacture a composition that is resistant to falling and breaking tin alloy. ...^ It is known that the characteristics of the joint interface of Sn-Ag-Cu alloy are closely related to the drop reliability. The conventional technique is usually to change the composition ratio of Sn, Ag and Cu to improve the resistance of the solder joint to fall. The function is to resist falling damage (for example, a total of 100 parts by weight and containing 3 parts by weight of silver, and 0.5 to 5 parts by weight of copper, Sn-3.0Ag_ _ u, and the compound is combined with a copper substrate. That is, the average number of times of falling down, °卩, and von droPPing Hfe) is 37·6 times. Taking the Sn_~3〇Ag-l.〇cu force composition as an example, the average number of fall damage resistance is 32.7 times, obviously changing the composition ratio of each matrix in the alloy has a certain influence on the drop resistance characteristics and the reliability of the solder joint. The inventor of the present invention improved the composition of the Sn-Ag'Cu-based alloy, and added other metal elements to the composition, and analyzed the drop characteristics to produce a good resistance to falling damage of 1295208. A characteristic lead-free solder alloy composition. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a lead-free solder alloy composition in which an indium or nickel element is added and which is resistant to falling damage. Therefore, the lead-free solder alloy composition of the present invention comprises: 0·01 to 4.0 parts by weight of silver (Ag); 〇·〇1 to 1.5 parts by weight of copper (cu);
〇·〇1〜0·2重量份之錮（In); 〇·〇1〜0.17重量份之鎳（见）； 以及與前述元素合計100重量份之錫（ Sn)。 本發明主要是在錫、銀、銅合金中添加適當比例的銦 和錄，有效改善銲錫合金的接合界面，藉此提供更好的耐 摔落破壞效果。 發明加入適當成分之金屬銦後，是將合金組成物形 成球狀（以下稱為錫球）並黏著於—個銅製的基板上作測 試=㈣落雜料（細ppedtest)，確實可㈣效提升 摔：哥命。根據發明人的測試，當組成物中金屬銦超過 重量份時、，由㈣的㈣較低，過多的銦會使錫球表面張 大it而縮小與銅基板的接觸面積而造成空 ^妾合介面強度與摔料命，而且錮的成本很高，因此Γ tr考量成本及㈣效果的評估下，本發明組成物中之 金屬錮的使用量以0.01〜0.2重量份為佳。 ，二明金屬鎳的使用範圍以ΟΝ，？重量份為較佳 田、’鎳的使用里咼於〇17重量份時，會造成組成物之 6 1295208 銲接點的導電率降低，且一般而言，在錫的合金中，鎳的 固溶性較差，所以本發明該金屬鎳不易添加超過〇·2重量份 。另一方面，當金屬鎳的組成含量低於0.01重量份時，則 是含量過少，此時該組成物的耐摔落效果不佳。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考較佳實施例的詳細說明中，將可清楚的呈現〇·〇1 to 0·2 parts by weight of 锢 (In); 〇·〇1 to 0.17 parts by weight of nickel (see); and 100 parts by weight of tin (Sn) in combination with the above elements. The invention mainly adds an appropriate proportion of indium and nickel to tin, silver and copper alloy, thereby effectively improving the joint interface of the solder alloy, thereby providing better resistance to falling damage. After adding the metal indium of the appropriate composition, the alloy composition is formed into a spherical shape (hereinafter referred to as a solder ball) and adhered to a substrate made of copper for testing = (4) falling materials (fine ppedtest), and indeed (four) effect improvement Fall: Brother. According to the test by the inventors, when the metal indium in the composition exceeds the weight part, the (four) is lower, and the excessive indium causes the surface of the solder ball to expand and reduces the contact area with the copper substrate to cause an empty interface. The strength and the throwing life, and the cost of the crucible are high. Therefore, the use amount of the metal crucible in the composition of the present invention is preferably 0.01 to 0.2 parts by weight in consideration of the cost of the Γtr and the evaluation of the effect. What is the scope of use of Niming Metal Nickel? The parts by weight are better, and the use of nickel in the case of 重量17 parts by weight causes a decrease in the electrical conductivity of the 6 1295208 solder joint of the composition, and generally, in the alloy of tin, the solid solubility of nickel is poor. Therefore, the metallic nickel of the present invention is not easily added in an amount exceeding 〇·2 parts by weight. On the other hand, when the composition content of the metallic nickel is less than 0.01 part by weight, the content is too small, and the composition has a poor drop resistance. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.
