[go: up one dir, main page]

WO2019004110A1 - Fil électrique pour bobine à haute fréquence, et composant électronique - Google Patents

Fil électrique pour bobine à haute fréquence, et composant électronique Download PDF

Info

Publication number
WO2019004110A1
WO2019004110A1 PCT/JP2018/023960 JP2018023960W WO2019004110A1 WO 2019004110 A1 WO2019004110 A1 WO 2019004110A1 JP 2018023960 W JP2018023960 W JP 2018023960W WO 2019004110 A1 WO2019004110 A1 WO 2019004110A1
Authority
WO
WIPO (PCT)
Prior art keywords
high frequency
wire
layer
frequency coil
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/023960
Other languages
English (en)
Japanese (ja)
Inventor
北沢　弘
卓也 先田
宮澤　貴志
正平 宮原
岡田　洋一
正宏 柳原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Totoku Electric Co Ltd
Original Assignee
Totoku Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Totoku Electric Co Ltd filed Critical Totoku Electric Co Ltd
Priority to CN201880042572.2A priority Critical patent/CN110800068B/zh
Publication of WO2019004110A1 publication Critical patent/WO2019004110A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation

Definitions

  • the present invention relates to a wire for high frequency coil and an electronic component. More particularly, the present invention relates to a wire for a high frequency coil which can be used for electronic components such as various high frequency coils and can reduce AC resistance at high frequency, and an electronic component using the wire for the high frequency coil.
  • Patent Document 1 proposes an enameled insulated wire having a core wire made of a conductor plated with a ferromagnetic substance such as pure iron on a copper wire, and describes that the high frequency gain Q is improved by several tens of percent. This characteristic improvement is considered to be based on the reduction of alternating current resistance at high frequency, and by applying a ferromagnetic layer to the outer periphery of the conductor, the external magnetic field is shielded and the outside penetrates the inside without being able to be shielded. It is believed that the increase in AC resistance is suppressed by reducing the eddy current due to the magnetic field and suppressing the loss due to the proximity effect. Further, Patent Document 1 also describes that a nickel plating layer is preferable to a copper plating layer as a plating layer provided on a ferromagnetic layer in order to improve soldering characteristics.
  • Patent Document 2 in order to improve solderability, an iron-plated layer is provided on the outer periphery of a conductor, and a nickel-plated layer having a thickness of 0.03 to 0.1 ⁇ m to ensure solderability. And a method of coating and baking an enamel insulating resin layer made of a polyurethane insulating paint before the iron plating layer is oxidized has been proposed.
  • a polyurethane coating layer is generally applied as an enamel insulation layer.
  • the heat resistance of the insulating resin constituting the insulating covering layer is indicated by a heat resistance class such as type A, E, B, F, or H and the maximum allowable temperature, and the polyurethane forming the above-mentioned polyurethane covering layer is The temperature index corresponds to E class 120 ° C.
  • a high temperature resistant resin such as a modified polyurethane or polyester having a temperature index F of 155 ° C., or a polyesterimide having a temperature index H of 180 ° C.
  • the soldering temperature is as high as 420 ° C. in Class F class and 460 ° C. in Class H class.
  • soldering temperature rises As the soldering temperature rises, cross-section reduction due to solder corrosion of the lead (copper conductor etc.) is likely to occur, and the reliability of the connection strength becomes a problem, so the lead is soldered in a very short time Is desirable. That is, the higher the wetting stress and the shorter the zero crossing time, the more reliable the solder connection can be.
  • An object of the present invention is to provide a wire for a high frequency coil and an electronic component using the wire for a high frequency coil, in which reliability of solder bonding can be ensured and reduction of alternating current resistance at high frequency can be achieved.
  • the electric wire for high frequency coil comprises at least a core wire having a copper conductor and a ferromagnetic layer provided on the outer periphery of the copper conductor, and an insulating covering layer provided on the core wire.
