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TW200636039A - Hot-melt silicone adhesive - Google Patents

Hot-melt silicone adhesive

Info

Publication number
TW200636039A
TW200636039A TW095106727A TW95106727A TW200636039A TW 200636039 A TW200636039 A TW 200636039A TW 095106727 A TW095106727 A TW 095106727A TW 95106727 A TW95106727 A TW 95106727A TW 200636039 A TW200636039 A TW 200636039A
Authority
TW
Taiwan
Prior art keywords
silicon
organopolysiloxane
hot
silicone adhesive
alkoxy group
Prior art date
Application number
TW095106727A
Other languages
English (en)
Other versions
TWI386473B (zh
Inventor
Toyohiko Fujisawa
Yoshito Ushio
Manabu Sutoh
Yoshinori Taniguchi
Koji Nakanishi
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of TW200636039A publication Critical patent/TW200636039A/zh
Application granted granted Critical
Publication of TWI386473B publication Critical patent/TWI386473B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/20—Compositions for hot melt adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW095106727A 2005-03-29 2006-03-01 熱熔型矽酮系黏著劑 TWI386473B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005094514A JP4849814B2 (ja) 2005-03-29 2005-03-29 ホットメルト型シリコーン系接着剤

Publications (2)

Publication Number Publication Date
TW200636039A true TW200636039A (en) 2006-10-16
TWI386473B TWI386473B (zh) 2013-02-21

Family

ID=36616990

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106727A TWI386473B (zh) 2005-03-29 2006-03-01 熱熔型矽酮系黏著劑

Country Status (8)

Country Link
US (1) US8093333B2 (zh)
EP (1) EP1863876B1 (zh)
JP (1) JP4849814B2 (zh)
KR (1) KR101275046B1 (zh)
CN (1) CN101151328B (zh)
DE (1) DE602006010346D1 (zh)
TW (1) TWI386473B (zh)
WO (1) WO2006104236A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
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TWI706998B (zh) * 2015-10-19 2020-10-11 日商陶氏東麗股份有限公司 活性能量射線可固化之熱熔聚矽氧組合物、其固化產品及製造膜之方法
TWI837333B (zh) * 2019-03-29 2024-04-01 日商陶氏東麗股份有限公司 固化性聚矽氧組成物、其固化物及其製造方法
TWI845652B (zh) * 2019-03-29 2024-06-21 日商陶氏東麗股份有限公司 固化性聚矽氧組成物、其固化物及其製造方法

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* Cited by examiner, † Cited by third party
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JP5025917B2 (ja) 2005-06-15 2012-09-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4839041B2 (ja) 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP2008218864A (ja) * 2007-03-07 2008-09-18 Denso Corp 積層型圧電体素子
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CN104774587B (zh) * 2014-03-18 2017-04-12 深圳市康利邦科技有限公司 一种高粘度强耐热的改性有机硅树脂粘胶剂及其制备方法
CN104449544A (zh) * 2014-11-05 2015-03-25 苏州培华电子材料有限公司 一种硅胶配方及其制备方法
KR102512586B1 (ko) 2015-09-10 2023-03-23 다우 실리콘즈 코포레이션 열가소성 실리콘 조성물을 이용하는 3d 인쇄 방법
CN105418669B (zh) * 2015-12-07 2018-02-09 武汉大学 一种多功能化烷氧基硅烷化炔属硅氢加成抑制剂及其制备方法
TWI808956B (zh) * 2016-12-28 2023-07-21 日商Ａｇｃ股份有限公司 積層體、附聚矽氧樹脂層之支持基材、附聚矽氧樹脂層之樹脂基板、及電子器件之製造方法
JP6946900B2 (ja) * 2016-12-28 2021-10-13 Ａｇｃ株式会社 積層体、シリコーン樹脂層付き支持基材、シリコーン樹脂層付き樹脂基板、および、電子デバイスの製造方法
TWI751253B (zh) * 2016-12-28 2022-01-01 日商Ａｇｃ股份有限公司 積層體、附聚矽氧樹脂層之支持基材、附聚矽氧樹脂層之樹脂基板、電子器件之製造方法
JP6946901B2 (ja) * 2016-12-28 2021-10-13 Ａｇｃ株式会社 積層体、シリコーン樹脂層付き支持基材、シリコーン樹脂層付き樹脂基板、電子デバイスの製造方法
CN107501942B (zh) * 2017-08-29 2020-10-02 北京康美特科技股份有限公司 可模塑成型的有机硅树脂、组合物及其半导体发光元件
CN112218912A (zh) * 2018-06-12 2021-01-12 迈图高新材料日本合同公司 硅酮固化物的制备方法、硅酮固化物及光学用部件
US12215226B2 (en) 2018-10-30 2025-02-04 Dow Toray Co., Ltd. Curable reactive silicone composition, cured product thereof and uses of composition and cured product
JP7534061B2 (ja) * 2018-12-25 2024-08-14 ダウ・東レ株式会社 硬化反応性シリコーン粘着剤組成物及びその硬化物並びにそれらの用途
JP7456938B2 (ja) * 2018-12-27 2024-03-27 ダウ・東レ株式会社 ホットメルト性を有する硬化性シリコーンシートの製造方法
CN113330071B (zh) 2018-12-27 2023-01-03 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
CN113348210B (zh) 2018-12-27 2023-01-03 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
KR20210149082A (ko) * 2019-03-29 2021-12-08 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
JP7509756B2 (ja) * 2019-03-29 2024-07-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
JP7424733B2 (ja) * 2019-09-14 2024-01-30 ダウ・東レ株式会社 ホットメルト性を有する硬化性シリコーンシートの製造方法
WO2021132710A1 (ja) * 2019-12-27 2021-07-01 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
JP2021161400A (ja) * 2020-03-30 2021-10-11 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
TWI890864B (zh) * 2020-10-29 2025-07-21 日商陶氏東麗股份有限公司 固化性氟矽氧組成物
JP7547303B2 (ja) 2021-10-25 2024-09-09 株式会社トッパンインフォメディア ネックポップラベル
CN114058326B (zh) * 2021-11-22 2023-05-23 烟台德邦科技股份有限公司 一种粘接及可靠性优异的有机聚硅氧烷组合物及其制备方法
CN118389120A (zh) * 2024-07-01 2024-07-26 杭州盾源聚芯半导体科技有限公司 用于熔接硅部件的黏结剂、工艺及熔接得到的硅质晶舟

