DK1404483T3 - Forbedringer af eller i forbindelse med loddemetaller - Google Patents

Forbedringer af eller i forbindelse med loddemetaller

Info

Publication number: DK1404483T3
Authority: DK; Denmark
Prior art keywords: solder; connection; tin; lead; oxidant
Prior art date: 2001-07-09

Application number

DK02716141T

Other languages

Danish (da)

English (en)

Inventor

Kai Hwa Chew

Wei Chih Pan

Original Assignee

Quantum Chem Tech Singapore

Singapore Asahi Chemical & Solder Ind Pte Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-07-09

Filing date

2002-01-22

Publication date

2004-11-22

2002-01-22 Application filed by Quantum Chem Tech Singapore, Singapore Asahi Chemical & Solder Ind Pte Ltd filed Critical Quantum Chem Tech Singapore

2004-11-22 Application granted granted Critical

2004-11-22 Publication of DK1404483T3 publication Critical patent/DK1404483T3/da

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Silicates, Zeolites, And Molecular Sieves (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Glass Compositions (AREA)
Thermally Insulated Containers For Foods (AREA)
Nonmetallic Welding Materials (AREA)
Lining Or Joining Of Plastics Or The Like (AREA)
Details Of Resistors (AREA)

DK02716141T 2001-07-09 2002-01-22 Forbedringer af eller i forbindelse med loddemetaller DK1404483T3 (da)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
SG200104071-6A SG139507A1 (en)	2001-07-09	2001-07-09	Improvements in or relating to solders
PCT/GB2002/000259 WO2003006200A1 (fr)	2001-07-09	2002-01-22	Ameliorations apportees ou reliees a des brasures

Publications (1)

Publication Number	Publication Date
DK1404483T3 true DK1404483T3 (da)	2004-11-22

Family

ID=20430801

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK02716141T DK1404483T3 (da)	2001-07-09	2002-01-22	Forbedringer af eller i forbindelse med loddemetaller

Country Status (22)

Country	Link
US (1)	US6843862B2 (fr)
EP (1)	EP1404483B1 (fr)
JP (1)	JP3795797B2 (fr)
CN (1)	CN1235717C (fr)
AT (1)	ATE278502T1 (fr)
AU (1)	AU2002226534B2 (fr)
BR (1)	BR0210970A (fr)
CZ (1)	CZ303793B6 (fr)
DE (1)	DE60201542T2 (fr)
DK (1)	DK1404483T3 (fr)
ES (1)	ES2230477T3 (fr)
HU (1)	HU229014B1 (fr)
MX (1)	MXPA04000229A (fr)
MY (1)	MY123567A (fr)
NO (1)	NO337878B1 (fr)
NZ (1)	NZ530220A (fr)
PL (1)	PL201507B1 (fr)
PT (1)	PT1404483E (fr)
RU (1)	RU2268126C2 (fr)
SG (1)	SG139507A1 (fr)
TW (1)	TW592869B (fr)
WO (1)	WO2003006200A1 (fr)

