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WO2019013038A1 - Corps stratifié, carte de circuit imprimé l'utilisant, carte de circuit imprimé souple, et article moulé - Google Patents

Corps stratifié, carte de circuit imprimé l'utilisant, carte de circuit imprimé souple, et article moulé Download PDF

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Publication number
WO2019013038A1
WO2019013038A1 PCT/JP2018/025165 JP2018025165W WO2019013038A1 WO 2019013038 A1 WO2019013038 A1 WO 2019013038A1 JP 2018025165 W JP2018025165 W JP 2018025165W WO 2019013038 A1 WO2019013038 A1 WO 2019013038A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
resin
metal
epoxy resin
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/025165
Other languages
English (en)
Japanese (ja)
Inventor
憲一 平林
亘 冨士川
白髪　潤
深澤　憲正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp, Dainippon Ink and Chemicals Co Ltd filed Critical DIC Corp
Priority to KR1020207000073A priority Critical patent/KR102372638B1/ko
Priority to JP2019526626A priority patent/JP6579295B2/ja
Priority to CN201880040445.9A priority patent/CN110753617A/zh
Publication of WO2019013038A1 publication Critical patent/WO2019013038A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/098—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/16—Layered products comprising a layer of metal next to a particulate layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09D161/04, C09D161/18 and C09D161/20
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Definitions

  • the present invention relates to a laminate that can be used for printed wiring boards, flexible printed wiring boards, molded articles, and the like.
  • FCCL flexible copper-clad laminate
  • the copper foil can not be made sufficiently thin for handling since it is pasted while pulling out the copper foil wound in a roll shape. Furthermore, it is necessary to roughen the surface of the copper foil in order to enhance the adhesion to the polymer film, so the high frequency (GHz band) and high frequency required to achieve high density and high performance of the printed wiring board There is a problem that transmission loss occurs in the transmission speed (tens of Gbps) area.
  • a metal thin film is formed on the surface of a polyimide film by a vapor deposition method or a sputtering method, and then an electroplating method, an electroless plating method or both are combined on the metal thin film.
  • a method of forming copper by a method has been proposed (see, for example, Patent Document 1).
  • Patent Document 1 in order to use a vapor deposition method or a sputtering method in order to form a metal thin film, extensive vacuum equipment is required, and there is a problem that the substrate size is limited on equipment.
  • ABS acrylonitrile-butadiene-styrene copolymer
  • ABS-PC polymer alloy of ABS and polycarbonate
  • the base material is not limited to ABS or ABS-PC, and a plated film having excellent adhesion can be obtained even with other types of plastic, and It has been required to reduce the use of environmentally hazardous substances.
  • the problem to be solved by the present invention is a laminate which can be produced by a simple method without roughening the surface of the support, and has excellent adhesion between the support and the metal layer (metal plating layer), Printed wiring board, a flexible printed wiring board, and a molded article using the same.
  • the present inventors provide a layer containing a compound having an aminotriazine ring as a primer layer on a support, and a metal formed by metal nanoparticles on the layer. It has been found that a laminate obtained by sequentially laminating a layer and a metal plating layer can solve the above problems, and the present invention has been completed.
  • the present invention is a laminate in which a primer layer (B), a metal nanoparticle layer (C) and a metal plating layer (D) are sequentially laminated on a support (A), and the primer layer
  • B) is a layer containing a compound (b1) having an aminotriazine ring, a printed wiring board using the same, a flexible printed wiring board and a molded article.
  • the laminate of the present invention is excellent in the adhesion between the support and the metal layer (metal plating layer) without roughening the surface of the support.
  • the metal layer metal plating layer
  • it is a laminate having a sufficiently thin metal layer with a smooth surface, without using extensive vacuum equipment.
  • the laminate of the present invention is, for example, a printed wiring board, a flexible printed wiring board, a conductive film for a touch panel, a metal mesh for a touch panel, an organic solar cell, an organic EL element, an organic transistor, by patterning a metal layer.
  • a metal layer for example, a printed wiring board, a flexible printed wiring board, a conductive film for a touch panel, a metal mesh for a touch panel, an organic solar cell, an organic EL element, an organic transistor, by patterning a metal layer.
  • It can be suitably used as an RFID such as a noncontact IC card, an electromagnetic wave shield, an LED illumination base, an electronic member such as a digital signage.
  • FCCL flexible printed wiring board applications
  • electronic components such as connectors for connecting wires for optical communication etc., electrical components, electric motor peripheral components, battery components, etc .; decorative components for automobiles, lamp reflectors, mobile phones, personal computers, mirrors, It can be suitably used for decoration of containers, home appliances, various switches, faucet parts, shower heads and the like.
  • the laminate of the present invention is a laminate in which a primer layer (B), a metal nanoparticle layer (C) and a metal plating layer (D) are sequentially laminated on a support (A), and the primer layer (B) is a layer containing a compound (b1) having an aminotriazine ring.
