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DK0478606T3 - Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra - Google Patents

Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra

Info

Publication number
DK0478606T3
DK0478606T3 DK90909068.0T DK90909068T DK0478606T3 DK 0478606 T3 DK0478606 T3 DK 0478606T3 DK 90909068 T DK90909068 T DK 90909068T DK 0478606 T3 DK0478606 T3 DK 0478606T3
Authority
DK
Denmark
Prior art keywords
preparation
epoxy
terminated
percent
electrical laminates
Prior art date
Application number
DK90909068.0T
Other languages
English (en)
Inventor
Raymond A Koenig
Joseph Gan
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of DK0478606T3 publication Critical patent/DK0478606T3/da

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/04Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/003Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/09Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
    • C08G18/092Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to isocyanurate groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/28Di-epoxy compounds containing acyclic nitrogen atoms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00Epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Thermal Sciences (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
  • Epoxy Compounds (AREA)
  • Paints Or Removers (AREA)
DK90909068.0T 1989-06-06 1990-05-25 Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra DK0478606T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB898912952A GB8912952D0 (en) 1989-06-06 1989-06-06 Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
SG9590553 1995-03-28

Publications (1)

Publication Number Publication Date
DK0478606T3 true DK0478606T3 (da) 1995-05-15

Family

ID=26295443

Family Applications (1)

Application Number Title Priority Date Filing Date
DK90909068.0T DK0478606T3 (da) 1989-06-06 1990-05-25 Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra

Country Status (14)

Country Link
US (1) US5112932A (da)
EP (1) EP0478606B1 (da)
JP (1) JP2859956B2 (da)
KR (1) KR0160755B1 (da)
AT (1) ATE115596T1 (da)
AU (1) AU628596B2 (da)
BR (1) BR9007428A (da)
CA (1) CA2018265A1 (da)
DE (1) DE69015188T2 (da)
DK (1) DK0478606T3 (da)
ES (1) ES2067030T3 (da)
GB (1) GB8912952D0 (da)
NZ (1) NZ233933A (da)
WO (1) WO1990015089A1 (da)

Families Citing this family (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322909B2 (ja) * 1991-08-15 2002-09-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3290449B2 (ja) 1991-08-19 2002-06-10 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3345687B2 (ja) 1991-12-06 2002-11-18 日本ペイント株式会社 オキサゾリドン環含有水性樹脂および塗料
DE4223632A1 (de) 1992-07-17 1994-01-20 Siemens Ag Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse
DE4223622A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223630A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
JP3355658B2 (ja) 1992-08-13 2002-12-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
US5290903A (en) * 1992-11-09 1994-03-01 Norton Company Composite abrasive wheels
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides
CA2115533C (en) * 1994-02-11 2002-06-18 Hiroshi Uchida Urethane modified epoxy resin compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
US5480958A (en) 1994-09-21 1996-01-02 Air Products And Chemicals, Inc. Polyepoxide resins incorporating epoxy terminated urethanes as tougheners
DE59602725D1 (de) * 1995-05-24 1999-09-16 Siemens Ag Epoxidharzformmassen mit halogenfreiem flammschutz
US5686541A (en) * 1995-11-14 1997-11-11 National Science Council Modification of epoxy resins with urethane prepolymer for electronic encapsulation
GB2315490B (en) * 1996-07-22 2001-02-07 Dow Deutschland Inc Improved curing catalysts for curing epoxy resins
JP4571714B2 (ja) * 1997-03-27 2010-10-27 三菱レイヨン株式会社 Frp用エポキシ樹脂組成物、プリプレグ及びそれを用いた管状成形体
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
GB9827367D0 (en) * 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
CN103554184A (zh) * 2004-05-28 2014-02-05 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
EP1775321A4 (en) * 2004-06-29 2011-09-14 Asahi Kasei Chemicals Corp FLAME RESISTANT EXPOXID RESIN COMPOSITION
KR100856186B1 (ko) * 2005-04-07 2008-09-03 아사히 가세이 케미칼즈 가부시키가이샤 에폭시 수지 조성물
EP1818044A1 (en) 2005-11-25 2007-08-15 DSMIP Assets B.V. Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups
WO2007075769A1 (en) * 2005-12-22 2007-07-05 Dow Global Technologies Inc. A curable epoxy resin composition and laminates made therefrom
JP2010526907A (ja) * 2007-05-09 2010-08-05 ダウ グローバル テクノロジーズ インコーポレイティド 過剰のエポキシレジンを含むエポキシ熱硬化性組成物およびその製造方法
EP2148894B1 (en) * 2007-05-16 2012-02-29 Dow Global Technologies LLC Flame retardant composition
CN101679579B (zh) 2007-06-20 2012-05-30 陶氏环球技术公司 对温度变化的敏感性非常低的耐碰撞环氧粘合剂
JP2010535321A (ja) * 2007-08-02 2010-11-18 ダウ グローバル テクノロジーズ インコーポレイティド 熱硬化減衰材材料
WO2009035860A1 (en) * 2007-09-11 2009-03-19 Dow Global Technologies Inc. Isocyanate modified epoxy resin for fusion bonded epoxy foam applications
WO2009045817A1 (en) * 2007-09-28 2009-04-09 Dow Global Technologies Inc. Epoxy resin formulations
JP2010540754A (ja) * 2007-10-05 2010-12-24 ダウ グローバル テクノロジーズ インコーポレイティド イソシアネート変性エポキシ樹脂及びそのエポキシ粉体コーティング組成物
US20100240816A1 (en) * 2007-10-26 2010-09-23 Dow Global Technologies Inc. Epoxy resin composition containing isocyanurates for use in electrical laminates
CN101842401B (zh) * 2007-10-31 2015-06-24 陶氏环球技术公司 用于熔融粘结环氧树脂应用的非烧结异氰酸酯改性环氧树脂
WO2009070488A1 (en) * 2007-11-29 2009-06-04 Dow Global Technologies Inc. Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
KR20100090296A (ko) 2007-11-29 2010-08-13 다우 글로벌 테크놀로지스 인크. 마이크로파 가열가능한 모노비닐 방향족 중합체
US8742018B2 (en) * 2008-01-08 2014-06-03 Dow Global Technologies Llc High Tg epoxy systems for composite applications
KR101593529B1 (ko) * 2009-01-06 2016-02-16 블루 큐브 아이피 엘엘씨 비브롬화 난연성 에폭시 수지 중 금속 화합물
KR20110119634A (ko) * 2009-01-06 2011-11-02 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지용 금속 안정화제 및 개선 방법
BRPI1005818A2 (pt) 2009-02-26 2016-03-08 Dow Global Technologies Llc adesivo estrutural monocomponente e método de aplicação de adesivo estrutural
US7947785B2 (en) * 2009-05-21 2011-05-24 New Jersey Institute Of Technology Polyoxazolidones derived from bisanhydrohexitols
KR100929380B1 (ko) 2009-06-18 2009-12-02 주식회사 신아티앤씨 난연성 폴리에폭시 화합물의 제조방법
CN102803335A (zh) 2009-06-22 2012-11-28 陶氏环球技术有限责任公司 环氧树脂的硬化剂组合物
EP2284004A1 (en) 2009-08-13 2011-02-16 Nan Ya Plastics Corp. Electric circuit board composition and a method of preparing circuit board
JP5715638B2 (ja) 2009-11-05 2015-05-13 ダウ グローバル テクノロジーズ エルエルシー ケトオキシムでキャップされたエラストマー強化剤を含む構造用エポキシ樹脂系接着剤
CN102666633B (zh) 2009-11-12 2016-02-17 陶氏环球技术有限责任公司 聚噁唑烷酮树脂
KR20120115329A (ko) 2009-12-22 2012-10-17 다우 글로벌 테크놀로지스 엘엘씨 옥사졸리돈 고리 함유 부가물
EP2528971A2 (en) 2010-01-29 2012-12-05 Dow Global Technologies LLC Compositions having phosphorus-containing compounds
CA2803289A1 (en) 2010-06-23 2011-12-29 Dow Global Technologies Llc Powder coatings compositions
WO2012000171A1 (en) 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
EP2588554B1 (en) 2010-06-29 2014-11-19 Dow Global Technologies LLC Storage-stable heat-activated tertiary amine catalysts for epoxy resins
JP2011063804A (ja) * 2010-10-15 2011-03-31 Hitachi Chem Co Ltd プリント配線板用プリプレグおよびそれを用いた積層板
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
CN103180400B (zh) 2010-12-26 2016-08-17 陶氏环球技术有限责任公司 含有用酚、多酚或氨基酚化合物封端的扩链弹性体增韧剂的结构环氧树脂粘合剂
US9408296B2 (en) 2010-12-28 2016-08-02 Mitsui Chemicals Tohcello, Inc. Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same
WO2012177392A1 (en) 2011-06-24 2012-12-27 Dow Global Technolgies Llc Thermosetting composition and process for preparing fiber-reinforced composites
WO2013003202A1 (en) 2011-06-30 2013-01-03 Dow Global Technologies Llc Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups
EP2739684A1 (en) 2011-08-01 2014-06-11 Dow Global Technologies LLC An oxazolidone ring containing vinyl ester resin and products therefrom
CN104136516B (zh) 2012-03-23 2016-06-01 陶氏环球技术有限责任公司 阻燃结构环氧树脂粘合剂以及粘合金属构件的方法
WO2013142750A2 (en) 2012-03-23 2013-09-26 Dow Global Technologies Llc Crash-durable adhesive with enhanced stress durability
WO2014062475A2 (en) 2012-10-17 2014-04-24 Dow Global Technologies Llc Toughened, curable epoxy compositions for high temperature applications
EP2909249B1 (en) * 2012-10-17 2019-07-31 Dow Global Technologies LLC Core shell rubber modified solid epoxy resins
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
RU2618745C2 (ru) 2012-11-07 2017-05-11 ДАУ ГЛОБАЛ ТЕКНОЛОДЖИЗ ЭлЭлСи Отверждаемая эпоксидная композиция и композит, полученный из нее
US9688807B2 (en) 2012-11-13 2017-06-27 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
BR112015010679A2 (pt) 2012-11-13 2017-07-11 Dow Global Technologies Llc sistema de resina epóxi curável, processo para formar um compósito de epóxi reforçado com fibra e compósito reforçado com fibra curada
JP6379110B2 (ja) 2012-12-21 2018-08-29 ダウ グローバル テクノロジーズ エルエルシー 電気ケーブル接続のための非イソシアネート系シーラント
WO2014100238A2 (en) 2012-12-21 2014-06-26 Dow Global Technologies Llc Phase-segmented non-isocyanate elastomers
CN104955865B (zh) 2012-12-21 2017-12-19 陶氏环球技术有限责任公司 硫醇固化弹性体环氧树脂
US9677370B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Deformable plug and seal well system
CN105452321A (zh) * 2013-08-16 2016-03-30 陶氏环球技术有限责任公司 1k热固性环氧树脂组合物
CA2922853C (en) 2013-09-16 2020-10-20 Dow Global Technologies Llc Polyurethane elastomer for use in subsea pipeline insulation
WO2015094896A1 (en) 2013-12-18 2015-06-25 Dow Global Technologies Llc Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents
WO2015164031A1 (en) 2014-04-22 2015-10-29 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
CN106257987A (zh) 2014-05-01 2016-12-28 陶氏环球技术有限责任公司 预浸材料制造和干燥方法
WO2015191354A1 (en) 2014-06-09 2015-12-17 Dow Global Technologies Llc Process for making curable, multi-layer fiber-reinforced prepreg
WO2016014284A1 (en) 2014-07-23 2016-01-28 Dow Global Technologies Llc Structural adhesives having improved wash-off resistance and method for dispensing same
DE102014226838A1 (de) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material
DE102014226842A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen
EP3237485A1 (en) 2014-12-24 2017-11-01 Dow Global Technologies LLC Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
CN104497271A (zh) * 2014-12-24 2015-04-08 济南圣泉集团股份有限公司 一种改性环氧树脂和改性环氧树脂组合物
WO2016108958A1 (en) 2014-12-31 2016-07-07 Dow Global Technologies Llc Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance
JP6978326B2 (ja) 2015-06-25 2021-12-08 ダウ グローバル テクノロジーズ エルエルシー 炭素繊維複合材を作製するための新規エポキシ樹脂系
JP6886455B2 (ja) 2015-09-10 2021-06-16 ダウ グローバル テクノロジーズ エルエルシー 改良された油性表面への接着および高いウォッシュオフ耐性を持つ、一液型の強靭化エポキシ接着剤
US20180258329A1 (en) 2015-09-10 2018-09-13 Dow Global Technologies Llc High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
CN105295041B (zh) * 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
EP3405510B2 (en) 2016-01-19 2023-06-07 Dow Global Technologies LLC One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
CN107227001B (zh) 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
CN109790279B (zh) 2016-08-19 2022-06-28 陶氏环球技术有限责任公司 含有内部脱模剂的环氧树脂组合物
WO2018033562A1 (en) * 2016-08-19 2018-02-22 Covestro Deutschland Ag Process for the synthesis of polyoxazolidinone compounds
US11624012B2 (en) 2016-10-24 2023-04-11 Ddp Speciality Electronic Materials Us, Llc Epoxy adhesive resistant to open bead humidity exposure
WO2018081032A1 (en) 2016-10-25 2018-05-03 Dow Global Technologies Llc Epoxy adhesive having improved low-temperature impact resistance
BR112019008520A2 (pt) 2016-10-28 2019-07-09 Dow Global Technologies Llc adesivo de epóxi durável em quebra que tem resistência ao impacto em baixa temperatura aprimorada
CN106519185B (zh) * 2016-11-16 2020-03-31 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在绝缘漆中的应用
JP2020508381A (ja) 2017-02-26 2020-03-19 ダウ グローバル テクノロジーズ エルエルシー 潜在性硬化剤の混合物を含有する一液型強化エポキシ接着剤
WO2018164794A1 (en) 2017-03-09 2018-09-13 Dow Global Technologies Llc Stable epoxy/internal mold release agent blends for the manufacture of composite articles
JP7028884B2 (ja) 2017-03-17 2022-03-02 ダウ グローバル テクノロジーズ エルエルシー エポキシ-アクリルハイブリッド接着剤
US10344115B2 (en) 2017-05-25 2019-07-09 International Business Machines Corporation Amine glyoxal resins
JP7098662B2 (ja) 2017-06-07 2022-07-11 ダウ グローバル テクノロジーズ エルエルシー ランダムに配向したフィラメントを有する成形化合物、ならびにその作製および使用方法
KR102627557B1 (ko) 2017-08-15 2024-01-24 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 이액형 상온 경화성 에폭시 접착제
JP7295095B2 (ja) 2017-09-12 2023-06-20 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー 一成分強化エポキシ接着剤
JP7343506B2 (ja) 2017-09-12 2023-09-12 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー 接着剤調合物
JP7365096B2 (ja) * 2017-09-29 2023-10-19 ビーエーエスエフ ソシエタス・ヨーロピア ジイソシアネートおよび2-フェニル-1,3-プロパンジオールのジグリシジルエーテル誘導体からの熱可塑性ポリオキサゾリドン
KR102667022B1 (ko) 2018-01-08 2024-05-21 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 에폭시 수지 접착제 조성물
CN112135852B (zh) 2018-05-18 2022-11-08 陶氏环球技术有限责任公司 聚异氰酸酯组分、聚氨酯发泡体系和由其制成的制品
WO2019231694A1 (en) 2018-05-29 2019-12-05 Dow Global Technologies Llc Method for bonding using one-component epoxy adhesive mixtures
CN112135869A (zh) 2018-06-05 2020-12-25 陶氏环球技术有限责任公司 将环氧-纤维复合材料回收到聚烯烃中的方法
KR20210020937A (ko) 2018-06-15 2021-02-24 다우 글로벌 테크놀로지스 엘엘씨 강화 에폭시 조성물
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
WO2020016276A1 (de) * 2018-07-18 2020-01-23 Basf Se Bulkpolymerisierung von polyoxazolidon
CN112638973B (zh) * 2018-07-30 2023-03-31 陶氏环球技术有限责任公司 可固化的树脂组合物
CN112654656B (zh) 2018-08-31 2024-02-27 陶氏环球技术有限责任公司 环氧复合配方
US11225542B1 (en) * 2018-11-09 2022-01-18 ASK Chemicals LLC Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
EP3924405A1 (en) 2019-02-15 2021-12-22 Dow Global Technologies LLC Epoxy composition
JP2022533832A (ja) 2019-05-21 2022-07-26 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー エポキシ接着剤組成物及び使用方法
EP3750933A1 (en) * 2019-06-12 2020-12-16 Covestro Deutschland AG Method for the production of epoxy-group terminated polyoxazolidinones
KR102861612B1 (ko) 2019-06-18 2025-09-17 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 내습성이 개선된 강인화된 1액형 에폭시 접착제
JP7647101B2 (ja) * 2019-11-18 2025-03-18 東レ株式会社 繊維強化複合材料の成形方法、およびそれに用いられるエポキシ樹脂組成物
US20210253772A1 (en) * 2020-02-18 2021-08-19 Covestro Llc Polyoxazolidinone compositions
EP4011927A1 (en) 2020-12-10 2022-06-15 Covestro Deutschland AG Composition comprising epoxy-functional oxazolidinone
WO2022122606A1 (en) 2020-12-10 2022-06-16 Covestro Deutschland Ag Composition comprising epoxy-functional oxazolidinone
JP2023149613A (ja) * 2022-03-31 2023-10-13 日鉄ケミカル&マテリアル株式会社 硬化性樹脂組成物、及びそれを用いたトウプリプレグ
EP4598975A1 (en) 2022-10-06 2025-08-13 DDP Specialty Electronic Materials US, LLC Two-component adhesive composition
CN119968416A (zh) 2022-10-06 2025-05-09 Ddp 特种电子材料美国有限责任公司 双组分粘合剂组合物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305494A (en) * 1963-04-12 1967-02-21 Baker Chem Co J T Oxazolidonyl sulfones and method of making same
US3334110A (en) * 1965-08-16 1967-08-01 Baker Chem Co J T Method for preparing epoxyoxazolidinones
US3494888A (en) * 1966-08-30 1970-02-10 Wilbur R Mcelroy Resin compositions from polyepoxides and isocyanate polymers
US3471442A (en) * 1967-02-02 1969-10-07 American Cyanamid Co Process for the preparation of thermoplastic polymers prepared by reacting diepoxide monomers with aromatic diisocyanates
US3694406A (en) * 1970-07-31 1972-09-26 Us Air Force Preparation of polyoxazolidones
US3767624A (en) * 1971-12-27 1973-10-23 Dow Chemical Co Oxazolidinone modified epoxy novolac resin
JPS5231000B2 (da) * 1972-11-29 1977-08-11
JPS5315757B2 (da) * 1973-08-31 1978-05-26
JPS57131219A (en) * 1981-02-06 1982-08-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition
ZA839459B (en) * 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
DE3323122A1 (de) * 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
FR2549277B1 (fr) * 1983-07-13 1985-10-25 Alsthom Atlantique Procede d'isolation par impregnation d'un bobinage electrique, et vernis sans solvant stabilise utilisable dans ce procede
GB8412900D0 (en) * 1984-05-21 1984-06-27 Secr Defence Thermosetting resin compositions
DE3720759A1 (de) * 1987-06-24 1989-01-05 Bayer Ag Oxazolidongruppen enthaltende epoxidharze

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DE69015188D1 (de) 1995-01-26
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US5112932A (en) 1992-05-12
AU5829190A (en) 1991-01-07
ATE115596T1 (de) 1994-12-15
BR9007428A (pt) 1992-07-21
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