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WO2024067664A1 - Unité de circuit électronique, unité de caméra et endoscope - Google Patents

Unité de circuit électronique, unité de caméra et endoscope Download PDF

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Publication number
WO2024067664A1
WO2024067664A1 PCT/CN2023/121882 CN2023121882W WO2024067664A1 WO 2024067664 A1 WO2024067664 A1 WO 2024067664A1 CN 2023121882 W CN2023121882 W CN 2023121882W WO 2024067664 A1 WO2024067664 A1 WO 2024067664A1
Authority
WO
WIPO (PCT)
Prior art keywords
groove
circuit substrate
sensor
electrode
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/121882
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English (en)
Chinese (zh)
Inventor
童毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou United Imaging Healthcare Surgical Technology Co Ltd
Original Assignee
Changzhou United Imaging Healthcare Surgical Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202211186387.5A external-priority patent/CN115278040B/zh
Priority claimed from CN202211187585.3A external-priority patent/CN115695964A/zh
Application filed by Changzhou United Imaging Healthcare Surgical Technology Co Ltd filed Critical Changzhou United Imaging Healthcare Surgical Technology Co Ltd
Publication of WO2024067664A1 publication Critical patent/WO2024067664A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Definitions

  • the present invention relates to the technical field of electronic circuit devices, and in particular to an electronic circuit unit, a camera unit and an endoscope.
  • One of the embodiments of the present specification provides an electronic circuit unit, including: a circuit substrate, the front side of the circuit substrate is used to set a sensor, and at least one first groove is opened on the front side and/or side of the circuit substrate; a first electronic component, and the first electronic component is arranged in the at least one first groove.
  • a first electrode is disposed in the at least one first groove, and the first electronic component is welded to the first electrode.
  • the first electronic component is a passive device in a driving circuit.
  • a second electronic component is further included, and at least one second groove is formed on the side surface of the circuit substrate, and the second electronic component is disposed in the at least one second groove.
  • a second electronic component is further included, and at least one second groove is formed on the back side of the circuit substrate, and the second electronic component is disposed in the at least one second groove.
  • a second electrode is disposed in the at least one second groove, and the second electronic component is welded to the second electrode.
  • the second electronic component is an active device in a driving circuit.
  • the first groove and the second groove are both disposed on a side surface of the circuit substrate, and along an axial direction of the circuit substrate, a distance from the first groove to the sensor is smaller than a distance from the second groove to the sensor.
  • the dimension of the circuit substrate along its axial direction is in the range of 1 mm-10 mm.
  • a plurality of third grooves are further provided on the side of the circuit substrate, a plurality of positioning portions are provided on the back side of the circuit substrate, and the plurality of positioning portions are correspondingly connected to the plurality of third grooves.
  • the electronic circuit unit also includes: a first cable, the first cable is arranged corresponding to the third grooves, the first cable passes through the corresponding positioning portion and one end is arranged in the corresponding third groove.
  • a third electrode is disposed in the plurality of third grooves, and one end of the first cable is welded to the third electrode.
  • the plurality of third grooves are arranged circumferentially along a side surface of the circuit substrate.
  • the plurality of third grooves are mutually independent grooves opened on the side plane of the circuit substrate, or the plurality of third grooves are grooves opened secondary on the basis of the strip grooves on the side surface of the circuit substrate.
  • the positioning portion is not in communication with a side portion of the corresponding third groove, and the positioning portion is in communication with an interior of the corresponding third groove.
  • the positioning portion is in communication with the side and interior of the corresponding third groove.
  • the electronic circuit unit further includes one or more second cables, and one end of the second cable is connected to one end of the corresponding first cable.
  • a fourth electrode is disposed in the third groove, one end of the second cable is welded to the fourth electrode, and the fourth electrode is connected to the third electrode disposed in the third groove.
  • an endoscope comprising: an operating portion and an insertion portion, the insertion portion comprising a camera unit, the camera unit being disposed at one end of the insertion portion inserted into a body; wherein the camera unit comprises an electronic circuit unit as described above, and the sensor; wherein the electronic circuit unit comprises: a circuit substrate, the front side of the circuit substrate being used to set the sensor, at least one first groove being formed on the front side and/or side of the circuit substrate; and a first electronic component, the first electronic component being disposed in the at least one first groove.
  • a second electronic component is further included, and the second electronic component is disposed in the operating portion.
  • the senor includes any one or more of a camera sensor, an ultrasonic sensor, a position sensor, a distance sensor, or an infrared sensor.
  • FIG1 is a schematic diagram of the structure of an electronic circuit unit provided according to some embodiments of the present specification.
  • FIG2a is a cross-sectional view of an electronic circuit unit in which an electronic component is welded to the bottom of a groove according to some embodiments of the present specification
  • FIG2b is a cross-sectional view of an electronic circuit unit in which an electronic component is welded to a side of a groove according to some embodiments of the present specification
  • FIG3a is a schematic diagram of a third groove provided as a polygonal hole according to some embodiments of the present specification.
  • FIG3b is a schematic diagram of a third groove provided as a circular hole according to some embodiments of the present specification.
  • FIG4a is a schematic diagram showing that the third groove is a hole and the third electrode is a planar connecting electrode according to some embodiments of the present specification;
  • FIG4b is a schematic diagram of a case where the third groove is a hole and the third electrode is a circular groove-shaped connecting electrode according to some embodiments of the present specification;
  • FIG5a is a schematic diagram showing that the third groove is open-shaped and the third electrode in the third groove is a planar connecting electrode according to some embodiments of the present specification;
  • FIG5b is a schematic diagram of a third groove being open-shaped and a third electrode in the third groove being an upward convex polygonal connecting electrode according to some embodiments of the present specification;
  • FIG5c is a schematic diagram showing that the third groove is open and the third electrode in the third groove is a concave quadrilateral connecting electrode according to some embodiments of the present specification;
  • FIG5d is a schematic diagram of a third groove being open and a third electrode in the third groove being a concave circular groove-shaped connecting electrode according to some embodiments of the present specification;
  • FIG. 6 is a schematic diagram showing that one end of a second cable and a first cable are connected to each other as a whole and then inserted into a positioning portion and connected by welding through a third groove according to some embodiments of the present specification.
  • FIG7 is a schematic diagram of the structure of an electronic circuit unit provided according to some embodiments of this specification.
  • FIG8a is a cross-sectional view of an electronic circuit unit in which an electronic component is welded to the bottom of a groove according to some embodiments of the present specification
  • FIG8b is a cross-sectional view of an electronic circuit unit in which an electronic component is welded to a side of a groove according to some embodiments of the present specification
  • FIG9a is a schematic diagram of a third groove provided as a polygonal hole according to some embodiments of the present specification.
  • FIG9b is a schematic diagram of a third groove provided as a circular hole according to some embodiments of the present specification.
  • FIG. 10a is a schematic diagram showing that the third groove is a hole and the third electrode is a planar connecting electrode according to some embodiments of the present specification;
  • FIG. 10 b is a schematic diagram of a case where the third groove is a hole and the third electrode is a circular groove-shaped connecting electrode according to some embodiments of the present specification;
  • FIG. 11a is a schematic diagram showing that the third groove is open-shaped and the third electrode in the third groove is a planar connecting electrode according to some embodiments of the present specification;
  • FIG. 11 b is a schematic diagram of a third groove being open-shaped and a third electrode in the third groove being an upward convex polygonal connecting electrode according to some embodiments of the present specification;
  • FIG. 11c is a schematic diagram showing that the third groove is open and the third electrode in the third groove is a concave quadrilateral connecting electrode according to some embodiments of the present specification;
  • FIG. 11d is a schematic diagram of a third groove being open and a third electrode in the third groove being a concave circular groove-shaped connecting electrode according to some embodiments of the present specification;
  • FIG12 is a schematic diagram of the structure of a camera unit provided according to some embodiments of this specification.
  • FIG13 is a schematic diagram of the structure of an electronic circuit unit provided according to some embodiments of this specification.
  • FIG14a is a cross-sectional view of an electronic circuit unit according to some embodiments of the present specification.
  • FIG14b is a cross-sectional view of an electronic circuit unit according to some embodiments of the present specification.
  • FIG15a is a schematic diagram of a third groove provided as a polygonal hole according to some embodiments of the present specification.
  • FIG15b is a schematic diagram of a third groove provided as a circular hole according to some embodiments of the present specification.
  • FIG16a is a schematic diagram showing that the third groove is configured as a hole and the third electrode disposed in the third groove is a planar connecting electrode according to some embodiments of the present specification;
  • FIG16b is a schematic diagram showing that the second groove is configured as a hole and the third electrode disposed in the second groove is a circular groove-shaped connecting electrode according to some embodiments of the present specification;
  • FIG17a is a schematic diagram showing that the third groove is set to an open shape and the third electrode arranged in the third groove is a concave plane connecting electrode according to some embodiments of the present specification;
  • FIG17b is a schematic diagram showing that the third groove is set to an open shape and the third electrode arranged in the third groove is a protruding planar connecting electrode according to some embodiments of the present specification;
  • FIG. 18a is a schematic diagram showing that a plurality of third grooves are configured as holes and a positioning portion is configured as a through hole according to some embodiments of the present specification;
  • FIG. 18b is a schematic diagram showing that a plurality of third grooves are provided in an opening shape and a positioning portion is provided in a through hole shape according to some embodiments of the present specification;
  • FIG18c is a schematic diagram of a second cable and one end of a first cable connected to each other as a whole and then inserted into a positioning portion and connected by welding through a third groove according to some embodiments of the present specification;
  • FIG. 19a is a schematic diagram showing that a plurality of third grooves are configured as holes and a positioning portion is configured as an open hole according to some embodiments of the present specification;
  • FIG. 19b is a schematic diagram showing that a plurality of third grooves are arranged in an open shape and a positioning portion is arranged in a hole shape according to some embodiments of the present specification;
  • FIG20 is a schematic diagram of the structure of a camera unit provided according to some embodiments of this specification.
  • FIG21 is a schematic diagram of two first electronic components disposed in a first groove according to some embodiments of this specification.
  • FIG. 22 is a schematic diagram of the structure of an endoscope provided according to some embodiments of the present specification.
  • system means for distinguishing different components, elements, parts, portions or assemblies at different levels.
  • device means for distinguishing different components, elements, parts, portions or assemblies at different levels.
  • unit means for distinguishing different components, elements, parts, portions or assemblies at different levels.
  • the words can be replaced by other expressions.
  • the electronic circuit unit is composed of two circuit substrates, which increases the axial length and makes the hard part relatively long, making the front end of the endoscope inflexible when performing surgery in the body.
  • the longer hard part can also increase the patient's pain when inserted into the human body.
  • the impedance of the power supply and signal wires increases when they are relatively far away from the sensor.
  • the increase in current change will increase the impedance of the wire impedance, which will increase the change in the impedance voltage drop, causing the power supply voltage supplied to the sensor to exceed the specification range and unstable operation.
  • the capacity of the electronic components must be increased, resulting in an increase in the size of the electronic components and an overall increase in the size of the electronic circuit unit, which is not suitable for use in endoscopes.
  • the high impedance of the signal wire is also prone to noise.
  • the type and number of sensors specifically included in the hard part of the insertion part may vary to a certain extent.
  • the insertion part may include a camera sensor (such as an image sensor).
  • the sensor may include an ultrasonic sensor.
  • the endoscope may also include other sensors such as position sensors and distance sensors.
  • the insertion portion includes an ultrasonic sensor
  • the electronic components are mounted on the back side of a circuit board, relatively far away from the ultrasonic sensor, the ultrasonic sensor cannot be stably driven, resulting in poor quality of the ultrasonic signal obtained.
  • the embodiments of this specification propose an electronic circuit unit, which uses a circuit substrate, and opens a recess (for example, a first groove) on the front side (the side for installing the sensor) and/or the side (the side adjacent to the front side of the circuit substrate) of the circuit substrate to accommodate the electronic components (for example, the first electronic component, the second electronic component) required to drive the sensor (for example, the camera sensor).
  • a recess for example, a first groove
  • the sensor for example, the first electronic component, the second electronic component
  • Such an arrangement not only improves the working stability of the camera sensor and improves the quality of the sensor data obtained (such as the image quality of the camera sensor), but also greatly shortens the length of the hard part of the endoscope head structure, increases the flexibility of the bending of the front end of the endoscope during surgery, and reduces the pain of the subject.
  • the manufacturing process and manufacturing cost are simplified. The following will take the sensor including the camera sensor as an example, and combine Figures 1 to 12 to describe the electronic circuit unit
  • the electronic circuit unit may include a circuit substrate and a first electronic component, and one side of the circuit substrate is used to place a sensor, where the side of the circuit substrate used to place the sensor is defined as the front side of the circuit substrate, the side of the circuit substrate adjacent to the front side is defined as the side side, and the side of the circuit substrate opposite to the front side is defined as the back side.
  • at least one first groove may be provided on the front side of the circuit substrate, and the first electronic component is disposed in the first groove.
  • at least one first groove may be provided on the side side of the circuit substrate, and the first electronic component is disposed in the first groove.
  • the first groove may be provided on both the front and side sides of the circuit substrate, and the first electronic component is located in the first groove provided on the front and side sides of the circuit substrate.
  • the embodiment described here is that the sensor is a camera sensor.
  • the sensor may include other types of sensors.
  • the sensor may include one or more of a camera sensor, an ultrasonic sensor, a position sensor, a distance sensor, and an infrared sensor.
  • the sensor is a camera sensor, and the electronic circuit unit can be used as a camera unit of an endoscope to obtain image information inside the body of the detection object.
  • the circuit substrate can be a rectangular parallelepiped, a cylinder, a terrace, a hemisphere, or other regular or irregular three-dimensional structures. The shape of the circuit substrate can be adaptively adjusted according to the specific application scenario and the size and quantity of electronic components.
  • the electronic components are arranged on the side of the circuit substrate close to the sensor, which can reduce the distance between the electronic components and the imaging sensor, thereby not only improving the image quality of the acquired image, but also greatly shortening the length of the hard part when used in the imaging sensor, thereby reducing the pain of the subject.
  • FIG1 is a schematic diagram of the structure of an electronic circuit unit according to an embodiment of the present specification.
  • the electronic circuit unit may include: a circuit substrate 100 and a first electronic component 200.
  • the front of the circuit substrate 100 is used to set the imaging sensor, and the side of the circuit substrate 100 may be provided with at least one first groove 110, and the first electronic component 200 is arranged in the first groove 110.
  • the circuit substrate 100 is a rectangular parallelepiped structure as a specific example for explanation, where the center of the circuit substrate 100 is taken as the coordinate origin, the surface in the positive direction of the x-axis is the front, the surface in the negative direction of the x-axis is the back, and the surface in the positive and negative directions of the y-axis and the positive and negative directions of the z-axis are the side.
  • the first groove 110 is not limited to the side in the positive direction of the y-axis shown in FIG1, and the first groove 110 can be located on any one or more sides of the circuit substrate 100.
  • the number of the first groove 110 is one, and the first groove 110 can also be located on the side of the circuit substrate 100 in the negative direction of the y-axis, the positive direction of the z-axis, or the negative direction of the z-axis.
  • the number of the first groove 110 is multiple, and the multiple first grooves 110 can be located on any multiple side of the circuit substrate 100 in the positive direction of the y-axis, the negative direction of the y-axis, the positive direction of the z-axis, and the negative direction of the z-axis.
  • the first groove 110 may also be located on the front side of the circuit substrate 100.
  • the first groove 110 may also be disposed on both the front side and the side side of the circuit substrate 100.
  • the front side of the circuit substrate 100 may be a bottom side of the three-dimensional structure, and the side side of the circuit substrate 100 may be a side adjacent to the bottom side.
  • the first electronic component 200 may be a passive device in a driving circuit.
  • the passive device may include any one or more of a capacitor, a resistor, an inductor, a converter, a filter, a mixer, a gradienter, and a switch.
  • the passive devices in the imaging driving circuit that drives the imaging sensor to work can be selectively stored in the first groove 110.
  • the components that need to be close to the imaging sensor are stored in the first groove 110.
  • the type of passive devices stored in the first groove 110 can be screened according to the operating characteristics of the passive devices (for example, the operating temperature).
  • this type of passive device does not need to be stored in the first groove. 110.
  • a passive component that does not generate heat can be stored in the first groove 110.
  • the heat generated by the passive component is very small, and basically will not affect the camera sensor, thereby ensuring the normal operation of the camera sensor and ensuring that the acquired image quality is high.
  • the passive components in the camera drive circuit such as capacitors, etc., can be stored in the first groove.
  • the type of passive components stored in the first groove can also be screened according to the working characteristics of the passive components (for example, working temperature). For example, passive components with lower working temperatures are stored inside the first groove.
  • the electronic circuit unit further includes a second electronic component 300, and at least one second groove 120 is provided on the side of the electronic circuit unit, and the second electronic component 300 is disposed in at least one second groove 120.
  • the second groove 120 is not limited to the side located in the positive direction of the y-axis as shown in FIG. 1, and the second groove 120 can be located on any one or more sides of the circuit substrate 100.
  • the number of the second groove 120 is one, and the second groove 120 can also be located on the side in the negative direction of the y-axis, the positive direction of the z-axis, or the negative direction of the z-axis of the circuit substrate 100.
  • the number of the second groove 120 is multiple, and the multiple second grooves 120 can be located on any multiple sides in the positive direction of the y-axis, the negative direction of the y-axis, the positive direction of the z-axis, and the negative direction of the z-axis of the circuit substrate 100.
  • the second groove 120 can also be located on the back side of the circuit substrate 100 (the surface along the negative direction of the x-axis shown in FIG. 1).
  • the second electronic component 300 is an active device in the camera drive circuit.
  • the active device may include, but is not limited to, any one or more of a force-shaping device (e.g., a transistor), an analog integrated circuit (e.g., an integrated operational amplifier), and a digital integrated circuit device (e.g., a driver IC and a waveform shaping circuit IC, etc.).
  • part of the first electronic component 200 may also be placed in the second groove, such as a resistor in a passive device.
  • the resistor has a high operating temperature, which may also affect high-speed signal transmission, resulting in an inability to stably drive the camera element and poor image quality. Therefore, this type of passive device does not need to be housed in the first groove 110.
  • the first electronic component 200 that generates some heat may be placed in the second groove 120.
  • the electronic circuit unit is used in an endoscope, and only the first groove 110 for placing the first electronic component 200 may be provided on the circuit substrate 100, and the second electronic component 300 is provided in the operating part of the endoscope (for example, the operating part 2 shown in FIG. 22 ). Active devices are larger in size than passive devices. At this time, the second electronic component 300 with a larger size is provided in the operating part of the endoscope, so that the volume of the second electronic circuit unit is relatively small, thereby reducing the pain of the detection object during the endoscopic detection.
  • the operating part is located in the external environment, and the heat generated by the second electronic component 300 can also be quickly dissipated, which will not affect the normal operation of the camera sensor, and can effectively avoid the situation where the image quality is reduced due to the heating of the active device.
  • the first groove 110 and the second groove 120 are both arranged on the side of the circuit substrate 100, and along the axial direction of the circuit substrate 100, the distance from the first groove 110 to the camera sensor is smaller than the distance from the second groove 120 to the camera sensor. In other words, the first groove 110 is closer to the front of the circuit substrate 100 than the second groove 120.
  • the axial direction here is the x-axis direction shown in FIG. 1 .
  • At least one first groove 110 is formed on the side of the circuit substrate 100 near the front side
  • at least one second groove 120 is formed on the side of the circuit substrate 100 near the back side of the circuit substrate 100 .
  • a first groove 110 and a second groove 120 are provided on the side of the circuit substrate 100, and a first electronic component 200 is arranged in the first groove 110, and a second electronic component 300 is arranged in the second groove 120, so that the electronic components are installed at the position closest to the camera sensor, the overall size of the electronic circuit unit is shortened, and the miniaturization of the endoscope head structure can be achieved. While the diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope can be bent more flexibly when the endoscope is operated in the subject's body, reducing the pain of the patient.
  • the impedance becomes smaller, the noise is reduced, and a high-quality image can be obtained.
  • the second electronic component 300 is far away from the camera sensor, and the heat generated by the second electronic component 300 arranged on the side of the circuit substrate 100 is easier to dissipate, which has less impact on the camera sensor, ensuring the normal operation of the camera sensor, and can effectively avoid the situation where the image quality is reduced due to the heating of the active device.
  • the use of a single circuit substrate 100 can simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.
  • first groove 110 and the second groove 120 are not limited to being located on the same side of the circuit substrate 100 as shown in FIG. 1 , and the first groove 110 and the second groove 120 can also be located on different sides of the circuit substrate 100.
  • first groove 110 is located on the side of the circuit substrate 100 along the positive direction of the y-axis or the negative direction of the y-axis
  • second groove 120 is located on the side of the circuit substrate 100 along the positive direction of the z-axis or the negative direction of the z-axis.
  • the first groove 110 is located on the side of the circuit substrate 100 along the positive direction of the z-axis or the negative direction of the z-axis
  • the second groove 120 is located on the side of the circuit substrate 100 along the positive direction of the y-axis or the negative direction of the y-axis.
  • the size of the circuit substrate 100 along its axial direction may be 2 mm-10 mm.
  • the size of the circuit substrate 100 along its axial direction may be 1 mm-7 mm, so as to further reduce the size of the circuit substrate 100 along the axial direction (the x-axis direction shown in FIG. 1 ), so that the overall size of the electronic circuit unit can be made smaller.
  • the number of the first groove 110 and the second groove 120 can be calibrated according to actual needs. Of course, more first grooves 110 and second grooves 120 can be set than the actual needs as a backup, and the specific number is not limited.
  • the first electronic component 200 is arranged in the corresponding first groove 110. As a possible implementation, a first electronic component 200 can be arranged in a first groove 110. As another possible implementation, a plurality of first electronic components 200 can also be arranged in a first groove 110, and the specific arrangement can be made according to actual application requirements.
  • the second electronic component 300 is arranged in the corresponding second groove 120. As a possible implementation, a second electronic component 300 can be arranged in a second groove 120. As another possible implementation, a plurality of second electronic components 300 can also be arranged in a second groove 120, and the specific arrangement can be made according to actual application requirements.
  • the sensor 21 is taken as an example of an image sensor, a photosensitive portion (not shown in the figure) is formed on the front of the image sensor, and a plurality of convex portions 22 are provided on the back of the image sensor.
  • the side of the image sensor close to the front of the circuit substrate 100 is the back, and the side away from the front of the circuit substrate 100 is the front.
  • Each convex portion 22 is correspondingly provided with an image sensor connecting electrode 23, and the back of the image sensor is welded to the front of the circuit substrate 100 through the convex portion 22 and the image sensor connecting electrode 23.
  • the front of the circuit substrate 100 is within the projection surface of the image sensor.
  • the projection surface of the image sensor refers to the projection of the back of the image sensor along the positive direction of the x-axis shown in FIG.
  • the front of the circuit substrate 100 is within the projection surface of the image sensor, which can increase the contact area when the circuit substrate 100 is connected to the image sensor, thereby improving the stability of the image sensor and the circuit substrate 100.
  • a sealing resin 24 is filled between the camera sensor and the circuit substrate 100.
  • the projection of the first groove 110 on the front of the circuit substrate 100 does not overlap with the position of the camera sensor connection electrode 23.
  • the back of the camera sensor and the front of the circuit substrate 100 can also be electrically connected in other ways.
  • a plurality of contact pins are provided on the back of the camera sensor, and contacts corresponding to the plurality of contact pins are provided on the front of the circuit substrate 100.
  • each contact pin corresponds to the contact one by one, thereby realizing the electrical connection of the camera sensor circuit substrate 100.
  • a resin layer may be coated around the image sensor and the circuit substrate 100 to ensure stability and waterproofness between the image sensor and the circuit substrate 100 .
  • a first electrode 111 is disposed in the first groove 110, and the first electronic component 200 is soldered to the first electrode 111.
  • the camera sensor connecting electrode 23 may be connected to the first electrode 111 through a through hole 25.
  • a second electrode 121 is disposed in the second groove 120 , and the second electronic component 300 is soldered to the second electrode 121 .
  • the camera sensor connection electrode 23 may be connected to the second electrode 121 through a through hole 25 .
  • the first electrode 111 may be disposed on the connecting wall between the through hole 25 and the first groove 110.
  • the connecting wall may be disposed at various positions of the first groove 110 according to actual needs.
  • the connecting wall is disposed on the bottom surface of the first groove 110, that is, the first electronic component 200 may be welded to the bottom surface of the first groove 110.
  • the connecting wall may be disposed on the side surface of the first groove 110, that is, the first electronic component 200 may be welded to the side surface of the first groove 110.
  • the second electrode 121 may be disposed on the connecting wall between the through hole 25 and the second groove 120, wherein the connecting wall may be disposed at various positions of the second groove 120 according to actual needs.
  • the connecting wall is disposed on the bottom surface of the second groove 120, that is, the second electronic component 300 may be welded to the bottom surface of the second groove 120.
  • the connecting wall is disposed on the side surface of the second groove 120, that is, the second electronic component 300 may be welded to the side surface of the second groove 120.
  • the bottom surface of the first groove 110 or the second groove 120 refers to the surface opposite to the side surface of the circuit substrate 100.
  • the side surface of the first groove 110 or the second groove 120 refers to the surface adjacent to the bottom surface of the first groove 110.
  • the electronic circuit unit provided in this specification adopts a circuit substrate 100, and the overall thickness and size of the circuit substrate 100 is controlled within the projection area of the camera sensor.
  • the electronic components required for the camera sensor operation are welded on the side of the circuit substrate 100, so that the electronic components are installed at the position closest to the camera sensor, shortening the overall size, and miniaturizing the endoscope head structure. While the diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope can be bent more flexibly during surgery in the subject's body, and the pain of the patient can be reduced when inserted into the human body.
  • the use of a single circuit substrate 100 can simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.
  • a plurality of third grooves 130 are further provided on the side of the circuit substrate 100, and a plurality of positioning portions 140 are provided on the back of the circuit substrate 100, and the plurality of positioning portions 140 are correspondingly connected to the plurality of third grooves 130.
  • the electronic circuit unit further includes a first cable 400, and the first cable 400 is arranged corresponding to the third groove 130, and the first cable 400 passes through the corresponding positioning portion 140 and one end is arranged in the corresponding third groove 130.
  • a third electrode 131 is provided, and one end of the first cable 400 is welded to the third electrode 131 .
  • a plurality of positioning portions 140 may be provided on the back of the circuit substrate 100, and a plurality of third grooves 130 may be provided on the side of the circuit substrate 100.
  • One end of the first cable 400 may be welded to the third electrode 131 in the third groove 130 after passing through the corresponding positioning portion 140.
  • the positioning portion 140 may be a positioning hole, and the positioning portion 140 is used to position the first cable 400 passing through.
  • the corresponding first cable 400 passing through is positioned by the positioning portion 140, so that each cable is independent of each other, which can effectively avoid the short circuit of the welding point, and is neat and easy to distinguish and troubleshoot the circuit.
  • the other end of the first cable 400 is connected to the external control system, and the external control system is used to power the camera sensor and provide a pulse drive signal through the first cable 400.
  • the external control system also communicates with the camera sensor through the first cable 400 to receive the transmission image sent by the camera sensor.
  • the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100. It is understood that the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100 in two ways.
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate 100 .
  • a plurality of mutually independent grooves may be provided on the side plane of the circuit substrate 100, that is, the plurality of third grooves 130 are holes.
  • the shapes of the plurality of third grooves 130 may be set according to the actual application.
  • the plurality of third grooves 130 may be set as polygonal holes.
  • the plurality of third grooves 130 may be set as circular holes.
  • the shape of the third electrode 131 provided in the third groove 130 may also be set.
  • FIG. 1 the shape of the third electrode 131 provided in the third groove 130 may also be set.
  • the third electrode 131 may be a planar connecting electrode (coplanar with the step surface of the circuit board). As another possible implementation, as shown in FIG. 4b, the third electrode 131 may be a circular groove connecting electrode (the connecting electrode is lower than the step surface of the circuit board). As other possible implementations, the third electrode 131 disposed in the third groove 130 may also be in other forms, for example, it may be an upward convex polygonal connection electrode (the connection electrode is higher than the step surface of the circuit board), or it may be a concave quadrilateral connection electrode (the connection electrode is lower than the step surface of the circuit board).
  • the plurality of third grooves 130 as a plurality of mutually independent grooves, it is possible to effectively avoid the occurrence of short circuits at the welding points, and the circuits are neatly and easily distinguished and checked.
  • the plurality of third grooves 130 are grooves opened a second time on the basis of the annular groove on the side surface of the circuit substrate.
  • a strip groove may be firstly opened on the side of the circuit substrate 100, wherein the strip groove runs through the four surfaces of the side of the circuit substrate 100 to form a rectangular annular groove, and then, a second opening is performed on the basis of the rectangular groove to obtain a plurality of third grooves 130, that is, the third groove 130 is open-shaped.
  • the shape of the third electrode 131 set in the third groove 130 can be set.
  • the third electrode 131 in the third groove 130 may be a planar connection electrode (coplanar with the step surface of the circuit board).
  • FIG. 5a the third electrode 131 in the third groove 130 may be a planar connection electrode (coplanar with the step surface of the circuit board).
  • the third electrode 131 in the third groove 130 may be an upward convex polygonal connection electrode (the connection electrode is higher than the step surface of the circuit board).
  • the third electrode 131 in the third groove 130 may be a concave quadrilateral connection electrode (the connection electrode is lower than the step surface of the circuit board).
  • the third electrode 131 in the third groove 130 may be a concave circular groove-shaped connecting electrode (the connecting electrode is lower than the stepped surface of the circuit board).
  • the third groove 130 and the third electrode 131 disposed in the third groove 130 are matched and set according to actual needs.
  • the corresponding communication modes between the plurality of positioning portions 140 and the plurality of third grooves 130 may also be arranged accordingly.
  • the positioning portion 140 is not connected to the side of the corresponding third groove 130 but is connected to the inside.
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate 100, that is, the plurality of third grooves 130 are hole holes, and the positioning holes are not connected to the side of the corresponding third groove 130, but are connected inside, that is, the positioning holes are through-hole-shaped.
  • the plurality of third grooves 130 are grooves opened twice on the basis of the strip-shaped grooves on the side of the circuit substrate, that is, the plurality of third grooves 130 are open-shaped, and the positioning holes are not connected to the side of the corresponding third groove 130, but are connected inside, that is, the positioning holes are through-hole-shaped.
  • the positioning hole is communicated with the side and the interior of the corresponding third groove 130 .
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are hole holes, and the positioning holes are connected to the side and the interior of the corresponding third grooves 130, that is, the positioning holes are in the shape of openings.
  • the plurality of third grooves 130 are grooves opened twice on the basis of the strip grooves on the side of the circuit substrate, that is, the plurality of third grooves 130 are in the shape of openings, and the positioning holes are connected to the side and the interior of the corresponding third grooves 130, that is, the positioning holes are in the shape of openings.
  • the electronic circuit unit may further include a second cable 500 .
  • There may be one or more second cables 500 and one end of the second cable 500 is connected to one end of the corresponding first cable 400 .
  • a positioning groove 150 is also provided on the side of the circuit substrate 100.
  • the number of the positioning grooves 150 is the same as the number of the second cables 500, and they are arranged one by one.
  • the number of the positioning grooves 150 may be more than the number of the second cables 500, so as to be used as a backup, and can be directly called when the second cables 500 are increased.
  • One end of the second cable 500 is first positioned by the positioning groove 150, and then welded to the third electrode 131, so as to be connected to one end of the corresponding first cable 400.
  • one end of the second cable 500 is arranged one by one with one end of the first cable 400.
  • the other end of the second cable 500 is connected to the lens driver, and the second cable 500 is used to input or output electrical signals.
  • the corresponding second cables 500 passing through are positioned by the positioning groove 150, so that each cable is independent of each other, which can effectively avoid the situation of short circuit at the welding point, and is neat and easy to distinguish and troubleshoot the circuit.
  • a fourth electrode (not shown) is disposed in the third groove 130 , one end of the second cable 500 is welded to the fourth electrode, and the fourth electrode is connected to the third electrode 131 disposed in the third groove 130 .
  • two rows of third grooves 130 may be provided on one side of the circuit substrate 100 where the positioning groove is provided, wherein the third electrode 131 is provided in one row of the third grooves 130, and the fourth electrode is provided in the other row of the third grooves 130.
  • the positioning groove on the side of the circuit substrate 100 is provided corresponding to the second cable 500, one end of the second cable 500 is first positioned through the positioning groove, and then welded to the fourth electrode, and the fourth electrode is connected to the third electrode through a through hole, thereby connected to one end of the corresponding first cable 400.
  • the second cable 500 and one end of the first cable 400 are connected to each other as a whole, and then inserted into the positioning hole and connected by welding through the third groove 130.
  • the positioning groove 150 can be set to different shapes.
  • the positioning groove 150 can be set to a circular groove shape.
  • the electronic circuit unit of the embodiment of the present specification by opening the first groove 110 on the side of the circuit substrate 100 near the front to accommodate the first electronic component 200, the distance between the first electronic component 200 and the camera sensor is reduced, so that the circuit impedance between the two becomes smaller, the voltage supplied to the camera sensor is stable when the working current changes, and the signal noise is reduced.
  • the camera sensor works stably, but also the image quality of the acquired image is improved.
  • the length of the hard part of the endoscope head structure is greatly shortened, which reduces the pain of the subject during endoscopic detection.
  • the camera sensor in the embodiment of the present specification is only used as a specific example of the sensor 21 to describe the electronic circuit unit.
  • the camera sensor can be replaced by any one or more of an ultrasonic sensor, a position sensor, a distance sensor, an infrared sensor, etc.
  • the first groove 110 may also be provided only on the side of the circuit substrate 100.
  • some embodiments of this specification also propose an electronic circuit unit. Specifically, as shown in FIG7 , the electronic circuit unit of the embodiment of this specification may include: a circuit substrate 100 and a first electronic component 200.
  • the front of the circuit substrate 100 is used to set the sensor 21 (for example, a camera sensor), and at least one first groove 110 is opened on the side of the circuit substrate 100.
  • the number of the first grooves 110 opened can be calibrated according to actual needs. In some embodiments, more first grooves 110 can be set than the actual needs for backup, and the specific number is not limited.
  • the first electronic component 200 is set in the corresponding first groove 110.
  • a first electronic component 200 can be set in a first groove 110.
  • a plurality of first electronic components 200 can also be set in a first groove 110, which can be specifically set according to actual application requirements.
  • the surface in the positive direction of the x-axis is the front side
  • the surface in the negative direction of the x-axis is the back side
  • the surface in the positive and negative directions of the y-axis and the positive and negative directions of the z-axis are the side surfaces.
  • the first groove 110 is not limited to the side surface in the positive direction of the y-axis shown in Figure 7, and the first groove 110 can be located on any one or more side surfaces of the circuit substrate 100.
  • the number of the first groove 110 is one, and the first groove 110 can also be located on the side of the circuit substrate 100 in the negative direction of the y-axis, the positive direction of the z-axis, or the negative direction of the z-axis.
  • the number of the first groove 110 is multiple, and the multiple first grooves 110 can be located on any multiple side of the circuit substrate 100 in the positive direction of the y-axis, the negative direction of the y-axis, the positive direction of the z-axis, and the negative direction of the z-axis.
  • the number of the first groove 110 is one, and the size of the circuit substrate 100 along its axial direction may be 1mm-5mm. In some embodiments, the number of the first groove 110 is multiple, and when the multiple first grooves 110 are arranged on the same side of the circuit substrate 100, the size of the circuit substrate 100 along its axial direction may be 2mm-7mm. In some embodiments, when the number of the first groove 110 is multiple, the multiple first grooves 110 are arranged on different sides of the circuit substrate 100, and the size of the circuit substrate 100 along its axial direction may be 1mm-5mm, so as to further reduce the size of the circuit substrate 100 along the axial direction (the x-axis direction shown in FIG. 7), so that the overall size of the electronic circuit unit can be made smaller.
  • a photosensitive portion (not shown in FIG8a and FIG8b) is formed on the front of the imaging sensor, and a plurality of convex portions 22 are provided on the back of the imaging sensor.
  • the side of the sensor close to the front of the circuit substrate 100 is the back side, and the side away from the front of the circuit substrate 100 is the front side.
  • the convex portion 22 is provided with a camera sensor connection electrode 23, and the back side of the camera sensor is welded to the front side of the circuit substrate 100 through the convex portion 22 and the camera sensor connection electrode 23.
  • the front side of the circuit substrate 100 is within the projection surface of the camera sensor, and the camera sensor and the circuit substrate 100 are filled with a sealing resin 24. Among them, the projection of the first groove 110 on the front side of the circuit substrate 100 does not overlap with the position of the camera sensor connection electrode 23.
  • a first electrode 111 is disposed in the first groove 110, and the first electronic component 200 is soldered to the first electrode 111.
  • the camera sensor connecting electrode 23 may be connected to the first electrode 111 through a through hole 25.
  • the first electrode 111 can be arranged on the connecting wall between the through hole 25 and the first groove 110, wherein the connecting wall can be arranged at various positions of the first groove 110 according to actual needs.
  • the connecting wall is arranged on the bottom surface of the first groove 110, that is, the first electronic component 200 can be welded on the bottom surface of the first groove 110.
  • the connecting wall is arranged on the side surface of the first groove 110, that is, the first electronic component 200 can be welded on the side surface of the first groove 110.
  • the first electronic component 200 may be a passive device in the camera drive circuit.
  • the passive devices in the camera drive circuit such as capacitors, resistors, and inductors, may be stored in the first groove 110.
  • the first grooves 110 at different positions may be selected for storage according to the working characteristics of the passive devices, such as the working temperature. For example, during the working process, the working temperature of the resistor is high, which will also affect the increase in the working temperature of the camera sensor, and the image quality obtained is poor. Therefore, this type of passive device needs to be stored in the first groove 110 opened on the side of the circuit substrate 100 and adjacent to the back of the circuit substrate 100.
  • the passive device that does not generate heat can be stored in the first groove 110 opened on the side of the circuit substrate 100 adjacent to the front, and the passive device that generates heat can be stored in the first groove 110 opened on the side of the circuit substrate 100 adjacent to the back.
  • the active device can also be stored in the first groove 110 opened on the side of the circuit substrate 100 adjacent to the back.
  • the electronic circuit unit provided in this specification adopts a circuit substrate 100, and the overall thickness and size of the circuit substrate 100 is controlled within the projection area of the imaging element. Furthermore, on the side of the circuit substrate 100, the electronic components required for the operation of the imaging sensor are welded, so that the electronic components are installed at the position closest to the sensor 21, and the overall size is shortened, which can realize the miniaturization of the endoscope head structure. While the diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope can be bent more flexibly during the operation in the subject's body, and the pain of the patient can be reduced when the endoscope is inserted into the human body.
  • the electronic components are installed at the position closest to the sensor 21, which improves the signal quality of the sensor.
  • the sensor 21 is used as an imaging sensor, during the high-speed driving and signal transmission of the imaging sensor, since the first electronic component 200 is closer to the imaging sensor, the circuit impedance becomes smaller, the power supply voltage supplied to the sensor works stably, the noise is reduced, and a high-quality image can be obtained.
  • the sensor 21 is an ultrasonic sensor, since the first electronic component 200 is closer to the ultrasonic sensor, the impedance becomes smaller, the noise is reduced, and the ultrasonic sensor can be driven more stably, thereby improving the quality of the acquired ultrasonic signal.
  • using a single circuit substrate 100 can simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.
  • first grooves 110 for accommodating electronic components is set on the side of the circuit substrate 100, which is different from the above-mentioned embodiment in that two rows of first grooves 110 for accommodating electronic components are set on the side of the circuit substrate 100, the settings of other connecting devices and the settings of each component are the same.
  • a plurality of third grooves 130 are further provided on the side of the circuit substrate 100, and a plurality of positioning portions 140 are provided on the back of the circuit substrate 100, and the plurality of positioning portions 140 are correspondingly connected to the plurality of third grooves 130.
  • the electronic circuit unit further includes a first cable 400, which is arranged corresponding to the third groove 130, passes through the corresponding positioning portion 140 and has one end arranged in the corresponding third groove 130.
  • a third electrode 131 is disposed in the third groove 130 , and one end of the first cable 400 is welded to the third electrode 131 .
  • a plurality of positioning portions 140 may be provided on the back of the circuit substrate 100, and a plurality of third grooves 130 may be provided on the side of the circuit substrate 100.
  • One end of the first cable 400 may be welded to the third electrode 131 in the third groove 130 after passing through the corresponding positioning portion 140.
  • the positioning portion 140 may be a positioning hole, and the positioning portion 140 is used to position the first cable 400 passing through.
  • the corresponding first cable 400 passing through is positioned by the positioning portion 140, so that each cable is independent of each other, which can effectively avoid the short circuit of the welding point, and is neat and easy to distinguish and troubleshoot the circuit.
  • the other end of the first cable 400 is connected to an external control system, and the external control system is used to power the camera sensor and provide a pulse drive signal through the first cable 400.
  • the external control system also communicates with the camera sensor through the first cable 400 to receive the transmission image sent by the camera sensor.
  • the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100. It is understood that the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100 in two ways.
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate 100 .
  • a plurality of mutually independent grooves may be provided on the side plane of the circuit substrate 100, that is, the plurality of third grooves 130 are holes.
  • the shapes of the plurality of third grooves 130 may be set according to the actual application.
  • the plurality of third grooves 130 may be set as polygonal holes.
  • the plurality of third grooves 130 may be set as circular holes.
  • the shape of the third electrode 131 provided in the third groove 130 may also be set.
  • FIG. 9a hole the shape of the third electrode 131 provided in the third groove 130 may also be set.
  • the third electrode 131 may be a planar connection electrode (coplanar with the step surface of the circuit board). As another possible implementation, as shown in FIG. 10b, the third electrode 131 may be a circular groove connection electrode (the connection electrode is lower than the step surface of the circuit board). As other possible implementations, the third electrode 131 provided in the third groove 130 may also be in other forms. For example, it can be a convex polygonal connection electrode (the connection electrode is higher than the step surface of the circuit board), or it can be a concave quadrilateral connection electrode (the connection electrode is lower than the step surface of the circuit board). Thus, by setting the plurality of third grooves 130 as a plurality of mutually independent grooves, it is possible to effectively avoid the occurrence of short circuits at the welding points, and the circuits are neatly distinguished and easy to troubleshoot.
  • the plurality of third grooves 130 are grooves opened a second time on the basis of the annular groove on the side surface of the circuit substrate.
  • a strip groove may be firstly opened on the side of the circuit substrate 100.
  • the strip groove runs through the four sides of the circuit substrate 100 to form a rectangular annular groove, and then, a second opening is performed on the basis of the rectangular groove to obtain a plurality of third grooves 130, that is, the third groove 130 is open-shaped.
  • the shape of the third electrode 131 provided in the third groove 130 may be set.
  • the third electrode 131 in the third groove 130 may be a planar connection electrode (coplanar with the step surface of the circuit board).
  • FIG. 11a planar connection electrode coplanar with the step surface of the circuit board.
  • the third electrode 131 in the third groove 130 may be an upward convex polygonal connection electrode (the connection electrode is higher than the step surface of the circuit board).
  • the third electrode 131 in the third groove 130 may be a concave quadrilateral connection electrode (the connection electrode is lower than the step surface of the circuit board).
  • the third electrode 131 in the third groove 130 may be a concave circular groove-shaped connecting electrode (the connecting electrode is lower than the stepped surface of the circuit board).
  • the third groove 130 and the third electrode 131 disposed in the third groove 130 are matched and set according to actual needs.
  • the corresponding communication modes between the plurality of positioning portions 140 and the plurality of third grooves 130 may also be arranged accordingly.
  • the positioning portion 140 is not connected to the side of the corresponding third groove 130 but is connected to the inside.
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are hole holes, and the positioning holes are not connected to the side of the corresponding third groove 130, but are connected inside, that is, the positioning holes are through-hole-shaped.
  • the plurality of third grooves 130 are grooves opened twice on the basis of the strip-shaped grooves on the side of the circuit substrate, that is, the plurality of third grooves 130 are open-shaped, and the positioning holes are not connected to the side of the corresponding third groove 130, but are connected inside, that is, the positioning holes are through-hole-shaped.
  • the positioning hole is communicated with the side and the interior of the corresponding third groove 130 .
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are hole holes, and the positioning holes are connected to the side and the interior of the corresponding third grooves 130, that is, the positioning holes are in the shape of openings.
  • the plurality of third grooves 130 are grooves opened twice on the basis of the strip grooves on the side of the circuit substrate, that is, the plurality of third grooves 130 are in the shape of openings, and the positioning holes are connected to the side and the interior of the corresponding third grooves 130, that is, the positioning holes are in the shape of openings.
  • the electronic circuit unit may further include a second cable 500 , wherein there may be one or more second cables 500 , and one end of the second cable 500 is connected to one end of the corresponding first cable 400 .
  • a positioning groove 150 is also provided on the side of the circuit substrate 100, wherein, as a possible implementation, the number of the positioning grooves 150 is the same as the number of the second cables 500, and they are arranged one by one. As another possible implementation, the number of the positioning grooves 150 may be more than the number of the second cables 500, so as to be used as a backup, and can be directly called when the second cables 500 are increased.
  • One end of the second cable 500 is first positioned by the positioning groove 150, and then welded to the third electrode 131, so as to be connected to one end of the corresponding first cable 400. Among them, one end of the second cable 500 is arranged one by one with one end of the first cable 400.
  • the other end of the second cable 500 is connected to the lens driver, and the second cable 500 is used to input or output electrical signals.
  • the corresponding second cables 500 passing through are positioned by the positioning groove 150, so that each cable is independent of each other, which can effectively avoid the situation of short circuit at the welding point, and is neat and easy to distinguish and troubleshoot the circuit.
  • a fourth electrode (not shown) is disposed in the third groove 130 , one end of the second cable 500 is welded to the fourth electrode, and the fourth electrode is connected to the third electrode 131 disposed in the third groove 130 .
  • two side surfaces of the positioning groove in the circuit substrate 100 may be provided.
  • a third electrode 131 is arranged in one row of third grooves, and a fourth electrode is arranged in another row of third grooves.
  • the positioning groove on the side of the circuit substrate 100 is arranged corresponding to the second cable 500, and one end of the second cable 500 is first positioned through the positioning groove and then welded to the fourth electrode.
  • the fourth electrode is connected to the third electrode through a through hole, and thus connected to one end of the corresponding first cable 400.
  • one end of the second cable 500 and the first cable 400 are connected to each other as a whole and then inserted into the positioning hole and connected by welding through the third groove 130.
  • the positioning groove 150 can be set to different shapes, wherein the positioning groove 150 can be set to a circular groove shape.
  • first groove 110 when only one row of grooves for accommodating electronic components is provided on the side of the circuit substrate 100 , that is, at least one first groove 110 is provided, the first groove 110 and the plurality of third grooves 130 may also be provided in the same row.
  • the electronic circuit unit provided in the embodiment of this specification adopts a circuit substrate 100, and the overall thickness and size of the circuit substrate 100 is controlled within the projection area of the sensor 21. Furthermore, on the side of the circuit substrate, the electronic components required for the action of the sensor 21 are welded, so that the electronic components are installed at the position closest to the sensor 21, and the overall size is shortened, so that the endoscope head structure can be miniaturized. While the diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope can be bent more flexibly when the endoscope is operated in the subject's body, and the pain of the patient can be reduced when inserted into the human body.
  • the impedance becomes smaller, the power supply voltage supplied to the sensor is stable, the noise is reduced, and higher quality sensor data can be obtained.
  • the use of a single circuit substrate 100 can simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.
  • the active device that generates heat is arranged on the side, which is conducive to heat dissipation, and can effectively avoid the situation where the sensor data quality decreases due to the heating of the active device.
  • the electronic circuit unit of the embodiment of this specification by providing a first groove on the side of the circuit substrate near the front to accommodate the electronic components, the distance between the electronic components and the sensor 21 is reduced, thereby improving the quality of obtaining sensor data.
  • the length of the hard part of the endoscope head structure is greatly shortened, which reduces the pain of the subject during endoscopic inspection.
  • setting the heat-generating active device on the side is conducive to heat dissipation, which can effectively avoid the situation where the sensor data quality is reduced due to the heat generated by the active device.
  • the present invention further proposes a camera unit.
  • the camera unit of the embodiment of the present invention may include the above-mentioned electronic circuit unit and sensor 21.
  • the first electronic component 200 and the second electronic component 300 are not shown.
  • connection method between the electronic circuit unit and the sensor 21 is the same as the connection method between the electronic circuit unit and the camera sensor described in the above embodiment. Please refer to the description of the above embodiment. To avoid redundancy, it will not be described in detail here.
  • the camera unit of the embodiment of this specification by opening a first groove on the side of the circuit substrate near the front to accommodate the electronic components, the distance between the electronic components and the sensor 21 is reduced, thereby not only improving the quality of the acquired sensor data, but also greatly shortening the overall length of the camera unit.
  • the first groove can be arranged on the front side of the circuit substrate for mounting the sensor 21 (for example, a camera sensor), in which case the first electronic component in the first groove is closer to the sensor 21.
  • Setting the first groove on the front side of the circuit substrate can further reduce the distance between the electronic component and the sensor, thereby further improving the working stability of the sensor and the quality of the acquired sensor data.
  • such a setting greatly shortens the length of the electronic circuit unit and the length of the hard part of the endoscope head structure when assembled at the end of the endoscope head, thereby alleviating the pain of the subject.
  • the following will describe in detail the scheme of setting the first groove on the front side of the circuit substrate in conjunction with Figures 13-21.
  • Fig. 13 is a schematic diagram of the structure of an electronic circuit unit according to an embodiment of the present specification. As shown in Fig. 13 , in some embodiments, the electronic circuit unit may include a circuit substrate 100 and a first electronic component 200 .
  • the front side of the circuit substrate 100 is used to set the sensor 21 (for example, a camera sensor), and one or more first grooves 110 are provided on the front side of the circuit substrate 100.
  • the number of the first grooves 110 here is not limited to the multiple ones indicated in FIG. 13, and can also be one, and the number of the first grooves 110 can be calibrated according to actual needs. For example, in a specific production process, more first grooves 110 can be set than the actual needs for backup, and the specific number is not limited.
  • the first electronic component 200 is set in the corresponding first groove 110. As a possible implementation, a first electronic component 200 can be set in a first groove 110.
  • a plurality of first electronic components 200 can also be set in a first groove 110.
  • two first electronic components 200 can be set in a first groove 110.
  • the number of first electronic components 200 set in the first groove 110 can be set according to actual application requirements.
  • the circuit substrate 100 is a rectangular parallelepiped structure as a specific example for description, where the center of the circuit substrate 100 is the coordinate origin, the surface in the positive direction of the x-axis is the front side, the surface in the negative direction of the x-axis is the back side, and the surfaces in the positive and negative directions of the y-axis and the positive and negative directions of the z-axis are the side surfaces.
  • the specific structure of the circuit substrate 100 reference may be made to the description elsewhere in this specification, and no further description will be given here.
  • each convex portion 22 is correspondingly provided with an image sensor connection electrode 23, and the back side of the image sensor is welded to the front side of the circuit substrate 100 through the convex portion 22 and the image sensor connection electrode 23, and the front side of the circuit substrate 100 is within the projection surface of the image sensor.
  • the projection surface of the image sensor refers to the projection of the back side of the image sensor along the positive direction of the x-axis shown in FIG. 13.
  • the front side of the circuit substrate 100 is within the projection surface of the image sensor, which can increase the contact area when the circuit substrate 100 is connected to the image sensor, thereby improving the stability of the image sensor and the circuit substrate 100.
  • the projection of the first groove 110 on the front side of the circuit substrate 100 does not overlap with the position of the image sensor connection electrode 23.