  • the laminate of the present invention may be a laminate in which the primer layer (B) and the like are sequentially laminated on one side of the support (A), and the primer layer (B) and the like may be formed on both sides of the support (A).
  • stacked sequentially may be sufficient.
  • Examples of the support (A) include polyimide, polyamideimide, polyamide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, acrylonitrile-butadiene-styrene (ABS) resin, polymer alloy of ABS and polycarbonate, and poly (meth) acrylic.
  • ABS acrylonitrile-butadiene-styrene
  • Acrylic resin such as methyl acid, polytetrafluoroethylene, polyvinylidene fluoride, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polycarbonate, polyethylene, polypropylene, polyurethane, liquid crystal polymer (LCP), polyetheretherketone (PEEK), polyphenylene Sulfide (PPS), polyphenylene sulfone (PPSU), epoxy resin, cellulose nanofibers, silicon, ceramics, Supports made of metal, etc., porous supports made of them, steel plates, supports made of metals such as copper, supports obtained by vapor-depositing silicon carbide, diamond like carbon, aluminum, copper, titanium etc. on their surfaces Etc.
  • LCP liquid crystal polymer
  • PEEK polyetheretherketone
  • PPS polyphenylene Sulfide
  • PPSU polyphenylene sulfone
  • a polyimide a polyethylene terephthalate, a polyethylene naphthalate, a liquid crystal polymer (LCP), a polyetheretherketone (PEEK), glass, as said support body (A) It is preferable to use a support made of cellulose nanofibers and the like.
  • the film-form or sheet-like support which has the bendable softness
  • the thickness is generally preferably 1 ⁇ m to 5,000 ⁇ m, more preferably 1 ⁇ m to 300 ⁇ m, and still more preferably 1 ⁇ m to 200 ⁇ m.
  • the surface of the support (A) may be as fine as possible without losing smoothness, as necessary. Irregularities may be formed, soil attached to the surface may be washed, or surface treatment may be performed to introduce functional groups such as hydroxyl group, carbonyl group, carboxyl group and the like. Specifically, methods such as plasma discharge treatment such as corona discharge treatment, dry treatment such as ultraviolet light treatment, wet treatment using an aqueous solution of water, acid or alkali, an organic solvent or the like may be mentioned.
  • the primer layer (B) is a layer containing a compound (b1) having an aminotriazine ring.
  • the compound (b1) having an aminotriazine ring may be a low molecular weight compound or a higher molecular weight resin.
  • various additives having an aminotriazine ring can be used.
  • Commercially available products include 2,4-diamino-6-vinyl-s-triazine (“VT” manufactured by Shikoku Kasei Co., Ltd.), “VD-3” manufactured by Shikoku Kasei Co., Ltd., and “VD-4” (aminotriazine ring Compounds having a hydroxyl group), "VD-5" (compounds having an aminotriazine ring and an ethoxysilyl group) manufactured by Shikoku Kasei Co., Ltd., and the like can be mentioned.
  • These additives may be used alone or in combination of two or more.
  • a resin to form the primer layer (B) When using a low molecular weight compound having the aminotriazine ring, it is preferable to use a resin to form the primer layer (B).
  • a resin used in this case for example, a block using urethane resin, acrylic resin, urethane-vinyl composite resin, epoxy resin, imide resin, imide resin, amide resin, melamine resin, phenol resin, urea formaldehyde resin, phenol as a blocking agent
  • Polyisocyanate, polyvinyl alcohol, polyvinyl pyrrolidone and the like can be mentioned. These resins can be used alone or in combination of two or more. Among these, an epoxy resin is preferable because adhesion can be further improved, and it is more preferable to use a novolac resin and an epoxy resin in combination.
  • the amount of use of the low molecular weight compound having an aminotriazine ring is preferably 0.1 parts by mass to 50 parts by mass, and more preferably 0.5 parts by mass to 10 parts by mass with respect to 100 parts by mass of the resin.
  • Examples of the resin having an aminotriazine ring include those in which an aminotriazine ring is covalently introduced into the polymer chain of the resin. Specifically, aminotriazine modified novolac resin (b1-1) can be mentioned.
  • the aminotriazine-modified novolak resin (b1-1) is a novolak resin in which an aminotriazine ring structure and a phenol structure are linked via a methylene group.
  • Examples of the aminotriazine-modified novolak resin (b1-1) include aminotriazine compounds such as melamine, benzoguanamine and acetoguanamine, and phenol compounds such as phenol, cresol, butylphenol, bisphenol A, phenylphenol, naphthol and resorcin, and formaldehyde Or co-condensation reaction in the presence or absence of a weak alkaline catalyst such as an alkylamine near neutrality, or reacting the above-mentioned phenol compound with an alkyl etherified product of an aminotriazine compound such as methyl etherified melamine. Obtained by
  • the aminotriazine-modified novolak resin (b1-1) is preferably one having substantially no methylol group.
  • the aminotriazine-modified novolak resin (b1-1) may contain a molecule in which only the aminotriazine structure generated as a by-product during the production thereof is methylene-bonded, or a molecule in which only the phenol structure is methylene-bonded. Absent. In addition, some unreacted raw material may be included.
  • phenol residue As said phenol structure, a phenol residue, a cresol residue, a butylphenol residue, a bisphenol A residue, a phenylphenol residue, a naphthol residue, a resorcinol residue etc. are mentioned, for example.
  • the term "residue” as used herein means a structure in which at least one hydrogen atom bonded to carbon of an aromatic ring is removed. For example, in the case of phenol, it means a hydroxyphenyl group.
  • triazine structure examples include structures derived from aminotriazine compounds such as melamine, benzoguanamine and acetoguanamine.
  • the phenol structure and the triazine structure may be used alone or in combination of two or more.
  • a phenol residue is preferable as the phenol structure, and a structure derived from melamine is preferable as the triazine structure because the adhesion can be further improved.
  • the hydroxyl value of the aminotriazine modified novolak resin (b1-1) is preferably 50 mgKOH / g to 200 mgKOH / g, more preferably 80 mgKOH / g to 180 mgKOH / g, more preferably 100 mgKOH, since adhesion can be further improved. It is more preferable that 1 g / g or more and 150 mg KOH / g or less.
  • the aminotriazine-modified novolak resin (b1-1) may be used alone or in combination of two or more.
  • an aminotriazine-modified novolak resin (b1-1) is used as the compound (b1) having an aminotriazine ring, it is preferable to use an epoxy resin (b2) in combination.
  • epoxy resin (b2) bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, cresol novolac epoxy resin, phenol novolak epoxy resin, bisphenol A novolac epoxy resin, alcohol ether epoxy resin , Tetrabromo bisphenol A type epoxy resin, naphthalene type epoxy resin, phosphorus-containing epoxy compound having a structure derived from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide derivative, derived from dicyclopentadiene derivative Examples thereof include epoxy resins having a structure, and epoxidized fats and oils such as epoxidized soybean oil. These epoxy resins can be used alone or in combination of two or more.
  • epoxy resins (b2) since the adhesion can be further improved, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, cresol novolac type epoxy resin, phenol novolac type epoxy resin, bisphenol A novolac type Epoxy resins are preferred, in particular bisphenol A epoxy resins.
  • the epoxy equivalent of the epoxy resin (b2) is preferably 100 g / equivalent or more and 300 g / equivalent or less, more preferably 120 g / equivalent or more and 250 g / equivalent or less, more preferably 150 g / equivalent or more and 200 g / equivalent, because adhesion can be further improved.
  • the equivalent or less is more preferable.
  • the primer layer (B) is a layer containing an aminotriazine-modified novolak resin (b1-1) and an epoxy resin (b2)
  • the adhesion can be further improved, so that the aminotriazine-modified novolak resin (b1-1) can be obtained.
  • 0.1 or more and 5 or less are preferable, and the molar ratio [(y) / (x)] of phenolic hydroxyl group (x) in (6) and epoxy group (y) in the said epoxy resin (b2) is 0.2,
  • the number is preferably 3 or more and more preferably 0.3 or more and 2 or less.
  • a primer composition (b) is used for formation of the said primer layer (B).
  • the primer composition (b) contains the compound (b1) having the aminotriazine ring and the epoxy resin (b2), but may further contain a crosslinking agent (b3) as required. .
  • a polyvalent carboxylic acid as the crosslinking agent (b3).
  • the polyvalent carboxylic acid include trimellitic anhydride, pyromellitic anhydride, maleic anhydride, and succinic acid.
  • These crosslinking agents can be used alone or in combination of two or more. Further, among these crosslinking agents, trimellitic anhydride is preferable because adhesion can be further improved.
  • other resin (b4) is blended as a component other than the above components (b1) to (b3), if necessary.
  • a urethane resin an acrylic resin, block isocyanate resin, a melamine resin, a phenol resin etc. are mentioned, for example.
  • These other resins may be used alone or in combination of two or more.
  • an organic solvent with the said primer composition (b), in order to set it as the viscosity which is easy to apply, when coating to the said support body (A).
  • the organic solvent include toluene, ethyl acetate, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, isopropyl alcohol and the like.
  • the amount of the organic solvent used be appropriately adjusted according to the coating method used when applying to the support (A) described later, and the desired film thickness of the primer layer (B).
  • a film forming auxiliary such as a film forming auxiliary, a leveling agent, a thickener, a water repellent, an antifoamer, an antioxidant, etc. are appropriately added to the primer composition (b), as necessary. You may use it.
  • the primer layer (B) applies the primer composition (b) to a part or all of the surface of the support (A) and removes the organic solvent contained in the primer composition (b) It can be formed by
  • Examples of the method for applying the primer composition (b) to the surface of the support (A) include methods such as gravure method, coating method, screen method, roller method, rotary method, spray method and capillary method. It can be mentioned.