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4430235A (en) 1981-07-17 1984-02-07 Union Carbide Corporation Polymeric antioxidants
JPH0617459B2 (ja) 1987-02-12 1994-03-09 信越化学工業株式会社 エポキシ樹脂組成物
JP2614453B2 (ja) * 1987-07-23 1997-05-28 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサン系ホットメルト接着剤
JPH02117682A (ja) 1988-10-27 1990-05-02 Sumitomo Bakelite Co Ltd １，３−ビス（ヒドロキシフェニル）ジシロキサン誘導体の製造法
JPH0320324A (ja) 1989-02-03 1991-01-29 Sumitomo Durez Co Ltd シリコーン変性エポキシ樹脂
US5162410A (en) * 1990-04-13 1992-11-10 Dow Corning Corporation Hot-melt silicon pressure sensitive adhesives with phenyl-containing siloxane fluid additive and related methods and articles
CA2038902A1 (en) * 1990-04-13 1991-10-14 Randall Paul Sweet Hot-melt silicone pressure sensitive adhesives with phenyl-containing siloxane fluid additive and related methods and articles
DE4038063C2 (de) 1990-11-29 1995-04-20 Bock Orthopaed Ind Gelenkloser Prothesenfuß
US5466532A (en) * 1991-03-26 1995-11-14 Gen Electric Solventless or high solids-containing silicone pressure sensitive adhesive compositions
JP3059776B2 (ja) 1991-05-27 2000-07-04 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴム粉状物の製造方法
US5300299A (en) * 1991-07-22 1994-04-05 Dow Corning Corporation Silicone pressure sensitive adhesive containing alkylmethylsiloxane wax and related methods and devices
JP3337232B2 (ja) 1991-12-26 2002-10-21 東レ・ダウコーニング・シリコーン株式会社 シリコーン硬化物微粒子と無機質微粒子からなる粉体混合物の製造方法
US5645941A (en) * 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
JP2781799B2 (ja) 1993-04-20 1998-07-30 信越ポリマー株式会社 硬質キートップ押釦スイッチ用カバー部材
JP3073884B2 (ja) * 1993-05-10 2000-08-07 信越化学工業株式会社 加熱硬化型シリコーンエラストマー組成物
JP3318408B2 (ja) 1993-10-06 2002-08-26 東レ・ダウコーニング・シリコーン株式会社 粉状シリコーン硬化物およびその製造方法
JP2832143B2 (ja) 1993-12-28 1998-12-02 信越化学工業株式会社 シリコーン微粒子およびその製造方法
US5482988A (en) * 1994-01-14 1996-01-09 Dow Corning Corporation Hot-melt silicone pressure sensitive adhesive with siloxylated polyether waxes as additives
TW343218B (en) 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
JP3574226B2 (ja) 1994-10-28 2004-10-06 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物およびその硬化物
TW296400B (zh) 1994-11-17 1997-01-21 Shinetsu Chem Ind Co
JPH09151253A (ja) 1995-11-29 1997-06-10 Toray Dow Corning Silicone Co Ltd オルガノポリシロキサン用耐熱剤および耐熱性オルガノポリシロキサン組成物
JPH09286971A (ja) * 1996-04-19 1997-11-04 Toray Dow Corning Silicone Co Ltd シリコーン系ダイボンディング剤、半導体装置の製造方法および半導体装置
US5859127A (en) 1996-11-29 1999-01-12 Shin-Etsu Polymer Co., Ltd. Thermosetting resin composition and two-parts composite body thereof with silcone rubber
JP3420473B2 (ja) 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 シリコーン系接着性シート、その製造方法、および半導体装置
EP0958805A3 (en) 1998-05-20 2003-07-09 Shin-Etsu Chemical Co., Ltd. Makeup cosmetic composition
JP2000198929A (ja) 1998-10-30 2000-07-18 Dow Corning Toray Silicone Co Ltd 複合成形用シリコーンゴム組成物
JP2002020719A (ja) 2000-07-11 2002-01-23 Shin Etsu Chem Co Ltd シリコーンゴム接着剤組成物及び該接着剤組成物と熱可塑性樹脂との一体成形体
SG91343A1 (en) * 2000-07-19 2002-09-17 Toshiba Kk Perpendicular magnetic recording medium and magnetic recording apparatus
US20030221770A1 (en) * 2002-05-28 2003-12-04 3M Innovative Properties Company Segmented curable transfer tapes
JP4663969B2 (ja) 2002-07-09 2011-04-06 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP2004043814A (ja) 2002-07-15 2004-02-12 Dow Corning Toray Silicone Co Ltd シリコーン系接着性シート、半導体チップと該チップ取付部の接着方法、および半導体装置
JP4289881B2 (ja) 2002-12-27 2009-07-01 東レ・ダウコーニング株式会社 複合シリコーンゴム粒子およびその製造方法
JP4348143B2 (ja) 2003-08-25 2009-10-21 Ｈｏｙａ株式会社 レンズ調整装置
JP2005075959A (ja) * 2003-09-01 2005-03-24 Dow Corning Toray Silicone Co Ltd 粘着性シリコーンエラストマーシート
JP4528613B2 (ja) * 2004-12-27 2010-08-18 東レ・ダウコーニング株式会社 シリコーン樹脂とエポキシ樹脂の接着複合体およびその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706998B (zh) * 2015-10-19 2020-10-11 日商陶氏東麗股份有限公司 活性能量射線可固化之熱熔聚矽氧組合物、其固化產品及製造膜之方法
TWI837333B (zh) * 2019-03-29 2024-04-01 日商陶氏東麗股份有限公司 固化性聚矽氧組成物、其固化物及其製造方法
TWI845652B (zh) * 2019-03-29 2024-06-21 日商陶氏東麗股份有限公司 固化性聚矽氧組成物、其固化物及其製造方法

Also Published As

Publication number Publication date
KR101275046B1 (ko) 2013-06-14
WO2006104236A1 (en) 2006-10-05
CN101151328A (zh) 2008-03-26
US20090075009A1 (en) 2009-03-19
US8093333B2 (en) 2012-01-10
KR20070114303A (ko) 2007-11-30
EP1863876B1 (en) 2009-11-11
JP4849814B2 (ja) 2012-01-11
CN101151328B (zh) 2011-03-30
TWI386473B (zh) 2013-02-21
DE602006010346D1 (de) 2009-12-24
EP1863876A1 (en) 2007-12-12
JP2006274007A (ja) 2006-10-12

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