首先參考表一之比較例丨〜5,表一中各比較例主要在 於：探討合金組成物中加入不同比例的金屬銦對於摔落壽 »ρ之衫響，而摔落壽命分析的測試方式，是在一銅製的基 板j設置21個合金銲接點，並藉由該料接點將基板固定 黏著在-台重量為75公克的手機上，將手機自距離地面高 度150公分處，自由摔落至地板上之後，取下基板並測量 基板上所有銲接點有無出現斷路現象，當料點產生斷路 現象時的摔落平均次數，即為本發明所稱之摔落壽命。 纟X例1〜4的試驗結果得知，在銀-銅合 、，中加入適當的金屬鋼所構成之組成物的摔落壽命，盘前First, refer to the comparative example 表~5 in Table 1. The comparison examples in Table 1 are mainly to investigate the test method of falling life analysis by adding different proportions of metal indium to the alloy composition. 21 alloy solder joints are arranged on a copper substrate j, and the substrate is fixedly adhered to a mobile phone having a weight of 75 grams by the material contact point, and the mobile phone is freely dropped to the floor at a height of 150 cm from the ground. After the above, the substrate is removed and any solder joints on the substrate are measured for the occurrence of an open circuit. The average number of drops when the material is broken is the fall life of the present invention.试验X test results of 1 to 4 show that the falling life of the composition composed of appropriate metal steel in silver-copper joints, before the disk
Sn-3-〇Ag-°-5Cu 2 :人相比/比較例1〜4 4實皆較習知技藝提高。惟由比 車乂例5的試驗結果得知，者 心重量份時（即高於。2;旦:物中之金屬銦的含量為 、 重里伤），其摔落壽命明顯下降 至32.1 z人，故本發明組 量份為較佳。 成物中之金屬銦以介於0.CH〜〇.2重 7 1295208Sn-3-〇Ag-°-5Cu 2 : human comparison/comparative examples 1 to 4 4 were improved by the prior art. However, it is known from the test results of the rut example 5 that when the weight of the heart is greater than that of the body (ie, the content of the metal indium in the material is too heavy, the drop life is significantly reduced to 32.1 z people). Therefore, the components of the present invention are preferred. The metal indium in the product is between 0. CH~〇.2 7 7295208
〔表一〕 比較例 各元素組成重量份 摔落壽命 (Sn —Ag一Cu—In) (平均、次數） 1 y6.49—3.0—0.5 —0.01 38.4 2 ——-- y6.45 —3.0—0.5 —0.05 ^~-__ 43.7 3 Λ 96.38-3.0-0.5-0.12 —_____ 44.3 4 ---- 96.32—3.0-0.5 — 0.18 42.9 5 1---- ^^28^3.0—0.5 —〇T22 —- 32^ 為本^明無錯銲錫合金纟且成物的實施例1〜12， 、、 貝施例1〜3主要是將金屬錮的含量固定在0.01重量 ^並改欠至屬鎳的組成含量，由實施例1及比較例1之 摔落壽命的測試結果顯示，在組成物中進—步加人金屬錄 確實可以提1¾摔落壽命，而當添加的金屬鎳為重量 伤日守，該組成物之摔落壽命有下降的趨勢，所以本發明金 屬錄的組成含量以0.17重量份為較佳。[Table 1] Comparative examples of each element composition weight part drop life (Sn - Ag - Cu - In) (average, number of times) 1 y6.49 - 3.0 - 0.5 - 0.01 38.4 2 ——-- y6.45 - 3.0 - 0.5 —0.05 ^~-__ 43.7 3 Λ 96.38-3.0-0.5-0.12 —_____ 44.3 4 ---- 96.32—3.0-0.5 — 0.18 42.9 5 1---- ^^28^3.0—0.5 —〇T22 — - 32^ In the first example, the examples 1 to 12, and the shell examples 1 to 3 are mainly used to fix the content of the metal ruthenium to 0.01 wt% and to reduce the composition to nickel. The content, the test results of the drop life of Example 1 and Comparative Example 1, show that the step-by-step addition of the metal record in the composition can indeed provide a 13⁄4 drop life, and when the added metal nickel is weight-damaged, The drop life of the composition tends to decrease, so that the composition of the metal of the present invention is preferably 0.17 parts by weight.
