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TW200519216A - Pb-free solder alloy, and solder material and solder joint using same - Google Patents

Pb-free solder alloy, and solder material and solder joint using same

Info

Publication number
TW200519216A
TW200519216A TW093130582A TW93130582A TW200519216A TW 200519216 A TW200519216 A TW 200519216A TW 093130582 A TW093130582 A TW 093130582A TW 93130582 A TW93130582 A TW 93130582A TW 200519216 A TW200519216 A TW 200519216A
Authority
TW
Taiwan
Prior art keywords
solder
joint
same
free
alloy
Prior art date
Application number
TW093130582A
Other languages
Chinese (zh)
Other versions
TWI301854B (en
Inventor
Shinya Ochi
Fumitosh Tawara
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of TW200519216A publication Critical patent/TW200519216A/en
Application granted granted Critical
Publication of TWI301854B publication Critical patent/TWI301854B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A solder alloy based on an Sn-Zn-In-Ag system contains, in weight, 3.0% < Zn < 5.0%, 0.1 % ≤ In ≤ 4.0%, 0.1% ≤ Ag ≤ 0.4%, and the balance Sn. Therefore, the current Sn-Pb soldering method can be employed as it is. Further, a Pb-free solder material having a solder characteristic with excellent bonding strengths of the parts can be provided. Still further, since a difference between a solidus temperature and a liquidus temperature is small, floating of the parts leads can be suppressed, even in case where packaging processes are performed many times over. Still further, when the joint is exposed to the high temperature and high humidity atmosphere, the bonding strength can be prevented from being lowered.
TW093130582A 2003-10-10 2004-10-08 Pb-free solder alloy, and solder material and solder joint using same TWI301854B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003352015 2003-10-10
JP2004223189A JP4453473B2 (en) 2003-10-10 2004-07-30 Lead-free solder alloys, solder materials and solder joints using them

Publications (2)

Publication Number Publication Date
TW200519216A true TW200519216A (en) 2005-06-16
TWI301854B TWI301854B (en) 2008-10-11

Family

ID=34425378

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130582A TWI301854B (en) 2003-10-10 2004-10-08 Pb-free solder alloy, and solder material and solder joint using same

Country Status (6)

Country Link
US (1) US20050079092A1 (en)
JP (1) JP4453473B2 (en)
KR (1) KR100678803B1 (en)
CN (1) CN1311950C (en)
SG (1) SG111229A1 (en)
TW (1) TWI301854B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1749616A1 (en) * 2005-08-05 2007-02-07 Grillo-Werke AG Process for arc or beam soldering or welding of workpieces from same or different metal or metallic aloys using a Sn-Basis alloy filler; Wire of Tin-basis alloy
US20080225490A1 (en) * 2007-03-15 2008-09-18 Daewoong Suh Thermal interface materials
CN101804527A (en) * 2010-04-06 2010-08-18 山东大学 Sn-Zn based unleaded brazing material with low Zn
CA2866466C (en) 2012-03-28 2016-10-25 Nippon Steel & Sumitomo Metal Corporation Tailored blank for hot stamping, hot stamped member, and methods for manufacturing same
CN104411449B (en) * 2012-04-18 2016-03-23 千住金属工业株式会社 Solder Alloy
CN104755221B (en) * 2012-08-31 2018-06-15 千住金属工业株式会社 Electric conductivity conformable material
CN103212919A (en) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 Improved lead-free solder wire and flux thereof
CN106238951A (en) * 2016-08-26 2016-12-21 王泽陆 A kind of environment-friendly high-intensity lead-free brazing and preparation technology thereof
CN109926750B (en) * 2019-05-17 2021-03-30 云南锡业集团（控股）有限责任公司研发中心 Low-temperature lead-free solder alloy and vacuum casting method thereof
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0168964B1 (en) * 1995-06-30 1999-01-15 이형도 Lead free solder with excellent solderability
WO1997012719A1 (en) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Lead-free solder
JPH10193171A (en) * 1996-12-27 1998-07-28 Murata Mfg Co Ltd Soldering article
JPH10249578A (en) * 1997-03-11 1998-09-22 Hitachi Cable Ltd Copper and copper alloy brazing sheet
JPH10328880A (en) * 1997-06-04 1998-12-15 Mitsui Mining & Smelting Co Ltd Tin-silver based lead-free solder alloy
JP2001321983A (en) * 2000-05-16 2001-11-20 Canon Inc Solder paste and method for soldering electronic components using the same
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy

Also Published As

Publication number Publication date
JP2005131705A (en) 2005-05-26
CN1311950C (en) 2007-04-25
US20050079092A1 (en) 2005-04-14
SG111229A1 (en) 2005-05-30
CN1605427A (en) 2005-04-13
JP4453473B2 (en) 2010-04-21
KR20050035083A (en) 2005-04-15
KR100678803B1 (en) 2007-02-06
TWI301854B (en) 2008-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees