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EP3549155A4 - Traitement et fabrication de matériaux de faibles dimensions supportant à la fois l'auto-thermalisation et l'auto-localisation - Google Patents

Traitement et fabrication de matériaux de faibles dimensions supportant à la fois l'auto-thermalisation et l'auto-localisation Download PDF

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Publication number
EP3549155A4
EP3549155A4 EP17899703.7A EP17899703A EP3549155A4 EP 3549155 A4 EP3549155 A4 EP 3549155A4 EP 17899703 A EP17899703 A EP 17899703A EP 3549155 A4 EP3549155 A4 EP 3549155A4
Authority
EP
European Patent Office
Prior art keywords
self
thermalization
localization
manufacturing
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17899703.7A
Other languages
German (de)
English (en)
Other versions
EP3549155A2 (fr
Inventor
Patrick Curran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seminuclear Inc
Original Assignee
Seminuclear Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seminuclear Inc filed Critical Seminuclear Inc
Publication of EP3549155A2 publication Critical patent/EP3549155A2/fr
Publication of EP3549155A4 publication Critical patent/EP3549155A4/fr
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N99/00Subject matter not provided for in other groups of this subclass
    • H10N99/05Devices based on quantum mechanical effects, e.g. quantum interference devices or metal single-electron transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82Heterojunctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/855Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/8556Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Particle Accelerators (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Photovoltaic Devices (AREA)
  • Recrystallisation Techniques (AREA)
EP17899703.7A 2017-03-15 2017-11-30 Traitement et fabrication de matériaux de faibles dimensions supportant à la fois l'auto-thermalisation et l'auto-localisation Pending EP3549155A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762471815P 2017-03-15 2017-03-15
US201762591848P 2017-11-29 2017-11-29
PCT/US2017/064020 WO2018164746A2 (fr) 2016-11-29 2017-11-30 Traitement et fabrication de matériaux de faibles dimensions supportant à la fois l'auto-thermalisation et l'auto-localisation

Publications (2)

Publication Number Publication Date
EP3549155A2 EP3549155A2 (fr) 2019-10-09
EP3549155A4 true EP3549155A4 (fr) 2020-09-30

Family

ID=68407930

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17899703.7A Pending EP3549155A4 (fr) 2017-03-15 2017-11-30 Traitement et fabrication de matériaux de faibles dimensions supportant à la fois l'auto-thermalisation et l'auto-localisation

Country Status (7)

Country Link
EP (1) EP3549155A4 (fr)
JP (1) JP7250340B2 (fr)
KR (1) KR102373619B1 (fr)
CN (1) CN110431652B (fr)
CA (1) CA3045318A1 (fr)
IL (1) IL266966B2 (fr)
WO (1) WO2018164746A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI754180B (zh) * 2018-10-29 2022-02-01 美商應用材料股份有限公司 用於形成薄膜的處理腔室與方法
CN111470577A (zh) * 2020-04-15 2020-07-31 苏州正奥水生态技术研究有限公司 一种污水处理光量子载体及其制备方法和使用方法
CN115903279B (zh) * 2022-10-12 2023-10-03 北京大学 一种基于同位素工程进行光谱发射率调控的方法及其应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6479919B1 (en) * 2001-04-09 2002-11-12 Terrence L. Aselage Beta cell device using icosahedral boride compounds
US20150206940A1 (en) * 2012-08-02 2015-07-23 University-Industry Cooperation Group Of Kyung Hee University Semiconductor device and method for producing same
US20160351286A1 (en) * 2015-05-28 2016-12-01 SemiNuclear, Inc. Composition and method for making picocrystalline artificial carbon atoms

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US3432539A (en) * 1965-06-30 1969-03-11 Du Pont Icosahedral dodecahydrododecaborane derivatives and their preparation
US4818625A (en) * 1985-06-24 1989-04-04 Lockheed Missiles & Space Company, Inc. Boron-silicon-hydrogen alloy films
US5872368A (en) * 1995-11-30 1999-02-16 The United States Of America As Represented By The Secretary Of The Navy Method of controlling a super conductor
US6025611A (en) * 1996-09-20 2000-02-15 The Board Of Regents Of The University Of Nebraska Boron-carbide and boron rich rhobohedral based transistors and tunnel diodes
JP2004123720A (ja) * 2002-09-11 2004-04-22 Sony Corp 分子素子、分子組織体、整流素子、整流方法、センサ素子、スイッチ素子、回路素子、論理回路素子、演算素子および情報処理素子
KR100683401B1 (ko) * 2005-08-11 2007-02-15 동부일렉트로닉스 주식회사 에피층을 이용한 반도체 장치 및 그 제조방법
US7795735B2 (en) * 2007-03-21 2010-09-14 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom
US7915643B2 (en) * 2007-09-17 2011-03-29 Transphorm Inc. Enhancement mode gallium nitride power devices
US8779462B2 (en) * 2008-05-19 2014-07-15 Infineon Technologies Ag High-ohmic semiconductor substrate and a method of manufacturing the same
KR101245037B1 (ko) * 2009-06-10 2013-03-18 씬실리콘 코포레이션 반도체 다층 스택을 구비한 광전지 모듈 및 광전지 모듈의 제작 방법
US8344337B2 (en) * 2010-04-21 2013-01-01 Axcelis Technologies, Inc. Silaborane implantation processes
JP6544807B2 (ja) * 2014-06-03 2019-07-17 株式会社日本製鋼所 ゲッタリング層を持つ半導体の製造方法、半導体装置の製造方法および半導体装置
US9972489B2 (en) * 2015-05-28 2018-05-15 SemiNuclear, Inc. Composition and method for making picocrystalline artificial borane atoms