  • the drying temperature may be set to a temperature in which the used organic solvent can be volatilized and the support (A) is not adversely affected by heat deformation and the like.
  • the film thickness of the primer layer (B) formed using the said primer composition (b) changes with uses which use the laminated body of this invention
  • the said metal support (A) and the metal nanoparticle layer (C) mentioned later A range in which adhesion to the surface is further improved is preferable
  • the film thickness of the primer layer (B) is preferably 10 nm to 30 ⁇ m, more preferably 10 nm to 1 ⁇ m, and still more preferably 10 nm to 500 nm.
  • the surface of the primer layer (B) can further improve the adhesion to the metal nanoparticle layer (C), and therefore, if necessary, it can be a dry process such as a plasma discharge treatment method such as corona discharge treatment method or an ultraviolet treatment method
  • the surface treatment may be performed by a treatment method, a wet treatment method using water, an acidic or alkaline chemical solution, an organic solvent or the like.
  • the metal nanoparticle layer (C) is formed on the primer layer (B), and as the metal constituting the metal nanoparticle layer (C), a transition metal or a compound thereof can be mentioned, among which Ionizable transition metals are preferred.
  • the ionic transition metal include copper, silver, gold, nickel, palladium, platinum, cobalt and the like. Among these, silver is preferable because it is easy to form the metal plating layer (D).
  • copper gold, silver, nickel, chromium, cobalt, tin etc. are mentioned as a metal which comprises the said metal plating layer (D).
  • copper is preferable because a laminate can be obtained which has a low electrical resistance and is resistant to corrosion.
  • a primer layer (B) is formed on a support (A), and then a fluid containing nano-sized metal nanoparticles (c) is coated. And forming the metal nanoparticle layer (C) by removing the organic solvent and the like contained in the fluid by drying, and then the metal plating layer (D) by electrolytic plating, electroless plating, or both.
  • the shape of the metal nanoparticles (c) used to form the metal nanoparticle layer (C) is preferably particulate or fibrous.
  • the size of the metal nanoparticles (c) is nanosize, specifically, when the shape of the metal nanoparticles (c) is particulate, a fine conductive pattern can be formed.
  • the average particle diameter is preferably 1 nm or more and 100 nm or less, and more preferably 1 nm or more and 50 nm or less because the resistance value can be further reduced.
  • the “average particle diameter” is a volume average value measured by dynamic light scattering method after diluting the conductive substance with a dispersion good solvent. For this measurement, "Nanotrack UPA-150" manufactured by Microtrac, Inc. can be used.
  • the diameter of the fiber is preferably 5 nm to 100 nm, and 5 nm to 50 nm. Is more preferred.
  • the length of the fiber is preferably 0.1 ⁇ m to 100 ⁇ m, and more preferably 0.1 ⁇ m to 30 ⁇ m.
  • the content of the metal nanoparticles (c) in the fluid is preferably 1% by mass to 90% by mass, more preferably 1% by mass to 60% by mass, and still more preferably 1% by mass to 10% by mass. More preferable.
  • a dispersant or solvent for dispersing the metal nanoparticles (c) in a solvent and, if necessary, a surfactant, a leveling agent, a viscosity modifier as described later, Film forming aids, antifoaming agents, preservatives and the like can be mentioned.
  • a low molecular weight or high molecular weight dispersant examples include dodecanethiol, 1-octanethiol, triphenylphosphine, dodecylamine, polyethylene glycol, polyvinyl pyrrolidone, polyethylene imine, polyvinyl pyrrolidone; fatty acids such as myristic acid, octanoic acid and stearic acid; cholic acid, Examples thereof include polycyclic hydrocarbon compounds having a carboxyl group such as glycyrrhizic acid and aventic acid.
  • a polymer dispersant is preferable because the adhesion between the metal nanoparticle layer (C) and the metal plating layer (D) can be improved, and as the polymer dispersant, polyethyleneimine, polypropyleneimine, etc. And a compound obtained by adding a polyoxyalkylene to the polyalkyleneimine, a urethane resin, an acrylic resin, the urethane resin, a compound having a phosphoric acid group in the acrylic resin, and the like.
  • the amount of the dispersing agent required to disperse the metal nanoparticles (c) is preferably 0.01 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the metal nanoparticles (c), and 0. More than 01 mass parts and below 10 mass parts are more preferred.
  • an aqueous medium and an organic solvent can be used as a solvent used for the said fluid.
  • the aqueous medium include distilled water, ion exchanged water, pure water, ultrapure water and the like.
  • an alcohol compound, an ether compound, an ester compound, a ketone compound etc. are mentioned as said organic solvent.
  • Examples of the alcohol compound include methanol, ethanol, n-propanol, isopropyl alcohol, n-butanol, isobutyl alcohol, sec-butanol, tert-butanol, heptanol, hexanol, octanol, nonanol, decanol, undecanol, dodecanol, tridecanol, and the like.
  • ethylene glycol, diethylene glycol, 1,3-butanediol, isoprene glycol and the like can be used as the fluid, as necessary.
  • a common surfactant can be used as the surfactant, and examples thereof include di-2-ethylhexyl sulfosuccinate, dodecylbenzene sulfonate, alkyl diphenyl ether disulfonate, alkyl naphthalene sulfonate, hexametaphosphoric acid Salt etc. are mentioned.
  • a general leveling agent can be used as the leveling agent, and examples thereof include silicone compounds, acetylene diol compounds, and fluorine compounds.
  • a general thickener can be used as the viscosity modifier.
  • an acrylic polymer or synthetic rubber latex that can be thickened by adjusting to alkalinity, or a urethane that can be thickened by association of molecules Resin, hydroxyethylcellulose, carboxymethylcellulose, methylcellulose, polyvinyl alcohol, castor oil with water, amide wax, polyethylene oxide, metal soap, dibenzylidene sorbitol and the like.
  • a general film forming aid can be used, and examples thereof include anionic surfactants (such as dioctyl sulfosuccinic acid ester soda salt) and hydrophobic nonionic surfactants (sorbitan monooleate).
  • anionic surfactants such as dioctyl sulfosuccinic acid ester soda salt
  • hydrophobic nonionic surfactants sorbitan monooleate
  • Etc. polyether-modified siloxane, silicone oil and the like.
  • antifoaming agent a general antifoaming agent can be used, and examples thereof include silicone antifoaming agents, nonionic surfactants, polyethers, higher alcohols, and polymer surfactants.
  • a general preservative can be used, for example, isothiazoline preservative, triazine preservative, imidazole preservative, pyridine preservative, azole preservative, iodine preservative, pyrithione Examples include antiseptics and the like.
  • the viscosity (value measured using a B-type viscometer at 25 ° C.) of the fluid is preferably 0.1 mPa ⁇ s or more and 500,000 mPa ⁇ s or less, and 0.2 mPa ⁇ s or more and 10,000 mPa ⁇ s or less More preferable.
  • the viscosity is preferably 5 mPa ⁇ s or more and 20 mPa ⁇ s or less.
  • Examples of methods for coating or printing the fluid on the primer layer (B) include inkjet printing, reverse printing, screen printing, offset printing, spin coating, spray coating, and bar coating. Methods, die coating methods, slit coating methods, roll coating methods, dip coating methods, pad printing, flexographic printing methods and the like.
  • the metal nanoparticle layer (C) patterned in the shape of a thin line of about 0.01 to 100 ⁇ m which is required when achieving high density of an electronic circuit or the like. It is preferable to use an inkjet printing method or a reverse printing method.
  • an inkjet printer As the inkjet printing method, one generally referred to as an inkjet printer can be used. Specifically, Konica Minolta EB 100, XY 100 (manufactured by Konica Minolta IJ Co., Ltd.), Dymatics Material Printer DMP-3000, Dimatics Material Printer DMP-2831 (manufactured by Fuji Film Co., Ltd.), etc. may be mentioned.
  • the reverse printing method the letterpress reverse printing method and the intaglio reverse printing method are known, and for example, the fluid is coated on the surface of various blankets and brought into contact with a plate in which non-image areas are projected;
  • the pattern is formed on the surface of the blanket or the like by selectively transferring the fluid corresponding to the non-image area onto the surface of the plate, and then the pattern is formed on the support (A).
  • a method of transferring to (surface) may be mentioned.
  • the pad printing method is known about printing of the pattern to a three-dimensional molded article. This is done by placing the ink on the intaglio plate, filling the ink uniformly into the recess by writing with the squeegee, pressing the pad made of silicone rubber or urethane rubber onto the plate loaded with the ink, the pattern on the pad It is a method of transferring and transferring to a three-dimensional molded product.
  • Mass per unit area of the metal nanoparticle layer (C) is preferably from 1 mg / m 2 or more 30,000 / m 2 or less, 1 mg / m 2 or more 5,000 mg / m 2 or less.
  • the thickness of the metal nanoparticle layer (C) is adjusted by controlling the processing time, the current density, the amount of use of the additive for plating, etc. in the plating process when forming the metal plating layer (D). be able to.
  • the metal plating layer (D) constituting the laminate of the present invention is, for example, a reliable member capable of maintaining good conductivity without causing disconnection or the like over a long period of time when the laminate is used for a printed wiring board or the like. It is a layer provided for the purpose of forming a highly conductive wiring pattern.
  • the method of forming by the plating process is preferable as the formation method.
  • wet plating methods such as an electrolytic plating method which can form the said metal plating layer (D) simply, and an electroless plating method, are mentioned. Also, two or more of these plating methods may be combined. For example, after the electroless plating is performed, electrolytic plating may be performed to form the metal plating layer (D).