  • the image sensor connection electrode 23 can be prevented from contacting the first electronic component 200 or the first electrode 111 in the first groove 110, thereby avoiding a short circuit in the internal circuit of the electronic circuit unit, and also facilitating the arrangement of wires and circuits in the electronic circuit unit.
  • the size of the circuit substrate 100 along its axial direction may be 1 mm to 5 mm. At this time, the size of the circuit substrate 100 along the axial direction (the x-axis direction shown in FIG. 7 ) is relatively small, ensuring that the overall size of the electronic circuit unit can be made smaller.
  • a first electrode 111 is disposed in the first groove 110, and the first electronic component 200 is soldered to the first electrode 111.
  • the image sensor connecting electrode 23 is connected to the first electrode 111, and a sealing resin 24 is filled between the image sensor and the circuit substrate 100 to ensure stability and waterproof performance between the image sensor and the circuit substrate 100.
  • the camera sensor connection electrode 23 may be connected to the first electrode 111 through a through hole 25.
  • the first electrode 111 may be disposed on a connecting wall between the through hole 25 and the first groove 110, wherein the connecting wall between the through hole 25 and the first groove 110 is the bottom surface or side surface of the first groove 110.
  • the first electronic component 200 is welded to the bottom surface of the first groove 110.
  • the first electronic component 200 is welded to the side surface of the first groove 110.
  • the bottom surface of the first groove 110 refers to the surface in the first groove 110 that is opposite to the position of the camera sensor.
  • the side surface of the first groove 110 refers to the surface adjacent to the bottom surface of the first groove 110.
  • the first electronic component 200 may be a passive device in the camera drive circuit.
  • the passive device may include one or more of a capacitor, a resistor, an inductor, a converter, a filter, a mixer, a gradienter, and a switch.
  • the passive devices in the camera drive circuit such as capacitors, resistors, and inductors, may be stored in the first groove 110, that is, the components that need to be close to the camera sensor are stored in the first groove 110.
  • the passive device that does not generate heat may be stored in the first groove 110.
  • the type of passive device stored in the first groove 110 may be screened according to the working characteristics of the passive device, such as the working temperature. For example, during the working process, the working temperature of the resistor is high, which will also affect the high-speed signal transmission, thereby causing the camera element to be unable to be stably driven, and the image quality obtained is poor. Therefore, this type of passive device does not need to be stored in the first groove 110.
  • the passive components in the camera drive circuit such as capacitors, may be stored in the first groove 110.
  • the type of passive components stored in the first groove 110 can also be screened according to the working characteristics of the passive components, such as working temperature. For example, passive components with lower working temperature are stored in the first groove.
  • the electronic circuit unit provided in this specification adopts a circuit substrate 100, and the overall thickness of the circuit substrate 100 is controlled within the front projection area of the camera sensor to achieve a thin diameter. Further, on the welding surface (front side) of the camera sensor, a first groove 110 is formed between the welded electrodes of each camera sensor to accommodate the first electronic component 200 required for the camera sensor to operate, so that the first electronic component 200 is installed at the position closest to the camera sensor. In addition, the axial length of the electronic circuit unit is shortened, and the miniaturization of the endoscope head structure can be achieved.
  • the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope is more flexible when the endoscope is operated in the subject's body, and the pain of the patient can be reduced when inserted into the human body.
  • the first electronic component 200 since the first electronic component 200 is installed on the front side of the circuit substrate 100 close to the camera sensor, it is closer to the camera sensor. Such a setting reduces the impedance between the camera sensor and the first electronic component 200, the camera sensor works more stably, the noise is reduced, and a high-quality image can be obtained.
  • the use of a single circuit substrate 100 can reduce the number of surface layers and bottom layers required for the same functions of multiple circuit boards, simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.
  • a second groove (not shown in FIG. 13 ) for placing a second electronic component may also be provided on the circuit substrate 100.
  • the second groove may be provided on the side or back of the circuit substrate 100.
  • the number of the second grooves may be one or more. When the number of the second grooves is multiple, the multiple second grooves may be provided on the same side of the circuit substrate, or on different sides of the circuit substrate 100.
  • FIGS. 1 to 12 For the content of the second groove and the second electronic component, please refer to the relevant description of FIGS. 1 to 12 , which will not be repeated here.
  • the electronic circuit unit is used in an endoscope, and the circuit substrate 100 may only be provided with a first groove 110 for placing the first electronic component 200, and the second electronic component is provided in the operating portion of the endoscope (for example, the operating portion 2 shown in FIG. 22 ).
  • Active devices are larger in size than passive devices.
  • the second electronic component with a larger size is provided in the operating portion of the endoscope, so that the volume of the second electronic circuit unit is relatively small, which reduces the pain of the test object during the endoscopic test.
  • the operating part is located in the external environment, and the heat generated by the second electronic component can be quickly dissipated, which will not affect the normal operation of the camera sensor and can effectively avoid the situation where the image quality is reduced due to the heating of the active device.
  • a plurality of third grooves 130 are provided on the side of the circuit substrate 100, and a plurality of positioning portions 140 are provided on the back of the circuit substrate 100, and the plurality of positioning portions 140 are correspondingly connected to the plurality of third grooves 130.
  • the electronic circuit unit further includes a first cable 400, the number of the first cables 400 is multiple, and the plurality of first cables 400 are respectively arranged corresponding to the plurality of third grooves 130, and the first cables 400 pass through the corresponding positioning portions 140 and one end is arranged in the corresponding third groove 130.
  • a third electrode 131 is disposed in the third groove 130 , and one end of the first cable 400 is welded to the third electrode 131 .
  • a plurality of positioning portions 140 may be provided on the back of the circuit substrate 100, and a plurality of third grooves 130 may be provided on the side of the circuit substrate 100.
  • One end of the first cable 400 may be welded to the third electrode 131 in the third groove 130 after passing through the corresponding positioning portion 140.
  • the positioning portion 140 may be a positioning hole, and the positioning portion 140 is used to position the first cable 400 passing through.
  • the corresponding first cable 400 passing through is positioned by the positioning portion 140, so that each cable is independent of each other, which can effectively avoid the short circuit of the welding point, and is neat and easy to distinguish and troubleshoot the circuit.
  • the other end of the first cable 400 is connected to an external control system, which is used to supply power and provide a pulse drive signal to the camera sensor through the first cable 400.
  • the external control system also communicates with the camera sensor through the first cable 400 to receive a transmission image sent by the camera sensor, or to send and receive instructions to the camera sensor.
  • the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100 . It is understandable that the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100 in two ways.
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate 100 .
  • a plurality of mutually independent grooves may be provided on the side plane of the circuit substrate 100, that is, the plurality of third grooves 130 are holes.
  • the shapes of the plurality of third grooves 130 may be set according to the actual application.
  • the plurality of third grooves 130 may be set as polygonal holes.
  • the plurality of third grooves 130 may be set as circular holes.
  • the shape of the third electrode 131 provided in the third groove 130 may also be set.
  • FIG. 15a hole the shape of the third electrode 131 provided in the third groove 130 may also be set.
  • the third electrode 131 provided in the third groove 130 may be a planar connection electrode (coplanar with the step surface of the circuit board).
  • the third electrode 131 provided in the third groove 130 may be a circular groove connection electrode (the connection electrode is lower than the step surface of the circuit board).
  • the third electrode 131 disposed in the third groove 130 may also be in other forms, for example, it may be a raised plane connection electrode (the connection electrode is higher than the step surface of the circuit board), or it may be a concave plane connection electrode (the connection electrode is lower than the step surface of the circuit board).
  • the plurality of third grooves 130 are grooves opened a second time on the basis of the strip-shaped grooves on the side surface of the circuit substrate 100 .
  • a strip groove may be firstly opened on the side of the circuit substrate 100, wherein the strip groove runs through the four surfaces of the side of the circuit substrate 100 to form a rectangular annular groove, and then, a second opening is performed on the basis of the strip groove to obtain a plurality of third grooves 130, that is, the third groove 130 is open-shaped.
  • the shape of the third electrode 131 provided in the third groove 130 may be set.
  • the third electrode 131 provided in the third groove 130 may be a concave plane connecting electrode (the connecting electrode is lower than the step surface of the circuit board).
  • FIG. 17a the third electrode 131 provided in the third groove 130 may be a concave plane connecting electrode (the connecting electrode is lower than the step surface of the circuit board).
  • the third electrode 131 provided in the third groove 130 may be a convex plane connecting electrode (the connecting electrode is higher than the step surface of the circuit board).
  • the third electrode 131 provided in the third groove 130 may also be a planar connecting electrode (coplanar with the step surface of the circuit board), or may be a circular groove connecting electrode (the connecting electrode is lower than the step surface of the circuit board).
  • the third groove 130 and the third electrode 131 are arranged in coordination with each other and are set according to actual needs.
  • the corresponding communication modes between the plurality of positioning portions and the plurality of third grooves may also be arranged accordingly.
  • the positioning portion 140 is not connected to the side of the corresponding third groove 130 but is connected to the inside.
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are holes, and the positioning portion 140 is not connected to the side of the corresponding third groove 130, but is connected inside, that is, the positioning portion 140 is in the shape of a through hole.
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are holes, and the positioning portion 140 is not connected to the side of the corresponding third groove 130, but is connected inside, that is, the positioning portion 140 is in the shape of a through hole.
  • the plurality of third grooves 130 are grooves opened twice on the basis of the annular groove on the side of the circuit substrate, that is, the plurality of third grooves 130 are open-shaped, and the positioning portion 140 is not connected to the side of the corresponding third groove 130, but is connected inside, that is, the positioning portion is in the shape of a through hole.
  • the positioning portion 140 is in communication with the side and the interior of the corresponding third groove 130 .
  • the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are holes, and the positioning portion 140 is connected to the side and the interior of the corresponding third groove 130, that is, the positioning portion 140 is in the shape of an opening.
  • the plurality of third grooves 130 are grooves opened twice on the basis of the annular groove on the side of the circuit substrate, that is, the plurality of third grooves 130 are in the shape of an opening, and the positioning portion 140 is connected to the side and the interior of the corresponding third groove 130, that is, the positioning portion 140 is in the shape of an opening.
  • the electronic circuit unit may further include a second cable 500, wherein the second cable 500 is one or more, and one end of the second cable 500 is connected to one end of the corresponding first cable 400.
  • the second cable 500 and one end of the first cable 400 are connected to each other as a whole, and then inserted into the positioning portion 140 and connected by welding through the third groove 130.
  • a positioning groove 150 is also provided on the side of the circuit substrate 100, wherein, as a possible implementation, the number of the positioning grooves 150 is the same as the number of the second cables 500, and they are arranged one by one; as another possible implementation, the number of the positioning grooves 150 can be more than the number of the second cables 500, so as to be used as a backup, and can be directly called when the second cables 500 are increased.
  • One end of the second cable 500 is first positioned by the positioning groove 150, and then welded to the third electrode 131, so as to be connected to one end of the corresponding first cable 400.
  • one end of the second cable 500 is arranged corresponding to one end of the first cable 400, and the other end of the second cable 500 is connected to the lens driver, and the second cable 500 is used to input or output electrical signals.
  • the corresponding second cables 500 passing through are positioned by the positioning groove 150, so that each cable is independent of each other, which can effectively avoid the situation of short circuit at the welding point, and is neat and easy to distinguish and troubleshoot the circuit.
  • a fourth electrode 122 is disposed in the third groove 130 , one end of the second cable 500 is welded to the fourth electrode 122 , and the fourth electrode 122 is connected to the third electrode 131 disposed in the third groove 130 .
  • two rows of third grooves 130 may be provided on one side of the circuit substrate 100 where the positioning grooves are provided.
  • the third electrodes 131 are provided in one row of the third grooves 130
  • the fourth electrodes 122 are provided in the other row of the third grooves 130.
  • the positioning grooves 150 on the side of the circuit substrate 100 are provided corresponding to the second cables 500, one end of the second cable 500 is first positioned by the positioning grooves 150, and then welded to the fourth electrode 122, and the fourth electrode 122 is connected to the third electrode 131 through the through hole 25, thereby being connected to one end of the corresponding first cable 400.
  • the positioning groove 150 can be set to different shapes, wherein, as shown in FIGS. 18a , 18b , 19a and 19b , the positioning groove 150 can be set to a circular groove shape.
  • the electronic circuit unit of the embodiment of the present specification by opening the first groove 110 on the front of the circuit substrate close to the sensor 21 to accommodate the electronic components (for example, the first electronic component 200), the distance between the first electronic component 200 and the sensor 21 is reduced.
  • Such a setting not only improves the stability of the sensor working voltage and the quality of obtaining sensor data, but also greatly shortens the length of the hard part of the endoscope head structure, reducing the pain of the subject during endoscopic examination.
  • this specification also proposes a camera unit.
  • the camera unit of the embodiment of the present specification may include the above-mentioned electronic circuit unit and camera sensor, wherein the first electronic component is not shown.
  • connection method between the electronic circuit unit and the camera sensor is the same as that described in the above embodiment. Please refer to the description of the above embodiment. To avoid redundancy, it will not be described in detail here.
  • the distance between the first electronic component and the camera sensor is reduced by opening a first groove on the front of the circuit substrate close to the camera sensor to accommodate the first electronic component. This not only improves the image quality of the acquired image, but also greatly shortens the overall length of the camera unit.
  • the endoscope head structure may include the above-mentioned camera unit, which may be an electronic circuit unit and a sensor 21.
  • the electronic circuit unit may be an electronic circuit unit and a sensor 21.
  • the endoscope head structure of the embodiment of the present specification by providing grooves on the front and/or side of the circuit substrate near the sensor 21 to accommodate electronic components, the distance between the electronic components and the sensor 21 is reduced, thereby improving the signal quality of the sensor obtained.
  • the sensor 21 as an imaging sensor as an example
  • the electronic components are arranged in the grooves provided on the front and/or side of the circuit substrate, which can more stably drive the imaging sensor and improve the image quality of the acquired image.
  • such a setting greatly shortens the length of the imaging unit and the length of the hard part of the endoscope head structure when assembled at the end of the endoscope head, thereby alleviating the pain of the subject.
  • this specification also proposes an endoscope.
  • the endoscope 1000 of the embodiment of the present specification may include the above-mentioned endoscope head structure 1.
  • the endoscope 1000 may also include an operating portion 2 and an insertion portion 3.
  • the endoscope head structure 1 is disposed at the front end of the insertion portion 3 of the endoscope 1000.
  • the endoscope of the embodiment of the present specification by opening grooves on the front and/or sides of the circuit substrate close to the sensor to accommodate electronic components, the distance between the electronic components and the sensor is reduced, thereby not only improving the signal quality of the sensor obtained, but also greatly shortening the length of the hard part of the endoscope head structure, alleviating the pain of the subject.
  • the sensor may include but is not limited to a camera sensor, an ultrasonic sensor, a position sensor, and a distance sensor.
  • the electronic components are arranged in the grooves opened on the front and/or sides of the circuit substrate, which can drive the camera sensor more stably and improve the image quality of the acquired image.
  • the ultrasonic sensor when the electronic components are installed in the grooves opened on the front and/or sides of the circuit substrate, the ultrasonic sensor can be driven more stably and the quality of the acquired ultrasonic signal can be improved.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Endoscopes (AREA)
  • Studio Devices (AREA)

Abstract

Des modes de réalisation de la présente description concernent une unité de circuit électronique, une unité de caméra et un endoscope. L'unité de circuit électronique comprend : un substrat de circuit, la face avant du substrat de circuit étant utilisée pour agencer un capteur sur celui-ci, et au moins une première rainure étant ménagée sur la face avant et/ou une face latérale du substrat de circuit ; et un premier composant électronique, le premier composant électronique étant agencé dans ladite première rainure.
PCT/CN2023/121882 2022-09-28 2023-09-27 Unité de circuit électronique, unité de caméra et endoscope Ceased WO2024067664A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202211186387.5A CN115278040B (zh) 2022-09-28 2022-09-28 电子电路单元和摄像单元
CN202211187585.3 2022-09-28
CN202211186387.5 2022-09-28
CN202211187585.3A CN115695964A (zh) 2022-09-28 2022-09-28 电子电路单元和摄像单元

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WO2024067664A1 true WO2024067664A1 (fr) 2024-04-04

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090021618A1 (en) * 2007-07-18 2009-01-22 Peter Schwarz Image Pick-Up Module
WO2018079328A1 (fr) * 2016-10-31 2018-05-03 オリンパス株式会社 Unité de capture d'image et système d'endoscope
CN109068967A (zh) * 2016-05-10 2018-12-21 奥林巴斯株式会社 电子电路单元、摄像单元、摄像模块以及内窥镜
CN115278040A (zh) * 2022-09-28 2022-11-01 常州联影智融医疗科技有限公司 电子电路单元和摄像单元
CN115695964A (zh) * 2022-09-28 2023-02-03 常州联影智融医疗科技有限公司 电子电路单元和摄像单元

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090021618A1 (en) * 2007-07-18 2009-01-22 Peter Schwarz Image Pick-Up Module
CN109068967A (zh) * 2016-05-10 2018-12-21 奥林巴斯株式会社 电子电路单元、摄像单元、摄像模块以及内窥镜
WO2018079328A1 (fr) * 2016-10-31 2018-05-03 オリンパス株式会社 Unité de capture d'image et système d'endoscope
CN115278040A (zh) * 2022-09-28 2022-11-01 常州联影智融医疗科技有限公司 电子电路单元和摄像单元
CN115695964A (zh) * 2022-09-28 2023-02-03 常州联影智融医疗科技有限公司 电子电路单元和摄像单元

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