本發明表二之實施例4〜7則是將金屬銦的組成含量固 定在0.12重量份，並改變金屬鎳的含量，實施例8〜ι〇是 將金屬銦的組成含量固定纟0·18重量份，同樣改變金屬鎳 的含量，由該等試驗結果得知，#組成物中之金屬鋼的組 成含量提高時，可以進一步提高組成物之摔落壽命，惟當 金屬鎳的含量鄰近0.17重量份時，該組成物之摔落壽命合 有下降的趨勢。但由於本發明實_卜10的摔落壽命; 均次數都在4G次以上，故該等實施例的摔落壽命皆高於習 知者，其中實施例4〜6及實施例8、9的摔落壽命更高達 8 12952〇8 50次以上。 至於實施例11、12主要是改變金屬銀的比例來作探对 ’由該等實施例的顯示可知，金屬銀之含量接& 4重量; 夺/、摔落可°卩會欠到影響而下降，故在本發明中該金 銀之組成含量應限制在4重量份以下。In the examples 4 to 7 of Table 2 of the present invention, the composition content of the metal indium is fixed at 0.12 parts by weight, and the content of the metal nickel is changed. In the embodiment 8 to ι, the composition content of the metal indium is fixed to 纟0·18 by weight. The content of the nickel metal is also changed. From the results of these tests, when the composition content of the metal steel in the composition is increased, the falling life of the composition can be further increased, but when the content of the metallic nickel is adjacent to 0.17 parts by weight. At the time, the falling life of the composition has a tendency to decrease. However, due to the fall life of the present invention, the average number of times is more than 4G times, so the fall life of the embodiments is higher than that of the conventional ones, wherein the embodiments 4 to 6 and the examples 8 and 9 The drop life is as high as 8 12952〇8 more than 50 times. As for the examples 11, 12, the ratio of the metallic silver is mainly changed to make a probe. 'The display of the examples shows that the content of the metallic silver is connected to the weight of the 4; the weight loss/fall can be affected. The content of the gold and silver in the present invention should be limited to 4 parts by weight or less.
實施例 各元素組成重量份Examples Each component consists of parts by weight
5 96.30—3.0—0.5-0.12—0.08 >50 6 7 96.27 3·〇~ 〇.5一 0.12— 0.11 ~ >~^〇5 96.30—3.0—0.5-0.12—0.08 >50 6 7 96.27 3·〇~ 〇.5一 0.12— 0.11 ~ >~^〇
9Γ0 U 12 96.31 96.21 96.15 98.46 95.54 3·0 — 0.5一 0.18 — 0.01 3.0— 0.5一 0.18— 0.H ^0-0.5-0.18-^^^17 〇·9— 0.5 — 0.08~ 0·06 3.8—0.5 — 0.09— 0.07 >50>T〇 42Τ >50 38^ 配合參閱圖1，該圖形為本發明實施例4 ( 96 37 Sn — 3.0Ag — 〇.5Cu—0·12Ιη—O.OINi)之無鉛銲錫合金組成物1 1295208 銲接在銅製基板2上的狀態，本發明實施例4之無鉛銲锡 合金組成物1與該銅製的基板2銲接後，經過50次摔落测 試後再拍下的橫截面圖片，圖中位於較底層的區塊即為鋼 製的基板2，位於上方面積較大的區塊為本發明無鉛銲锡合 金組成物1，而無鉛銲錫合金組成物丨與基板2在銲接時會 形成一層界面層3，經過50次摔落測試後，該界面層3與9Γ0 U 12 96.31 96.21 96.15 98.46 95.54 3·0 — 0.5 — 0.18 — 0.01 3.0— 0.5 — 0.18 — 0.H ^0-0.5-0.18-^^^17 〇·9— 0.5 — 0.08~ 0·06 3.8— 0.5 - 0.09 - 0.07 > 50 > T 〇 42 Τ > 50 38 ^ Referring to Figure 1, the figure is the embodiment 4 (96 37 Sn - 3.0Ag - 〇.5Cu - 0 · 12 Ι — - O. OINi) The lead-free solder alloy composition 1 1295208 is soldered on the copper substrate 2, and the lead-free solder alloy composition 1 of the fourth embodiment of the present invention is soldered to the copper substrate 2, and then photographed after 50 drops of the test. The cross-sectional picture, the lower-lying block in the figure is the steel substrate 2, and the block having a larger upper area is the lead-free solder alloy composition 1 of the present invention, and the lead-free solder alloy composition 丨 and the substrate 2 An interface layer 3 is formed during soldering, and after 50 drops of the test, the interface layer 3 is
基板2仍連績接觸在一起，顯示本發明該實施例4確實可 以承受超過50次以上的摔落次數。 參閱圖2、3，分別是本發明實施例6及實施例9之無 鉛2錫合金組成物1與基板2的接合示意圖，即本發明^ 等只施例在經過50次摔落測試後拍下的橫截面圖〜片，同樣 顯示基板2與界面| 3是緊密接觸在—起，並沒有因為摔 落造成破壞。 衣二為比較例 〜平乂 1夕！ J ν , Γ…巧The substrate 2 is still in contact with each other, indicating that the embodiment 4 of the present invention can withstand more than 50 drops. 2 and 3, respectively, are schematic diagrams of the bonding of the lead-free 2 tin alloy composition 1 of the embodiment 6 and the embodiment 9 to the substrate 2, that is, the invention is photographed after 50 drops of the test. The cross-sectional view of the piece ~ also shows that the substrate 2 and the interface | 3 are in close contact, and there is no damage caused by the fall. Clothing II is a comparative example ~ Ping Yi 1 Xi! J ν , Γ...巧巧
