WO2024067664A1 - Electronic circuit unit, camera unit and endoscope - Google Patents

Abstract

Provided in the embodiments of the present description are an electronic circuit unit, a camera unit and an endoscope. The electronic circuit unit comprises: a circuit substrate, the front face of the circuit substrate being used for arranging a sensor thereon, and at least one first groove being provided on the front face and/or a side face of the circuit substrate; and a first electronic component, the first electronic component being arranged in the at least one first groove.

Description

Electronic circuit unit, camera unit and endoscope

cross reference

This application claims priority to Chinese application No. 202211186387.5 filed on September 28, 2022, and priority to Chinese application No. 202211187585.3 filed on September 28, 2022, the entire contents of which are incorporated herein by reference.

Technical Field

The present invention relates to the technical field of electronic circuit devices, and in particular to an electronic circuit unit, a camera unit and an endoscope.

Background technique

In the process of medical diagnosis and treatment, it has been widely used to insert an endoscope into the internal part of the object to directly observe the lesion and then determine the cause of the disease. In the relevant technology of endoscope, the distance between the electronic components in the electronic circuit unit and the sensor is relatively far, which leads to increased impedance. When the signal is transmitted at high speed, it is easy to generate noise, resulting in poor data quality of the sensor. For example, when the sensor is a camera sensor, it affects the quality of the image finally obtained. In addition, since the electronic components in the electronic circuit unit are set at a relatively far distance, the hard part is longer, which increases the pain of the subject.

Summary of the invention

One of the embodiments of the present specification provides an electronic circuit unit, including: a circuit substrate, the front side of the circuit substrate is used to set a sensor, and at least one first groove is opened on the front side and/or side of the circuit substrate; a first electronic component, and the first electronic component is arranged in the at least one first groove.

In some embodiments, a first electrode is disposed in the at least one first groove, and the first electronic component is welded to the first electrode.

In some embodiments, the first electronic component is a passive device in a driving circuit.

In some embodiments, a second electronic component is further included, and at least one second groove is formed on the side surface of the circuit substrate, and the second electronic component is disposed in the at least one second groove.

In some embodiments, a second electronic component is further included, and at least one second groove is formed on the back side of the circuit substrate, and the second electronic component is disposed in the at least one second groove.

In some embodiments, a second electrode is disposed in the at least one second groove, and the second electronic component is welded to the second electrode.

In some embodiments, the second electronic component is an active device in a driving circuit.

In some embodiments, the first groove and the second groove are both disposed on a side surface of the circuit substrate, and along an axial direction of the circuit substrate, a distance from the first groove to the sensor is smaller than a distance from the second groove to the sensor.

In some embodiments, the dimension of the circuit substrate along its axial direction is in the range of 1 mm-10 mm.

In some embodiments, a plurality of third grooves are further provided on the side of the circuit substrate, a plurality of positioning portions are provided on the back side of the circuit substrate, and the plurality of positioning portions are correspondingly connected to the plurality of third grooves. The electronic circuit unit also includes: a first cable, the first cable is arranged corresponding to the third grooves, the first cable passes through the corresponding positioning portion and one end is arranged in the corresponding third groove.

In some embodiments, a third electrode is disposed in the plurality of third grooves, and one end of the first cable is welded to the third electrode.

In some embodiments, the plurality of third grooves are arranged circumferentially along a side surface of the circuit substrate.

In some embodiments, the plurality of third grooves are mutually independent grooves opened on the side plane of the circuit substrate, or the plurality of third grooves are grooves opened secondary on the basis of the strip grooves on the side surface of the circuit substrate.

In some embodiments, the positioning portion is not in communication with a side portion of the corresponding third groove, and the positioning portion is in communication with an interior of the corresponding third groove.

In some embodiments, the positioning portion is in communication with the side and interior of the corresponding third groove.

In some embodiments, the electronic circuit unit further includes one or more second cables, and one end of the second cable is connected to one end of the corresponding first cable.

In some embodiments, a fourth electrode is disposed in the third groove, one end of the second cable is welded to the fourth electrode, and the fourth electrode is connected to the third electrode disposed in the third groove.

In some embodiments, an electronic circuit unit as described above; and a sensor; wherein the electronic circuit unit includes: a circuit substrate, the front side of the circuit substrate is used to set the sensor, and at least one first groove is opened on the front side and/or side of the circuit substrate; a first electronic component, the first electronic component is arranged in the at least one first groove.

One of the embodiments of the present specification provides an endoscope, comprising: an operating portion and an insertion portion, the insertion portion comprising a camera unit, the camera unit being disposed at one end of the insertion portion inserted into a body; wherein the camera unit comprises an electronic circuit unit as described above, and the sensor; wherein the electronic circuit unit comprises: a circuit substrate, the front side of the circuit substrate being used to set the sensor, at least one first groove being formed on the front side and/or side of the circuit substrate; and a first electronic component, the first electronic component being disposed in the at least one first groove.

In some embodiments, a second electronic component is further included, and the second electronic component is disposed in the operating portion.

In some embodiments, the sensor includes any one or more of a camera sensor, an ultrasonic sensor, a position sensor, a distance sensor, or an infrared sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

The present application will be further described in the form of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:

FIG1 is a schematic diagram of the structure of an electronic circuit unit provided according to some embodiments of the present specification;

FIG2a is a cross-sectional view of an electronic circuit unit in which an electronic component is welded to the bottom of a groove according to some embodiments of the present specification;

FIG2b is a cross-sectional view of an electronic circuit unit in which an electronic component is welded to a side of a groove according to some embodiments of the present specification;

FIG3a is a schematic diagram of a third groove provided as a polygonal hole according to some embodiments of the present specification;

FIG3b is a schematic diagram of a third groove provided as a circular hole according to some embodiments of the present specification;

FIG4a is a schematic diagram showing that the third groove is a hole and the third electrode is a planar connecting electrode according to some embodiments of the present specification;

FIG4b is a schematic diagram of a case where the third groove is a hole and the third electrode is a circular groove-shaped connecting electrode according to some embodiments of the present specification;

FIG5a is a schematic diagram showing that the third groove is open-shaped and the third electrode in the third groove is a planar connecting electrode according to some embodiments of the present specification;

FIG5b is a schematic diagram of a third groove being open-shaped and a third electrode in the third groove being an upward convex polygonal connecting electrode according to some embodiments of the present specification;

FIG5c is a schematic diagram showing that the third groove is open and the third electrode in the third groove is a concave quadrilateral connecting electrode according to some embodiments of the present specification;

FIG5d is a schematic diagram of a third groove being open and a third electrode in the third groove being a concave circular groove-shaped connecting electrode according to some embodiments of the present specification;

6 is a schematic diagram showing that one end of a second cable and a first cable are connected to each other as a whole and then inserted into a positioning portion and connected by welding through a third groove according to some embodiments of the present specification.

FIG7 is a schematic diagram of the structure of an electronic circuit unit provided according to some embodiments of this specification;

FIG8a is a cross-sectional view of an electronic circuit unit in which an electronic component is welded to the bottom of a groove according to some embodiments of the present specification;

FIG8b is a cross-sectional view of an electronic circuit unit in which an electronic component is welded to a side of a groove according to some embodiments of the present specification;

FIG9a is a schematic diagram of a third groove provided as a polygonal hole according to some embodiments of the present specification;

FIG9b is a schematic diagram of a third groove provided as a circular hole according to some embodiments of the present specification;

FIG. 10a is a schematic diagram showing that the third groove is a hole and the third electrode is a planar connecting electrode according to some embodiments of the present specification;

FIG. 10 b is a schematic diagram of a case where the third groove is a hole and the third electrode is a circular groove-shaped connecting electrode according to some embodiments of the present specification;

FIG. 11a is a schematic diagram showing that the third groove is open-shaped and the third electrode in the third groove is a planar connecting electrode according to some embodiments of the present specification;

FIG. 11 b is a schematic diagram of a third groove being open-shaped and a third electrode in the third groove being an upward convex polygonal connecting electrode according to some embodiments of the present specification;

FIG. 11c is a schematic diagram showing that the third groove is open and the third electrode in the third groove is a concave quadrilateral connecting electrode according to some embodiments of the present specification;

FIG. 11d is a schematic diagram of a third groove being open and a third electrode in the third groove being a concave circular groove-shaped connecting electrode according to some embodiments of the present specification;

FIG12 is a schematic diagram of the structure of a camera unit provided according to some embodiments of this specification;

FIG13 is a schematic diagram of the structure of an electronic circuit unit provided according to some embodiments of this specification;

FIG14a is a cross-sectional view of an electronic circuit unit according to some embodiments of the present specification;

FIG14b is a cross-sectional view of an electronic circuit unit according to some embodiments of the present specification;

FIG15a is a schematic diagram of a third groove provided as a polygonal hole according to some embodiments of the present specification;

FIG15b is a schematic diagram of a third groove provided as a circular hole according to some embodiments of the present specification;

FIG16a is a schematic diagram showing that the third groove is configured as a hole and the third electrode disposed in the third groove is a planar connecting electrode according to some embodiments of the present specification;

FIG16b is a schematic diagram showing that the second groove is configured as a hole and the third electrode disposed in the second groove is a circular groove-shaped connecting electrode according to some embodiments of the present specification;

FIG17a is a schematic diagram showing that the third groove is set to an open shape and the third electrode arranged in the third groove is a concave plane connecting electrode according to some embodiments of the present specification;

FIG17b is a schematic diagram showing that the third groove is set to an open shape and the third electrode arranged in the third groove is a protruding planar connecting electrode according to some embodiments of the present specification;

FIG. 18a is a schematic diagram showing that a plurality of third grooves are configured as holes and a positioning portion is configured as a through hole according to some embodiments of the present specification;

FIG. 18b is a schematic diagram showing that a plurality of third grooves are provided in an opening shape and a positioning portion is provided in a through hole shape according to some embodiments of the present specification;

FIG18c is a schematic diagram of a second cable and one end of a first cable connected to each other as a whole and then inserted into a positioning portion and connected by welding through a third groove according to some embodiments of the present specification;

FIG. 19a is a schematic diagram showing that a plurality of third grooves are configured as holes and a positioning portion is configured as an open hole according to some embodiments of the present specification;

FIG. 19b is a schematic diagram showing that a plurality of third grooves are arranged in an open shape and a positioning portion is arranged in a hole shape according to some embodiments of the present specification;

FIG20 is a schematic diagram of the structure of a camera unit provided according to some embodiments of this specification;

FIG21 is a schematic diagram of two first electronic components disposed in a first groove according to some embodiments of this specification;

FIG. 22 is a schematic diagram of the structure of an endoscope provided according to some embodiments of the present specification.

Detailed ways

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

It should be understood that the "system", "device", "unit" and/or "module" used herein are a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and/or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "comprises" and "includes" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

In the related technologies of endoscopes, the electronic circuit unit is composed of two circuit substrates, which increases the axial length and makes the hard part relatively long, making the front end of the endoscope inflexible when performing surgery in the body. The longer hard part can also increase the patient's pain when inserted into the human body. In addition, when the electronic components are installed on the back of a circuit substrate, the impedance of the power supply and signal wires increases when they are relatively far away from the sensor. When the sensor captures a scene with a large change in light and dark, the increase in current change will increase the impedance of the wire impedance, which will increase the change in the impedance voltage drop, causing the power supply voltage supplied to the sensor to exceed the specification range and unstable operation. In order to maintain the stable operation of the power supply voltage supplied to the sensor, the capacity of the electronic components must be increased, resulting in an increase in the size of the electronic components and an overall increase in the size of the electronic circuit unit, which is not suitable for use in endoscopes. In addition, during high-speed signal transmission, the high impedance of the signal wire is also prone to noise.

Among them, depending on the actual endoscope situation, the type and number of sensors specifically included in the hard part of the insertion part may vary to a certain extent. For example, in some endoscopes, the insertion part may include a camera sensor (such as an image sensor). In other ultrasonic endoscopes, the sensor may include an ultrasonic sensor. In addition to camera sensors and ultrasonic sensors, the endoscope may also include other sensors such as position sensors and distance sensors. When the insertion part includes a camera sensor, when the electronic components are mounted on a circuit substrate When the back side is relatively far away from the camera sensor, the camera sensor cannot be stably driven, resulting in poor image quality. Similarly, when the insertion portion includes an ultrasonic sensor, when the electronic components are mounted on the back side of a circuit board, relatively far away from the ultrasonic sensor, the ultrasonic sensor cannot be stably driven, resulting in poor quality of the ultrasonic signal obtained.

At the same time, the number of circuit substrates increases, the production cost increases, the number of precision welding and precision assembly increases, the number of work sections increases, and the process is complicated.

Based on the above problems, the embodiments of this specification propose an electronic circuit unit, which uses a circuit substrate, and opens a recess (for example, a first groove) on the front side (the side for installing the sensor) and/or the side (the side adjacent to the front side of the circuit substrate) of the circuit substrate to accommodate the electronic components (for example, the first electronic component, the second electronic component) required to drive the sensor (for example, the camera sensor). Such an arrangement not only improves the working stability of the camera sensor and improves the quality of the sensor data obtained (such as the image quality of the camera sensor), but also greatly shortens the length of the hard part of the endoscope head structure, increases the flexibility of the bending of the front end of the endoscope during surgery, and reduces the pain of the subject. At the same time, by accommodating electronic components by opening a recess on a single circuit substrate, the manufacturing process and manufacturing cost are simplified. The following will take the sensor including the camera sensor as an example, and combine Figures 1 to 12 to describe the electronic circuit unit in detail.

In some embodiments, the electronic circuit unit may include a circuit substrate and a first electronic component, and one side of the circuit substrate is used to place a sensor, where the side of the circuit substrate used to place the sensor is defined as the front side of the circuit substrate, the side of the circuit substrate adjacent to the front side is defined as the side side, and the side of the circuit substrate opposite to the front side is defined as the back side. In some embodiments, at least one first groove may be provided on the front side of the circuit substrate, and the first electronic component is disposed in the first groove. In some embodiments, at least one first groove may be provided on the side side of the circuit substrate, and the first electronic component is disposed in the first groove. In some embodiments, the first groove may be provided on both the front and side sides of the circuit substrate, and the first electronic component is located in the first groove provided on the front and side sides of the circuit substrate.

Exemplarily, the embodiment described here is that the sensor is a camera sensor. In actual applications, the sensor may include other types of sensors. For example, the sensor may include one or more of a camera sensor, an ultrasonic sensor, a position sensor, a distance sensor, and an infrared sensor. For example, the sensor is a camera sensor, and the electronic circuit unit can be used as a camera unit of an endoscope to obtain image information inside the body of the detection object. In some embodiments, the circuit substrate can be a rectangular parallelepiped, a cylinder, a terrace, a hemisphere, or other regular or irregular three-dimensional structures. The shape of the circuit substrate can be adaptively adjusted according to the specific application scenario and the size and quantity of electronic components.

In the embodiments of the present specification, the electronic components are arranged on the side of the circuit substrate close to the sensor, which can reduce the distance between the electronic components and the imaging sensor, thereby not only improving the image quality of the acquired image, but also greatly shortening the length of the hard part when used in the imaging sensor, thereby reducing the pain of the subject.

The embodiment in which the first groove is disposed on the side surface of the circuit substrate will be described in detail below with reference to FIGS. 1 to 12 .

FIG1 is a schematic diagram of the structure of an electronic circuit unit according to an embodiment of the present specification. Taking the sensor 21 as an imaging sensor as an example for explanation, as shown in FIG1, in some embodiments, the electronic circuit unit may include: a circuit substrate 100 and a first electronic component 200. Among them, the front of the circuit substrate 100 is used to set the imaging sensor, and the side of the circuit substrate 100 may be provided with at least one first groove 110, and the first electronic component 200 is arranged in the first groove 110. As shown in FIG1, the circuit substrate 100 is a rectangular parallelepiped structure as a specific example for explanation, where the center of the circuit substrate 100 is taken as the coordinate origin, the surface in the positive direction of the x-axis is the front, the surface in the negative direction of the x-axis is the back, and the surface in the positive and negative directions of the y-axis and the positive and negative directions of the z-axis are the side. It should be noted that the first groove 110 is not limited to the side in the positive direction of the y-axis shown in FIG1, and the first groove 110 can be located on any one or more sides of the circuit substrate 100. For example, the number of the first groove 110 is one, and the first groove 110 can also be located on the side of the circuit substrate 100 in the negative direction of the y-axis, the positive direction of the z-axis, or the negative direction of the z-axis. For another example, the number of the first groove 110 is multiple, and the multiple first grooves 110 can be located on any multiple side of the circuit substrate 100 in the positive direction of the y-axis, the negative direction of the y-axis, the positive direction of the z-axis, and the negative direction of the z-axis.

It should be noted that, in some embodiments, the first groove 110 may also be located on the front side of the circuit substrate 100. For details about the first groove 110 being disposed on the front side of the circuit substrate 100, reference may be made to the description elsewhere in this specification, for example, FIG. 13 to FIG. 21 and their related descriptions. In some embodiments, the first groove 110 may also be disposed on both the front side and the side side of the circuit substrate 100. In addition, when the circuit substrate 100 is other three-dimensional structures (for example, a cylinder, a triangular prism, a pentagonal prism, a step, etc.), the front side of the circuit substrate 100 may be a bottom side of the three-dimensional structure, and the side side of the circuit substrate 100 may be a side adjacent to the bottom side.

In some embodiments, the first electronic component 200 may be a passive device in a driving circuit. In some embodiments, the passive device may include any one or more of a capacitor, a resistor, an inductor, a converter, a filter, a mixer, a gradienter, and a switch. Taking the sensor as an imaging sensor as an example, the passive devices in the imaging driving circuit that drives the imaging sensor to work can be selectively stored in the first groove 110. In other words, the components that need to be close to the imaging sensor are stored in the first groove 110. In one embodiment of the present specification, the type of passive devices stored in the first groove 110 can be screened according to the operating characteristics of the passive devices (for example, the operating temperature). For example, during the operation of the resistor, its operating temperature is high, which will also affect the high-speed signal transmission, resulting in the inability to stably drive the imaging element and the acquired image quality is poor. Therefore, this type of passive device does not need to be stored in the first groove. 110. In a specific embodiment provided in the present specification, a passive component that does not generate heat can be stored in the first groove 110. The heat generated by the passive component here is very small, and basically will not affect the camera sensor, thereby ensuring the normal operation of the camera sensor and ensuring that the acquired image quality is high. As another possible implementation, the passive components in the camera drive circuit, such as capacitors, etc., can be stored in the first groove. In an embodiment of the present specification, the type of passive components stored in the first groove can also be screened according to the working characteristics of the passive components (for example, working temperature). For example, passive components with lower working temperatures are stored inside the first groove.

In some embodiments, the electronic circuit unit further includes a second electronic component 300, and at least one second groove 120 is provided on the side of the electronic circuit unit, and the second electronic component 300 is disposed in at least one second groove 120. It should be noted that the second groove 120 is not limited to the side located in the positive direction of the y-axis as shown in FIG. 1, and the second groove 120 can be located on any one or more sides of the circuit substrate 100. For example, the number of the second groove 120 is one, and the second groove 120 can also be located on the side in the negative direction of the y-axis, the positive direction of the z-axis, or the negative direction of the z-axis of the circuit substrate 100. For another example, the number of the second groove 120 is multiple, and the multiple second grooves 120 can be located on any multiple sides in the positive direction of the y-axis, the negative direction of the y-axis, the positive direction of the z-axis, and the negative direction of the z-axis of the circuit substrate 100. In some embodiments, the second groove 120 can also be located on the back side of the circuit substrate 100 (the surface along the negative direction of the x-axis shown in FIG. 1).

The second electronic component 300 is an active device in the camera drive circuit. In some embodiments, the active device may include, but is not limited to, any one or more of a force-shaping device (e.g., a transistor), an analog integrated circuit (e.g., an integrated operational amplifier), and a digital integrated circuit device (e.g., a driver IC and a waveform shaping circuit IC, etc.). In some embodiments, part of the first electronic component 200 may also be placed in the second groove, such as a resistor in a passive device. During operation, the resistor has a high operating temperature, which may also affect high-speed signal transmission, resulting in an inability to stably drive the camera element and poor image quality. Therefore, this type of passive device does not need to be housed in the first groove 110. At this time, the first electronic component 200 that generates some heat may be placed in the second groove 120.

In some specific application scenarios, for example, the electronic circuit unit is used in an endoscope, and only the first groove 110 for placing the first electronic component 200 may be provided on the circuit substrate 100, and the second electronic component 300 is provided in the operating part of the endoscope (for example, the operating part 2 shown in FIG. 22 ). Active devices are larger in size than passive devices. At this time, the second electronic component 300 with a larger size is provided in the operating part of the endoscope, so that the volume of the second electronic circuit unit is relatively small, thereby reducing the pain of the detection object during the endoscopic detection. In addition, the operating part is located in the external environment, and the heat generated by the second electronic component 300 can also be quickly dissipated, which will not affect the normal operation of the camera sensor, and can effectively avoid the situation where the image quality is reduced due to the heating of the active device.

In order to reduce the influence of the second electronic component 300 in the second groove 120 on the sensor 21 (for example, a camera sensor), in some embodiments, the first groove 110 and the second groove 120 are both arranged on the side of the circuit substrate 100, and along the axial direction of the circuit substrate 100, the distance from the first groove 110 to the camera sensor is smaller than the distance from the second groove 120 to the camera sensor. In other words, the first groove 110 is closer to the front of the circuit substrate 100 than the second groove 120. The axial direction here is the x-axis direction shown in FIG. 1 .

1 , at least one first groove 110 is formed on the side of the circuit substrate 100 near the front side, and at least one second groove 120 is formed on the side of the circuit substrate 100 near the back side of the circuit substrate 100 .

A first groove 110 and a second groove 120 are provided on the side of the circuit substrate 100, and a first electronic component 200 is arranged in the first groove 110, and a second electronic component 300 is arranged in the second groove 120, so that the electronic components are installed at the position closest to the camera sensor, the overall size of the electronic circuit unit is shortened, and the miniaturization of the endoscope head structure can be achieved. While the diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope can be bent more flexibly when the endoscope is operated in the subject's body, reducing the pain of the patient. In addition, during the high-speed driving and signal transmission of the camera sensor, since the first electronic component 200 is closer to the camera sensor, the impedance becomes smaller, the noise is reduced, and a high-quality image can be obtained. The second electronic component 300 is far away from the camera sensor, and the heat generated by the second electronic component 300 arranged on the side of the circuit substrate 100 is easier to dissipate, which has less impact on the camera sensor, ensuring the normal operation of the camera sensor, and can effectively avoid the situation where the image quality is reduced due to the heating of the active device. At the same time, the use of a single circuit substrate 100 can simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.

It should be noted that the first groove 110 and the second groove 120 are not limited to being located on the same side of the circuit substrate 100 as shown in FIG. 1 , and the first groove 110 and the second groove 120 can also be located on different sides of the circuit substrate 100. For example, the first groove 110 is located on the side of the circuit substrate 100 along the positive direction of the y-axis or the negative direction of the y-axis, and the second groove 120 is located on the side of the circuit substrate 100 along the positive direction of the z-axis or the negative direction of the z-axis. For another example, the first groove 110 is located on the side of the circuit substrate 100 along the positive direction of the z-axis or the negative direction of the z-axis, and the second groove 120 is located on the side of the circuit substrate 100 along the positive direction of the y-axis or the negative direction of the y-axis. When the first groove 110 and the second groove 120 are arranged on different sides of the circuit substrate 100, the space of each side of the circuit substrate 100 can be effectively utilized, and the size of the circuit substrate 100 along the axial direction (the x-axis direction shown in FIG. 1 ) can be further reduced, so that the overall size of the electronic circuit unit can be made smaller.

In some embodiments, when the first groove 110 and the second groove 120 are arranged on the same side of the circuit substrate 100, the size of the circuit substrate 100 along its axial direction may be 2 mm-10 mm. Preferably, when the first groove 110 and the second groove 120 are arranged on different sides of the circuit substrate 100, the size of the circuit substrate 100 along its axial direction may be 1 mm-7 mm, so as to further reduce the size of the circuit substrate 100 along the axial direction (the x-axis direction shown in FIG. 1 ), so that the overall size of the electronic circuit unit can be made smaller.

The number of the first groove 110 and the second groove 120 can be calibrated according to actual needs. Of course, more first grooves 110 and second grooves 120 can be set than the actual needs as a backup, and the specific number is not limited. The first electronic component 200 is arranged in the corresponding first groove 110. As a possible implementation, a first electronic component 200 can be arranged in a first groove 110. As another possible implementation, a plurality of first electronic components 200 can also be arranged in a first groove 110, and the specific arrangement can be made according to actual application requirements. The second electronic component 300 is arranged in the corresponding second groove 120. As a possible implementation, a second electronic component 300 can be arranged in a second groove 120. As another possible implementation, a plurality of second electronic components 300 can also be arranged in a second groove 120, and the specific arrangement can be made according to actual application requirements.

Specifically, as shown in FIG. 2a and FIG. 2b, the sensor 21 is taken as an example of an image sensor, a photosensitive portion (not shown in the figure) is formed on the front of the image sensor, and a plurality of convex portions 22 are provided on the back of the image sensor. Among them, the side of the image sensor close to the front of the circuit substrate 100 is the back, and the side away from the front of the circuit substrate 100 is the front. Each convex portion 22 is correspondingly provided with an image sensor connecting electrode 23, and the back of the image sensor is welded to the front of the circuit substrate 100 through the convex portion 22 and the image sensor connecting electrode 23. In some embodiments, the front of the circuit substrate 100 is within the projection surface of the image sensor. The projection surface of the image sensor refers to the projection of the back of the image sensor along the positive direction of the x-axis shown in FIG. Here, the front of the circuit substrate 100 is within the projection surface of the image sensor, which can increase the contact area when the circuit substrate 100 is connected to the image sensor, thereby improving the stability of the image sensor and the circuit substrate 100. In order to further improve the stability and waterproofness between the camera sensor and the circuit substrate 100, in some embodiments, a sealing resin 24 is filled between the camera sensor and the circuit substrate 100. In some embodiments, the projection of the first groove 110 on the front of the circuit substrate 100 does not overlap with the position of the camera sensor connection electrode 23. This can prevent the camera sensor connection electrode 23 from contacting the first electronic component 200 or the first electrode in the first groove 110, avoid short circuits in the internal circuit of the electronic circuit unit, and also facilitate the arrangement of wires and circuits inside the electronic circuit unit. In some alternative embodiments, the back of the camera sensor and the front of the circuit substrate 100 can also be electrically connected in other ways. For example, a plurality of contact pins are provided on the back of the camera sensor, and contacts corresponding to the plurality of contact pins are provided on the front of the circuit substrate 100. When the back of the camera sensor is connected to the front of the circuit substrate 100, each contact pin corresponds to the contact one by one, thereby realizing the electrical connection of the camera sensor circuit substrate 100. Furthermore, after the back side of the image sensor is connected to the front side of the circuit substrate 100 , a resin layer may be coated around the image sensor and the circuit substrate 100 to ensure stability and waterproofness between the image sensor and the circuit substrate 100 .

In one embodiment of the present specification, as shown in FIG2a and FIG2b, a first electrode 111 is disposed in the first groove 110, and the first electronic component 200 is soldered to the first electrode 111. The camera sensor connecting electrode 23 may be connected to the first electrode 111 through a through hole 25.

In one embodiment of the present specification, as shown in FIG2 , a second electrode 121 is disposed in the second groove 120 , and the second electronic component 300 is soldered to the second electrode 121 . The camera sensor connection electrode 23 may be connected to the second electrode 121 through a through hole 25 .

In some embodiments, the first electrode 111 may be disposed on the connecting wall between the through hole 25 and the first groove 110. The connecting wall may be disposed at various positions of the first groove 110 according to actual needs. As a possible implementation, as shown in FIG. 2a, the connecting wall is disposed on the bottom surface of the first groove 110, that is, the first electronic component 200 may be welded to the bottom surface of the first groove 110. Alternatively, as shown in FIG. 2b, the connecting wall may be disposed on the side surface of the first groove 110, that is, the first electronic component 200 may be welded to the side surface of the first groove 110. The second electrode 121 may be disposed on the connecting wall between the through hole 25 and the second groove 120, wherein the connecting wall may be disposed at various positions of the second groove 120 according to actual needs. As a possible implementation, as shown in FIG. 2a, the connecting wall is disposed on the bottom surface of the second groove 120, that is, the second electronic component 300 may be welded to the bottom surface of the second groove 120. As shown in FIG. 2b, the connecting wall is disposed on the side surface of the second groove 120, that is, the second electronic component 300 may be welded to the side surface of the second groove 120. It should be noted that the bottom surface of the first groove 110 or the second groove 120 refers to the surface opposite to the side surface of the circuit substrate 100. Correspondingly, the side surface of the first groove 110 or the second groove 120 refers to the surface adjacent to the bottom surface of the first groove 110.

The electronic circuit unit provided in this specification adopts a circuit substrate 100, and the overall thickness and size of the circuit substrate 100 is controlled within the projection area of the camera sensor. At the same time, the electronic components required for the camera sensor operation are welded on the side of the circuit substrate 100, so that the electronic components are installed at the position closest to the camera sensor, shortening the overall size, and miniaturizing the endoscope head structure. While the diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope can be bent more flexibly during surgery in the subject's body, and the pain of the patient can be reduced when inserted into the human body. In addition, during the high-speed driving and signal transmission of the camera sensor, since the first electronic component 200 is closer to the camera sensor, the circuit impedance between the two becomes smaller, the voltage supplied to the camera sensor is stable when the working current changes, the signal noise is reduced, the camera sensor works stably and can obtain high-quality images. At the same time, the use of a single circuit substrate 100 can simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.

In one embodiment of the present specification, as shown in FIG. 1 , FIG. 2a and FIG. 2b , a plurality of third grooves 130 are further provided on the side of the circuit substrate 100, and a plurality of positioning portions 140 are provided on the back of the circuit substrate 100, and the plurality of positioning portions 140 are correspondingly connected to the plurality of third grooves 130. In some embodiments, the electronic circuit unit further includes a first cable 400, and the first cable 400 is arranged corresponding to the third groove 130, and the first cable 400 passes through the corresponding positioning portion 140 and one end is arranged in the corresponding third groove 130. A third electrode 131 is provided, and one end of the first cable 400 is welded to the third electrode 131 .

Specifically, a plurality of positioning portions 140 may be provided on the back of the circuit substrate 100, and a plurality of third grooves 130 may be provided on the side of the circuit substrate 100. One end of the first cable 400 may be welded to the third electrode 131 in the third groove 130 after passing through the corresponding positioning portion 140. The positioning portion 140 may be a positioning hole, and the positioning portion 140 is used to position the first cable 400 passing through. Thus, the corresponding first cable 400 passing through is positioned by the positioning portion 140, so that each cable is independent of each other, which can effectively avoid the short circuit of the welding point, and is neat and easy to distinguish and troubleshoot the circuit.

Among them, the other end of the first cable 400 is connected to the external control system, and the external control system is used to power the camera sensor and provide a pulse drive signal through the first cable 400. In addition, the external control system also communicates with the camera sensor through the first cable 400 to receive the transmission image sent by the camera sensor.

In one embodiment of the present specification, the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100. It is understood that the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100 in two ways.

In one embodiment of the present specification, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate 100 .

Specifically, a plurality of mutually independent grooves may be provided on the side plane of the circuit substrate 100, that is, the plurality of third grooves 130 are holes. In one specific embodiment of the present specification, the shapes of the plurality of third grooves 130 may be set according to the actual application. As a possible implementation, as shown in FIG. 3a, the plurality of third grooves 130 may be set as polygonal holes. As another possible implementation, as shown in FIG. 3b, the plurality of third grooves 130 may be set as circular holes. In another specific embodiment of the present specification, when the third groove 130 is a hole, the shape of the third electrode 131 provided in the third groove 130 may also be set. As a possible implementation, as shown in FIG. 4a, the third electrode 131 may be a planar connecting electrode (coplanar with the step surface of the circuit board). As another possible implementation, as shown in FIG. 4b, the third electrode 131 may be a circular groove connecting electrode (the connecting electrode is lower than the step surface of the circuit board). As other possible implementations, the third electrode 131 disposed in the third groove 130 may also be in other forms, for example, it may be an upward convex polygonal connection electrode (the connection electrode is higher than the step surface of the circuit board), or it may be a concave quadrilateral connection electrode (the connection electrode is lower than the step surface of the circuit board). Thus, by setting the plurality of third grooves 130 as a plurality of mutually independent grooves, it is possible to effectively avoid the occurrence of short circuits at the welding points, and the circuits are neatly and easily distinguished and checked.

In another embodiment of the present specification, the plurality of third grooves 130 are grooves opened a second time on the basis of the annular groove on the side surface of the circuit substrate.

Specifically, a strip groove may be firstly opened on the side of the circuit substrate 100, wherein the strip groove runs through the four surfaces of the side of the circuit substrate 100 to form a rectangular annular groove, and then, a second opening is performed on the basis of the rectangular groove to obtain a plurality of third grooves 130, that is, the third groove 130 is open-shaped. Among them, according to the actual application, the shape of the third electrode 131 set in the third groove 130 can be set. As a possible embodiment, as shown in FIG. 5a, the third electrode 131 in the third groove 130 may be a planar connection electrode (coplanar with the step surface of the circuit board). As another possible embodiment, as shown in FIG. 5b, the third electrode 131 in the third groove 130 may be an upward convex polygonal connection electrode (the connection electrode is higher than the step surface of the circuit board). As another possible embodiment, as shown in FIG. 5c, the third electrode 131 in the third groove 130 may be a concave quadrilateral connection electrode (the connection electrode is lower than the step surface of the circuit board). As another possible implementation, as shown in FIG. 5 d , the third electrode 131 in the third groove 130 may be a concave circular groove-shaped connecting electrode (the connecting electrode is lower than the stepped surface of the circuit board).

The third groove 130 and the third electrode 131 disposed in the third groove 130 are matched and set according to actual needs.

It should be noted that, based on the different arrangements of the plurality of third grooves 130 , the corresponding communication modes between the plurality of positioning portions 140 and the plurality of third grooves 130 may also be arranged accordingly.

In one embodiment of the present specification, the positioning portion 140 is not connected to the side of the corresponding third groove 130 but is connected to the inside.

Specifically, as a possible implementation, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate 100, that is, the plurality of third grooves 130 are hole holes, and the positioning holes are not connected to the side of the corresponding third groove 130, but are connected inside, that is, the positioning holes are through-hole-shaped. As another possible implementation, the plurality of third grooves 130 are grooves opened twice on the basis of the strip-shaped grooves on the side of the circuit substrate, that is, the plurality of third grooves 130 are open-shaped, and the positioning holes are not connected to the side of the corresponding third groove 130, but are connected inside, that is, the positioning holes are through-hole-shaped.

In another embodiment of the present specification, the positioning hole is communicated with the side and the interior of the corresponding third groove 130 .

Specifically, as a possible implementation, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are hole holes, and the positioning holes are connected to the side and the interior of the corresponding third grooves 130, that is, the positioning holes are in the shape of openings. As another possible implementation, the plurality of third grooves 130 are grooves opened twice on the basis of the strip grooves on the side of the circuit substrate, that is, the plurality of third grooves 130 are in the shape of openings, and the positioning holes are connected to the side and the interior of the corresponding third grooves 130, that is, the positioning holes are in the shape of openings.

In one embodiment of the present specification, as shown in FIG1 , the electronic circuit unit may further include a second cable 500 . There may be one or more second cables 500 , and one end of the second cable 500 is connected to one end of the corresponding first cable 400 .

Specifically, as shown in FIG. 1 , a positioning groove 150 is also provided on the side of the circuit substrate 100. As a possible implementation, the number of the positioning grooves 150 is the same as the number of the second cables 500, and they are arranged one by one. As another possible implementation, the number of the positioning grooves 150 may be more than the number of the second cables 500, so as to be used as a backup, and can be directly called when the second cables 500 are increased. One end of the second cable 500 is first positioned by the positioning groove 150, and then welded to the third electrode 131, so as to be connected to one end of the corresponding first cable 400. Among them, one end of the second cable 500 is arranged one by one with one end of the first cable 400. The other end of the second cable 500 is connected to the lens driver, and the second cable 500 is used to input or output electrical signals. Thus, the corresponding second cables 500 passing through are positioned by the positioning groove 150, so that each cable is independent of each other, which can effectively avoid the situation of short circuit at the welding point, and is neat and easy to distinguish and troubleshoot the circuit.

In one embodiment of the present specification, a fourth electrode (not shown) is disposed in the third groove 130 , one end of the second cable 500 is welded to the fourth electrode, and the fourth electrode is connected to the third electrode 131 disposed in the third groove 130 .

Specifically, as a possible implementation, two rows of third grooves 130 may be provided on one side of the circuit substrate 100 where the positioning groove is provided, wherein the third electrode 131 is provided in one row of the third grooves 130, and the fourth electrode is provided in the other row of the third grooves 130. The positioning groove on the side of the circuit substrate 100 is provided corresponding to the second cable 500, one end of the second cable 500 is first positioned through the positioning groove, and then welded to the fourth electrode, and the fourth electrode is connected to the third electrode through a through hole, thereby connected to one end of the corresponding first cable 400. Alternatively, as shown in FIG. 6 , the second cable 500 and one end of the first cable 400 are connected to each other as a whole, and then inserted into the positioning hole and connected by welding through the third groove 130.

It should be noted that, according to actual needs, the positioning groove 150 can be set to different shapes. For example, the positioning groove 150 can be set to a circular groove shape.

In summary, according to the electronic circuit unit of the embodiment of the present specification, by opening the first groove 110 on the side of the circuit substrate 100 near the front to accommodate the first electronic component 200, the distance between the first electronic component 200 and the camera sensor is reduced, so that the circuit impedance between the two becomes smaller, the voltage supplied to the camera sensor is stable when the working current changes, and the signal noise is reduced. As a result, not only the camera sensor works stably, but also the image quality of the acquired image is improved. In addition, the length of the hard part of the endoscope head structure is greatly shortened, which reduces the pain of the subject during endoscopic detection. It should be noted that the camera sensor in the embodiment of the present specification is only used as a specific example of the sensor 21 to describe the electronic circuit unit. In some alternative embodiments, the camera sensor can be replaced by any one or more of an ultrasonic sensor, a position sensor, a distance sensor, an infrared sensor, etc.

It is understandable that, in addition to providing the first groove 110 and the second groove 120 on the side of the circuit substrate 100 in the above manner to respectively accommodate the first electronic component 200 and the second electronic component 300, the first groove 110 may also be provided only on the side of the circuit substrate 100. Correspondingly, some embodiments of this specification also propose an electronic circuit unit. Specifically, as shown in FIG7 , the electronic circuit unit of the embodiment of this specification may include: a circuit substrate 100 and a first electronic component 200.

In some embodiments, the front of the circuit substrate 100 is used to set the sensor 21 (for example, a camera sensor), and at least one first groove 110 is opened on the side of the circuit substrate 100. Among them, the number of the first grooves 110 opened can be calibrated according to actual needs. In some embodiments, more first grooves 110 can be set than the actual needs for backup, and the specific number is not limited. The first electronic component 200 is set in the corresponding first groove 110. As a possible implementation, a first electronic component 200 can be set in a first groove 110. As another possible implementation, a plurality of first electronic components 200 can also be set in a first groove 110, which can be specifically set according to actual application requirements. Among them, as shown in Figure 7, with the center of the circuit substrate 100 as the coordinate origin, the surface in the positive direction of the x-axis is the front side, the surface in the negative direction of the x-axis is the back side, and the surface in the positive and negative directions of the y-axis and the positive and negative directions of the z-axis are the side surfaces. It should be noted that the first groove 110 is not limited to the side surface in the positive direction of the y-axis shown in Figure 7, and the first groove 110 can be located on any one or more side surfaces of the circuit substrate 100. For example, the number of the first groove 110 is one, and the first groove 110 can also be located on the side of the circuit substrate 100 in the negative direction of the y-axis, the positive direction of the z-axis, or the negative direction of the z-axis. For another example, the number of the first groove 110 is multiple, and the multiple first grooves 110 can be located on any multiple side of the circuit substrate 100 in the positive direction of the y-axis, the negative direction of the y-axis, the positive direction of the z-axis, and the negative direction of the z-axis.

In some embodiments, the number of the first groove 110 is one, and the size of the circuit substrate 100 along its axial direction may be 1mm-5mm. In some embodiments, the number of the first groove 110 is multiple, and when the multiple first grooves 110 are arranged on the same side of the circuit substrate 100, the size of the circuit substrate 100 along its axial direction may be 2mm-7mm. In some embodiments, when the number of the first groove 110 is multiple, the multiple first grooves 110 are arranged on different sides of the circuit substrate 100, and the size of the circuit substrate 100 along its axial direction may be 1mm-5mm, so as to further reduce the size of the circuit substrate 100 along the axial direction (the x-axis direction shown in FIG. 7), so that the overall size of the electronic circuit unit can be made smaller.

Specifically, taking an imaging sensor as a specific example of the sensor 21, as shown in FIG8a and FIG8b, a photosensitive portion (not shown in FIG8a and FIG8b) is formed on the front of the imaging sensor, and a plurality of convex portions 22 are provided on the back of the imaging sensor. The side of the sensor close to the front of the circuit substrate 100 is the back side, and the side away from the front of the circuit substrate 100 is the front side. In some embodiments, the convex portion 22 is provided with a camera sensor connection electrode 23, and the back side of the camera sensor is welded to the front side of the circuit substrate 100 through the convex portion 22 and the camera sensor connection electrode 23. The front side of the circuit substrate 100 is within the projection surface of the camera sensor, and the camera sensor and the circuit substrate 100 are filled with a sealing resin 24. Among them, the projection of the first groove 110 on the front side of the circuit substrate 100 does not overlap with the position of the camera sensor connection electrode 23.

In one embodiment of the present specification, as shown in FIG8a and FIG8b, a first electrode 111 is disposed in the first groove 110, and the first electronic component 200 is soldered to the first electrode 111. The camera sensor connecting electrode 23 may be connected to the first electrode 111 through a through hole 25.

Specifically, the first electrode 111 can be arranged on the connecting wall between the through hole 25 and the first groove 110, wherein the connecting wall can be arranged at various positions of the first groove 110 according to actual needs. As a possible implementation, as shown in FIG8a, the connecting wall is arranged on the bottom surface of the first groove 110, that is, the first electronic component 200 can be welded on the bottom surface of the first groove 110. As shown in FIG8b, the connecting wall is arranged on the side surface of the first groove 110, that is, the first electronic component 200 can be welded on the side surface of the first groove 110.

In some embodiments, the first electronic component 200 may be a passive device in the camera drive circuit. As a possible implementation, the passive devices in the camera drive circuit, such as capacitors, resistors, and inductors, may be stored in the first groove 110. In one embodiment of the present specification, the first grooves 110 at different positions may be selected for storage according to the working characteristics of the passive devices, such as the working temperature. For example, during the working process, the working temperature of the resistor is high, which will also affect the increase in the working temperature of the camera sensor, and the image quality obtained is poor. Therefore, this type of passive device needs to be stored in the first groove 110 opened on the side of the circuit substrate 100 and adjacent to the back of the circuit substrate 100. In a specific embodiment provided in the present specification, the passive device that does not generate heat can be stored in the first groove 110 opened on the side of the circuit substrate 100 adjacent to the front, and the passive device that generates heat can be stored in the first groove 110 opened on the side of the circuit substrate 100 adjacent to the back. It should be noted that the active device can also be stored in the first groove 110 opened on the side of the circuit substrate 100 adjacent to the back.

The electronic circuit unit provided in this specification adopts a circuit substrate 100, and the overall thickness and size of the circuit substrate 100 is controlled within the projection area of the imaging element. Furthermore, on the side of the circuit substrate 100, the electronic components required for the operation of the imaging sensor are welded, so that the electronic components are installed at the position closest to the sensor 21, and the overall size is shortened, which can realize the miniaturization of the endoscope head structure. While the diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope can be bent more flexibly during the operation in the subject's body, and the pain of the patient can be reduced when the endoscope is inserted into the human body. In addition, the electronic components are installed at the position closest to the sensor 21, which improves the signal quality of the sensor. For example, when the sensor 21 is used as an imaging sensor, during the high-speed driving and signal transmission of the imaging sensor, since the first electronic component 200 is closer to the imaging sensor, the circuit impedance becomes smaller, the power supply voltage supplied to the sensor works stably, the noise is reduced, and a high-quality image can be obtained. For another example, when the sensor 21 is an ultrasonic sensor, since the first electronic component 200 is closer to the ultrasonic sensor, the impedance becomes smaller, the noise is reduced, and the ultrasonic sensor can be driven more stably, thereby improving the quality of the acquired ultrasonic signal. At the same time, using a single circuit substrate 100 can simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.

It should be noted that in the embodiments of the present specification, except that a row of first grooves 110 for accommodating electronic components is set on the side of the circuit substrate 100, which is different from the above-mentioned embodiment in that two rows of first grooves 110 for accommodating electronic components are set on the side of the circuit substrate 100, the settings of other connecting devices and the settings of each component are the same.

In one embodiment of the present specification, as shown in FIGS. 7, 8a and 8b, a plurality of third grooves 130 are further provided on the side of the circuit substrate 100, and a plurality of positioning portions 140 are provided on the back of the circuit substrate 100, and the plurality of positioning portions 140 are correspondingly connected to the plurality of third grooves 130. In some embodiments, the electronic circuit unit further includes a first cable 400, which is arranged corresponding to the third groove 130, passes through the corresponding positioning portion 140 and has one end arranged in the corresponding third groove 130.

A third electrode 131 is disposed in the third groove 130 , and one end of the first cable 400 is welded to the third electrode 131 .

Specifically, a plurality of positioning portions 140 may be provided on the back of the circuit substrate 100, and a plurality of third grooves 130 may be provided on the side of the circuit substrate 100. One end of the first cable 400 may be welded to the third electrode 131 in the third groove 130 after passing through the corresponding positioning portion 140. In some embodiments, the positioning portion 140 may be a positioning hole, and the positioning portion 140 is used to position the first cable 400 passing through. Thus, the corresponding first cable 400 passing through is positioned by the positioning portion 140, so that each cable is independent of each other, which can effectively avoid the short circuit of the welding point, and is neat and easy to distinguish and troubleshoot the circuit.

The other end of the first cable 400 is connected to an external control system, and the external control system is used to power the camera sensor and provide a pulse drive signal through the first cable 400. In addition, the external control system also communicates with the camera sensor through the first cable 400 to receive the transmission image sent by the camera sensor.

In one embodiment of the present specification, the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100. It is understood that the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100 in two ways.

In one embodiment of the present specification, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate 100 .

Specifically, a plurality of mutually independent grooves may be provided on the side plane of the circuit substrate 100, that is, the plurality of third grooves 130 are holes. In a specific embodiment of the present specification, the shapes of the plurality of third grooves 130 may be set according to the actual application. As a possible implementation, as shown in FIG. 9a, the plurality of third grooves 130 may be set as polygonal holes. As another possible implementation, as shown in FIG. 9b, the plurality of third grooves 130 may be set as circular holes. In another specific embodiment of the present specification, when the third groove 130 is a hole, the shape of the third electrode 131 provided in the third groove 130 may also be set. As a possible implementation, as shown in FIG. 10a, the third electrode 131 may be a planar connection electrode (coplanar with the step surface of the circuit board). As another possible implementation, as shown in FIG. 10b, the third electrode 131 may be a circular groove connection electrode (the connection electrode is lower than the step surface of the circuit board). As other possible implementations, the third electrode 131 provided in the third groove 130 may also be in other forms. For example, it can be a convex polygonal connection electrode (the connection electrode is higher than the step surface of the circuit board), or it can be a concave quadrilateral connection electrode (the connection electrode is lower than the step surface of the circuit board). Thus, by setting the plurality of third grooves 130 as a plurality of mutually independent grooves, it is possible to effectively avoid the occurrence of short circuits at the welding points, and the circuits are neatly distinguished and easy to troubleshoot.

In another embodiment of the present specification, the plurality of third grooves 130 are grooves opened a second time on the basis of the annular groove on the side surface of the circuit substrate.

Specifically, a strip groove may be firstly opened on the side of the circuit substrate 100. The strip groove runs through the four sides of the circuit substrate 100 to form a rectangular annular groove, and then, a second opening is performed on the basis of the rectangular groove to obtain a plurality of third grooves 130, that is, the third groove 130 is open-shaped. According to the actual application, the shape of the third electrode 131 provided in the third groove 130 may be set. As a possible implementation, as shown in FIG. 11a, the third electrode 131 in the third groove 130 may be a planar connection electrode (coplanar with the step surface of the circuit board). As another possible implementation, as shown in FIG. 11b, the third electrode 131 in the third groove 130 may be an upward convex polygonal connection electrode (the connection electrode is higher than the step surface of the circuit board). As another possible implementation, as shown in FIG. 11c, the third electrode 131 in the third groove 130 may be a concave quadrilateral connection electrode (the connection electrode is lower than the step surface of the circuit board). As another possible implementation, as shown in FIG. 11 d , the third electrode 131 in the third groove 130 may be a concave circular groove-shaped connecting electrode (the connecting electrode is lower than the stepped surface of the circuit board).

The third groove 130 and the third electrode 131 disposed in the third groove 130 are matched and set according to actual needs.

It should be noted that, based on the different arrangements of the plurality of third grooves 130 , the corresponding communication modes between the plurality of positioning portions 140 and the plurality of third grooves 130 may also be arranged accordingly.

In one embodiment of the present specification, the positioning portion 140 is not connected to the side of the corresponding third groove 130 but is connected to the inside.

Specifically, as a possible implementation, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are hole holes, and the positioning holes are not connected to the side of the corresponding third groove 130, but are connected inside, that is, the positioning holes are through-hole-shaped. As another possible implementation, the plurality of third grooves 130 are grooves opened twice on the basis of the strip-shaped grooves on the side of the circuit substrate, that is, the plurality of third grooves 130 are open-shaped, and the positioning holes are not connected to the side of the corresponding third groove 130, but are connected inside, that is, the positioning holes are through-hole-shaped.

In another embodiment of the present specification, the positioning hole is communicated with the side and the interior of the corresponding third groove 130 .

Specifically, as a possible implementation, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are hole holes, and the positioning holes are connected to the side and the interior of the corresponding third grooves 130, that is, the positioning holes are in the shape of openings. As another possible implementation, the plurality of third grooves 130 are grooves opened twice on the basis of the strip grooves on the side of the circuit substrate, that is, the plurality of third grooves 130 are in the shape of openings, and the positioning holes are connected to the side and the interior of the corresponding third grooves 130, that is, the positioning holes are in the shape of openings.

In one embodiment of the present specification, as shown in FIG. 7 , the electronic circuit unit may further include a second cable 500 , wherein there may be one or more second cables 500 , and one end of the second cable 500 is connected to one end of the corresponding first cable 400 .

Specifically, as shown in FIG. 7 , a positioning groove 150 is also provided on the side of the circuit substrate 100, wherein, as a possible implementation, the number of the positioning grooves 150 is the same as the number of the second cables 500, and they are arranged one by one. As another possible implementation, the number of the positioning grooves 150 may be more than the number of the second cables 500, so as to be used as a backup, and can be directly called when the second cables 500 are increased. One end of the second cable 500 is first positioned by the positioning groove 150, and then welded to the third electrode 131, so as to be connected to one end of the corresponding first cable 400. Among them, one end of the second cable 500 is arranged one by one with one end of the first cable 400. The other end of the second cable 500 is connected to the lens driver, and the second cable 500 is used to input or output electrical signals. Thus, the corresponding second cables 500 passing through are positioned by the positioning groove 150, so that each cable is independent of each other, which can effectively avoid the situation of short circuit at the welding point, and is neat and easy to distinguish and troubleshoot the circuit.

In one embodiment of the present specification, a fourth electrode (not shown) is disposed in the third groove 130 , one end of the second cable 500 is welded to the fourth electrode, and the fourth electrode is connected to the third electrode 131 disposed in the third groove 130 .

Specifically, as a possible implementation, two side surfaces of the positioning groove in the circuit substrate 100 may be provided. A row of third grooves. A third electrode 131 is arranged in one row of third grooves, and a fourth electrode is arranged in another row of third grooves. The positioning groove on the side of the circuit substrate 100 is arranged corresponding to the second cable 500, and one end of the second cable 500 is first positioned through the positioning groove and then welded to the fourth electrode. The fourth electrode is connected to the third electrode through a through hole, and thus connected to one end of the corresponding first cable 400. As shown in FIG. 6, one end of the second cable 500 and the first cable 400 are connected to each other as a whole and then inserted into the positioning hole and connected by welding through the third groove 130.

It should be noted that, according to actual needs, the positioning groove 150 can be set to different shapes, wherein the positioning groove 150 can be set to a circular groove shape.

It should be noted that when only one row of grooves for accommodating electronic components is provided on the side of the circuit substrate 100 , that is, at least one first groove 110 is provided, the first groove 110 and the plurality of third grooves 130 may also be provided in the same row.

The electronic circuit unit provided in the embodiment of this specification adopts a circuit substrate 100, and the overall thickness and size of the circuit substrate 100 is controlled within the projection area of the sensor 21. Furthermore, on the side of the circuit substrate, the electronic components required for the action of the sensor 21 are welded, so that the electronic components are installed at the position closest to the sensor 21, and the overall size is shortened, so that the endoscope head structure can be miniaturized. While the diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope can be bent more flexibly when the endoscope is operated in the subject's body, and the pain of the patient can be reduced when inserted into the human body. In addition, during the high-speed driving and signal transmission of the sensor 21, since the first electronic component 200 is closer to the sensor 21, the impedance becomes smaller, the power supply voltage supplied to the sensor is stable, the noise is reduced, and higher quality sensor data can be obtained. In addition, the use of a single circuit substrate 100 can simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size. In addition, the active device that generates heat is arranged on the side, which is conducive to heat dissipation, and can effectively avoid the situation where the sensor data quality decreases due to the heating of the active device.

In summary, according to the electronic circuit unit of the embodiment of this specification, by providing a first groove on the side of the circuit substrate near the front to accommodate the electronic components, the distance between the electronic components and the sensor 21 is reduced, thereby improving the quality of obtaining sensor data. In addition, the length of the hard part of the endoscope head structure is greatly shortened, which reduces the pain of the subject during endoscopic inspection. In addition, setting the heat-generating active device on the side is conducive to heat dissipation, which can effectively avoid the situation where the sensor data quality is reduced due to the heat generated by the active device.

Corresponding to the electronic circuit unit of the above embodiment, the present invention further proposes a camera unit.

As shown in Fig. 12, the camera unit of the embodiment of the present invention may include the above-mentioned electronic circuit unit and sensor 21. The first electronic component 200 and the second electronic component 300 are not shown.

The connection method between the electronic circuit unit and the sensor 21 is the same as the connection method between the electronic circuit unit and the camera sensor described in the above embodiment. Please refer to the description of the above embodiment. To avoid redundancy, it will not be described in detail here. According to the camera unit of the embodiment of this specification, by opening a first groove on the side of the circuit substrate near the front to accommodate the electronic components, the distance between the electronic components and the sensor 21 is reduced, thereby not only improving the quality of the acquired sensor data, but also greatly shortening the overall length of the camera unit.

In some embodiments, the first groove can be arranged on the front side of the circuit substrate for mounting the sensor 21 (for example, a camera sensor), in which case the first electronic component in the first groove is closer to the sensor 21. Setting the first groove on the front side of the circuit substrate can further reduce the distance between the electronic component and the sensor, thereby further improving the working stability of the sensor and the quality of the acquired sensor data. In addition, such a setting greatly shortens the length of the electronic circuit unit and the length of the hard part of the endoscope head structure when assembled at the end of the endoscope head, thereby alleviating the pain of the subject. The following will describe in detail the scheme of setting the first groove on the front side of the circuit substrate in conjunction with Figures 13-21.

Fig. 13 is a schematic diagram of the structure of an electronic circuit unit according to an embodiment of the present specification. As shown in Fig. 13 , in some embodiments, the electronic circuit unit may include a circuit substrate 100 and a first electronic component 200 .

In some embodiments, the front side of the circuit substrate 100 is used to set the sensor 21 (for example, a camera sensor), and one or more first grooves 110 are provided on the front side of the circuit substrate 100. It should be noted that the number of the first grooves 110 here is not limited to the multiple ones indicated in FIG. 13, and can also be one, and the number of the first grooves 110 can be calibrated according to actual needs. For example, in a specific production process, more first grooves 110 can be set than the actual needs for backup, and the specific number is not limited. The first electronic component 200 is set in the corresponding first groove 110. As a possible implementation, a first electronic component 200 can be set in a first groove 110. As another possible implementation, a plurality of first electronic components 200 can also be set in a first groove 110. For example, as shown in FIG. 21, two first electronic components 200 can be set in a first groove 110. The number of first electronic components 200 set in the first groove 110 can be set according to actual application requirements. As shown in FIG13 , the circuit substrate 100 is a rectangular parallelepiped structure as a specific example for description, where the center of the circuit substrate 100 is the coordinate origin, the surface in the positive direction of the x-axis is the front side, the surface in the negative direction of the x-axis is the back side, and the surfaces in the positive and negative directions of the y-axis and the positive and negative directions of the z-axis are the side surfaces. For the specific structure of the circuit substrate 100, reference may be made to the description elsewhere in this specification, and no further description will be given here.

Taking the sensor 21 as an imaging sensor as a specific example, as shown in FIG. 14a and FIG. 14b, a photosensitive portion is formed on the front side of the imaging sensor, and a plurality of convex portions 22 are provided on the back side of the imaging sensor. The side facing away from the front of the circuit substrate 100 is the back side, and the side away from the front of the circuit substrate 100 is the front side. In some embodiments, each convex portion 22 is correspondingly provided with an image sensor connection electrode 23, and the back side of the image sensor is welded to the front side of the circuit substrate 100 through the convex portion 22 and the image sensor connection electrode 23, and the front side of the circuit substrate 100 is within the projection surface of the image sensor. The projection surface of the image sensor refers to the projection of the back side of the image sensor along the positive direction of the x-axis shown in FIG. 13. Here, the front side of the circuit substrate 100 is within the projection surface of the image sensor, which can increase the contact area when the circuit substrate 100 is connected to the image sensor, thereby improving the stability of the image sensor and the circuit substrate 100. In some embodiments, the projection of the first groove 110 on the front side of the circuit substrate 100 does not overlap with the position of the image sensor connection electrode 23. In this way, the image sensor connection electrode 23 can be prevented from contacting the first electronic component 200 or the first electrode 111 in the first groove 110, thereby avoiding a short circuit in the internal circuit of the electronic circuit unit, and also facilitating the arrangement of wires and circuits in the electronic circuit unit.

In some embodiments, when the first groove 110 is disposed on the front side of the circuit substrate 100, the size of the circuit substrate 100 along its axial direction may be 1 mm to 5 mm. At this time, the size of the circuit substrate 100 along the axial direction (the x-axis direction shown in FIG. 7 ) is relatively small, ensuring that the overall size of the electronic circuit unit can be made smaller.

In one embodiment of the present specification, as shown in FIGS. 14a and 14b , a first electrode 111 is disposed in the first groove 110, and the first electronic component 200 is soldered to the first electrode 111. The image sensor connecting electrode 23 is connected to the first electrode 111, and a sealing resin 24 is filled between the image sensor and the circuit substrate 100 to ensure stability and waterproof performance between the image sensor and the circuit substrate 100.

In some embodiments, the camera sensor connection electrode 23 may be connected to the first electrode 111 through a through hole 25. As a possible implementation, the first electrode 111 may be disposed on a connecting wall between the through hole 25 and the first groove 110, wherein the connecting wall between the through hole 25 and the first groove 110 is the bottom surface or side surface of the first groove 110. Specifically, as shown in FIG. 14a, the first electronic component 200 is welded to the bottom surface of the first groove 110. As shown in FIG. 14b, the first electronic component 200 is welded to the side surface of the first groove 110. It should be noted that the bottom surface of the first groove 110 refers to the surface in the first groove 110 that is opposite to the position of the camera sensor. Correspondingly, the side surface of the first groove 110 refers to the surface adjacent to the bottom surface of the first groove 110.

In some embodiments, the first electronic component 200 may be a passive device in the camera drive circuit. In some embodiments, the passive device may include one or more of a capacitor, a resistor, an inductor, a converter, a filter, a mixer, a gradienter, and a switch. As a possible implementation, the passive devices in the camera drive circuit, such as capacitors, resistors, and inductors, may be stored in the first groove 110, that is, the components that need to be close to the camera sensor are stored in the first groove 110. In a specific embodiment of the present specification, the passive device that does not generate heat may be stored in the first groove 110. Specifically, the type of passive device stored in the first groove 110 may be screened according to the working characteristics of the passive device, such as the working temperature. For example, during the working process, the working temperature of the resistor is high, which will also affect the high-speed signal transmission, thereby causing the camera element to be unable to be stably driven, and the image quality obtained is poor. Therefore, this type of passive device does not need to be stored in the first groove 110. As another possible implementation, the passive components in the camera drive circuit, such as capacitors, may be stored in the first groove 110. In one embodiment of the present specification, the type of passive components stored in the first groove 110 can also be screened according to the working characteristics of the passive components, such as working temperature. For example, passive components with lower working temperature are stored in the first groove.

The electronic circuit unit provided in this specification adopts a circuit substrate 100, and the overall thickness of the circuit substrate 100 is controlled within the front projection area of the camera sensor to achieve a thin diameter. Further, on the welding surface (front side) of the camera sensor, a first groove 110 is formed between the welded electrodes of each camera sensor to accommodate the first electronic component 200 required for the camera sensor to operate, so that the first electronic component 200 is installed at the position closest to the camera sensor. In addition, the axial length of the electronic circuit unit is shortened, and the miniaturization of the endoscope head structure can be achieved. While the diameter is thinned, the length of the hard part of the endoscope head structure is also shortened, so that the front end of the endoscope is more flexible when the endoscope is operated in the subject's body, and the pain of the patient can be reduced when inserted into the human body. In addition, during the high-speed driving and signal transmission of the camera sensor, since the first electronic component 200 is installed on the front side of the circuit substrate 100 close to the camera sensor, it is closer to the camera sensor. Such a setting reduces the impedance between the camera sensor and the first electronic component 200, the camera sensor works more stably, the noise is reduced, and a high-quality image can be obtained. At the same time, the use of a single circuit substrate 100 can reduce the number of surface layers and bottom layers required for the same functions of multiple circuit boards, simplify the manufacturing process, reduce the manufacturing cost, and reduce the axial size.

In some embodiments, a second groove (not shown in FIG. 13 ) for placing a second electronic component may also be provided on the circuit substrate 100. Specifically, the second groove may be provided on the side or back of the circuit substrate 100. In some embodiments, the number of the second grooves may be one or more. When the number of the second grooves is multiple, the multiple second grooves may be provided on the same side of the circuit substrate, or on different sides of the circuit substrate 100. For the content of the second groove and the second electronic component, please refer to the relevant description of FIGS. 1 to 12 , which will not be repeated here.

In some specific application scenarios, for example, the electronic circuit unit is used in an endoscope, and the circuit substrate 100 may only be provided with a first groove 110 for placing the first electronic component 200, and the second electronic component is provided in the operating portion of the endoscope (for example, the operating portion 2 shown in FIG. 22 ). Active devices are larger in size than passive devices. In this case, the second electronic component with a larger size is provided in the operating portion of the endoscope, so that the volume of the second electronic circuit unit is relatively small, which reduces the pain of the test object during the endoscopic test. In addition, the operating part is located in the external environment, and the heat generated by the second electronic component can be quickly dissipated, which will not affect the normal operation of the camera sensor and can effectively avoid the situation where the image quality is reduced due to the heating of the active device.

In one embodiment of the present specification, as shown in Fig. 13, Fig. 14a and Fig. 14b, a plurality of third grooves 130 are provided on the side of the circuit substrate 100, and a plurality of positioning portions 140 are provided on the back of the circuit substrate 100, and the plurality of positioning portions 140 are correspondingly connected to the plurality of third grooves 130. In some embodiments, the electronic circuit unit further includes a first cable 400, the number of the first cables 400 is multiple, and the plurality of first cables 400 are respectively arranged corresponding to the plurality of third grooves 130, and the first cables 400 pass through the corresponding positioning portions 140 and one end is arranged in the corresponding third groove 130.

A third electrode 131 is disposed in the third groove 130 , and one end of the first cable 400 is welded to the third electrode 131 .

Specifically, a plurality of positioning portions 140 may be provided on the back of the circuit substrate 100, and a plurality of third grooves 130 may be provided on the side of the circuit substrate 100. One end of the first cable 400 may be welded to the third electrode 131 in the third groove 130 after passing through the corresponding positioning portion 140. The positioning portion 140 may be a positioning hole, and the positioning portion 140 is used to position the first cable 400 passing through. Thus, the corresponding first cable 400 passing through is positioned by the positioning portion 140, so that each cable is independent of each other, which can effectively avoid the short circuit of the welding point, and is neat and easy to distinguish and troubleshoot the circuit.

The other end of the first cable 400 is connected to an external control system, which is used to supply power and provide a pulse drive signal to the camera sensor through the first cable 400. In addition, the external control system also communicates with the camera sensor through the first cable 400 to receive a transmission image sent by the camera sensor, or to send and receive instructions to the camera sensor.

In one embodiment of the present specification, the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100 . It is understandable that the plurality of third grooves 130 may be arranged circumferentially along the side of the circuit substrate 100 in two ways.

In one embodiment of the present specification, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate 100 .

Specifically, a plurality of mutually independent grooves may be provided on the side plane of the circuit substrate 100, that is, the plurality of third grooves 130 are holes. In a specific embodiment of the present specification, the shapes of the plurality of third grooves 130 may be set according to the actual application. As a possible implementation, as shown in FIG. 15a, the plurality of third grooves 130 may be set as polygonal holes. As another possible implementation, as shown in FIG. 15b, the plurality of third grooves 130 may be set as circular holes. In another specific embodiment of the present specification, when the third groove 130 is a hole, the shape of the third electrode 131 provided in the third groove 130 may also be set. As a possible implementation, as shown in FIG. 16a, the third electrode 131 provided in the third groove 130 may be a planar connection electrode (coplanar with the step surface of the circuit board). As another possible implementation, as shown in FIG. 16b, the third electrode 131 provided in the third groove 130 may be a circular groove connection electrode (the connection electrode is lower than the step surface of the circuit board). As other possible implementations, the third electrode 131 disposed in the third groove 130 may also be in other forms, for example, it may be a raised plane connection electrode (the connection electrode is higher than the step surface of the circuit board), or it may be a concave plane connection electrode (the connection electrode is lower than the step surface of the circuit board). Thus, by setting the plurality of third grooves 130 as a plurality of mutually independent grooves, it is possible to effectively avoid the occurrence of short circuits at welding points, and the circuits are neatly distinguished and easy to troubleshoot.

In another embodiment of the present specification, the plurality of third grooves 130 are grooves opened a second time on the basis of the strip-shaped grooves on the side surface of the circuit substrate 100 .

Specifically, a strip groove may be firstly opened on the side of the circuit substrate 100, wherein the strip groove runs through the four surfaces of the side of the circuit substrate 100 to form a rectangular annular groove, and then, a second opening is performed on the basis of the strip groove to obtain a plurality of third grooves 130, that is, the third groove 130 is open-shaped. According to the actual application, the shape of the third electrode 131 provided in the third groove 130 may be set. As a possible implementation, as shown in FIG. 17a, the third electrode 131 provided in the third groove 130 may be a concave plane connecting electrode (the connecting electrode is lower than the step surface of the circuit board). As another possible implementation, as shown in FIG. 17b, the third electrode 131 provided in the third groove 130 may be a convex plane connecting electrode (the connecting electrode is higher than the step surface of the circuit board). As other possible implementations, the third electrode 131 provided in the third groove 130 may also be a planar connecting electrode (coplanar with the step surface of the circuit board), or may be a circular groove connecting electrode (the connecting electrode is lower than the step surface of the circuit board).

The third groove 130 and the third electrode 131 are arranged in coordination with each other and are set according to actual needs.

It should be noted that, based on the different arrangements of the plurality of third grooves 130 , the corresponding communication modes between the plurality of positioning portions and the plurality of third grooves may also be arranged accordingly.

In one embodiment of the present specification, the positioning portion 140 is not connected to the side of the corresponding third groove 130 but is connected to the inside.

Specifically, as a possible implementation, as shown in FIG. 18a, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are holes, and the positioning portion 140 is not connected to the side of the corresponding third groove 130, but is connected inside, that is, the positioning portion 140 is in the shape of a through hole. As another possible implementation, as shown in FIG. 18b, the plurality of third grooves 130 are grooves opened twice on the basis of the annular groove on the side of the circuit substrate, that is, the plurality of third grooves 130 are open-shaped, and the positioning portion 140 is not connected to the side of the corresponding third groove 130, but is connected inside, that is, the positioning portion is in the shape of a through hole.

In another embodiment of the present specification, the positioning portion 140 is in communication with the side and the interior of the corresponding third groove 130 .

Specifically, as a possible implementation, as shown in FIG. 19a, the plurality of third grooves 130 are mutually independent grooves opened on the side plane of the circuit substrate, that is, the plurality of third grooves 130 are holes, and the positioning portion 140 is connected to the side and the interior of the corresponding third groove 130, that is, the positioning portion 140 is in the shape of an opening. As another possible implementation, as shown in FIG. 19b, the plurality of third grooves 130 are grooves opened twice on the basis of the annular groove on the side of the circuit substrate, that is, the plurality of third grooves 130 are in the shape of an opening, and the positioning portion 140 is connected to the side and the interior of the corresponding third groove 130, that is, the positioning portion 140 is in the shape of an opening.

In one embodiment of the present specification, as shown in Fig. 13, 14a and 14b, the electronic circuit unit may further include a second cable 500, wherein the second cable 500 is one or more, and one end of the second cable 500 is connected to one end of the corresponding first cable 400. As shown in Fig. 18c, the second cable 500 and one end of the first cable 400 are connected to each other as a whole, and then inserted into the positioning portion 140 and connected by welding through the third groove 130.

Specifically, as shown in FIG. 13 , a positioning groove 150 is also provided on the side of the circuit substrate 100, wherein, as a possible implementation, the number of the positioning grooves 150 is the same as the number of the second cables 500, and they are arranged one by one; as another possible implementation, the number of the positioning grooves 150 can be more than the number of the second cables 500, so as to be used as a backup, and can be directly called when the second cables 500 are increased. One end of the second cable 500 is first positioned by the positioning groove 150, and then welded to the third electrode 131, so as to be connected to one end of the corresponding first cable 400. Among them, one end of the second cable 500 is arranged corresponding to one end of the first cable 400, and the other end of the second cable 500 is connected to the lens driver, and the second cable 500 is used to input or output electrical signals. Thus, the corresponding second cables 500 passing through are positioned by the positioning groove 150, so that each cable is independent of each other, which can effectively avoid the situation of short circuit at the welding point, and is neat and easy to distinguish and troubleshoot the circuit.

In one embodiment of the present specification, as shown in FIGS. 14 a , 14 b and 17 a , a fourth electrode 122 is disposed in the third groove 130 , one end of the second cable 500 is welded to the fourth electrode 122 , and the fourth electrode 122 is connected to the third electrode 131 disposed in the third groove 130 .

Specifically, as a possible implementation, as shown in FIGS. 14a, 14b and 17a, two rows of third grooves 130 may be provided on one side of the circuit substrate 100 where the positioning grooves are provided. The third electrodes 131 are provided in one row of the third grooves 130, and the fourth electrodes 122 are provided in the other row of the third grooves 130. As shown in FIGS. 14a, 14b and 17a, the positioning grooves 150 on the side of the circuit substrate 100 are provided corresponding to the second cables 500, one end of the second cable 500 is first positioned by the positioning grooves 150, and then welded to the fourth electrode 122, and the fourth electrode 122 is connected to the third electrode 131 through the through hole 25, thereby being connected to one end of the corresponding first cable 400.

It should be noted that, according to actual needs, the positioning groove 150 can be set to different shapes, wherein, as shown in FIGS. 18a , 18b , 19a and 19b , the positioning groove 150 can be set to a circular groove shape.

In summary, according to the electronic circuit unit of the embodiment of the present specification, by opening the first groove 110 on the front of the circuit substrate close to the sensor 21 to accommodate the electronic components (for example, the first electronic component 200), the distance between the first electronic component 200 and the sensor 21 is reduced. Such a setting not only improves the stability of the sensor working voltage and the quality of obtaining sensor data, but also greatly shortens the length of the hard part of the endoscope head structure, reducing the pain of the subject during endoscopic examination.

Corresponding to the electronic circuit unit of the above embodiment, this specification also proposes a camera unit.

As shown in Fig. 20, the camera unit of the embodiment of the present specification may include the above-mentioned electronic circuit unit and camera sensor, wherein the first electronic component is not shown.

The connection method between the electronic circuit unit and the camera sensor is the same as that described in the above embodiment. Please refer to the description of the above embodiment. To avoid redundancy, it will not be described in detail here. According to the camera unit of the embodiment of this specification, the distance between the first electronic component and the camera sensor is reduced by opening a first groove on the front of the circuit substrate close to the camera sensor to accommodate the first electronic component. This not only improves the image quality of the acquired image, but also greatly shortens the overall length of the camera unit.

This specification also proposes an endoscope head structure. In some embodiments, the endoscope head structure may include the above-mentioned camera unit, which may be an electronic circuit unit and a sensor 21. For the specific content of the electronic circuit unit, please refer to Figures 1 to 21 of the specification and their related contents, which will not be repeated here.

According to the endoscope head structure of the embodiment of the present specification, by providing grooves on the front and/or side of the circuit substrate near the sensor 21 to accommodate electronic components, the distance between the electronic components and the sensor 21 is reduced, thereby improving the signal quality of the sensor obtained. Taking the sensor 21 as an imaging sensor as an example, the electronic components are arranged in the grooves provided on the front and/or side of the circuit substrate, which can more stably drive the imaging sensor and improve the image quality of the acquired image. In addition, such a setting greatly shortens the length of the imaging unit and the length of the hard part of the endoscope head structure when assembled at the end of the endoscope head, thereby alleviating the pain of the subject.

Corresponding to the endoscope head structure of the above-mentioned embodiment, this specification also proposes an endoscope.

As shown in FIG22 , the endoscope 1000 of the embodiment of the present specification may include the above-mentioned endoscope head structure 1. In one embodiment of the present specification, as shown in FIG22 , the endoscope 1000 may also include an operating portion 2 and an insertion portion 3. The endoscope head structure 1 is disposed at the front end of the insertion portion 3 of the endoscope 1000.

According to the endoscope of the embodiment of the present specification, by opening grooves on the front and/or sides of the circuit substrate close to the sensor to accommodate electronic components, the distance between the electronic components and the sensor is reduced, thereby not only improving the signal quality of the sensor obtained, but also greatly shortening the length of the hard part of the endoscope head structure, alleviating the pain of the subject. In some embodiments, the sensor may include but is not limited to a camera sensor, an ultrasonic sensor, a position sensor, and a distance sensor. For example, taking sensor 21 as an example of a camera sensor, the electronic components are arranged in the grooves opened on the front and/or sides of the circuit substrate, which can drive the camera sensor more stably and improve the image quality of the acquired image. For another example, taking sensor 21 as an ultrasonic sensor as an example, when the electronic components are installed in the grooves opened on the front and/or sides of the circuit substrate, the ultrasonic sensor can be driven more stably and the quality of the acquired ultrasonic signal can be improved.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

Claims (21)

An electronic circuit unit, comprising: A circuit substrate (100), the front side of the circuit substrate (100) being used to arrange a sensor (21), and at least one first groove (110) being provided on the front side and/or the side side of the circuit substrate (100); A first electronic component (200), wherein the first electronic component (200) is arranged in the at least one first groove (110). According to the electronic circuit unit according to claim 1, a first electrode (111) is arranged in the at least one first groove (110), and the first electronic component (200) is welded to the first electrode (111). The electronic circuit unit according to claim 1, wherein the first electronic component (200) is a passive device in a driving circuit. The electronic circuit unit according to any one of claims 1 to 3 further comprises a second electronic component (300), at least one second groove (120) is formed on a side surface of the circuit substrate (100), and the second electronic component (300) is arranged in the at least one second groove (120). The electronic circuit unit according to any one of claims 1 to 3 further comprises a second electronic component (300), at least one second groove (120) is formed on the back side of the circuit substrate (100), and the second electronic component (300) is arranged in the at least one second groove (120). The electronic circuit unit according to claim 4 or 5, wherein a second electrode (121) is provided in the at least one second groove (120), and the second electronic component (300) is soldered to the second electrode (121). The electronic circuit unit according to any one of claims 4 to 6, wherein the second electronic component (300) is an active device in a driving circuit. An electronic circuit unit according to claims 1-4, wherein the first groove (110) and the second groove (120) are both arranged on the side of the circuit substrate (100), and along the axial direction of the circuit substrate (100), the distance from the first groove (110) to the sensor (21) is smaller than the distance from the second groove (120) to the sensor (21). The electronic circuit unit according to any one of claims 1 to 8, wherein a dimension of the circuit substrate (100) along its axial direction is in the range of 1 mm to 10 mm. The electronic circuit unit according to any one of claims 1 to 9, wherein a plurality of third grooves (130) are further provided on the side of the circuit substrate (100), a plurality of positioning portions (140) are provided on the back of the circuit substrate (100), and the plurality of positioning portions (140) are correspondingly connected to the plurality of third grooves (130), and the electronic circuit unit further comprises: A first cable (400), wherein the first cable (400) is arranged corresponding to the third groove (130), and the first cable (400) passes through the corresponding positioning portion (140) and one end of the first cable (400) is arranged in the corresponding third groove (130). The electronic circuit unit according to claim 10, wherein a third electrode (131) is provided in each of the plurality of third grooves (130), and one end of the first cable (400) is welded to the third electrode (131). The electronic circuit unit according to claim 11, wherein the plurality of third grooves (130) are arranged circumferentially along a side surface of the circuit substrate (100). The electronic circuit unit according to claim 12, wherein the plurality of third grooves (130) are mutually independent grooves opened on the side plane of the circuit substrate (100), or the plurality of third grooves (130) are grooves opened secondary on the basis of the strip grooves on the side of the circuit substrate (100). The electronic circuit unit according to claim 12 or 13, wherein the positioning portion (140) is not connected to the side of the corresponding third groove (130), and the positioning portion (140) is connected to the inside of the corresponding third groove (130). The electronic circuit unit according to claim 12 or 13, wherein the positioning portion (140) is in communication with the side and the interior of the corresponding third groove (130). The electronic circuit unit according to any one of claims 10 to 15, further comprising: The second cable (500) includes one or more second cables (500), and one end of the second cable (500) is connected to one end of the corresponding first cable (400). The electronic circuit unit according to claim 16, wherein a fourth electrode is arranged in the third groove (130), one end of the second cable (500) is welded to the fourth electrode, and the fourth electrode is connected to the third electrode (131) arranged in the third groove (130). A camera unit, comprising: the electronic circuit unit as described in any one of claims 1 to 17; and a sensor (21); Wherein, the electronic circuit unit comprises: A circuit substrate (100), the front side of the circuit substrate (100) being used to arrange the sensor (21), and at least one first groove (110) being provided on the front side and/or the side side of the circuit substrate (100); A first electronic component (200), wherein the first electronic component (200) is arranged in the at least one first groove (110). An endoscope, comprising: an operating portion (2) and an insertion portion (3), wherein the insertion portion (3) comprises a camera unit (1), and the camera unit (1) is arranged at one end of the insertion portion (3) inserted into a body; wherein the camera unit comprises the electronic circuit unit according to any one of claims 1 to 17, and the sensor (21); Wherein, the electronic circuit unit comprises: A circuit substrate (100), the front side of the circuit substrate (100) being used to arrange the sensor (21), and at least one first groove (110) being provided on the front side and/or the side side of the circuit substrate (100); A first electronic component (200), wherein the first electronic component (200) is arranged in the at least one first groove (110). The endoscope according to claim 19, further comprising a second electronic component, wherein the second electronic component is disposed in the operating portion (2). An endoscope according to claim 19 or 20, wherein the sensor (21) comprises any one or more of a camera sensor, an ultrasonic sensor, a position sensor, a distance sensor or an infrared sensor.