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US20080126535A1 (en) *	2006-11-28	2008-05-29	Yinjun Zhu	User plane location services over session initiation protocol (SIP)
EP1560272B1 (fr) *	2004-01-29	2016-04-27	Panasonic Intellectual Property Management Co., Ltd.	Module de cellules solaires
US8961709B1 (en)	2004-03-09	2015-02-24	Senju Metal Industry Co., Ltd.	Solder paste
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US6985105B1 (en) *	2004-10-15	2006-01-10	Telecommunication Systems, Inc.	Culled satellite ephemeris information based on limiting a span of an inverted cone for locating satellite in-range determinations
GB2406101C (en) *	2004-10-27	2007-09-11	Quantum Chem Tech Singapore	Improvements in ro relating to solders
US20060120911A1 (en) *	2004-12-08	2006-06-08	Manoj Gupta	Method of forming composite solder by cold compaction and composite solder
US20070231594A1 (en) *	2005-08-12	2007-10-04	John Pereira	Multilayer solder article
US20070036670A1 (en) *	2005-08-12	2007-02-15	John Pereira	Solder composition
US20080175748A1 (en) *	2005-08-12	2008-07-24	John Pereira	Solder Composition
US20070037004A1 (en) *	2005-08-12	2007-02-15	Antaya Technologies Corporation	Multilayer solder article
US20070292708A1 (en) *	2005-08-12	2007-12-20	John Pereira	Solder composition
US7749336B2 (en) *	2005-08-30	2010-07-06	Indium Corporation Of America	Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) *	2005-09-26	2007-03-29	Indium Corporation Of America	Low melting temperature compliant solders
US7825780B2 (en) *	2005-10-05	2010-11-02	Telecommunication Systems, Inc.	Cellular augmented vehicle alarm notification together with location services for position of an alarming vehicle
US7907551B2 (en) *	2005-10-06	2011-03-15	Telecommunication Systems, Inc.	Voice over internet protocol (VoIP) location based 911 conferencing
US20070172381A1 (en) *	2006-01-23	2007-07-26	Deram Brian T	Lead-free solder with low copper dissolution
US8150363B2 (en)	2006-02-16	2012-04-03	Telecommunication Systems, Inc.	Enhanced E911 network access for call centers
US8059789B2 (en)	2006-02-24	2011-11-15	Telecommunication Systems, Inc.	Automatic location identification (ALI) emergency services pseudo key (ESPK)
US7471236B1 (en)	2006-03-01	2008-12-30	Telecommunication Systems, Inc.	Cellular augmented radar/laser detector
US8208605B2 (en) *	2006-05-04	2012-06-26	Telecommunication Systems, Inc.	Extended efficient usage of emergency services keys
US20080259908A1 (en) *	2006-09-26	2008-10-23	John Gordon Hines	Location object proxy
WO2008057477A2 (fr) *	2006-11-03	2008-05-15	Telecommunication Systems, Inc.	Passerelle itinérante activant des services liés à des positions (lbs) et itinérant pour des plans d'utilisateurs dans des réseaux amcr sans devoir requérir l'utilisation de centres mobiles de positionnement
US20080157910A1 (en) *	2006-12-29	2008-07-03	Park Chang-Min	Amorphous soft magnetic layer for on-die inductively coupled wires
US20080167018A1 (en) *	2007-01-10	2008-07-10	Arlene Havlark	Wireless telecommunications location based services scheme selection
EP2177305B1 (fr)	2007-07-18	2013-07-03	Senju Metal Industry Co., Ltd	Brasure sans plomb en contenant pour circuit électronique embarqué
GB2455486A (en) *	2008-03-05	2009-06-17	Quantum Chem Tech Singapore	A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
CN101474728B (zh) *	2009-01-07	2011-06-01	高新锡业（惠州）有限公司	无铅软钎焊料
US9841282B2 (en)	2009-07-27	2017-12-12	Visa U.S.A. Inc.	Successive offer communications with an offer recipient
CN109702372A (zh) *	2019-03-06	2019-05-03	上海莜玮汽车零部件有限公司	无铅焊料合金及其应用
CN113798725B (zh) *	2021-10-13	2022-10-04	浙江强力控股有限公司	选择性波峰焊用免焊剂无铅焊料及其制备方法

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WO1997009455A1 (fr) *	1995-09-01	1997-03-13	Sarnoff Corporation	Composition de brasage
JP3874031B2 (ja)	1995-11-29	2007-01-31	内橋エステック株式会社	無鉛はんだ合金
JP3643008B2 (ja) *	1996-02-09	2005-04-27	松下電器産業株式会社	はんだ付け方法
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JPH09326554A (ja) *	1996-06-06	1997-12-16	Matsushita Electric Ind Co Ltd	電子部品接合用電極のはんだ合金及びはんだ付け方法
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JPH11221694A (ja) *	1998-02-06	1999-08-17	Hitachi Ltd	鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
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JP2000141078A (ja) *	1998-09-08	2000-05-23	Nippon Sheet Glass Co Ltd	無鉛ハンダ
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WO2002040213A1 (fr) *	2000-11-16	2002-05-23	Singapore Asahi Chemical And Solder Industries Pte. Ltd.	Brasures sans plomb

2001
- 2001-07-09 SG SG200104071-6A patent/SG139507A1/en unknown
- 2001-08-09 MY MYPI20013738 patent/MY123567A/en unknown
- 2001-08-17 US US09/932,793 patent/US6843862B2/en not_active Expired - Lifetime
- 2001-09-05 CN CNB011326336A patent/CN1235717C/zh not_active Expired - Lifetime
- 2001-10-09 TW TW090124883A patent/TW592869B/zh not_active IP Right Cessation
- 2001-11-30 JP JP2001367169A patent/JP3795797B2/ja not_active Expired - Lifetime
2002
- 2002-01-22 ES ES02716141T patent/ES2230477T3/es not_active Expired - Lifetime
- 2002-01-22 AT AT02716141T patent/ATE278502T1/de active
- 2002-01-22 CZ CZ20040209A patent/CZ303793B6/cs not_active IP Right Cessation
- 2002-01-22 HU HU0401432A patent/HU229014B1/hu unknown
- 2002-01-22 RU RU2004103629/02A patent/RU2268126C2/ru active
- 2002-01-22 DE DE60201542T patent/DE60201542T2/de not_active Expired - Lifetime
- 2002-01-22 NZ NZ530220A patent/NZ530220A/en not_active IP Right Cessation
- 2002-01-22 EP EP02716141A patent/EP1404483B1/fr not_active Expired - Lifetime
- 2002-01-22 PT PT02716141T patent/PT1404483E/pt unknown
- 2002-01-22 AU AU2002226534A patent/AU2002226534B2/en not_active Expired
- 2002-01-22 DK DK02716141T patent/DK1404483T3/da active
- 2002-01-22 WO PCT/GB2002/000259 patent/WO2003006200A1/fr not_active Ceased
- 2002-01-22 PL PL364627A patent/PL201507B1/pl unknown
- 2002-01-22 MX MXPA04000229A patent/MXPA04000229A/es active IP Right Grant
- 2002-01-22 BR BR0210970-0A patent/BR0210970A/pt not_active Application Discontinuation
2004
- 2004-01-09 NO NO20040106A patent/NO337878B1/no not_active IP Right Cessation

Also Published As

Publication number	Publication date
PT1404483E (pt)	2005-01-31
RU2268126C2 (ru)	2006-01-20
DE60201542T2 (de)	2005-02-03
CZ303793B6 (cs)	2013-05-09
EP1404483A1 (fr)	2004-04-07
PL364627A1 (en)	2004-12-13
MXPA04000229A (es)	2005-03-07
ATE278502T1 (de)	2004-10-15
PL201507B1 (pl)	2009-04-30
EP1404483B1 (fr)	2004-10-06
JP3795797B2 (ja)	2006-07-12
NO20040106L (no)	2004-03-09
HU229014B1 (en)	2013-07-29
NZ530220A (en)	2005-05-27
WO2003006200A1 (fr)	2003-01-23
JP2003039193A (ja)	2003-02-12
RU2004103629A (ru)	2005-06-10
AU2002226534B2 (en)	2006-11-09
TW592869B (en)	2004-06-21
HK1053278A1 (en)	2003-10-17
NO337878B1 (no)	2016-07-04
US20030007886A1 (en)	2003-01-09
MY123567A (en)	2006-05-31
CN1235717C (zh)	2006-01-11
HUP0401432A2 (en)	2004-11-29
CN1396039A (zh)	2003-02-12
SG139507A1 (en)	2008-02-29
DE60201542D1 (de)	2004-11-11
ES2230477T3 (es)	2005-05-01
BR0210970A (pt)	2004-06-08
CZ2004209A3 (cs)	2004-09-15
US6843862B2 (en)	2005-01-18

Publication	Publication Date	Title
DK1404483T3 (da)	2004-11-22	Forbedringer af eller i forbindelse med loddemetaller
MX2009004793A (es)	2009-05-21	Fundente para suelda libre de plomo, y metodo de soldeo.
EP1541654A4 (fr)	2008-07-09	Adhesif conducteur et circuit l'utilisant
TW200615074A (en)	2006-05-16	Solder composition, connecting process with soldering, and connection structure with soldering
TW200642785A (en)	2006-12-16	Metal nanoparticle compositions
IL180932A0 (en)	2007-07-04	Improvements in or relating to solders
GB2433944A (en)	2007-07-11	Solder alloy
ATE266497T1 (de)	2004-05-15	Verwendung einer bleifreien lotlegierungspaste zum herstellen von leiterplatten
AU2003296716A1 (en)	2004-07-22	Anode used for electroplating
ATE324222T1 (de)	2006-05-15	Bleifreie zink enthaltende weichlotpaste
KR970000427A (ko)	1997-01-21	납땜성이 우수한 무연땜납
CN104439751A (zh)	2015-03-25	新型低熔点无铅焊料
CN101347876A (zh)	2009-01-21	用于锡银锌系无铅焊料的水溶性助焊剂
WO2006038907A3 (fr)	2007-06-14	Composition de brasage sans plomb destinee a des substrats
TW200519216A (en)	2005-06-16	Pb-free solder alloy, and solder material and solder joint using same
EP1707302A3 (fr)	2007-01-17	Alliage de brasage sans plomb comprenant essentiellement de l'étain, de l'argent, du cuivre et du phosphore
FR3048908B1 (fr)	2020-05-29	Composition de brasure sans plomb a ductilite elevee
KR970000428A (ko)	1997-01-21	기계적 특성이 우수한 무연땜납
DK1233682T3 (da)	2007-08-13	Levnedsmiddelsammensætninger og fremgangsmåde til fremstilling af samme
Seelig et al.	2001	Advanced issues in assembly: Part 1- Lead contamination in lead-free assembly
KR200349938Y1 (ko)	2004-05-08	무연 안정기 회로
TW200711778A (en)	2007-04-01	Solder alloy, and electronic substrate making use of the solder alloy and process for producing the same
JP2006320912A (ja)	2006-11-30	高温はんだ合金
CN104384752A (zh)	2015-03-04	一种应用于传感器的助焊剂
WO2003021008A1 (fr)	2003-03-13	Solution galvanoplastique d'etain et procede de galvanoplastie