[go: up one dir, main page]

KR920701289A - 에폭시-말단화된 폴리옥사졸리돈, 이의 제조방법 및 이로부터의 전기 적층물 - Google Patents

에폭시-말단화된 폴리옥사졸리돈, 이의 제조방법 및 이로부터의 전기 적층물

Info

Publication number
KR920701289A
KR920701289A KR1019910701786A KR910701786A KR920701289A KR 920701289 A KR920701289 A KR 920701289A KR 1019910701786 A KR1019910701786 A KR 1019910701786A KR 910701786 A KR910701786 A KR 910701786A KR 920701289 A KR920701289 A KR 920701289A
Authority
KR
South Korea
Prior art keywords
epoxy
compound
catalyst
polyepoxide
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019910701786A
Other languages
English (en)
Other versions
KR0160755B1 (en
Inventor
아.꼬에니 레이몽
강 죠셉
Original Assignee
리챠드 지.워터맨
더 다우 케미칼 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리챠드 지.워터맨, 더 다우 케미칼 캄파니 filed Critical 리챠드 지.워터맨
Publication of KR920701289A publication Critical patent/KR920701289A/ko
Application granted granted Critical
Publication of KR0160755B1 publication Critical patent/KR0160755B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/09—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
    • C08G18/092—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to isocyanurate groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Thermal Sciences (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Compounds (AREA)

Abstract

내용 없음

Description

에폭시-말단화된 폴리옥사졸리돈, 이의 제조방법 및 이로부터의 전기 적층물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (27)