  • a metal such as copper contained in the electroless plating solution is precipitated by bringing the electroless plating solution into contact with the metal constituting the metal nanoparticle layer (C). It is a method of forming an electroless plating layer (coating) composed of a coating.
  • Examples of the electroless plating solution include those containing a metal such as copper, silver, gold, nickel, chromium, cobalt and tin, a reducing agent, and a solvent such as an aqueous medium and an organic solvent.
  • reducing agent examples include dimethylaminoborane, hypophosphorous acid, sodium hypophosphite, dimethylamine borane, hydrazine, formaldehyde, sodium borohydride, phenol and the like.
  • monocarboxylic acids such as acetic acid and formic acid
  • dicarboxylic acid compounds such as malonic acid, succinic acid, adipic acid, maleic acid and fumaric acid
  • malic acid lactic acid and glycol Hydroxycarboxylic acid compounds such as gluconic acid and citric acid
  • amino acid compounds such as glycine, alanine, iminodiacetic acid, arginine, aspartic acid and glutamic acid
  • iminodiacetic acid nitrilotriacetic acid, ethylenediaminediacetic acid, ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic acid, etc.
  • a complexing agent such as an organic acid such as aminopolycarboxylic acid compound of the above or a soluble salt of such an organic acid (sodium salt, potassium salt, ammonium salt etc.), an amine compound such as ethylenediamine, diethylenetriamine, triethylenetetramine etc. It can be used for.
  • the electroless plating solution is preferably used at 20 ° C. or more and 98 ° C. or less.
  • the electrolytic plating method is performed, for example, in a state in which an electrolytic plating solution is in contact with the surface of the metal forming the metal nanoparticle layer (C) or the electroless plating layer (film) formed by the electroless processing.
  • a conductive substance constituting the metal nanoparticle layer (C) in which a metal such as copper contained in the electrolytic plating solution is disposed at the cathode by energization, or an electroless plating layer formed by the electroless treatment It is a method of depositing on the surface of (coating) to form an electrolytic plating layer (metal coating).
  • Examples of the electrolytic plating solution include those containing sulfides of metals such as copper, nickel, chromium, cobalt and tin, sulfuric acid, and an aqueous medium. Specifically, those containing copper sulfate, sulfuric acid and an aqueous medium can be mentioned.
  • the electrolytic plating solution is preferably used at 20 ° C. or more and 98 ° C. or less.
  • the metal plating layer (D) As a method of forming the metal plating layer (D), after electroless plating is performed because the film thickness of the metal plating layer (D) can be easily controlled to a desired film thickness from thin film to thick film, The method of electrolytic plating is preferred.
  • the film thickness of the metal plating layer (D) is preferably 1 ⁇ m or more and 50 ⁇ m or less.
  • the film thickness of the metal plating layer (D) is adjusted by controlling the processing time, the current density, the use amount of the additive for plating, etc. in the plating treatment step in forming the metal plating layer (D). Can.
  • Production Example 1 Production of aminotriazine-modified novolak resin Add 750 parts by mass of phenol, 75 parts by mass of melamine, 346 parts by mass of 41.5% by mass formalin, and 1.5 parts by mass of triethylamine to a flask equipped with a thermometer, a condenser, a distillation pipe and a stirrer, The temperature was raised to 100 ° C. with caution. After reacting for 2 hours at 100 ° C. under reflux, the temperature was raised to 180 ° C. over 2 hours while removing water under normal pressure. Then, unreacted phenol was removed under reduced pressure to obtain an aminotriazine-modified novolak resin. The hydroxyl equivalent was 120 g / equivalent.
  • Preparation Example 1 Preparation of Primer Composition (1) Novolak resin ("PHENOLITE TD-2131” manufactured by DIC Corporation, hydroxyl group equivalent 104 g / equivalent) 35 parts by mass, epoxy resin ("EPICLON 850-S” manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent 188 g / equivalent) ) After mixing 64 parts by mass and 1 part by mass of 2,4-diamino-6-vinyl-s-triazine ("VT” manufactured by Shikoku Kasei Co., Ltd.), the mixture is diluted with methyl ethyl ketone so that the nonvolatile content is 2% by mass.
  • the primer composition (1) was obtained by mixing uniformly.
  • Preparation Example 3 Preparation of Primer Composition (3) After mixing 65 parts by mass of the aminotriazine novolac resin obtained in Preparation Example 1 and 35 parts by mass of an epoxy resin ("EPICLON 850-S" manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent), The primer composition (3) was obtained by diluting with methyl ethyl ketone so as to have a non-volatile content of 2% by mass and uniformly mixing.
  • an epoxy resin (“EPICLON 850-S” manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent
  • Preparation Example 4 Preparation of Primer Composition (4) After mixing 48 parts by mass of the aminotriazine novolac resin obtained in Preparation Example 1 and 52 parts by mass of an epoxy resin ("EPICLON 850-S" manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent), The primer composition (4) was obtained by diluting with methyl ethyl ketone so as to have a non-volatile content of 2% by mass and uniformly mixing.
  • an epoxy resin (“EPICLON 850-S” manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent
  • Preparation Example 5 Preparation of Primer Composition (5) After mixing 39 parts by mass of the aminotriazine novolac resin obtained in Production Example 1 and 61 parts by mass of an epoxy resin ("EPICLON 850-S" manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent), The primer composition (5) was obtained by diluting with methyl ethyl ketone so that the non-volatile content was 2% by mass and uniformly mixing.
  • an epoxy resin (“EPICLON 850-S” manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent
  • Preparation Example 6 Preparation of Primer Composition (6) After mixing 31 parts by mass of the aminotriazine novolak resin obtained in Preparation Example 1 and 69 parts by mass of an epoxy resin ("EPICLON 850-S" manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent), The primer composition (6) was obtained by diluting with methyl ethyl ketone so as to have a non-volatile content of 2% by mass and uniformly mixing.
  • an epoxy resin (“EPICLON 850-S” manufactured by DIC Corporation; bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent)
  • Preparation Example 7 Preparation of Primer Composition (7) 47 parts by mass of the aminotriazine novolak resin obtained in Production Example 1, and an epoxy resin ("EPICLON 850-S" manufactured by DIC Corporation; 52 parts by mass of bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent), trimmerization anhydride After mixing 1 part by mass of the acid, the mixture was diluted with methyl ethyl ketone so as to have a nonvolatile content of 2% by mass, and uniformly mixed, to obtain a primer composition (7).
  • an epoxy resin (“EPICLON 850-S" manufactured by DIC Corporation; 52 parts by mass of bisphenol A epoxy resin, epoxy group equivalent of 188 g / equivalent)
  • trimmerization anhydride After mixing 1 part by mass of the acid, the mixture was diluted with methyl ethyl ketone so as to have a nonvolatile content of 2% by mass, and uniformly mixed, to obtain a primer composition (7).
  • Preparation Example 8 Preparation of Primer Composition (R1)
  • the block isocyanate resin (resin content 25% by mass aqueous solution) was diluted with methyl ethyl ketone so that the non-volatile content was 2% by mass, to obtain a primer composition (R1).
  • Example 1 described in Japanese Patent No. 4573138, a cationic silver nano consisting of a flake-like lump having an ash green color which is a complex of silver nanoparticles and an organic compound having a cationic group (amino group) I got the particles. Thereafter, the powder of silver nanoparticles was dispersed in a mixed solvent of 45 parts by mass of ethylene glycol and 55 parts by mass of ion-exchanged water to prepare a fluid (1) having 5% by mass of cationic silver nanoparticles. .
  • Example 1 On the surface of a polyimide film ("Kapton 150 EN-C" manufactured by Toray DuPont Co., Ltd .; thickness 38 ⁇ m), the primer composition (1) obtained in Preparation Example 1 was used as a tabletop small coater (RK Print Coat Instrument Co., Ltd.) It applied so that the thickness after the drying might be set to 100 nm using the product made from "K printing prober". Next, the primer layer was formed on the surface of the polyimide film by drying at 150 ° C. for 5 minutes using a hot air dryer.
  • the fluid (1) obtained above was applied to the surface of the primer layer formed above using a bar coater. Then, by drying for 5 minutes at 150 ° C., a silver layer (film thickness 20 nm) corresponding to the metal nanoparticle layer (C) was formed.
  • the silver layer formed above is immersed for 12 minutes at 45 ° C. in an electroless copper plating solution (“OIC Kappa” manufactured by Okuno Pharmaceutical Co., Ltd., “OIC kappa”, pH 12.5) to perform electroless copper plating, and copper by electroless plating A plating layer (film thickness 0.2 ⁇ m) was formed.
  • an electroless copper plating solution (“OIC Kappa” manufactured by Okuno Pharmaceutical Co., Ltd., “OIC kappa”, pH 12.5) to perform electroless copper plating, and copper by electroless plating
  • a plating layer (film thickness 0.2 ⁇ m) was formed.
  • the copper plating layer by electroless copper plating obtained above is set on the cathode side, phosphorus-containing copper is set on the anode side, and an electrolytic plating solution containing copper sulfate is used at a current density of 2.5 A / dm 2 By performing electrolytic plating for 30 minutes, a copper plating layer (film thickness 15 ⁇ m) by electrolytic copper plating was formed on the surface of the copper plating layer by electroless copper plating.
  • the electrolytic plating solution 70 g / L of copper sulfate, 200 g / L of sulfuric acid, 50 mg / L of chlorine ion, and 5 ml / L of an additive (“Top Rutina SF-M” manufactured by Okuno Pharmaceutical Co., Ltd.) were used.
  • a combination of a copper plating layer by electroless copper plating and a copper plating layer by electrolytic copper plating formed thereon corresponds to the metal plating layer (D).
  • a laminate (1) in which a support (A), a primer layer (B), a metal nanoparticle layer (C), and a metal plating layer (D) were sequentially laminated was obtained.
  • Example 1 is similar to Example 1 except that primer compositions (2) to (7), (R-1) or (R-2) are used instead of primer composition (1) used in Example 1.
  • primer compositions (2) to (7), (R-1) or (R-2) are used instead of primer composition (1) used in Example 1.
  • laminates (2) to (7), (R-1) or (R-2) were obtained.
  • the adhesion was evaluated according to the following criteria from the value of the peel strength before heating measured above.
  • the retention ratio before and after heating was calculated, and heat resistance was evaluated according to the following criteria.
  • composition of the primer composition used in Examples 1 to 4 and Comparative Examples 1 and 2 and the measurement results of peel strength before and after heating, and the evaluation results of adhesion and heat resistance are shown in Table 1.
  • the composition of a primer composition shows only a non volatile matter.
  • the laminates (1) to (7) obtained in Examples 1 to 7, which are laminates of the present invention, have sufficiently high initial (pre-heating) adhesion and also a decrease in peel strength after heating. It was confirmed that the heat resistance was excellent.

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne: un corps stratifié qui a une couche d'apprêt (B), une couche de nanoparticules métalliques (C) et une couche de placage métallique (D) stratifiée dans l'ordre sur un corps de support (A), et qui est caractérisé en ce que la couche d'apprêt (B) contient un composé (b1) ayant un anneau aminotriazine; une carte de circuit imprimé utilisant le corps stratifié; une carte de circuit imprimé souple; et un article moulé. Le corps stratifié peut être produit par un procédé simple sans rendre rugueuse la surface du corps de support, et assure une excellente adhérence entre le corps de support et la couche métallique (couche plaquée par métal).
PCT/JP2018/025165 2017-07-10 2018-07-03 Corps stratifié, carte de circuit imprimé l'utilisant, carte de circuit imprimé souple, et article moulé Ceased WO2019013038A1 (fr)

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KR1020207000073A KR102372638B1 (ko) 2017-07-10 2018-07-03 적층체, 그것을 사용한 프린트 배선판, 플렉서블 프린트 배선판 및 성형품
JP2019526626A JP6579295B2 (ja) 2017-07-10 2018-07-03 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
CN201880040445.9A CN110753617A (zh) 2017-07-10 2018-07-03 层叠体、使用其的印刷布线板、挠性印刷布线板及成形品

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JP2022190866A (ja) * 2021-06-15 2022-12-27 Dic株式会社 積層体およびその製造方法
WO2023238592A1 (fr) 2022-06-07 2023-12-14 Dic株式会社 Stratifié de transfert et son procédé de fabrication
KR20240037880A (ko) 2021-07-15 2024-03-22 다이요 잉키 세이조 가부시키가이샤 적층체 및 적층체를 구비한 전자 기기
KR20240037879A (ko) 2021-07-15 2024-03-22 다이요 잉키 세이조 가부시키가이샤 적층체 및 적층체를 구비한 전자 기기
KR20250042654A (ko) 2023-09-19 2025-03-27 디아이씨 가부시끼가이샤 적층체 및 그 제조 방법

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WO2016208672A1 (fr) * 2015-06-26 2016-12-29 Dic株式会社 Corps stratifié, article moulé, profil électroconducteur, circuit électronique et blindage électromagnétique

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JP2022540412A (ja) * 2019-07-02 2022-09-15 山▲東▼▲聖▼泉新材料股▲ふん▼有限公司 接着促進剤およびそれを含有する感光性樹脂組成物
JP7311232B2 (ja) 2019-07-02 2023-07-19 山▲東▼▲聖▼泉新材料股▲ふん▼有限公司 接着促進剤およびそれを含有する感光性樹脂組成物
JP2022190866A (ja) * 2021-06-15 2022-12-27 Dic株式会社 積層体およびその製造方法
KR20240037880A (ko) 2021-07-15 2024-03-22 다이요 잉키 세이조 가부시키가이샤 적층체 및 적층체를 구비한 전자 기기
KR20240037879A (ko) 2021-07-15 2024-03-22 다이요 잉키 세이조 가부시키가이샤 적층체 및 적층체를 구비한 전자 기기
WO2023238592A1 (fr) 2022-06-07 2023-12-14 Dic株式会社 Stratifié de transfert et son procédé de fabrication
KR20250021432A (ko) 2022-06-07 2025-02-13 디아이씨 가부시끼가이샤 전사용 적층체 및 그 제조 방법
KR20250042654A (ko) 2023-09-19 2025-03-27 디아이씨 가부시끼가이샤 적층체 및 그 제조 방법

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TWI707928B (zh) 2020-10-21
KR20200015695A (ko) 2020-02-12
JP6579295B2 (ja) 2019-09-25

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