知:當組成物中的金屬錄的組成含量增加i G.23重量份（ 即高於0.17重量份時)，其摔落壽命明顯下降，而由比較例 與本發明實_ n m㈣8與實施例12的比對可 口’在組成物中沒有加人金屬錮和鎳時，其摔料命確實 牛低。亦即’由前述比較例及實施例的比對可知，本發明 鋼為基質之合金組成物中添加銦㈣，的確^ 曰口”、、鉛鲜錫合金組成物之耐摔落破壞效果。 10 1295208It is understood that when the composition content of the metal recorded in the composition is increased by i G. 23 parts by weight (i.e., when it is higher than 0.17 parts by weight), the fall life is significantly decreased, and the comparative example and the present invention _ n m (four) 8 and the embodiment The comparison of 12 is delicious. When the metal bismuth and nickel are not added to the composition, the smashing life is really low. That is, it can be seen from the comparison of the above comparative examples and the examples that the indium (four) is added to the alloy composition of the steel of the present invention, and the composition of the lead-free tin alloy and the lead-tin-tin alloy is resistant to falling damage. 1295208
摔落壽命 (平均次數） ——-- 41.7 43.5 29.8 各元素組成重量份Falling life (average number of times) ——-- 41.7 43.5 29.8 Weight of each element
3·〇-〇·5 —0·12—〇·23 Sn— Ag^CnJ 98.6— 0.9~ 〇·5 ^η~ ciTy 95.7— 3.8—0.53·〇-〇·5 —0·12—〇·23 Sn— Ag^CnJ 98.6— 0.9~ 〇·5 ^η~ ciTy 95.7— 3.8—0.5
At 僅為本發明之較佳實施例而已，當不 能以此限定本發明實旆銘 田不 域，卩卩大凡財發日㈣請專利 範圍及發明說明内交所你々％ l # 門奋所作之間早的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 θ 1疋本lx明無錯銲錫合金組成物之實施例4，銲接在 一基板上並經過50次摔落測試後所拍下的橫截面圖片； 圖2疋本發明無錯銲錫合金組成物之實施例6，銲接在 一基板上並經過50次摔落測試後所拍下的橫截面圖片；及 圖3是本發明無鉛銲錫合金組成物之實施例9，銲接在 一基板上並經過50次摔落測試後所拍下的橫截面圖片。At is only a preferred embodiment of the present invention, and when it is not possible to limit the present invention to the actual name of the field, the name of the patent is limited to the date of the patent and the invention. Early equivalent changes and modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a cross-sectional photograph taken after welding on a substrate and subjected to 50 drop tests; FIG. 2 Example 6 of the wrong solder alloy composition, a cross-sectional picture taken after being soldered on a substrate and subjected to 50 drop tests; and FIG. 3 is an embodiment 9 of the lead-free solder alloy composition of the present invention, soldered in a A cross-sectional picture taken on the substrate after 50 drops of the test.
1295208 【主要元件符號說明】 1 ·………·無錯銲錫合金組成物 2………··基板 3 .........界面層 121295208 [Explanation of main component symbols] 1 ·.........· Error-free solder alloy composition 2.........··Substrate 3 .........Interfacial layer 12
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095118539A TW200743543A (en) | 2006-05-25 | 2006-05-25 | Lead-free solder alloy compound capable of resisting fracturing and damages |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095118539A TW200743543A (en) | 2006-05-25 | 2006-05-25 | Lead-free solder alloy compound capable of resisting fracturing and damages |
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| Publication Number | Publication Date |
|---|---|
| TW200743543A TW200743543A (en) | 2007-12-01 |
| TWI295208B true TWI295208B (en) | 2008-04-01 |
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| TW095118539A TW200743543A (en) | 2006-05-25 | 2006-05-25 | Lead-free solder alloy compound capable of resisting fracturing and damages |
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| TW (1) | TW200743543A (en) |
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| TW200743543A (en) | 2007-12-01 |
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