  1. (A)(1) 5내지 30중량의 폴리이소시아네이트 화합물을 (2) (a) 70내지 95중량%의 폴리에폭사이드 화합물 및 (b) 0.01 내지 2중량%의 촉매를 포함하는 혼합물에 3내지 90분의 시간내에 첨가하고(여기서, 중량%는 폴리에폭사이드 화합물과 폴리이소시아네이트 화합물의 합한 중량을 기준으로 한다), (B) 단계(A)에서 수득된 반응 혼합물을 5 내지 180분의 시간동안 110℃내지 200℃의 온도로 가열하여 50 내지 100%의 원래의 이소시아네이트 그룹이 옥사졸리돈 환으로 전환되고 0 내지 50%의 원래의 이소시아네이트 그룹이 이소시아누레이트환으로 전환된 에폭시-말단화된 폴리옥사졸리돈을 수득함을 특징으로 하는, 승온에서 에폭시 그룹과 이소시아네이트 그룹을 반응시키기 위한 촉매의 존재하에 폴리에폭사이드 화합물을 폴리이소시아네이트 화합물과 반응시킴을 포함하는 경화시 유리전이도온도가 135℃이상이고 N-메틸피롤리돈 흡수율이 0.5%미만인 에폭시-말단화된 폴리옥사졸리돈의 제조방법.
  2. 제1항에 있어서, 단계(A)에서 0.02 내지 0.1중량%의 촉매가 사용됨을 특징으로 하는 에폭시-말단화된 폴리옥사졸리돈의 제조방법.
  3. 제1항에 있어서, 단계(A)에서 0.02 내지 0.1중량%의 촉매가 사용됨을 특징으로 하는 에폭시-말단화된 폴리옥사졸리돈의 제조방법.
  4. 제1항 내지 제3항 중의 어느 한 항에 있어서, 단계(A)에서 폴리이소시아네이트 화합물이 폴리에폭사이드 화합물 및 촉매의 혼합물에 15 내지 60분의 시간내에 첨가됨을 특징으로 하는 방법.
  5. 제4항에 있어서, 단계(A)에서 폴리이소시아네이트 화합물이 폴리에폭사이드 화합물 및 촉매의 혼합물에 20 내지 45분의 시간내에 첨가됨을 특징으로 하는 방법.
  6. 제1항 내지 제5항 중의 어느 한 항에 있어서, 단계(B)에서 반응 혼합물이 120℃ 내지 180℃의 온도로 가열됨을 특징으로 하는 방법.
  7. 제6항에 있어서, 단계(B)에서 반응 혼합물이 140℃ 내지 160℃의 온도로 가열됨을 특징으로 하는 방법.
  8. 제1항 내지 제7항 중의 어느 한 항에 있어서, 소정량의 촉매 및 소정량의 폴리이소시아네이트 화합물의 존재하에 이소시아네이트 그룹의 옥사졸리돈 환 및 이소시아누레이트 환으로의 전환이 단계(B)에서 사용된 반응온도에 의해 조절되는 방법.
  9. 제1항 내지 제7항 중의 어느 한 항에 있어서, 소정의 반응온도 및 소정량의 폴리이소시아네이트 화합물의 존재하에 이소시아네이트 그룹의 옥사졸리돈 환 및 이소시아누레이트 환으로의 전환이 단계(A)에서 사용된 촉매의 양에 의해 조절되는 방법.
  10. 제1항 내지 제7항 중의 어느 한 항에 있어서, 소정량의 촉매 및 소정의 반응온도하에 이소시아네이트 그룹의 옥사졸리돈 및 이소시아누레이트 환으로의 전환이 단계(A)에서 사용된 폴리리이소시아네이트 화합물의 양에 의해 조절되는 방법.
  11. 제1항 내지 제7항 중의 어느 한 항에 있어서, 소정의 반응온도더, 소정량의 촉매 및 소정량의 폴리에폭사이드 및 폴리이소시아네이트 화합물의 존재하에 이소시아네이트 그룹의 옥사졸리돈 환 및 이소시아누레이트 환으로의 전환이 폴리이소시아네이트 화합물의 첨가 속도에 의해 조절하는 방법.
  12. 제1항 내지 제11항 중의 어느 한 항에 있어서, 사용된 촉매기 이미다졸 화합물 또는 테트라페닐포스포늄 브로마이드임을 특징으로 하는 방법.
  13. 제12항에 있어서, 이미다졸 화합물이 2-페닐이미다-졸, 2-메틸이미다졸, 2-에틸-4-메틸이미-다졸, 4,4-메틸렌-비스(2-에틸-5-메틸이미-다졸)임을 특징으로 하는 방법.
  14. 폴리이소시아네이트 화합물로부터 유도된 5 내지 30중량%의 단위와 폴리에폭사이드 화합물로부터 유도된 70내지 95중량%의 단위(여기서, 중량%는 폴리에폭사이드 화합물과 폴리이소시아네이트 화합물의 합한 중량을 기준으로 한다)를 포함하고, 옥사졸리돈 환으로서 존재하는 50 내지 100%의 원래 이소시아네이트 그룹 및 이소시아네이트 환으로서 존재하는 0 내지 50%의 원래의 이소시아네이트 그룹을 가지며, 유리전이온도가 135℃이상이고 N-메틸피솔리돈 흡수율일 0.5%미만인 에폭시-말단화된 폴리옥사졸리돈.