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6479919B1 (en) * 2001-04-09 2002-11-12 Terrence L. Aselage Beta cell device using icosahedral boride compounds
US20150206940A1 (en) * 2012-08-02 2015-07-23 University-Industry Cooperation Group Of Kyung Hee University Semiconductor device and method for producing same
US20160351286A1 (en) * 2015-05-28 2016-12-01 SemiNuclear, Inc. Composition and method for making picocrystalline artificial carbon atoms

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
COREY MELNICK ET AL: "Phonovoltaic. I. Harvesting hot optical phonons in a nanoscale p - n junction", PHYSICAL REVIEW B, vol. 93, no. 9, 4 March 2016 (2016-03-04), XP055690570, ISSN: 2469-9950, DOI: 10.1103/PhysRevB.93.094302 *
JING LIU ET AL: "The local structure of transition metal doped semiconducting boron carbides", JOURNAL OF PHYSICS D: APPLIED PHYSICS, INSTITUTE OF PHYSICS PUBLISHING LTD, GB, vol. 43, no. 8, 3 March 2010 (2010-03-03), pages 85403, XP020171369, ISSN: 0022-3727 *
KUMAR VOBULAPURAM RAMESH ET AL: "Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges", IEEE NANOTECHNOLOGY MAGAZINE, IEEE, USA, vol. 8, no. 4, 1 December 2014 (2014-12-01), pages 14 - 20, XP011564671, ISSN: 1932-4510, [retrieved on 20141118], DOI: 10.1109/MNANO.2014.2355275 *
NAN LIU ET AL: "Large-Area, Transparent, and Flexible Infrared Photodetector Fabricated Using P-N Junctions Formed by N-Doping Chemical Vapor Deposition Grown Graphene", NANO LETTERS, vol. 14, no. 7, 9 July 2014 (2014-07-09), US, pages 3702 - 3708, XP055723189, ISSN: 1530-6984, DOI: 10.1021/nl500443j *
S. YU. RYBAKOV ET AL: "Oxygen Effect on the Stability of PECVD Boron-Carbon Films", JOURNAL DE PHYSIQUE IV, vol. 05, no. C5, 1 June 1995 (1995-06-01), FR, pages C5 - 921, XP055689624, ISSN: 1155-4339, DOI: 10.1051/jphyscol:19955109 *
SHIOYA HIROKI ET AL: "Gate tunable non-linear currents in bilayer graphene diodes", APPLIED PHYSICS LETTERS, A I P PUBLISHING LLC, US, vol. 100, no. 3, 16 January 2012 (2012-01-16), pages 33113 - 33113, XP012156888, ISSN: 0003-6951, [retrieved on 20120118], DOI: 10.1063/1.3676441 *
YI ZHANG: "Epitaxial growth of icosahedral boron arsenide on silicon carbide substrates: Improved process conditions and electrical properties", DISSERTATION, 1 January 2011 (2011-01-01), XP055554015, ISBN: 978-1-267-14614-4, Retrieved from the Internet <URL:http://krex.k-state.edu/dspace/bitstream/handle/2097/13122/YiZhang2011.pdf?sequence=3&isAllowed=y> [retrieved on 20190208] *

Also Published As

Publication number Publication date
JP7250340B2 (ja) 2023-04-03
KR20190126765A (ko) 2019-11-12
IL266966B2 (en) 2024-03-01
CN110431652A (zh) 2019-11-08
IL266966B1 (en) 2023-11-01
KR102373619B1 (ko) 2022-03-15
IL266966A (en) 2019-07-31
CN110431652B (zh) 2023-12-29
CA3045318A1 (fr) 2018-09-13
WO2018164746A3 (fr) 2018-12-06
JP2020515057A (ja) 2020-05-21
WO2018164746A2 (fr) 2018-09-13
EP3549155A2 (fr) 2019-10-09

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