FR3112427A1 - Formation de contacts passivés pour cellules solaires IBC - Google Patents
Formation de contacts passivés pour cellules solaires IBC Download PDFInfo
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- FR3112427A1 FR3112427A1 FR2007380A FR2007380A FR3112427A1 FR 3112427 A1 FR3112427 A1 FR 3112427A1 FR 2007380 A FR2007380 A FR 2007380A FR 2007380 A FR2007380 A FR 2007380A FR 3112427 A1 FR3112427 A1 FR 3112427A1
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- ibc
- solar cells
- formation
- bsf
- removal
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- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 34
- 230000000873 masking effect Effects 0.000 claims description 15
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 claims description 12
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 12
- 238000002161 passivation Methods 0.000 claims description 10
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 7
- 238000001465 metallisation Methods 0.000 claims description 7
- 229910019213 POCl3 Inorganic materials 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 210000001061 forehead Anatomy 0.000 claims description 3
- 239000005360 phosphosilicate glass Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910015844 BCl3 Inorganic materials 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 229910020286 SiOxNy Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/20—Optical components
- H02S40/22—Light-reflecting or light-concentrating means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/164—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells
- H10F10/165—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells the heterojunctions being Group IV-IV heterojunctions, e.g. Si/Ge, SiGe/Si or Si/SiC photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/164—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells
- H10F10/165—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells the heterojunctions being Group IV-IV heterojunctions, e.g. Si/Ge, SiGe/Si or Si/SiC photovoltaic cells
- H10F10/166—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells the heterojunctions being Group IV-IV heterojunctions, e.g. Si/Ge, SiGe/Si or Si/SiC photovoltaic cells the Group IV-IV heterojunctions being heterojunctions of crystalline and amorphous materials, e.g. silicon heterojunction [SHJ] photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/219—Arrangements for electrodes of back-contact photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Photovoltaic Devices (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
Abstract
Formation de contacts passivés pour cellules solaires IBC
La présente description concerne un procédé comprenant la formation de contacts passivés, pour cellules solaires IBC.
Figure pour l'abrégé : Fig. 2
Description
La présente description concerne le domaine de cellules solaire et, plus particulièrement, la fabrication de cellules solaires IBC (interdigitées avec contact au dos ou Interdigited Backside Contact).
On connaît de nombreux procédés de fabrication de cellules solaires.
Il existe un besoin d’amélioration des techniques de fabrication des cellules solaires et des panneaux photovoltaïques
Les modes de réalisation décrits pallient tout ou partie des inconvénients des procédés connus de fabrication de cellules solaires.
Les modes de réalisation décrit prévoient la formation de contact passivés pour structure de type IBC.
An
embodiment
provides a
method comprising the formation of passivated contact IBC.
An embodiment provides a comprising
the formation of IBC solar cells.
According to an embodiment the method
compris
e
s
a multifunctional film stack
.
According to an embodiment, t
he method compris
es
the following successive steps:
1. SDE;
2. Tunnel oxide + P+poly layer, masking layer deposition in LPCVD or PECVD process;
3 . Front side wrap around removal (this step can be skipped when applied with PECVD);
4. Trench opening by laser;
5. Texturing;
6. FSF and BSF formation using POCl3;
7. Laser doping on BSF area;
8. PSG & masking layer removal;
9. Annealing;
10. Passivation front;
11. Passivation rear ; and
12. Metallization .
1. SDE;
2. Tunnel oxide + P+poly layer, masking layer deposition in LPCVD or PECVD process;
3 . Front side wrap around removal (this step can be skipped when applied with PECVD);
4. Trench opening by laser;
5. Texturing;
6. FSF and BSF formation using POCl3;
7. Laser doping on BSF area;
8. PSG & masking layer removal;
9. Annealing;
10. Passivation front;
11. Passivation rear ; and
12. Metallization .
According to an embodiment, the method comprises the following successive steps:
1. SDE / Saw Damage Etching or removal;
2. Tunnel oxide + P+poly layer + PSG layer masking layer deposition in LPCVD or PECVD process;
3. Front side wrap around removal (this step can be skipped when applied with PECVD);
4. Trench opening + Laser doping on BSF (Front Surface Field) by laser;
5. Texturing;
6. FSF (Front Surface Field) and formation using POCl3 (including Annealing);
7. PSG ( Phosphosilicate Glass) & masking layer removal;
8. Passivation f ront;
9. Passivation rear;
10. Metallization.
1. SDE / Saw Damage Etching or removal;
2. Tunnel oxide + P+poly layer + PSG layer masking layer deposition in LPCVD or PECVD process;
3. Front side wrap around removal (this step can be skipped when applied with PECVD);
4. Trench opening + Laser doping on BSF (Front Surface Field) by laser;
5. Texturing;
6. FSF (Front Surface Field) and formation using POCl3 (including Annealing);
7. PSG ( Phosphosilicate Glass) & masking layer removal;
8. Passivation f ront;
9. Passivation rear;
10. Metallization.
An embodiment provides a
n IBC Structure obtained by the
disclosed
method.
An
embodiment provides an
IBC solar cell obtained by the
disclosed
method.
An embodiment provides a
solar panel comprising IBC solar cells.
Ces caractéristiques et avantages, ainsi que d'autres, seront exposés en détail dans la description suivante de modes de réalisation particuliers faite à titre non limitatif en relation avec les figures jointes parmi lesquelles :
De mêmes éléments ont été désignés par de mêmes références dans les différentes figures. En particulier, les éléments structurels et/ou fonctionnels communs aux différents modes de réalisation peuvent présenter les mêmes références et peuvent disposer de propriétés structurelles, dimensionnelles et matérielles identiques.
Par souci de clarté, seuls les étapes et éléments utiles à la compréhension des modes de réalisation décrits ont été représentés et sont détaillés. En particulier, les techniques de mise en œuvre des étapes décrites qui sont en elles-mêmes usuelles n’ont pas été détaillées et on pourra se référer, par exemple, aux techniques et matériaux décrits dans les documents US-B-10,388,804 et US-B-7,633,006 dont les contenus sont incorporés par références dans la présente description.
Sauf précision contraire, lorsque l'on fait référence à deux éléments connectés entre eux, cela signifie directement connectés sans éléments intermédiaires autres que des conducteurs, et lorsque l'on fait référence à deux éléments reliés (en anglais "coupled") entre eux, cela signifie que ces deux éléments peuvent être connectés ou être reliés par l'intermédiaire d'un ou plusieurs autres éléments.
Dans la description qui suit, lorsque l'on fait référence à des qualificatifs de position absolue, tels que les termes "avant", "arrière", "haut", "bas", "gauche", "droite", etc., ou relative, tels que les termes "dessus", "dessous", "supérieur", "inférieur", etc., ou à des qualificatifs d'orientation, tels que les termes "horizontal", "vertical", etc., il est fait référence sauf précision contraire à l'orientation des figures.
Sauf précision contraire, les expressions "environ", "approximativement", "sensiblement", et "de l'ordre de" signifient à 10 % près, de préférence à 5 % près.
Les figures représentent des vues en coupe transversale de plaquette en matériau semiconducteur sur et dans lesquelles sont formées les cellules solaires. Ces vues sont partielles et ne représentent qu’une faible portion de la plaquette.
La figure 1 illustre, par des vues en coupe, des étapes d’un exemple de procédé de fabrication de cellules solaires usuel.
Dans cette réalisation classique, 15 étapes sont nécessaires à partir d’une tranche ou plaquette en matériau semiconducteur jusqu’à la réalisation des métallisations de formation des contacts en face arrière.
The
15
successive steps are
:
1. SDE (Saw Damage Etching)
2. Tunnel oxide + Intrinsic poly layer
3. Emitter source layer
4. Laser doping
5. Removing emitter source layer
6. masking layer deposition
7. Front side wrap around removal
8. Texturing
9. masking layer opening for BSF (Back Surface Field)
10. FSF (Front Surface Field) and BSF formation with POCl3
11. PSG (Phosphosilicate Glass) & masking layer removal
12. Annealing
13. Front side passivation
14. Rear side passivation
15. Metallization .
1. SDE (Saw Damage Etching)
2. Tunnel oxide + Intrinsic poly layer
3. Emitter source layer
4. Laser doping
5. Removing emitter source layer
6. masking layer deposition
7. Front side wrap around removal
8. Texturing
9. masking layer opening for BSF (Back Surface Field)
10. FSF (Front Surface Field) and BSF formation with POCl3
11. PSG (Phosphosilicate Glass) & masking layer removal
12. Annealing
13. Front side passivation
14. Rear side passivation
15. Metallization .
La figure 2 illustre, par des vues en coupe, des étapes d’un mode de réalisation d’un procédé de fabrication de cellules solaires.
Selon ce mode de réalisation, le procédé ne comporte plus que 12 étapes
The disclosed method constitutes an innovative multifunctional film stack for passivated contact IBC (Interdigited Back side Contact) and comprises the following steps:
1. SDE / Saw D amage Etching or removal
2. Tunnel oxide + P+poly layer, masking layer deposition in LPCVD or PECVD process
3. Front side wrap around removal (this step can be skipped when applied with PECVD)
4. Trench opening by laser
5. Texturing
6. FSF(Front Surface Field)and BSF(Back Surface Field)formation using POCl3
7. Laser doping on BSF area
8. PSG (Phosphosilicate Glass)& masking layer removal
9. Annealing
10. Passivation f ront
11. Passivation rear
12. Metallization
1. SDE / Saw D amage Etching or removal
2. Tunnel oxide + P+poly layer, masking layer deposition in LPCVD or PECVD process
3. Front side wrap around removal (this step can be skipped when applied with PECVD)
4. Trench opening by laser
5. Texturing
6. FSF(Front Surface Field)and BSF(Back Surface Field)formation using POCl3
7. Laser doping on BSF area
8. PSG (Phosphosilicate Glass)& masking layer removal
9. Annealing
10. Passivation f ront
11. Passivation rear
12. Metallization
Wafer can be B, Ga doped for p-type, P doped for n-type.
Tunnel oxide is formed as first layer
.
p-poly layer is formed with B2H6 or BCl3 + SiH4 reaction.
Masking layer can be
SiOx
,
SiOxNy
,
SiNx
,
SiC
layer.
At least three layers are formed in stack.
These layers are formed by LPCVD or PECVD.
In-situ doped emitter layer is formed, and compensation with laser doped BSF.
Key advantages are:
#2 to #6 steps of the example of Figure 1 are integrated into #2 innovation step.
#2 to #6 steps of the example of Figure 1 are integrated into #2 innovation step.
#7 innovation step is added.
3 less process steps for IBC.
La figure 3 illustre, par des vues en coupe, des étapes d’un autre mode de réalisation d’un procédé de fabrication de cellules solaires.
Selon ce mode de réalisation, le procédé ne comporte plus que 10 étapes.
The disclosed method constitutes an innovative process flow using multifunctional film stack for Passivated contact IBC ( Interdigited Back side Contact) and comprises the following steps:
1. SDE / Saw Damage Etching or removal
2. Tunnel oxide + P+poly layer + PSG layer masking layer deposition in LPCVD or PECVD process
3. Front side wrap around removal (this step can be skipped when applied with PECVD)
4. Trench opening + Laser doping on BSF(Front Surface Field)by laser
5. Texturing
6. FSF(Front Surface Field)and formation using POCl3 (including Annealing)
7. PSG(Phosphosilicate Glass)& masking layer removal
8. Passivation Front
9. Passivation rear
10. Metallization
1. SDE / Saw Damage Etching or removal
2. Tunnel oxide + P+poly layer + PSG layer masking layer deposition in LPCVD or PECVD process
3. Front side wrap around removal (this step can be skipped when applied with PECVD)
4. Trench opening + Laser doping on BSF(Front Surface Field)by laser
5. Texturing
6. FSF(Front Surface Field)and formation using POCl3 (including Annealing)
7. PSG(Phosphosilicate Glass)& masking layer removal
8. Passivation Front
9. Passivation rear
10. Metallization
Wafer can be B, Ga doped for p-type, P doped for n-type.
Tunnel oxide is formed as first layer
.
p-poly layer is formed with B2H6 or BCl3 + SiH4 reaction.
PSG layer is formed with PH3+TEOS reaction.
Masking layer can be
SiOx
,
SiOxNy
,
SiNx
,
SiC
layer, or a combination.
At least three layers are formed in stack.
These layers are formed by LPCVD or PECVD.
In-situ doped emitter layer is formed, and compensation with laser doped BSF
.
Key advantages are:
#2 to #6 steps of the example of Figure 1 are integrated into #2 innovation step.
#9 to #10 of the example of Figure 1 are partially integrated to #4 innovation step.
#12 of the example of Figure 1 is integrated to #6 innovation step.
5 less process steps for IBC.
#2 to #6 steps of the example of Figure 1 are integrated into #2 innovation step.
#9 to #10 of the example of Figure 1 are partially integrated to #4 innovation step.
#12 of the example of Figure 1 is integrated to #6 innovation step.
5 less process steps for IBC.
Divers modes de réalisation et variantes ont été décrits. La personne du métier comprendra que certaines caractéristiques de ces divers modes de réalisation et variantes pourraient être combinées, et d’autres variantes apparaîtront à la personne du métier.
Enfin, la mise en oeuvre pratique des modes de réalisation et variantes décrits est à la portée de la personne du métier à partir des indications fonctionnelles données ci-dessus.
Claims (7)
- A method comprising the formation of passivated contact IBC.
- A method comprising the formation of IBC solar cells.
- The method according to claim 1 or 2, comprising a multifunctional film stack.
- The method according to anyone of claims 1 to 3, comprising the following successive steps:
1. SDE;
2. Tunnel oxide + P+poly layer, masking layer deposition in LPCVD or PECVD process;
3. Front side wrap around removal (this step can be skipped when applied with PECVD);
4. Trench opening by laser;
5. Texturing;
6. FSF and BSF formation using POCl3;
7. Laser doping on BSF area;
8. PSG & masking layer removal;
9. Annealing;
10. Passivation front;
11. Passivation rear; and
12. Metallization. - An IBC Structure obtained by the method according to anyone of claims 1 to 4.
- An IBC solar cell obtained by the method according to anyone of claims 1 to 4.
- A solar panel comprising IBC solar cells according to claim 6.
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2007380A FR3112427A1 (fr) | 2020-07-13 | 2020-07-13 | Formation de contacts passivés pour cellules solaires IBC |
| FR2011025A FR3112429B1 (fr) | 2020-07-13 | 2020-10-28 | Fabrication de cellules solaires |
| PCT/EP2021/069368 WO2022013165A1 (fr) | 2020-07-13 | 2021-07-12 | Fabrication de cellules solaires |
| EP21743469.5A EP4179579A1 (fr) | 2020-07-13 | 2021-07-12 | Fabrication de cellules solaires |
| US18/003,044 US20230253521A1 (en) | 2020-07-13 | 2021-07-12 | Solar cell manufacture |
| JP2023503071A JP2023534500A (ja) | 2020-07-13 | 2021-07-12 | 太陽電池の製造 |
| KR1020237004709A KR20230048041A (ko) | 2020-07-13 | 2021-07-12 | 태양 전지 제조 |
| CA3188777A CA3188777A1 (fr) | 2020-07-13 | 2021-07-12 | Fabrication de cellules solaires |
| PH1/2023/550042A PH12023550042A1 (en) | 2020-07-13 | 2021-07-12 | Solar cell manufacture |
| CN202180049703.1A CN115836398A (zh) | 2020-07-13 | 2021-07-12 | 太阳能电池的制造 |
| TW110125591A TW202218176A (zh) | 2020-07-13 | 2021-07-13 | 太陽能電池製造 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2007380A FR3112427A1 (fr) | 2020-07-13 | 2020-07-13 | Formation de contacts passivés pour cellules solaires IBC |
| FR2007380 | 2020-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR3112427A1 true FR3112427A1 (fr) | 2022-01-14 |
Family
ID=74045811
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR2007380A Pending FR3112427A1 (fr) | 2020-07-13 | 2020-07-13 | Formation de contacts passivés pour cellules solaires IBC |
| FR2011025A Active FR3112429B1 (fr) | 2020-07-13 | 2020-10-28 | Fabrication de cellules solaires |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR2011025A Active FR3112429B1 (fr) | 2020-07-13 | 2020-10-28 | Fabrication de cellules solaires |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20230253521A1 (fr) |
| EP (1) | EP4179579A1 (fr) |
| JP (1) | JP2023534500A (fr) |
| KR (1) | KR20230048041A (fr) |
| CN (1) | CN115836398A (fr) |
| CA (1) | CA3188777A1 (fr) |
| FR (2) | FR3112427A1 (fr) |
| PH (1) | PH12023550042A1 (fr) |
| TW (1) | TW202218176A (fr) |
| WO (1) | WO2022013165A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025200243A1 (fr) * | 2024-03-27 | 2025-10-02 | 天合光能股份有限公司 | Procédé de fabrication d'une cellule solaire à contact arrière, ainsi que cellule solaire et module de cellules |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024228665A1 (fr) * | 2023-04-30 | 2024-11-07 | Maxeon Solar Pte. Ltd. | Cellule solaire à architecture cellulaire conçue pour une recombinaison de porteuse réduite |
| CN116387371B (zh) | 2023-06-02 | 2023-09-29 | 天合光能股份有限公司 | 太阳能电池及其制作方法、光伏组件及光伏系统 |
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| DE1770122A1 (de) | 1968-04-03 | 1971-09-30 | Bayer Ag | Verfahren zur Herstellung neuartiger 1,2-Benzisothiazol-Derivate |
| US7468485B1 (en) | 2005-08-11 | 2008-12-23 | Sunpower Corporation | Back side contact solar cell with doped polysilicon regions |
| US7737357B2 (en) * | 2006-05-04 | 2010-06-15 | Sunpower Corporation | Solar cell having doped semiconductor heterojunction contacts |
| US8222516B2 (en) * | 2008-02-20 | 2012-07-17 | Sunpower Corporation | Front contact solar cell with formed emitter |
| US8790957B2 (en) * | 2010-03-04 | 2014-07-29 | Sunpower Corporation | Method of fabricating a back-contact solar cell and device thereof |
| US8134217B2 (en) * | 2010-12-14 | 2012-03-13 | Sunpower Corporation | Bypass diode for a solar cell |
| US8802486B2 (en) * | 2011-04-25 | 2014-08-12 | Sunpower Corporation | Method of forming emitters for a back-contact solar cell |
| CN102856328B (zh) * | 2012-10-10 | 2015-06-10 | 友达光电股份有限公司 | 太阳能电池及其制作方法 |
| SG10201704400YA (en) * | 2012-12-28 | 2017-07-28 | Merck Patent Gmbh | Doping media for the local doping of silicon wafers |
| KR20140135881A (ko) * | 2013-05-16 | 2014-11-27 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| KR101627204B1 (ko) * | 2013-11-28 | 2016-06-03 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| KR101613846B1 (ko) * | 2014-06-10 | 2016-04-20 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| WO2016149174A1 (fr) * | 2015-03-13 | 2016-09-22 | Natcore Technology, Inc. | Cellules solaires d'hétérojonction à contact arrière traitées au laser |
| KR102373649B1 (ko) | 2015-05-28 | 2022-03-11 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| WO2017035446A1 (fr) * | 2015-08-26 | 2017-03-02 | Natcore Technology, Inc. | Systèmes et procédés de formation de cellule solaire émettrice à contacts arrière en feuilles |
| US10505064B2 (en) * | 2015-09-14 | 2019-12-10 | Sharp Kabushiki Kaisha | Photovoltaic device |
| US10396235B2 (en) * | 2015-10-16 | 2019-08-27 | Sunpower Corporation | Indentation approaches for foil-based metallization of solar cells |
| US10217878B2 (en) * | 2016-04-01 | 2019-02-26 | Sunpower Corporation | Tri-layer semiconductor stacks for patterning features on solar cells |
| JP2020167243A (ja) * | 2019-03-29 | 2020-10-08 | パナソニック株式会社 | 太陽電池セル集合体、及び、太陽電池セルの製造方法 |
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2020
- 2020-07-13 FR FR2007380A patent/FR3112427A1/fr active Pending
- 2020-10-28 FR FR2011025A patent/FR3112429B1/fr active Active
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- 2021-07-12 US US18/003,044 patent/US20230253521A1/en not_active Abandoned
- 2021-07-12 KR KR1020237004709A patent/KR20230048041A/ko not_active Withdrawn
- 2021-07-12 CA CA3188777A patent/CA3188777A1/fr active Pending
- 2021-07-12 CN CN202180049703.1A patent/CN115836398A/zh active Pending
- 2021-07-12 JP JP2023503071A patent/JP2023534500A/ja active Pending
- 2021-07-12 EP EP21743469.5A patent/EP4179579A1/fr active Pending
- 2021-07-12 WO PCT/EP2021/069368 patent/WO2022013165A1/fr not_active Ceased
- 2021-07-13 TW TW110125591A patent/TW202218176A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025200243A1 (fr) * | 2024-03-27 | 2025-10-02 | 天合光能股份有限公司 | Procédé de fabrication d'une cellule solaire à contact arrière, ainsi que cellule solaire et module de cellules |
Also Published As
| Publication number | Publication date |
|---|---|
| CA3188777A1 (fr) | 2022-01-20 |
| KR20230048041A (ko) | 2023-04-10 |
| FR3112429A1 (fr) | 2022-01-14 |
| TW202218176A (zh) | 2022-05-01 |
| WO2022013165A1 (fr) | 2022-01-20 |
| EP4179579A1 (fr) | 2023-05-17 |
| JP2023534500A (ja) | 2023-08-09 |
| PH12023550042A1 (en) | 2024-03-18 |
| CN115836398A (zh) | 2023-03-21 |
| US20230253521A1 (en) | 2023-08-10 |
| FR3112429B1 (fr) | 2025-04-11 |
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