  15. 제1항 내지 제13항 중의 어느 한 항의 방법에 의해 제조된, 이소시아네이트 함량이 5 내지 30중량%의 에폭시-말단화된 폴리옥사졸리돈.
  16. 제14항 또는 제15항에 있어서, 사용된 폴리에폭사이드가 하기 일반식을 가짐을 특징으로 하는 에폭시-말단화된 폴리옥사졸리돈.
    상기 식에서, R은 치환되거나 비치환된 방향족, 지방족, 지환족 또는 헤테로사이클릭 다가 그룹이고, n은 1이상 5미만의 평균치를 갖는다.
  17. 제16항에 있어서, 사용된 폴리에폭사이드가 2,2-비스(4-하이드록시페닐)프로판, 2,2-비스(3,5-디브로모하이드록시페닐)프로판 또는 이의 둘 이상의 혼합물임을 특징으로 하는 에폭시-말단화된 폴리옥사졸리돈.
  18. 제14항 내지 제17항 중의 어느 한 항에 있어서, 사용된 폴리이소시아네이트 화합물이 하기 일반식을 가짐을 특징으로 하는 에폭시-말단화된 폴리옥사졸리돈.
    상기 식에서, R'는 치환되거나 비치환된 지방족, 지환족, 방향족 또는 헤테로사이클릭 다가 그룹이과 m은 1이상 5미만, 바람직하게는 1.5 내지 4, 가장 바람직하게는 2 내지 3의 평균치를 갖는다.
  19. 제17항에 있어서, 폴리이소시아네이트가 4,4'-메틸렌비스(페닐이소시아네이트)또는 이의 이성체, 중합체성 MDI 또는 톨루엔 디이소시아네이트, 또는 이의 둘 이상의 혼합물임을 특징으로 하는 에폭시-말단화된 폴리옥사졸리돈.
  20. 에폭시 수지가 제14항 내지 제19항 중의 어느 한 항에서 청구된 에폭시-말단화된 폴리옥사졸리돈임을 특징으로 하는 에폭시 수지, 에폭시 수지용 경화제, 유기 용매 및 임의로 촉진제 및 기타 통상적인 보조제를 포함하는 에폭시 수지 와니스 조성물.
  21. 제20항에 있어서, 에폭시-말단화된 폴리옥사졸리돈이 25 내지 75중량%의 와니스 조성물을 포함함을 특징으로 하는 에폭시 수지 와니스 조성물.
  22. 제20항에 있어서, 에폭시-말단화된 폴리옥사졸리돈이 35 내지 65중량%의 와니스 조성물을 포함함을 특징으로 하는 에폭시 수지 와니스 조성물.
  23. 제20항에 있어서, 에폭시-말단화된 폴리옥사졸리돈이 40 내지 60중량%의 와니스 조성물을 포함함을 특징으로 하는 에폭시 수지 와니스 조성물.
  24. 사용된 에폭시 수지 와니스가 제20항 내지 제23항 중의 어느 한 항의 에폭시 수지 와니스 조성물임을 특징으로 하는 (a) 보강 웹을 에폭시 수지 와니스 조성물, 에폭시 수지용 경화제 및 유기 용매로 함침시키고, (b) 이와같이 제조된 프리프레그(prepreg)를 에폭시 수지가 경화제와 부분적으로 반응하기에 충분한 온도로 가열하고, (c) 상기 프리프레의 적어도 한층을 전기 전도성 재료와 함께 적충시키고 이와 같이 하여 제조된 적층물을 승온으로 가열시키는 단계를 포함하는 전기 적층물의 제조방법.
  25. 제24항에 있어서, 단계(B)에서 에폭시 수지와 경화제의 부분 반응을 100℃ 내지 230℃의 온도에서 수행하고 적층단계(C)를 130℃ 내지 230℃의 온도 및 34kPa 내지 6.9MPa의 압력에서 수행함을 특징으로 하는 방법.
  26. 제24항 또는 제25항의 방법에 의해 제조됨을 특징으로 하는 전기 적충물.
  27. 제26항의 전기 적충물로부터 제조됨을 특징으로 하는 인쇄 회로판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910701786A 1989-06-06 1991-12-06 Epoxy terminated polyoxazolidones Expired - Fee Related KR0160755B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB898912952A GB8912952D0 (en) 1989-06-06 1989-06-06 Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
GB89129522 1989-06-06
PCT/US1990/002973 WO1990015089A1 (en) 1989-06-06 1990-05-25 Epoxy-terminated polyoxazolidones, process of preparation, and electrical laminates therefrom
SG9590553 1995-03-28

Publications (2)

Publication Number Publication Date
KR920701289A true KR920701289A (ko) 1992-08-11
KR0160755B1 KR0160755B1 (en) 1999-01-15

Family

ID=26295443

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701786A Expired - Fee Related KR0160755B1 (en) 1989-06-06 1991-12-06 Epoxy terminated polyoxazolidones

Country Status (14)

Country Link
US (1) US5112932A (ko)
EP (1) EP0478606B1 (ko)
JP (1) JP2859956B2 (ko)
KR (1) KR0160755B1 (ko)
AT (1) ATE115596T1 (ko)
AU (1) AU628596B2 (ko)
BR (1) BR9007428A (ko)
CA (1) CA2018265A1 (ko)
DE (1) DE69015188T2 (ko)
DK (1) DK0478606T3 (ko)
ES (1) ES2067030T3 (ko)
GB (1) GB8912952D0 (ko)
NZ (1) NZ233933A (ko)
WO (1) WO1990015089A1 (ko)

Families Citing this family (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322909B2 (ja) * 1991-08-15 2002-09-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3290449B2 (ja) 1991-08-19 2002-06-10 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3345687B2 (ja) 1991-12-06 2002-11-18 日本ペイント株式会社 オキサゾリドン環含有水性樹脂および塗料
DE4223632A1 (de) 1992-07-17 1994-01-20 Siemens Ag Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse
DE4223630A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223622A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
JP3355658B2 (ja) 1992-08-13 2002-12-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
US5290903A (en) * 1992-11-09 1994-03-01 Norton Company Composite abrasive wheels
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides
CA2115533C (en) * 1994-02-11 2002-06-18 Hiroshi Uchida Urethane modified epoxy resin compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
US5480958A (en) * 1994-09-21 1996-01-02 Air Products And Chemicals, Inc. Polyepoxide resins incorporating epoxy terminated urethanes as tougheners
WO1996037532A1 (de) * 1995-05-24 1996-11-28 Siemens Aktiengesellschaft Epoxidharzformmassen mit halogenfreiem flammschutz
US5686541A (en) * 1995-11-14 1997-11-11 National Science Council Modification of epoxy resins with urethane prepolymer for electronic encapsulation
GB2315490B (en) * 1996-07-22 2001-02-07 Dow Deutschland Inc Improved curing catalysts for curing epoxy resins
DE69829465T2 (de) * 1997-03-27 2006-02-09 Mitsubishi Rayon Co., Ltd. Epoxidharzzusammensetzung für faserverstärkte kunststoffe, prepeg, und daraus hergestellter schlauchförmiger formkörper
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
GB9827367D0 (en) * 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
EP1753772B1 (en) 2004-05-28 2016-12-28 Blue Cube IP LLC Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
WO2006001445A1 (ja) * 2004-06-29 2006-01-05 Asahi Kasei Chemicals Corporation 難燃性エポキシ樹脂組成物
US20090032286A1 (en) * 2005-04-07 2009-02-05 Masaaki Urakawa Epoxy Resin Composition
EP1818044A1 (en) 2005-11-25 2007-08-15 DSMIP Assets B.V. Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups
WO2007075769A1 (en) * 2005-12-22 2007-07-05 Dow Global Technologies Inc. A curable epoxy resin composition and laminates made therefrom
CN103059267A (zh) * 2007-05-09 2013-04-24 陶氏环球技术公司 含有过量环氧树脂的环氧热固性组合物及其制备方法
ATE547446T1 (de) * 2007-05-16 2012-03-15 Dow Global Technologies Llc Flammenhemmende zusammensetzungen
JP5662145B2 (ja) 2007-06-20 2015-01-28 ダウ グローバル テクノロジーズ エルエルシー 温度変化に対する非常に低い感受性を有する衝突耐久性エポキシ接着剤
CN101772553A (zh) * 2007-08-02 2010-07-07 陶氏环球技术公司 热固性阻尼材料
EP2193153A1 (en) * 2007-09-11 2010-06-09 Dow Global Technologies Inc. Isocyanate modified epoxy resin for fusion bonded epoxy foam applications
KR101520131B1 (ko) * 2007-09-28 2015-05-13 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 조성물
WO2009045835A1 (en) * 2007-10-05 2009-04-09 Dow Global Technologies Inc. Isocyanate modified epoxy resin and epoxy powder coating composition thereof
