[go: up one dir, main page]

WO2024203054A1 - Substrat de montage et endoscope - Google Patents

Substrat de montage et endoscope Download PDF

Info

Publication number
WO2024203054A1
WO2024203054A1 PCT/JP2024/008429 JP2024008429W WO2024203054A1 WO 2024203054 A1 WO2024203054 A1 WO 2024203054A1 JP 2024008429 W JP2024008429 W JP 2024008429W WO 2024203054 A1 WO2024203054 A1 WO 2024203054A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
terminal
mounting board
terminal portion
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/008429
Other languages
English (en)
Japanese (ja)
Inventor
敦 小師
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of WO2024203054A1 publication Critical patent/WO2024203054A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/40—Circuit details for pick-up tubes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Definitions

  • the present invention relates to a mounting board and an endoscope.
  • This application claims priority based on Japanese Application No. 2023-50039 filed on March 27, 2023, and incorporates by reference all of the contents of the above-mentioned Japanese application.
  • An endoscope is a medical device that can be inserted into a subject's body cavity to allow observation and treatment of desired locations, and is equipped with an imaging module built into the tip of the insertion tube that is inserted into the body cavity.
  • the imaging module is equipped with an imaging element such as a CMOS (Complementary Metal Oxide Semiconductor) and a mounting board on which the imaging element is mounted together with multiple passive components.
  • CMOS Complementary Metal Oxide Semiconductor
  • the imaging module has an imaging element, and it is necessary to provide a terminal on the mounting board that is electrically connected to the imaging element.
  • a terminal on the mounting board that is electrically connected to the imaging element.
  • two opposing faces of the mounting board are cut out and the terminal is embedded, so that when a power supply wire is connected to the terminal, the connection part is prevented from protruding outside the imaging element.
  • Patent Documents 1 and 2 do not take into consideration the problems mentioned above and are unable to solve them.
  • the present invention was made in consideration of these circumstances, and its purpose is to provide a mounting board and endoscope that can solve the problem of reduced strength that accompanies miniaturization.
  • the mounting board according to the present invention is a mounting board comprising a mounting section having a mounting surface for an electronic component, and a terminal section provided with a terminal for supplying power to the electronic component, the terminal section being provided on the surface opposite the mounting surface of the mounting section, and having a notch section formed at a position corresponding to a corner of the mounting section, and a first terminal provided in the notch section.
  • the terminal portion is provided on the surface opposite the mounting surface of the mounting portion, a notch portion is formed at a position corresponding to a corner of the mounting portion, and a first terminal is provided in the notch portion.
  • a power line that supplies power to an electronic component mounted on the mounting surface is connected to the first terminal.
  • the endoscope according to the present invention comprises the above-mentioned mounting board and electronic components mounted on the mounting board.
  • the present invention can solve the problem of reduced strength that accompanies miniaturization of endoscopes (mounting boards).
  • FIG. 1 is a block diagram showing a configuration of an endoscope device.
  • FIG. 2 is a side view of the imaging module according to the first embodiment. 2 is a perspective view of a mounting board of the imaging module according to the first embodiment when viewed from one direction.
  • FIG. 4 is a perspective view of the mounting board of the imaging module according to the first embodiment when viewed from the other direction.
  • FIG. 3C is a diagram of the mounting board as seen in the direction of the arrow in FIG. 3B.
  • 11 is a perspective view of a mounting board of an imaging module according to a second embodiment when viewed from one direction.
  • FIG. 11 is a perspective view of a mounting board of an imaging module according to a second embodiment when viewed from the other direction.
  • FIG. 11 is a perspective view of a mounting board of an imaging module according to a second embodiment when viewed from the other direction.
  • FIG. 5C is a diagram of the mounting board as seen in the direction of the arrow in FIG. 5B.
  • a light distribution lens 14 and an objective lens 15 are provided at the tip of the insertion tube section 10 and are exposed to the outside.
  • One end of a light guide 16 faces the back side of the light distribution lens 14, and an imaging module 3 is incorporated on the back side of the objective lens 15 with its imaging surface facing the objective lens 15.
  • the light guide 16 is made up of multiple optical fibers bundled together, and is connected to the connector section 13 through the inside of the insertion tube section 10, the operation section 11, and the universal tube 12.
  • a cable 17 is inserted into the insertion tube section 10, the operation section 11, and the universal tube 12.
  • the cable 17 is a shielded cable with multiple core wires such as control lines and signal lines.
  • the imaging module 3 is connected to a drive section 18 provided in the connector section 13 by the cable 17.
  • the operation unit 11 is provided with operation buttons for performing various operations.
  • the operation unit 11 has a control button 19.
  • the control button 19 is a button for remotely operating the processor device 2 connected by the connector unit 13.
  • the operation unit 11 is also provided with an operation knob (not shown), and the user can adjust the orientation of the tip of the insertion tube unit 10 by operating the knob.
  • the processor device 2 includes a control unit 20, a timing controller 21, and a signal processing circuit 22.
  • the control unit 20 includes a CPU, ROM, and RAM, and performs integrated control of the endoscope device by the operation of the CPU according to a control program stored in the ROM.
  • the control unit 20 is connected to a drive unit 18 provided in the connector unit 13 of the endoscope 1, and a control button 19 provided in the operation unit 11.
  • the drive unit 18 outputs the unique information of the imaging module 3 (number of pixels, sensitivity, field rate, etc.) to the control unit 20.
  • the control unit 20 operates in response to the operation of the control button 19, and outputs a control command based on the unique information of the imaging module 3 provided by the drive unit 18.
  • the timing controller 21 generates clock pulses according to control commands given by the control unit 20 and outputs them to the signal processing circuit 22 and the drive unit 18 provided in the connector unit 13.
  • the drive unit 18 drives the imaging module 3 at a timing synchronized with the clock pulses output from the timing controller 21.
  • the image signal output by the imaging module 3 is pre-processed in the drive unit 18 and input to the signal processing circuit 22 of the processor device 2 in one field cycle.
  • the signal processing circuit 22 performs image processing such as gamma correction and interpolation processing, as well as various character and image superimposition processing, on the image signal from the imaging module 3 in accordance with the clock pulse from the timing controller 21, converts it into an image signal that complies with a specified standard, and outputs it to the external monitor 23.
  • the monitor 23 is equipped with a liquid crystal display, an organic EL display, etc., and displays the image captured by the imaging module 3 based on the image signal output from the processor device 2.
  • the processor device 2 further includes a light source 24 and an operation panel 25.
  • the light source 24 is a high-intensity lamp such as a xenon lamp, a halogen lamp, or a metal halide lamp, and is turned on by power supplied from a lamp power supply 26.
  • the operation panel 25 is equipped with operation buttons, a touch panel GUI (Graphical User Interface), etc.
  • the operation panel 25 is connected to the control unit 20, and the user can operate the operation panel 25 to configure various settings, including imaging conditions such as brightness and contrast.
  • the imaging module 3 captures images of the inside of the body cavity.
  • the captured image (image signal) output by the imaging module 3 is displayed on the monitor 23 after undergoing image processing by the signal processing circuit 22 as described above.
  • the imaging by the imaging module 3 is performed in response to the operation of the control button 19 of the operation unit 11.
  • FIG. 2 is a side view of the imaging module 3 according to the first embodiment. For convenience, FIG. 2 illustrates a case where a cable 17 is connected to the imaging module 3.
  • the imaging module 3 includes an imaging element 4 and a mounting board 6.
  • the imaging element 4 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device), and converts the optical image formed on the rectangular imaging surface 41 into an electrical signal and outputs it.
  • CMOS Complementary Metal Oxide Semiconductor
  • CCD Charge Coupled Device
  • FIG. 3A is a perspective view of the mounting board 6 of the imaging module 3 according to embodiment 1 when viewed from one direction
  • FIG. 3B is a perspective view of the mounting board 6 of the imaging module 3 according to embodiment 1 when viewed from the other direction.
  • a first terminal 65 is formed on the concave curved surface of the cutout portion 64.
  • the first terminal 65 is made of a conductive metal in a semi-cylindrical shape with approximately the same curvature as the concave curved surface of the cutout portion 64.
  • the first terminal 65 passes through the inside of the terminal portion 63 and the mounting portion 62 and is electrically connected to the current-carrying pattern 61 on the mounting surface 60.
  • the first terminal 65 is embedded in the concave curved surface of the cutout portion 64 by so-called castellation processing, and the inner curved surface is exposed. As shown in FIG. 2, the core wire of the cable 17 is connected to the first terminal 65 by, for example, soldering.
  • the terminal portion 63 has notches 64 formed at positions corresponding to the edges of the mounting portion 62, and the portions other than the notches 64 are flush with the side of the mounting portion 62 (see Figures 3 and 4). Therefore, the terminal portion 63 has a generally cross shape when viewed in cross section in a direction intersecting the axial direction.
  • the terminal portion 63 has a substantially cross-shaped end face 67 (protruding end face) on the side opposite the mounting surface 60 of the mounting portion 62 in the axial direction, i.e., the juxtaposition direction.
  • the end face 67 has second terminals 66 formed in two places.
  • Each second terminal 66 is made of a rectangular conductive metal and is embedded in the end surface 67.
  • a passive component is connected to the second terminal 66.
  • the passive component is an electronic component such as a capacitor that constitutes a processing circuit that processes the output signal of the image sensor 4, converts it into an image signal indicating the brightness of each pixel of the image sensor 4, and outputs it.
  • the mounting section and the terminal section have the same shape when viewed in the direction of side-by-side installation, and when a land section is provided on the terminal section, the two opposing faces are cut out and the electrodes are embedded. This makes it possible to prevent the connection section from protruding from the sides of the terminal section and mounting section when the core wire of the power supply cable is connected to such a land section by soldering, improving workability when installing the imaging module on an endoscope.
  • the terminal portion 63 of the endoscope 1 of embodiment 1 has notches 64 formed at positions corresponding to each edge of the mounting portion 62, i.e., each corner of the opposite surface 623. More specifically, the notches 64 are formed by performing castellation processing on the edges of the terminal portion 63, which has a rectangular prism shape that imitates the mounting portion 62. Therefore, the notches 64 are provided at positions corresponding to the edges of the rectangular prism, and the distance (thickness) between the notches 64 (first terminals 65) can be sufficiently secured. This solves the problem of reduced strength described above.
  • the mounting portion 62 and the terminal portion 63 are both rectangular when viewed in the juxtaposed direction, and the portions other than the cutout portion 64 are flush with the side surface of the mounting portion 62, and the cutout portion 64 has the concave curved surface and is recessed in the axial direction of the terminal portion 63.
  • the dimension of the terminal portion 63 is equal to or smaller than the dimension of the opposite surface 623.
  • the mounting portion 62 has a generally hexahedral shape and extends in the direction in which the mounting portion 62 and the terminal portion 63 are arranged side by side.
  • the mounting portion 62 has a mounting surface 60 on the imaging element 4 side.
  • the dimensions of the mounting portion 62 are equal to or greater than the dimensions of the terminal portion 63.
  • the mounting surface 60 has a size corresponding to the image sensor 4, and a current-carrying pattern 61 that is connected to the electrodes 40 of the image sensor 4 is provided on the mounting surface 60 at a position corresponding to the electrodes 40 of the image sensor 4.
  • a terminal portion 63 is provided on the surface 623 opposite the mounting surface 60.
  • a recess 621 is formed in the mounting section 62.
  • the recess 621 is formed from one side surface 624 of the four side surfaces adjacent to the mounting surface 60 to two side surfaces adjacent to the one side surface 624. That is, the recess 621 is formed by cutting out the one side surface 624, and has a flat bottom.
  • the recess 621 is formed closer to the opposite surface 623.
  • a third terminal 622 is provided at the bottom of the recess 621.
  • the third terminal 622 is made of a rectangular conductive metal and is embedded in the bottom of the recess 621 by, for example, castellation processing. One main surface of the third terminal 622 is exposed to the outside.
  • the above-mentioned passive components are mounted on the third terminal 622.
  • the terminal portion 63 is provided with a terminal for supplying power to the imaging element 4.
  • the terminal portion 63 is columnar, and protrudes from the opposite surface 623 in the thickness direction of the mounting portion 62.
  • the terminal portion 63 is formed with notches 64 at positions corresponding to each edge of the mounting portion 62 (each corner of the opposite surface 623).
  • each notch 64 is provided with a first terminal 65, as in the first embodiment.
  • the configuration of each notch 64 and the configuration of the first terminal 65 are the same as in the first embodiment, and detailed explanation will be omitted.
  • the terminal portion 63 also has a generally cross-shaped end face 67 on the side opposite the mounting surface 60 of the mounting portion 62 in the axial direction, i.e., the juxtaposition direction.
  • a second terminal 66A is formed at one location on the end face 67.
  • the second terminal 66A is made of a circular conductive metal and is embedded in the end face 67.
  • a ground wire is connected to the second terminal 66A.
  • the cutouts 64 are formed at four locations corresponding to each corner of the opposite surface 623, but this is not limited to this.
  • the cutouts 64 may be formed at only two or three locations.
  • the cutout portion 64 has a concave curved surface, but this is not limited thereto, and the cutout portion 64 may be configured to have a flat surface.

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Surgery (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biophysics (AREA)
  • Endoscopes (AREA)

Abstract

L'invention concerne un substrat de montage et un endoscope avec lesquels il est possible de résoudre le problème de détérioration de la résistance qui accompagne une miniaturisation. Un substrat de montage (6) comprend une partie de montage (62) qui présente une surface de montage (60) sur laquelle doit être monté un composant électronique, et une partie borne (63) qui est pourvue d'une borne pour fournir de l'énergie électrique au composant électronique, la partie borne (63) présentant : des encoches (64) qui sont disposées sur une surface opposée (623) sur le côté en regard de la surface de montage (60) de la partie de montage (62), les encoches (64) étant formées au niveau de positions correspondant aux coins de la partie de montage (62) ; et des premières bornes (65) qui sont disposées sur les encoches (64).
PCT/JP2024/008429 2023-03-27 2024-03-06 Substrat de montage et endoscope Pending WO2024203054A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023050039A JP2024139204A (ja) 2023-03-27 2023-03-27 実装基板及び内視鏡
JP2023-050039 2023-03-27

Publications (1)

Publication Number Publication Date
WO2024203054A1 true WO2024203054A1 (fr) 2024-10-03

Family

ID=92905517

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2024/008429 Pending WO2024203054A1 (fr) 2023-03-27 2024-03-06 Substrat de montage et endoscope

Country Status (2)

Country Link
JP (1) JP2024139204A (fr)
WO (1) WO2024203054A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000075218A (ja) * 1998-09-01 2000-03-14 Olympus Optical Co Ltd 内視鏡
JP2008307293A (ja) * 2007-06-15 2008-12-25 Olympus Medical Systems Corp 撮像装置
JP2017099530A (ja) * 2015-11-30 2017-06-08 株式会社フジクラ 撮像モジュール及び内視鏡
JP2017108396A (ja) * 2015-11-30 2017-06-15 株式会社フジクラ 撮像モジュール
JP2019195451A (ja) * 2018-05-09 2019-11-14 株式会社フジクラ 撮像モジュール
JP2020053566A (ja) * 2018-09-27 2020-04-02 京セラ株式会社 電子素子実装用基板、電子装置、および電子モジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000075218A (ja) * 1998-09-01 2000-03-14 Olympus Optical Co Ltd 内視鏡
JP2008307293A (ja) * 2007-06-15 2008-12-25 Olympus Medical Systems Corp 撮像装置
JP2017099530A (ja) * 2015-11-30 2017-06-08 株式会社フジクラ 撮像モジュール及び内視鏡
JP2017108396A (ja) * 2015-11-30 2017-06-15 株式会社フジクラ 撮像モジュール
JP2019195451A (ja) * 2018-05-09 2019-11-14 株式会社フジクラ 撮像モジュール
JP2020053566A (ja) * 2018-09-27 2020-04-02 京セラ株式会社 電子素子実装用基板、電子装置、および電子モジュール

Also Published As

Publication number Publication date
JP2024139204A (ja) 2024-10-09

Similar Documents

Publication Publication Date Title
US9462933B2 (en) Image pickup unit for endoscope
JP5839811B2 (ja) 撮像ユニット及び内視鏡
JP5659325B1 (ja) 撮像モジュールおよび内視鏡装置
US20180070803A1 (en) Imaging device and endoscope system
CN112135557B (zh) 摄像单元和斜视型内窥镜
WO2015045616A1 (fr) Unité d'imagerie et dispositif d'endoscope
EP2987448A1 (fr) Dispositif d'imagerie, et endoscope électronique
JP6539548B2 (ja) 内視鏡用撮像装置及び内視鏡
US10973394B2 (en) Endoscope
WO2024203054A1 (fr) Substrat de montage et endoscope
US11903566B2 (en) Imaging module and endoscope having image sensor and mounting board
US10191270B2 (en) Imaging unit and endoscope apparatus
US10456013B2 (en) Cable connection structure, imaging apparatus, and endoscope
TWI814107B (zh) 影像擷取組件及其相關的內視鏡
JP3548467B2 (ja) 撮像装置
JPH0437053A (ja) 固体撮像素子
JP2015080675A (ja) 内視鏡及び内視鏡の製造方法
JP6321916B2 (ja) 撮像装置および電子内視鏡
JP2000031444A (ja) 固体撮像装置
JP6736377B2 (ja) 電子内視鏡装置
WO2021176736A1 (fr) Partie d'extrémité distale d'endoscope, structure d'extrémité distale, endoscope et procédé de confirmation de conduction
EP4223209A1 (fr) Endoscope
CN115363511A (zh) 内窥镜摄像装置及内窥镜
CN115915597A (zh) 一种表面贴装组件以及相关的内视镜
JP2015080633A (ja) 電気ユニット及び電気ユニットを用いた内視鏡装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24779189

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE