[go: up one dir, main page]

ES2067030T3 - Procedimiento para la preparacion de polioxazolidinas acabadas en epoxi y de estratificados electricos a base de ellas. - Google Patents

Procedimiento para la preparacion de polioxazolidinas acabadas en epoxi y de estratificados electricos a base de ellas.

Info

Publication number
ES2067030T3
ES2067030T3 ES90909068T ES90909068T ES2067030T3 ES 2067030 T3 ES2067030 T3 ES 2067030T3 ES 90909068 T ES90909068 T ES 90909068T ES 90909068 T ES90909068 T ES 90909068T ES 2067030 T3 ES2067030 T3 ES 2067030T3
Authority
ES
Spain
Prior art keywords
preparation
epoxy
electrical
stratificates
poloxazolidines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90909068T
Other languages
English (en)
Inventor
Raymond A Koenig
Joseph Gan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of ES2067030T3 publication Critical patent/ES2067030T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/09—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
    • C08G18/092—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to isocyanurate groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Thermal Sciences (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Compounds (AREA)

Abstract

SE PRESENTAN POLIOXAZOLIDONA TERMINADA EN EPOXI QUE TIENE DE 5 A 30 POR CIENTO EN PESO DEL CONTENIDO ISOCIANATO. ESTAS POLIOXAZOLIDONAS SE PREPARAN MEDIANTE UN PROCESO EN EL QUE SE CONTROLAN VARIOS PARAMETROS DE PROCESO DE UNA MANERA DIRIGIDA PARA DAR UN PRODUCTO QUE TIENE DE 50 A 100 POR CIENTO DE GRUPOS ISOCIANATOS CONVERTIDOS A ANILLOS OXAZOLIDONAS Y DE 0 A 50 POR CIENTO DE LOS GRUPOS ISOCIANATOS CONVERTIDOS A ANILLOS ISOCIANURATOS. ESTAS POLIOXAZOLIDONAS TERMINADAS EN EPOXI EXHIBEN ALTAS TEMPERATURAS DE TRANSICION DE VIDRIO Y ALTA RESISTENCIA A QUIMICOS AL CURARSE. SON UTILES PARA LA PREPARACION DE LAMINADOS ELECTRICOS, PARTICULARMENTE LAMINADOS UTILIZADOS EN LA PREPARACION DE PLACAS DE CIRCUITOS ELECTRICOS.
ES90909068T 1989-06-06 1990-05-25 Procedimiento para la preparacion de polioxazolidinas acabadas en epoxi y de estratificados electricos a base de ellas. Expired - Lifetime ES2067030T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB898912952A GB8912952D0 (en) 1989-06-06 1989-06-06 Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
SG9590553 1995-03-28

Publications (1)

Publication Number Publication Date
ES2067030T3 true ES2067030T3 (es) 1995-03-16

Family

ID=26295443

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90909068T Expired - Lifetime ES2067030T3 (es) 1989-06-06 1990-05-25 Procedimiento para la preparacion de polioxazolidinas acabadas en epoxi y de estratificados electricos a base de ellas.

Country Status (14)

Country Link
US (1) US5112932A (es)
EP (1) EP0478606B1 (es)
JP (1) JP2859956B2 (es)
KR (1) KR0160755B1 (es)
AT (1) ATE115596T1 (es)
AU (1) AU628596B2 (es)
BR (1) BR9007428A (es)
CA (1) CA2018265A1 (es)
DE (1) DE69015188T2 (es)
DK (1) DK0478606T3 (es)
ES (1) ES2067030T3 (es)
GB (1) GB8912952D0 (es)
NZ (1) NZ233933A (es)
WO (1) WO1990015089A1 (es)

Families Citing this family (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322909B2 (ja) * 1991-08-15 2002-09-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3290449B2 (ja) 1991-08-19 2002-06-10 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3345687B2 (ja) 1991-12-06 2002-11-18 日本ペイント株式会社 オキサゾリドン環含有水性樹脂および塗料
DE4223630A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223632A1 (de) 1992-07-17 1994-01-20 Siemens Ag Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse
DE4223622A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
JP3355658B2 (ja) 1992-08-13 2002-12-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides
US5290903A (en) * 1992-11-09 1994-03-01 Norton Company Composite abrasive wheels
CA2115533C (en) * 1994-02-11 2002-06-18 Hiroshi Uchida Urethane modified epoxy resin compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
US5480958A (en) * 1994-09-21 1996-01-02 Air Products And Chemicals, Inc. Polyepoxide resins incorporating epoxy terminated urethanes as tougheners
WO1996037532A1 (de) * 1995-05-24 1996-11-28 Siemens Aktiengesellschaft Epoxidharzformmassen mit halogenfreiem flammschutz
US5686541A (en) * 1995-11-14 1997-11-11 National Science Council Modification of epoxy resins with urethane prepolymer for electronic encapsulation
GB2315490B (en) * 1996-07-22 2001-02-07 Dow Deutschland Inc Improved curing catalysts for curing epoxy resins
JP4571714B2 (ja) * 1997-03-27 2010-10-27 三菱レイヨン株式会社 Ｆｒｐ用エポキシ樹脂組成物、プリプレグ及びそれを用いた管状成形体
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
GB9827367D0 (en) * 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
CN1960997B (zh) * 2004-05-28 2014-05-07 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
JP4662489B2 (ja) * 2004-06-29 2011-03-30 旭化成イーマテリアルズ株式会社 難燃性エポキシ樹脂組成物
WO2006109744A1 (ja) * 2005-04-07 2006-10-19 Asahi Kasei Chemicals Corporation エポキシ樹脂組成物
EP1818044A1 (en) * 2005-11-25 2007-08-15 DSMIP Assets B.V. Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups
KR20080077639A (ko) * 2005-12-22 2008-08-25 다우 글로벌 테크놀로지스 인크. 경화성 에폭시 수지 조성물 및 이로부터 제조한 적층물
BRPI0810290A2 (pt) * 2007-05-09 2014-11-04 Dow Global Technologies Inc "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."
ATE547446T1 (de) * 2007-05-16 2012-03-15 Dow Global Technologies Llc Flammenhemmende zusammensetzungen
BRPI0811680A2 (pt) 2007-06-20 2015-02-10 Dow Global Technologies Inc "adesivo estrutural de um componente e método"
WO2009018194A1 (en) * 2007-08-02 2009-02-05 Dow Global Technologies Inc. Thermoset dampener material
WO2009035860A1 (en) * 2007-09-11 2009-03-19 Dow Global Technologies Inc. Isocyanate modified epoxy resin for fusion bonded epoxy foam applications
US20100294429A1 (en) * 2007-09-28 2010-11-25 Dow Global Technologies Inc. Epoxy resin formulations
BRPI0816499A2 (pt) * 2007-10-05 2019-09-24 Dow Global Technologies Inc composição de resina epóxi de revestimento em pó e artigo
JP2011500950A (ja) * 2007-10-26 2011-01-06 ダウ グローバル テクノロジーズ インコーポレイティド 電気用積層体において使用されるイソシアヌラート含有エポキシ樹脂組成物
BRPI0817181A8 (pt) 2007-10-31 2016-12-20 Dow Global Technologies Inc Polímero termofixo contendo anel de oxazolidinona terminado por epóxi, composição termofixa de revestimento em pó, substrato, método para prover um substrato com um revestimento epóxi ligado por fusão (fbe), substrato revestido, método para preparar um polimero contendo um anel de oxazolidinona terminado por epóxi e polímero
WO2009070488A1 (en) * 2007-11-29 2009-06-04 Dow Global Technologies Inc. Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
KR20100090296A (ko) 2007-11-29 2010-08-13 다우 글로벌 테크놀로지스 인크. 마이크로파 가열가능한 모노비닐 방향족 중합체
CN101910238B (zh) * 2008-01-08 2013-03-27 陶氏环球技术公司 用于复合材料应用的高Tg环氧体系
JP5886629B2 (ja) * 2009-01-06 2016-03-16 ブルー キューブ アイピー エルエルシー 非臭素化難燃性エポキシ樹脂における金属化合物
US20110218273A1 (en) * 2009-01-06 2011-09-08 Dow Global Technologies Llc Metal stabilizers for epoxy resins and advancement process
US20110297317A1 (en) 2009-02-26 2011-12-08 Andreas Lutz One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol
US7947785B2 (en) * 2009-05-21 2011-05-24 New Jersey Institute Of Technology Polyoxazolidones derived from bisanhydrohexitols
KR100929380B1 (ko) * 2009-06-18 2009-12-02 주식회사 신아티앤씨 난연성 폴리에폭시 화합물의 제조방법
EP2445949B1 (en) 2009-06-22 2015-03-25 Dow Global Technologies LLC Hardener composition for epoxy resins
EP2284004A1 (en) 2009-08-13 2011-02-16 Nan Ya Plastics Corp. Electric circuit board composition and a method of preparing circuit board
EP2496657B1 (en) 2009-11-05 2016-04-27 Dow Global Technologies LLC Structural epoxy resin adhasives containing elastomeric tougheners capped with ketoximes
JP5706437B2 (ja) * 2009-11-12 2015-04-22 ダウ グローバル テクノロジーズ エルエルシー ポリオキサゾリドン樹脂
KR20120115329A (ko) 2009-12-22 2012-10-17 다우 글로벌 테크놀로지스 엘엘씨 옥사졸리돈 고리 함유 부가물
JP5767250B2 (ja) 2010-01-29 2015-08-19 ダウ グローバル テクノロジーズ エルエルシー リン含有化合物を有する組成物
JP2013534954A (ja) * 2010-06-23 2013-09-09 ダウ グローバル テクノロジーズ エルエルシー 粉体コーティング組成物
WO2012006001A2 (en) 2010-06-29 2012-01-12 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
WO2012000171A1 (en) 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
JP2011063804A (ja) * 2010-10-15 2011-03-31 Hitachi Chem Co Ltd プリント配線板用プリプレグおよびそれを用いた積層板
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
CN103180400B (zh) 2010-12-26 2016-08-17 陶氏环球技术有限责任公司 含有用酚、多酚或氨基酚化合物封端的扩链弹性体增韧剂的结构环氧树脂粘合剂
JP5833024B2 (ja) 2010-12-28 2015-12-16 三井化学東セロ株式会社 樹脂組成物、これを含む保護膜、ドライフィルム、回路基板、及び多層回路基板
JP2014517136A (ja) 2011-06-24 2014-07-17 ダウ グローバル テクノロジーズ エルエルシー 熱硬化性組成物、及び繊維強化コンポジットの調製方法
JP6008958B2 (ja) 2011-06-30 2016-10-19 ダウ グローバル テクノロジーズ エルエルシー アミン硬化剤の混合物及び過剰のエポキシ基を含む硬化性エポキシ樹脂系
EP2739684A1 (en) * 2011-08-01 2014-06-11 Dow Global Technologies LLC An oxazolidone ring containing vinyl ester resin and products therefrom
BR112014018126B1 (pt) 2012-03-23 2021-07-13 Dow Global Technologies Llc Adesivo estrutural termocurável e processo para unir e soldar membros metálicos
BR112014018129B1 (pt) 2012-03-23 2021-07-20 Dow Global Technologies Llc Adesivo estrutural termocurável e método para unir um membro de alumínio a um segundo membro metálico
WO2014062531A2 (en) * 2012-10-17 2014-04-24 Dow Global Technologies Llc Core shell rubber modified solid epoxy resins
RU2015118176A (ru) 2012-10-17 2016-12-10 БЛЮ КЬЮБ АйПи ЭлЭлСи Ударопрочные отверждающиеся эпоксидные композиции для применения при высокой температуре
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
WO2014071576A1 (en) 2012-11-07 2014-05-15 Dow Global Technologies Llc A curable epoxy composition and a composite made therefrom
EP2920226B1 (en) 2012-11-13 2016-12-28 Dow Global Technologies LLC Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
JP6367817B2 (ja) 2012-11-13 2018-08-01 ダウ グローバル テクノロジーズ エルエルシー 樹脂移送成形プロセスのためのポリエチレンテトラアミン含有エポキシ樹脂系
WO2014100238A2 (en) 2012-12-21 2014-06-26 Dow Global Technologies Llc Phase-segmented non-isocyanate elastomers
EP2935389B1 (en) 2012-12-21 2017-11-29 Dow Global Technologies LLC Non-isocyanate sealant for electrical cable joining
JP2016501970A (ja) 2012-12-21 2016-01-21 ダウ グローバル テクノロジーズ エルエルシー チオール硬化弾性エポキシ樹脂
US9677372B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Well system cementing plug
BR112016002599A2 (pt) * 2013-08-16 2017-08-01 Dow Global Technologies Llc composição de epóxi termofixa 1k
SG11201601534WA (en) 2013-09-16 2016-04-28 Dow Global Technologies Llc Polyurethane elastomer for use in subsea pipeline insulation
JP6400707B2 (ja) 2013-12-18 2018-10-03 ダウ グローバル テクノロジーズ エルエルシー ポリエンと、エポキシ樹脂と、チオール及びアミン硬化剤の混合物との反応における、有機ポリマーを形成するための方法
WO2015164031A1 (en) 2014-04-22 2015-10-29 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
EP3137538A1 (en) 2014-05-01 2017-03-08 Dow Global Technologies LLC Prepreg manufacturing and drying process
WO2015191354A1 (en) 2014-06-09 2015-12-17 Dow Global Technologies Llc Process for making curable, multi-layer fiber-reinforced prepreg
KR102407087B1 (ko) 2014-07-23 2022-06-10 다우 글로벌 테크놀로지스 엘엘씨 개선된 워시-오프 저항성을 갖는 구조용 접착제 및 이의 분배 방법
DE102014226838A1 (de) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material
DE102014226842A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen
CN104497271A (zh) * 2014-12-24 2015-04-08 济南圣泉集团股份有限公司 一种改性环氧树脂和改性环氧树脂组合物
EP3237485A1 (en) 2014-12-24 2017-11-01 Dow Global Technologies LLC Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
US10392539B2 (en) 2014-12-31 2019-08-27 Dow Global Technologies Llc Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance
WO2016209864A1 (en) 2015-06-25 2016-12-29 Dow Global Technologies Llc Novel epoxy resin system for making carbon fiber composites
CN107922583B (zh) 2015-09-10 2024-06-18 Ddp特种电子材料美国有限责任公司 具有改进的对油性表面的粘附力和高抗冲掉性的单组分增韧环氧粘合剂
JP6923514B2 (ja) 2015-09-10 2021-08-18 ダウ グローバル テクノロジーズ エルエルシー 高アスペクト比充填剤を伴う高弾性強靭化一液型エポキシ構造用接着剤
CN105295041B (zh) * 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
EP3405510B2 (en) 2016-01-19 2023-06-07 Dow Global Technologies LLC One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
CN107227001B (zh) * 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
JP2019526664A (ja) * 2016-08-19 2019-09-19 コベストロ、ドイチュラント、アクチエンゲゼルシャフトＣｏｖｅｓｔｒｏ Ｄｅｕｔｓｃｈｌａｎｄ Ａｇ ポリオキサゾリジノン化合物の合成法
JP6966537B2 (ja) 2016-08-19 2021-11-17 ダウ グローバル テクノロジーズ エルエルシー 内部離型剤を含有するエポキシ樹脂組成物
BR112019008052B1 (pt) 2016-10-24 2023-10-31 Dow Global Technologies Llc Adesivo de epóxi termocurável de componente único e método para formar uma ligação adesiva entre dois substratos
WO2018081032A1 (en) 2016-10-25 2018-05-03 Dow Global Technologies Llc Epoxy adhesive having improved low-temperature impact resistance
JP7011656B2 (ja) 2016-10-28 2022-01-26 ダウ グローバル テクノロジーズ エルエルシー 改善された低温耐衝撃性を有する衝突耐久性エポキシ接着剤
CN106519185B (zh) * 2016-11-16 2020-03-31 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在绝缘漆中的应用
US11274236B2 (en) 2017-02-26 2022-03-15 Ddp Specialty Electronic Materials Us, Llc One-component toughened epoxy adhesives containing a mixture of latent curing agents
US20200181361A1 (en) 2017-03-09 2020-06-11 Dow Global Technologies Llc Stable epoxy/internal mold release agent blends for the manufacture of composite articles
CN110352225B (zh) 2017-03-17 2021-07-30 陶氏环球技术有限责任公司 环氧丙烯酸混合胶黏剂
US10344115B2 (en) 2017-05-25 2019-07-09 International Business Machines Corporation Amine glyoxal resins
WO2018226288A1 (en) 2017-06-07 2018-12-13 Dow Global Technologies Llc Molding compound having randomly oriented filaments and methods for making and using same
US20200140727A1 (en) 2017-08-15 2020-05-07 Ddp Specialty Electronics Materials Us, Inc. Two-component room temperature curable toughened epoxy adhesives
CN111886312B (zh) 2017-09-12 2023-07-14 Ddp特种电子材料美国有限责任公司 胶粘剂配制品
CN111630130B (zh) 2017-09-12 2022-09-30 Ddp特种电子材料美国公司 单组分增韧的环氧胶粘剂
WO2019063391A1 (de) * 2017-09-29 2019-04-04 Basf Se Thermoplastische polyoxazolidone aus diisocyanten und diglycidylether von 2-phenyl-1,3-propandiol-derivaten
US11674063B2 (en) 2018-01-08 2023-06-13 Ddp Specialty Electronic Materials Us, Llc Epoxy resin adhesive compositions
CN112135852B (zh) 2018-05-18 2022-11-08 陶氏环球技术有限责任公司 聚异氰酸酯组分、聚氨酯发泡体系和由其制成的制品
US11173672B2 (en) 2018-05-29 2021-11-16 Ddp Specialty Electronic Materials Us, Llc Method for bonding using one-component epoxy adhesive mixtures
KR20210016552A (ko) 2018-06-05 2021-02-16 다우 글로벌 테크놀로지스 엘엘씨 에폭시-섬유 복합재를 폴리올레핀에 재활용하는 방법
WO2019240897A1 (en) 2018-06-15 2019-12-19 Dow Global Technologies Llc Toughened epoxy compositions
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
US12077631B2 (en) 2018-07-18 2024-09-03 Basf Se Bulk polymerisation of polyoxazolidone
WO2020024091A1 (en) * 2018-07-30 2020-02-06 Dow Global Technologies Llc Curable resin composition
JP7394833B2 (ja) 2018-08-31 2023-12-08 ダウ グローバル テクノロジーズ エルエルシー エポキシ複合配合物
US11225542B1 (en) * 2018-11-09 2022-01-18 ASK Chemicals LLC Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
JP7645803B2 (ja) 2019-02-15 2025-03-14 ダウ グローバル テクノロジーズ エルエルシー エポキシ複合材料
KR102862608B1 (ko) 2019-05-21 2025-09-24 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 에폭시 접착제 조성물 및 사용 방법
EP3750933A1 (en) * 2019-06-12 2020-12-16 Covestro Deutschland AG Method for the production of epoxy-group terminated polyoxazolidinones
KR102861612B1 (ko) 2019-06-18 2025-09-17 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 내습성이 개선된 강인화된 1액형 에폭시 접착제
WO2021100649A1 (ja) * 2019-11-18 2021-05-27 東レ株式会社 繊維強化複合材料の成形方法、およびそれに用いられるエポキシ樹脂組成物
US20210253772A1 (en) * 2020-02-18 2021-08-19 Covestro Llc Polyoxazolidinone compositions
WO2022122606A1 (en) 2020-12-10 2022-06-16 Covestro Deutschland Ag Composition comprising epoxy-functional oxazolidinone
EP4011927A1 (en) 2020-12-10 2022-06-15 Covestro Deutschland AG Composition comprising epoxy-functional oxazolidinone
JP2023149613A (ja) * 2022-03-31 2023-10-13 日鉄ケミカル＆マテリアル株式会社 硬化性樹脂組成物、及びそれを用いたトウプリプレグ
WO2024076408A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition
EP4598975A1 (en) 2022-10-06 2025-08-13 DDP Specialty Electronic Materials US, LLC Two-component adhesive composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305494A (en) * 1963-04-12 1967-02-21 Baker Chem Co J T Oxazolidonyl sulfones and method of making same
US3334110A (en) * 1965-08-16 1967-08-01 Baker Chem Co J T Method for preparing epoxyoxazolidinones
US3494888A (en) * 1966-08-30 1970-02-10 Wilbur R Mcelroy Resin compositions from polyepoxides and isocyanate polymers
US3471442A (en) * 1967-02-02 1969-10-07 American Cyanamid Co Process for the preparation of thermoplastic polymers prepared by reacting diepoxide monomers with aromatic diisocyanates
US3694406A (en) * 1970-07-31 1972-09-26 Us Air Force Preparation of polyoxazolidones
US3767624A (en) * 1971-12-27 1973-10-23 Dow Chemical Co Oxazolidinone modified epoxy novolac resin
JPS5231000B2 (es) * 1972-11-29 1977-08-11
JPS5315757B2 (es) * 1973-08-31 1978-05-26
JPS57131219A (en) * 1981-02-06 1982-08-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition
ZA839459B (en) * 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
DE3323122A1 (de) * 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
FR2549277B1 (fr) * 1983-07-13 1985-10-25 Alsthom Atlantique Procede d'isolation par impregnation d'un bobinage electrique, et vernis sans solvant stabilise utilisable dans ce procede
GB8412900D0 (en) * 1984-05-21 1984-06-27 Secr Defence Thermosetting resin compositions
DE3720759A1 (de) * 1987-06-24 1989-01-05 Bayer Ag Oxazolidongruppen enthaltende epoxidharze

Also Published As

Publication number Publication date
EP0478606A1 (en) 1992-04-08
BR9007428A (pt) 1992-07-21
WO1990015089A1 (en) 1990-12-13
US5112932A (en) 1992-05-12
ATE115596T1 (de) 1994-12-15
DE69015188T2 (de) 1995-05-04
DE69015188D1 (de) 1995-01-26
JP2859956B2 (ja) 1999-02-24
KR920701289A (ko) 1992-08-11
JPH04506678A (ja) 1992-11-19
AU628596B2 (en) 1992-09-17
EP0478606B1 (en) 1994-12-14
KR0160755B1 (en) 1999-01-15
CA2018265A1 (en) 1990-12-06
EP0478606A4 (en) 1992-05-13
NZ233933A (en) 1993-05-26
DK0478606T3 (da) 1995-05-15
AU5829190A (en) 1991-01-07
GB8912952D0 (en) 1989-07-26

Similar Documents

Publication Publication Date Title
ES2067030T3 (es) Procedimiento para la preparacion de polioxazolidinas acabadas en epoxi y de estratificados electricos a base de ellas.
ATE107677T1 (de) Epoxidharzmischungen.
MY115821A (en) Prepreg, resin varnish and resin composition for printed wiring boards and laminates for printed wiring boards produced therefrom
DE69020820D1 (de) Harzmassen, die aromatische Cyanatester, Polyepoxidverbindungen und thermoplastische Polymere umfassen, und daraus hergestellte Prepregs.
DE59403338D1 (de) Oleophob modifizierte mikroporöse Polymere
DE3686634D1 (de) Verfahren zur herstellung von leiterplatten fuer das zusammenschalten mit koaxialkabeln und dadurch hergestellte leiterplatten.
BR8800708A (pt) Artigo de cimento curado e processo para preparar um artigo de cimento curado de alta resistencia
FI874046A0 (fi) Foerfarande foer framstaellning av en med laonga fibrer armerad polyamidbaserad komposit.
ES2028359T3 (es) Procedimiento para la obtencion de cianoguanidinas oligomeras.
ATE98282T1 (de) Unter abspaltung von oximen haertende 1 k rtv massen.
ATE142660T1 (de) Herstellung von kettenverlängerten epoxyharzen
ATE80944T1 (de) Leitfaehige harzstruktur zum verbinden von metalleitern.
DK540086A (da) Imidgruppeholdige polymere og fremgangsmaade til fremstilling deraf
ATE72450T1 (de) Verfahren zur herstellung von prepregs und deren verwendung.
DK640087D0 (da) Termohaerdende sammensaetninger, deres fremstilling og anvendelse
DE59004017D1 (de) Verfahren zur Herstellung von chlorsubstituierten aromatischen Aminen.
MY130153A (en) Epoxy-terminated polyoxazolidones, process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones.
BR8002771A (pt) Processo para a preparacao de fibrilhas a base de poliolefinas e fibrilhas tendo por base poliolefinas
BR9002460A (pt) Composicao nao curada,composicao curavel,produto curavel e processo para obter uma composicao nao curada
ES2019297B3 (es) Polimeros con grupos imidas y procedimiento de preparacion.
ATE128473T1 (de) Epoxidharzmischungen.
ATE65524T1 (de) Neue loesliche und/oder schmelzbare polyamidimid- polyimid-blockcopolymere.
ATA166589A (de) Verfahren zur herstellung von polyimiden und imiden
BR8802570A (pt) Processo para preparacao de policicloacetais,processo para preparacao de polimeros reticulados,e composicoes endureciveis a base de epoxido
Salto et al. Laminated Imide Resin Sheet and Process for Producing the Same

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 478606

Country of ref document: ES