JP2011500950A (ja) * 2007-10-26 2011-01-06 ダウ グローバル テクノロジーズ インコーポレイティド 電気用積層体において使用されるイソシアヌラート含有エポキシ樹脂組成物
CA2703977C (en) * 2007-10-31 2016-06-21 Dow Global Technologies Inc. Non-sintering isocyanate modified epoxy resin for fusion bonded epoxy applications
KR101150311B1 (ko) * 2007-11-29 2012-06-11 다우 글로벌 테크놀로지스 엘엘씨 열경화성 에폭시 수지의 경화제로서 디시안디아미드를 사용한 디메틸포름아미드가 없는 제형
JP2011505275A (ja) 2007-11-29 2011-02-24 ダウ グローバル テクノロジーズ インコーポレイティド マイクロ波加熱性モノビニル芳香族ポリマー
JP2011509339A (ja) * 2008-01-08 2011-03-24 ダウ グローバル テクノロジーズ エルエルシー 複合材料用の高Ｔｇエポキシ系
US20110218273A1 (en) * 2009-01-06 2011-09-08 Dow Global Technologies Llc Metal stabilizers for epoxy resins and advancement process
US20110263754A1 (en) * 2009-01-06 2011-10-27 Dow Global Technologies Llc Metallic compounds in non-brominated flame retardant epoxy resins
JP2012519220A (ja) 2009-02-26 2012-08-23 ダウ グローバル テクノロジーズ エルエルシー ダイマー化脂肪酸／エポキシ樹脂アダクト及びポリオールを含む一液型構造エポキシ樹脂接着剤
US7947785B2 (en) * 2009-05-21 2011-05-24 New Jersey Institute Of Technology Polyoxazolidones derived from bisanhydrohexitols
KR100929380B1 (ko) * 2009-06-18 2009-12-02 주식회사 신아티앤씨 난연성 폴리에폭시 화합물의 제조방법
US20120083564A1 (en) 2009-06-22 2012-04-05 Dow Global Technologies Llc Hardener composition for epoxy resins
EP2284004A1 (en) 2009-08-13 2011-02-16 Nan Ya Plastics Corp. Electric circuit board composition and a method of preparing circuit board
US20120211161A1 (en) 2009-11-05 2012-08-23 Andreas Lutz Structural epoxy resin adhesives containing elastomeric tougheners capped with ketoximes
KR20120097511A (ko) * 2009-11-12 2012-09-04 다우 글로벌 테크놀로지스 엘엘씨 폴리옥사졸리돈 수지
WO2011087486A1 (en) 2009-12-22 2011-07-21 Dow Global Technologies Inc. Oxazolidone ring contaning adducts
EP2528971A2 (en) 2010-01-29 2012-12-05 Dow Global Technologies LLC Compositions having phosphorus-containing compounds
WO2011163100A2 (en) * 2010-06-23 2011-12-29 Dow Global Technologies Llc Powder coatings compositions
WO2012000171A1 (en) 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
KR20130108100A (ko) 2010-06-29 2013-10-02 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지용의 저장 안정성 열 활성화된 3급 아민 촉매
JP2011063804A (ja) * 2010-10-15 2011-03-31 Hitachi Chem Co Ltd プリント配線板用プリプレグおよびそれを用いた積層板
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
CN103180400B (zh) 2010-12-26 2016-08-17 陶氏环球技术有限责任公司 含有用酚、多酚或氨基酚化合物封端的扩链弹性体增韧剂的结构环氧树脂粘合剂
KR101520202B1 (ko) 2010-12-28 2015-05-13 미쓰이 가가쿠 토세로 가부시키가이샤 수지 조성물, 이것을 포함하는 보호막, 드라이 필름, 회로 기판 및 다층 회로 기판
BR112013031429A2 (pt) 2011-06-24 2016-12-13 Dow Global Technologies Llc sistema de resina epóxi curável de dois componentes e processo para formar um compósito de epóxi reforçado com fibra
CN103619900B (zh) 2011-06-30 2016-05-11 陶氏环球技术有限责任公司 含胺硬化剂的混合物与过量环氧基团的可固化环氧树脂体系
CN103842436A (zh) 2011-08-01 2014-06-04 陶氏环球技术有限责任公司 包含*唑烷酮环的乙烯基酯树脂及其产品
WO2013142751A2 (en) 2012-03-23 2013-09-26 Dow Global Technologies Llc Flame retardant structural epoxy resin adhesives and process for bonding metal members
JP6173424B2 (ja) 2012-03-23 2017-08-02 ダウ グローバル テクノロジーズ エルエルシー 応力耐久性が高い破壊耐久性接着剤
EP2909250B1 (en) 2012-10-17 2016-12-07 Blue Cube IP LLC Toughened, curable epoxy compositions for high temperature applications
US9701851B2 (en) 2012-10-17 2017-07-11 Dow Global Technologies Llc Core shell rubber modified solid epoxy resins
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
EP2917278A4 (en) 2012-11-07 2016-06-08 Dow Global Technologies Llc CURABLE EPOXY COMPOSITION AND COMPOSITE MANUFACTURED THEREFROM
EP2920226B1 (en) 2012-11-13 2016-12-28 Dow Global Technologies LLC Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
CN104781303B (zh) 2012-11-13 2017-11-10 陶氏环球技术有限责任公司 用于树脂传递模塑方法的含多亚乙基四胺的环氧树脂体系
JP6379110B2 (ja) 2012-12-21 2018-08-29 ダウ グローバル テクノロジーズ エルエルシー 電気ケーブル接続のための非イソシアネート系シーラント
JP2016501970A (ja) 2012-12-21 2016-01-21 ダウ グローバル テクノロジーズ エルエルシー チオール硬化弾性エポキシ樹脂
CN104968703B (zh) 2012-12-21 2018-04-10 陶氏环球技术有限责任公司 相分段的非异氰酸酯弹性体
US9677372B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Well system cementing plug
BR112016002599A2 (pt) * 2013-08-16 2017-08-01 Dow Global Technologies Llc composição de epóxi termofixa 1k
CN105518044B (zh) 2013-09-16 2019-05-21 陶氏环球技术有限责任公司 用于海底管道绝缘材料的聚氨酯弹性体
MX394984B (es) 2013-12-18 2025-03-24 Dow Global Technologies Llc Proceso para la formacion de un polimero organico en una reaccion de un polieno, una resina epoxi y una mezcla de agentes de curado de tiol y de amina.
US10066136B2 (en) 2014-04-22 2018-09-04 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
EP3137538A1 (en) 2014-05-01 2017-03-08 Dow Global Technologies LLC Prepreg manufacturing and drying process
EP3152251B1 (en) 2014-06-09 2018-05-02 Dow Global Technologies LLC Process for making curable, multi-layer fiber-reinforced prepreg
CN106661190B (zh) 2014-07-23 2020-09-11 陶氏环球技术有限责任公司 具有改进的耐冲洗性的结构粘合剂和用于分配其的方法
DE102014226838A1 (de) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material
DE102014226842A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen
CN107001591B (zh) 2014-12-24 2020-03-13 陶氏环球技术有限责任公司 快速凝固的环氧树脂系统和使用所述环氧树脂系统涂布管道的方法
CN104497271A (zh) * 2014-12-24 2015-04-08 济南圣泉集团股份有限公司 一种改性环氧树脂和改性环氧树脂组合物
WO2016108958A1 (en) 2014-12-31 2016-07-07 Dow Global Technologies Llc Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance
WO2016209864A1 (en) 2015-06-25 2016-12-29 Dow Global Technologies Llc Novel epoxy resin system for making carbon fiber composites
WO2017044359A1 (en) 2015-09-10 2017-03-16 Dow Global Technologies Llc High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
CN107922583B (zh) 2015-09-10 2024-06-18 Ddp特种电子材料美国有限责任公司 具有改进的对油性表面的粘附力和高抗冲掉性的单组分增韧环氧粘合剂
CN105295041B (zh) * 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
US10815405B2 (en) 2016-01-19 2020-10-27 Dow Global Technologies Llc One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
CN107227001B (zh) * 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
US11326018B2 (en) 2016-08-19 2022-05-10 Covestro Deutschland Ag Process for the synthesis of polyoxazolidinone compounds
KR102393025B1 (ko) 2016-08-19 2022-05-03 다우 글로벌 테크놀로지스 엘엘씨 내부 몰드 이형제를 함유하는 에폭시 수지 조성물
BR112019008052B1 (pt) 2016-10-24 2023-10-31 Dow Global Technologies Llc Adesivo de epóxi termocurável de componente único e método para formar uma ligação adesiva entre dois substratos
WO2018081032A1 (en) 2016-10-25 2018-05-03 Dow Global Technologies Llc Epoxy adhesive having improved low-temperature impact resistance
CN110072915A (zh) 2016-10-28 2019-07-30 陶氏环球技术有限责任公司 具有改善的低温耐冲击性的耐碰撞环氧粘合剂
CN106519185B (zh) * 2016-11-16 2020-03-31 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在绝缘漆中的应用
WO2018156450A1 (en) 2017-02-26 2018-08-30 Dow Global Technologies Llc One-component toughened epoxy adhesives containing a mixture of latent curing agents
EP3592796B1 (en) 2017-03-09 2021-04-21 Dow Global Technologies LLC Stable epoxy/internal mold release agent blends for the manufacture of composite articles
KR102522215B1 (ko) 2017-03-17 2023-04-18 다우 글로벌 테크놀로지스 엘엘씨 에폭시-아크릴계 하이브리드 접착제
US10344115B2 (en) 2017-05-25 2019-07-09 International Business Machines Corporation Amine glyoxal resins
JP7098662B2 (ja) 2017-06-07 2022-07-11 ダウ グローバル テクノロジーズ エルエルシー ランダムに配向したフィラメントを有する成形化合物、ならびにその作製および使用方法
KR102627557B1 (ko) 2017-08-15 2024-01-24 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 이액형 상온 경화성 에폭시 접착제
JP7343506B2 (ja) 2017-09-12 2023-09-12 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 接着剤調合物
KR102606942B1 (ko) 2017-09-12 2023-11-29 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 1액형 강화 에폭시 접착제
WO2019063391A1 (de) * 2017-09-29 2019-04-04 Basf Se Thermoplastische polyoxazolidone aus diisocyanten und diglycidylether von 2-phenyl-1,3-propandiol-derivaten
EP3737725B1 (en) 2018-01-08 2023-03-01 DDP Specialty Electronic Materials US, LLC Epoxy resin adhesive compositions
ES3013876T3 (en) 2018-05-18 2025-04-15 Dow Global Technologies Llc A polyisocyanate component, a polyurethane foaming system and an article made therefrom
JP7411577B2 (ja) 2018-05-29 2024-01-11 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 一液型エポキシ接着剤混合物を使用する接合方法
JP2021526168A (ja) 2018-06-05 2021-09-30 ダウ グローバル テクノロジーズ エルエルシー エポキシ繊維複合体をポリオレフィンにリサイクルするための方法
WO2019240897A1 (en) 2018-06-15 2019-12-19 Dow Global Technologies Llc Toughened epoxy compositions
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
JP7512249B2 (ja) * 2018-07-18 2024-07-08 ビーエーエスエフ ソシエタス・ヨーロピア ポリオキサゾリドンのバルク重合
EP3830156B1 (en) * 2018-07-30 2024-11-27 Dow Global Technologies LLC Curable resin composition
KR102862563B1 (ko) 2018-08-31 2025-09-24 다우 글로벌 테크놀로지스 엘엘씨 에폭시 복합체 제형
US11225542B1 (en) * 2018-11-09 2022-01-18 ASK Chemicals LLC Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
US11732085B2 (en) 2019-02-15 2023-08-22 Dow Global Technologies Llc Epoxy composition
KR102862608B1 (ko) 2019-05-21 2025-09-24 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 에폭시 접착제 조성물 및 사용 방법
EP3750933A1 (en) * 2019-06-12 2020-12-16 Covestro Deutschland AG Method for the production of epoxy-group terminated polyoxazolidinones
EP3986949A1 (en) 2019-06-18 2022-04-27 DDP Specialty Electronic Materials US, LLC One-component toughened epoxy adhesives with improved humidity resistance
JP7647101B2 (ja) * 2019-11-18 2025-03-18 東レ株式会社 繊維強化複合材料の成形方法、およびそれに用いられるエポキシ樹脂組成物
US20210253772A1 (en) * 2020-02-18 2021-08-19 Covestro Llc Polyoxazolidinone compositions
WO2022122606A1 (en) 2020-12-10 2022-06-16 Covestro Deutschland Ag Composition comprising epoxy-functional oxazolidinone
EP4011927A1 (en) 2020-12-10 2022-06-15 Covestro Deutschland AG Composition comprising epoxy-functional oxazolidinone
JP2023149613A (ja) * 2022-03-31 2023-10-13 日鉄ケミカル＆マテリアル株式会社 硬化性樹脂組成物、及びそれを用いたトウプリプレグ
WO2024076408A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition
CN119968413A (zh) 2022-10-06 2025-05-09 Ddp 特种电子材料美国有限责任公司 双组分粘合剂组合物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305494A (en) * 1963-04-12 1967-02-21 Baker Chem Co J T Oxazolidonyl sulfones and method of making same
US3334110A (en) * 1965-08-16 1967-08-01 Baker Chem Co J T Method for preparing epoxyoxazolidinones
US3494888A (en) * 1966-08-30 1970-02-10 Wilbur R Mcelroy Resin compositions from polyepoxides and isocyanate polymers
US3471442A (en) * 1967-02-02 1969-10-07 American Cyanamid Co Process for the preparation of thermoplastic polymers prepared by reacting diepoxide monomers with aromatic diisocyanates
US3694406A (en) * 1970-07-31 1972-09-26 Us Air Force Preparation of polyoxazolidones
US3767624A (en) * 1971-12-27 1973-10-23 Dow Chemical Co Oxazolidinone modified epoxy novolac resin
JPS5231000B2 (ko) * 1972-11-29 1977-08-11
JPS5315757B2 (ko) * 1973-08-31 1978-05-26
JPS57131219A (en) * 1981-02-06 1982-08-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition
ZA839459B (en) * 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
DE3323122A1 (de) * 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
FR2549277B1 (fr) * 1983-07-13 1985-10-25 Alsthom Atlantique Procede d'isolation par impregnation d'un bobinage electrique, et vernis sans solvant stabilise utilisable dans ce procede
GB8412900D0 (en) * 1984-05-21 1984-06-27 Secr Defence Thermosetting resin compositions
DE3720759A1 (de) * 1987-06-24 1989-01-05 Bayer Ag Oxazolidongruppen enthaltende epoxidharze

Also Published As

Publication number Publication date
AU628596B2 (en) 1992-09-17
DE69015188T2 (de) 1995-05-04
EP0478606B1 (en) 1994-12-14
US5112932A (en) 1992-05-12
DK0478606T3 (da) 1995-05-15
NZ233933A (en) 1993-05-26
DE69015188D1 (de) 1995-01-26
ES2067030T3 (es) 1995-03-16
JPH04506678A (ja) 1992-11-19
KR0160755B1 (en) 1999-01-15
EP0478606A4 (en) 1992-05-13
JP2859956B2 (ja) 1999-02-24
AU5829190A (en) 1991-01-07
ATE115596T1 (de) 1994-12-15
WO1990015089A1 (en) 1990-12-13
GB8912952D0 (en) 1989-07-26
CA2018265A1 (en) 1990-12-06
EP0478606A1 (en) 1992-04-08
BR9007428A (pt) 1992-07-21

Similar Documents

Publication Publication Date Title
KR920701289A (ko) 에폭시-말단화된 폴리옥사졸리돈, 이의 제조방법 및 이로부터의 전기 적층물
US4401499A (en) Crosslinked resin of epoxy compound and isocyanate and process for producing same
JP2002527529A5 (ko)
DE2510796A1 (de) Verfahren zur herstellung von schichtstoffen
US4783345A (en) Method for the manufacture of prepregs and their use
EP0411050A1 (en) POLYIMIDE RESIN.
KR850002582A (ko) 경화성 에폭시 수지 조성물
EP0270601A1 (en) Homogeneous thermoset copolymers
DE3148358C2 (ko)
DE69837394T2 (de) Mehrwertige phenole, epoxyharze, epoxyharz-zuammensetzungen und ihre vernetzten produkte
KR0139001B1 (ko) 방향족 디아민 경화제를 포함하는 에폭시 수지 조성물
US5026872A (en) Aromatic ether-ketone polyamines, intermediates and products, and methods for preparing same
US4138372A (en) Resin compositions containing polyepoxides and uretdiones
CN105440586B (zh) 一种介电特性优良的改性环氧树脂组合物及其应用
US5614600A (en) Fiber-reinforced resin plate and process for producing the same
DE69024807T2 (de) Schlagfestes hochtemperaturharz enthaltendes matrixsystem
EP0165423B1 (de) Laminate aus Polyhydantoinen
US5015719A (en) Aromatic dicyanate/aromatic diepoxy compositions, cured products and methods
JPS5865718A (ja) プレポリマ−の製造方法および該プレポリマ−を用いた無溶剤型プリプレグ
JPH10279781A (ja) エポキシ樹脂組成物
US3491059A (en) Heat curable epoxy compositions with curing agent 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane
US6310119B1 (en) Film-shaped encapsulating agent for electronic parts
KR101798865B1 (ko) 옥사졸리돈기를 갖는 에폭시 수지，이의 제조방법 및 이를 이용한 동박 적층판
JPS5898326A (ja) 交叉結合された樹脂の製造方法
KR101910134B1 (ko) 변성 에폭시 수지 및 그 제조방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20100811

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20110820

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20110820

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000