  • the ferromagnetic layer has a gap in the radial direction, tin in the solder at the time of soldering can easily reach the copper conductor. As a result, due to metal-to-metal bonding between copper and tin in the solder, the wetting stress becomes high, and a strong solder joint can be obtained.
  • the ferromagnetic layer has an iron layer and a nickel layer provided on the outer periphery of the iron layer.
  • the number of the gaps is a number visible on the surface of the core and is formed by an axial imaginary line and a radial imaginary line having the same length as the diameter D of the core.
  • the number of squares visible in the square is preferably in the range of 2 or more and 30 or less. According to the present invention, since the number of gaps visible in the square is within the above range, the solder at the time of soldering can easily reach the copper conductor.
  • the gap preferably has a coil width within a range of 0.3 ⁇ m to 5 ⁇ m.
  • the copper conductor is preferably selected from tough pitch copper, oxygen free copper, copper-tin alloy, copper-silver alloy, copper-nickel alloy, copper clad aluminum, copper clad magnesium .
  • the copper conductor since the copper conductor has a low resistance and good conductivity of 60% IACS or more, the copper-based metal is in the outermost layer even when the diameter of the conductor is reduced. It is not easily oxidized and the reliability of the soldered joint can be enhanced.
  • the electronic component according to the present invention is characterized by being configured using the electric wire for a high frequency coil according to the present invention.
  • the electronic component include a winding component such as a high frequency coil, and a circuit board provided with a winding component such as a high frequency coil.
  • the electric wire for high frequency coil comprises at least a core wire having a copper conductor and a ferromagnetic layer provided on the outer periphery of the copper conductor, and an insulating covering layer provided on the core wire.
  • a wire for a high frequency coil characterized in that a wetting stress at the time of soldering is 3.4 mN or more and a zero cross time is 0.4 seconds or less. According to this invention, the wetting stress is high, and a strong solder joint can be obtained.
  • the diameter of the copper conductor is preferably in the range of 0.02 to 0.40 mm.
  • the wetting stress is 3.7 mN or more and the zero crossing time is 0.2 seconds or less.
  • the ferromagnetic layer has an iron layer and a nickel layer provided on the outer periphery of the iron layer, and the iron layer has a Vickers hardness of 200 HV.
  • the ferromagnetic layer has an iron layer and a nickel layer provided on the outer periphery of the iron layer, and the thickness of the iron layer is 0.2 ⁇ m or more and 3.0 ⁇ m. It is preferable that it is the following.
  • the electronic component according to the present invention is characterized in that the electric wire for high frequency coil according to the present invention is connected by soldering.
  • the electronic component include a winding component such as a high frequency coil, and a circuit board provided with a winding component such as a high frequency coil.
  • An electric wire 20 for a high frequency coil according to the present invention includes a core 10 having a copper conductor 1 and a ferromagnetic layer 4 provided on the outer periphery of the copper conductor 1, and the core 10 And at least the insulating covering layer 5 provided on the And as shown to FIG. 3 (A) (B), the ferromagnetic layer 4 has the characteristics in having the clearance gap G of radial direction X.
  • the ferromagnetic layer 4 preferably comprises an iron layer 2 and a nickel layer 3 provided on the outer periphery of the iron layer 2.
  • the solder at the time of soldering easily reaches the copper conductor 1.
  • the wetting stress becomes high, and a strong solder joint can be obtained.
  • the gap G is in a form in which the ferromagnetic layer 4 (for example, the nickel layer 3 and the iron layer 2) is pierced. If there is no gap G, tin in the solder will bond with nickel, but if the thickness of the nickel layer is very thin, nickel will diffuse into the solder instantaneously. As a result, since it will actually be bonded to iron, the wetting stress is low and it is difficult to obtain good bonding strength.
  • Core wire 10 includes copper conductor 1 and ferromagnetic layer 4 provided on the outer periphery of copper conductor 1.
  • the high frequency coil wire 20 is at least constituted by a core 10 and an insulating covering layer 5 provided on the core 10.
  • the copper conductor 1 contains copper or a copper alloy as a main constituent metal, and in the present application, tough pitch copper, oxygen free copper, copper-tin alloy, copper-silver alloy, copper-nickel alloy, copper clad aluminum, copper It is selected from clad magnesium and the like. Since these conductors have low resistance and good conductivity of 60% IACS or higher, even when the diameter of the conductor is reduced, a metal mainly composed of copper is in the outermost layer, so it is difficult to be oxidized, and solder is It is possible to improve the reliability of the post-joining.
  • copper-tin alloy copper-silver alloy, copper-nickel alloy, copper clad aluminum, copper clad magnesium, etc.
  • copper is used so that the above-mentioned conductivity (60% IACS or more) preferable as the high frequency coil wire 20 can be obtained.
  • an alloy its alloy composition is preferably adjusted, and in the case of a clad, it is preferable that the material of the core material and the ratio of the clad material to the core material be adjusted.
  • the diameter of the copper conductor 1 is not particularly limited, but it is preferably fine such that the reliability of connection strength in an environment where the soldering temperature is high is a problem, for example, in the range of about 0.02 to 0.40 mm .
  • the ferromagnetic layer 4 is provided on the copper conductor 1, and when the core wire 10 obtained is used as a high frequency coil wire 20 for a high frequency coil, it acts to reduce AC resistance and improve high frequency characteristics. .
  • the constituent material of the ferromagnetic layer 4 is not particularly limited. For example, iron, cobalt, nickel, permalloy (Ni78-Fe22), permalloy (Ni45-Fe55), supermalloy (Ni75-Cu5-Fe20), Co-Ni-Fe (Co20-Ni40-Fe40) etc. can be mentioned.
  • the method of forming the ferromagnetic layer 4 is not particularly limited, electroplating is preferred as a method of forming on the copper conductor 1, but any of the above-described compositions can be deposited by electroplating, and thus preferably used. it can.
  • the high frequency coil wire 20 according to the present invention is characterized in that a gap G described later is formed in the ferromagnetic layer 4.
  • the ferromagnetic layer 4 will be described by way of an example comprising an iron layer 2 and a nickel layer 3.
  • the ferromagnetic layer 4 composed of other than the iron layer 2 and the nickel layer 3 has the high frequency characteristics slightly different depending on its composition, but the same applies to the action, thickness, soldering and the like of the gap G.
  • the iron layer 2 is provided on the copper conductor 1 and constitutes the ferromagnetic layer 4 together with the nickel layer 3.
  • the thickness of the iron layer 2 is preferably in the range of 0.2 ⁇ m to 3.0 ⁇ m.
  • the AC resistance is reduced to improve the high frequency characteristics.
  • pure iron plating is preferably employed because it is ferromagnetic.
  • the iron layer 2 may contain other elements (for example, nickel, cobalt, phosphorus, boron, etc.) as long as the effect of reducing the AC resistance is not impaired.
  • the iron layer 2 can improve high frequency characteristics, and also has an effect of preventing solder corrosion at the time of soldering.
  • solder corrosion is prevented by the iron layer 2 formed on the copper conductor 1 means that it is difficult to form an intermetallic compound of tin and iron in the solder.
  • the difficulty in forming such intermetallic compounds inhibits the combination of copper and tin in the solder, which results in low wetting stress (ie, bonding strength) and poor connection reliability, and in a short time. It may not be possible to meet the demand for solderability.
  • the present invention is characterized in that the ferromagnetic layer 4 composed of the iron layer 2 and the nickel layer 3 has a gap G in the radial direction X.
  • a gap G By having such a gap G, tin in the solder at the time of soldering can easily reach the copper conductor 1. As a result, due to metal-to-metal bonding between copper and tin in the solder, the wetting stress becomes high, and a strong solder joint can be obtained.
  • the gap G has an integral form which is penetrated from the nickel layer 3 to the iron layer 2
  • the number of gaps G is a number visible on the surface of the core wire 10, and in a square (Y1 ⁇ X1) formed by an axial imaginary line Y1 having the same length as the diameter D of the core wire 10 and a radial imaginary line X1. It is a number that looks like
  • the number of gaps G is preferably in the range of 2 or more and 30 or less. Within this range, the solder during soldering can easily reach the copper conductor, and as a result, good wetting stress can be obtained by the metal-to-metal bonding between copper and tin in the solder, and a strong solder can be obtained. Bonding is obtained.
  • the width of the gap G is preferably in the range of 0.3 ⁇ m to 5 ⁇ m, and more preferably in the range of 0.5 ⁇ m to 2.0 ⁇ m.
  • the solder at the time of soldering can easily reach the copper conductor, and as a result, good wetting stress can be obtained by the metal-to-metal bonding between copper and tin in the solder, and a strong solder joint can be obtained.
  • variety of the clearance gap G exceeds 5 micrometers, it may become a pinhole easily.
  • the gap G can be formed by controlling the mechanical characteristics (tensile strength, elongation) of the copper conductor 1 and the size and angle of the pulley as shown in the later-described embodiment.
  • the gap G can be formed by adding an additive to the iron plating solution or controlling the plating conditions to increase the hardness of the iron layer 2 to 200 HV or more in Vickers hardness.
  • the additive examples include thiourea, saccharin, benzothiazole, JGB (Janas green B), bensalacetone, gelatin, polyethylene glycol, butynediol, coumarin and the like, and several tens of ppm of these may be added.
  • molecules or ions can be adsorbed on the precipitation site alone and precipitated.
  • an iron complex is formed by these additives, and the complex can be adsorbed to the precipitation site to be precipitated. Fine and hard crystal grains can be obtained by the effect of the additive, and the iron layer 2 having a Vickers hardness of about 250 HV can be formed.
  • the thickness of the iron layer 2 By setting the thickness of the iron layer 2 to 0.5 ⁇ m or more, preferably 1 ⁇ m or more, the electrodeposition stress is increased, and a gap G is present in the iron layer 2.
  • fine and hard crystal grains can be obtained, for example, by lowering the temperature of the plating solution from 30 ° C. to 20 ° C., or lowering the pH to 3 to 2, and iron with a Vickers hardness of about 300 HV.
  • Layer 2 can be formed. By setting the thickness of the iron layer 2 to 0.5 ⁇ m or more, preferably 1 ⁇ m or more, the electrodeposition stress is increased, and a gap G is present in the iron layer 2.
  • the iron layer 2 is preferably formed by electroplating, and can be formed by supplying power to the copper conductor 1 in an iron electrolytic solution.
  • the plating solution is not particularly limited as long as it is a plating solution having at least an inorganic salt of iron and a supporting electrolyte.
  • an iron sulfate plating solution or an iron chloride plating solution can be used.
  • the plating solution may contain various additives such as a surfactant and a brightening agent, as needed, as long as the effects of the present invention are not impaired.
  • the nickel layer 3 is provided on the iron layer 2 and constitutes the ferromagnetic layer 4 together with the iron layer 2.
  • the thickness of the nickel layer 3 is preferably in the range of 0.01 ⁇ m or more and 1.0 ⁇ m or less, and when the solderability is improved, the nickel layer 3 is used together with the iron layer 2 for a high frequency coil or the like. AC resistance can be reduced to improve high frequency characteristics. If the nickel layer 3 is too thick, the effect of iron, which is a ferromagnetic material, is reduced, and the suppression of high frequency loss due to the proximity effect can not be achieved.
  • the nickel layer 3 is too thin, in an environment where the soldering temperature is high, the nickel layer 3 and tin in the solder react instantaneously and diffuse, and in fact, for bonding the underlying iron layer 2 to the solder material Therefore, the wetting stress is low and it is difficult to obtain a good bonding strength.
  • the nickel layer 3 and the iron layer 2 constitute the ferromagnetic layer 4, and the ferromagnetic layer 4 has the gap G in the radial direction X as described above. In addition, since the gap G has already been described, the description thereof is omitted here.
  • the nickel layer 3 is preferably formed by electroplating, and can be formed by supplying power to the copper conductor 1 provided with the iron layer 2 in a nickel electrolytic solution.
  • the plating solution is not particularly limited as long as it is a plating solution having at least an inorganic salt of nickel and a supporting electrolyte.
  • a nickel sulfate plating solution or a nickel chloride plating solution can be used.
  • the plating solution may contain various additives such as a surfactant and a brightening agent, as needed, as long as the effects of the present invention are not impaired.
  • the insulating covering layer 5 is provided on the ferromagnetic layer 4 as shown in FIG.
  • the high frequency coil wire 20 is useful as various high frequency coils and wires for high frequency coils (a stranded wire, an insulated wire etc. in which the outer periphery of the gathered strands is integrated with the insulating coating) Available to
  • the insulating covering layer 5 is formed by applying and baking a solderable insulating enamel film, or a solderable insulating enamel film and a fusion enamel film on the outer periphery of the core wire 10 after the ferromagnetic layer 4 is formed. Be done.
  • the solderable insulating enamel coating can be formed, for example, by applying and baking a solderable enamel paint such as general purpose polyurethane, modified polyurethane, or polyester imide. Further, the fused enamel film formed on the outer periphery can be formed by coating and baking a fused enamel paint such as nylon or epoxy. These coatings can be manufactured using a conventional enameled wire manufacturing apparatus. In the case where the insulating coating layer 5 (polyamide imide, polyimide, polyester or the like) which can not be soldered is provided, the insulating coating layer 5 can be satisfactorily soldered by peeling it mechanically and / or chemically.
  • the high frequency coil electric wire 20 according to the present invention provided with the insulating covering layer 5 can be used as a component wire of a litz wire, a component wire of a three-layer insulated wire, or the like, except for the high frequency coil.
  • a core wire 10 before providing the insulating covering layer 5 or a surface of the core wire 10 provided with a protective film such as an imidazole complex film it is twisted to form a stranded wire or assembly. It is good also as an insulated wire etc. for high frequency which set it as the assembly line, and the perimeter of the strand or the assembly line was united by extrusion, tape winding, baking etc.
  • the electronic component according to the present invention is configured using the high frequency coil wire 20 according to the present invention described above.
  • Examples of the electronic component include a winding component such as a high frequency coil, and a circuit board provided with a winding component such as a high frequency coil.
  • Example 1 A 0.1 mm diameter annealed material (ACW, tensile strength: 240 MPa, elongation: 27%) obtained by annealing a 0.1 mm diameter hard copper wire (HCW) in an inert gas atmosphere at 360 ° C. as a copper conductor 1 After degreasing and acid activation treatment, an iron layer 2 with a thickness of 1 ⁇ m is formed by electroplating, and subsequently, a nickel layer 3 with a thickness of 0.03 ⁇ m is formed by electroplating, and a ferromagnetic layer 4 (iron layer A core wire 10 provided with 2 and a nickel layer 3) was obtained.
  • ACW tensile strength: 240 MPa, elongation: 278%
  • Iron plating uses iron sulfate plating solution (250 g / L of ferrous sulfate, 50 g / L of iron chloride, 30 g / L of ammonium chloride), and nickel plating uses nickel sulfate (250 g / L of nickel sulfate, 30 g of nickel chloride) / L and boric acid 15 g / L) were used.
  • the obtained core wire 10 was wound while being in contact with a 350 times diameter pulley at an angle of 120 °, and a gap G was provided in the radial direction X of the ferromagnetic layer 4. Thus, a core wire 10 provided with a gap G was obtained.
  • Example 2 The thickness of the iron layer 2 was 2 ⁇ m.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 3 The thickness of the iron layer 2 was 3 ⁇ m.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 4 As the copper conductor 1, an annealed material (ACAW, tensile strength: 330 MPa, elongation: 24%) of 0.1 mm in diameter obtained by annealing hard copper-silver alloy wire (HCAW) of 0.1 mm in diameter in an inert gas atmosphere at 650 ° C. Using. The core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 5 As the copper conductor 1, an annealed material (ACSW, tensile strength: 300 MPa, elongation: 25%) of 0.1 mm in diameter obtained by annealing hard copper-tin alloy wire (HCSW) of 0.1 mm in diameter in an inert gas atmosphere at 600 ° C. Using. The core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • ACSW tensile strength: 300 MPa, elongation: 25%
  • HCSW hard copper-tin alloy wire
  • Example 6 A 300 times diameter pulley was used.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 7 A 200 times diameter pulley was used.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 8 A pulley 100 times the diameter was used.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 9 Annealing was performed in an inert gas atmosphere at 300.degree.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • the annealed material (ACW) had a tensile strength of 280 MPa and an elongation of 15%.
  • Example 10 Annealing was performed at 280 ° C. in an inert gas atmosphere.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • the annealed material (ACW) had a tensile strength of 300 MPa and an elongation of 5%.
  • Example 11 It was wound while contacting the pulley at an angle of 90 °.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 12 It was wound using a 100 times diameter pulley and contacting the pulley at a 90 ° angle.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 13 An annealed material (ACW, tensile strength: 280 MPa, elongation: 18%) having a diameter of 0.05 mm obtained by annealing a hard copper wire (HCW) having a diameter of 0.05 mm in an inert gas atmosphere at 360 ° C. was used as a copper conductor 1.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 14 An annealed material (ACW, tensile strength: 260 MPa, elongation: 22%) having a diameter of 0.08 mm obtained by annealing a hard copper wire (HCW) having a diameter of 0.08 mm in an inert gas atmosphere at 360 ° C. was used as a copper conductor 1.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Example 15 An annealed material (ACW, tensile strength: 240 MPa, elongation: 28%) having a diameter of 0.12 mm obtained by annealing a hard copper wire (HCW) having a diameter of 0.12 mm in an inert gas atmosphere at 360 ° C. was used as a copper conductor 1.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • Comparative Example 1 It did not anneal in inert gas atmosphere.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • the non-annealed hard copper wire (HCW) had a tensile strength of 400 MPa and an elongation of 2%.
  • Comparative Example 2 The thickness of the iron layer 2 was 2 ⁇ m.
  • the core wire 10 was obtained in the same manner as in Comparative Example 1 except for the above.
  • Comparative Example 3 The thickness of the iron layer 2 was 3 ⁇ m.
  • the core wire 10 was obtained in the same manner as in Comparative Example 1 except for the above.
  • Comparative Example 4 Annealed in an inert gas atmosphere at 280 ° C. and used a 400 times diameter pulley. The others were the same as in Example 1 to obtain a high frequency coil wire.
  • the annealed material (ACW) had a tensile strength of 300 MPa and an elongation of 5%.
  • Comparative Example 5 Annealed in an inert gas atmosphere at 280 ° C. and wound while contacting a 400 times diameter pulley at a 90 ° angle.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • the annealed material (ACW) had a tensile strength of 300 MPa and an elongation of 5%.
  • Comparative Example 6 As the copper conductor 1, an annealed material (ACSW, tensile strength: 300 MPa, elongation: 25%) of 0.1 mm in diameter obtained by annealing hard copper-tin alloy wire (HCSW) of 0.1 mm in diameter in an inert gas atmosphere at 600 ° C. Using. Further, it was wound while contacting a pulley having a diameter of 400 times at an angle of 120 °. The core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • ACSW tensile strength: 300 MPa, elongation: 25%
  • HCSW hard copper-tin alloy wire
  • Comparative Example 7 Annealed in an inert gas atmosphere at 300 ° C. and wound while contacting a 350 times diameter pulley at a 160 ° angle.
  • the core wire 10 was obtained in the same manner as in Example 1 except for the above.
  • the annealed material (ACW) had a tensile strength of 240 MPa and an elongation of 15%.
  • Table 1 shows the elements of the core wire 10 obtained in the example and the comparative example.
  • the wetting stress (mN) and the zero cross time (seconds) at the time of soldering were measured with a dynamic wettability tester (WET-6100, manufactured by Lesca Co., Ltd.).
  • the solder was tested at a temperature of 380 ° C. using Sn-3Ag-0.5Cu (manufactured by Senju Metal Industry Co., Ltd.). The results are shown in Table 2.
  • Example 13 The same measurement (wet stress, zero cross time, number of gaps) as in Example 1 was performed on core wires 10 of Examples 13 to 15 having different diameters of copper conductor 1.
  • Example 13 conductor diameter: 0.05 mm
  • wetting stress 1.8 mN
  • zero cross time 0.2 seconds
  • number of gaps G 25, width of gaps G: 1.5 mm
  • product of number and width 37.5.
  • Example 14 conductor diameter: 0.08 mm
  • wetting stress 2.9 mN
  • zero cross time 0.2 seconds
  • number of gaps G 19, width of gaps G: 1.0 mm, product of number and width : 19.
  • Example 15 In Example 15 (conductor diameter: 0.12 mm), wetting stress: 4.3 mN, zero cross time: 0.2 seconds, number of gaps G: 12, width of gaps G: 1.0 mm, product of number and width : 12. From these results, the wetting stress (mN) was divided by a unit surface area, and as a result, Example 1 (conductor diameter: 0.10 mm), Example 13 (conductor diameter: 0.05 mm), Example 14 (Conductor diameter: 0.08 mm) and Example 15 (conductor diameter: 0.12 mm) were all around 5.7 mN / mm 2 .
  • the high frequency characteristics were measured by an LCR meter (a precision LCR meter, 4284 A, 20 Hz to 1 MHz, manufactured by Agilent). The measurement was made with a sample length of 1.50 m, a dedicated bobbin: inner diameter ⁇ 67 mm, and a number of turns of 5 turns, and the terminal was soldered at both ends and connected to the texture for measurement. Using the following samples 1 to 3 (electric wire 20 for high frequency coil) provided with two types of urethane as the insulating coating layer 5, the frequency was changed from 1 kHz to 1 MHz and measurement was performed.
  • Sample 1 2 kinds urethane coated enameled copper wire (21 pieces / ⁇ 0.10 mm)
  • Sample 2 Two types of urethane coated enameled iron plated stranded wire (21 pieces / ⁇ 0.10 mm), gap G: none, iron plating solution (the same iron plating solution as in Example 1, no additive), nickel plating solution (Example The same nickel plating solution as 1), Fe layer thickness: 0.8 ⁇ m, Ni layer thickness: 0.05 ⁇ m
  • Sample 3 Two kinds of urethane coated enameled iron plated stranded wire (21 pieces / ⁇ 0.10 mm), gap G: Yes, iron plating solution (the same iron plating solution as in Example 1, additive: saccharin 2 m / L), nickel plating Solution (the same nickel plating solution as in Example 1), thickness of Fe layer: 0.8 ⁇ m, thickness of Ni layer: 0.05 ⁇ m
  • FIG. 3 (A) is a surface photograph of a seed urethane coated enameled magnetic plated strand of sample 3.
  • FIG. 3 (B) is a surface photograph of the two types of urethane coated enameled magnetic plated strands of sample 2.
  • FIG. 3 (C) is a surface photograph of the two types of urethane-coated enameled copper stranded wire of sample 1.
  • Table 3 is an impedance result
  • Table 4 is a result of resistance loss.
  • Tables 3 and 4 when the ferromagnetic layer 4 is provided, the same high frequency characteristics are shown regardless of the presence or absence of the gap G, and the presence of the gap G lowers the high frequency characteristics. It was not confirmed.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Insulated Conductors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Le problème à résoudre par la présente invention est de fournir : un fil électrique destiné à une bobine à haute fréquence et avec lequel la fiabilité d'un joint soudé est assurée et une résistance CA à des fréquences élevées peut être réduite ; et un composant électronique ayant le fil électrique pour une bobine à haute fréquence. La solution selon l'invention porte sur l'utilisation de ce fil électrique pour une bobine à haute fréquence, le fil électrique étant configuré à partir d'au moins : un fil de noyau 10 ayant un conducteur de cuivre 1 et une couche ferromagnétique 4 disposée sur la circonférence externe du conducteur de cuivre 1, et une couche de revêtement isolante 4 disposée sur le fil de noyau 10, la couche ferromagnétique 4 ayant un espace G dans une direction radiale X, la contrainte de mouillage pendant le brasage est d'au moins 3,4 mN, et le temps de passage par zéro n'est pas supérieur à 0,4 secondes.
PCT/JP2018/023960 2017-06-26 2018-06-25 Fil électrique pour bobine à haute fréquence, et composant électronique Ceased WO2019004110A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880042572.2A CN110800068B (zh) 2017-06-26 2018-06-25 高频线圈用电线及电子部件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-123866 2017-06-26
JP2017123866A JP6352501B1 (ja) 2017-06-26 2017-06-26 高周波コイル用電線及び電子部品

Publications (1)

Publication Number Publication Date
WO2019004110A1 true WO2019004110A1 (fr) 2019-01-03

Family

ID=62779850

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/023960 Ceased WO2019004110A1 (fr) 2017-06-26 2018-06-25 Fil électrique pour bobine à haute fréquence, et composant électronique

Country Status (4)

Country Link
JP (1) JP6352501B1 (fr)
CN (1) CN110800068B (fr)
TW (1) TWI772446B (fr)
WO (1) WO2019004110A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU214353U1 (ru) * 2022-06-27 2022-10-25 Общество с ограниченной ответственностью "Электрозащитные решения" Устройство для защиты от высокочастотных перенапряжений

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7761247B2 (ja) * 2021-04-26 2025-10-28 国立研究開発法人産業技術総合研究所 導線、コイル、トランス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS421339Y1 (fr) * 1964-10-31 1967-01-26
JP2011222617A (ja) * 2010-04-06 2011-11-04 Furukawa Electric Co Ltd:The インダクタ用線材およびインダクタ
JP2016046522A (ja) * 2014-08-22 2016-04-04 住友電気工業株式会社 コイル用線材

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5266340B2 (ja) * 2010-03-23 2013-08-21 株式会社フジクラ 高周波電線及び高周波コイル
CN106342011B (zh) * 2010-09-30 2013-08-07 上海航天设备制造总厂 一种多股铜丝线束与银箔的焊接方法
WO2013051102A1 (fr) * 2011-10-04 2013-04-11 古河電気工業株式会社 Tige d'enroulement pour bobine d'induction, et bobine d'induction

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS421339Y1 (fr) * 1964-10-31 1967-01-26
JP2011222617A (ja) * 2010-04-06 2011-11-04 Furukawa Electric Co Ltd:The インダクタ用線材およびインダクタ
JP2016046522A (ja) * 2014-08-22 2016-04-04 住友電気工業株式会社 コイル用線材

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU214353U1 (ru) * 2022-06-27 2022-10-25 Общество с ограниченной ответственностью "Электрозащитные решения" Устройство для защиты от высокочастотных перенапряжений

Also Published As

Publication number Publication date
TWI772446B (zh) 2022-08-01
JP6352501B1 (ja) 2018-07-04
CN110800068A (zh) 2020-02-14
JP2019008994A (ja) 2019-01-17
TW201917742A (zh) 2019-05-01
CN110800068B (zh) 2021-10-01

Similar Documents

Publication Publication Date Title
JP2003293187A (ja) めっきを施した銅または銅合金およびその製造方法
JP3470795B2 (ja) 銅被覆アルミニウム線
JP2002226982A (ja) 耐熱性皮膜、その製造方法および電気電子部品
KR20120139817A (ko) 고주파 전선 및 고주파 코일
KR20190097078A (ko) 표면 처리재와 그 제조방법 및 이 표면 처리재를 이용하여 제작한 부품
JP2002317295A (ja) リフロー処理Ｓｎ合金めっき材料、それを用いた嵌合型接続端子
JPWO2009005041A1 (ja) 耐フレッティング性コネクタおよびその製造方法
JP6352501B1 (ja) 高周波コイル用電線及び電子部品
JP6896677B2 (ja) 高周波コイル用電線及び電子部品
JP2008218318A (ja) 配線用導体およびその製造方法
JP2003301292A (ja) めっきアルミニウム線およびエナメル被覆めっきアルミニウム線
JP2000057850A (ja) 銅被覆アルミニウム線および絶縁銅被覆アルミニウム線
WO2018124115A1 (fr) Matériau de traitement de surface et article fabriqué à l'aide dudit matériau
WO2014024767A1 (fr) Câble isolant et bobine électrique utilisant celui-ci
JP2004111072A (ja) 平角強磁性導体およびその製造方法、及び該導体を用いたエナメル被覆平角強磁性線、自己融着性エナメル被覆平角強磁性線および強磁性フラットケーブル
JP2005105307A (ja) リフローＳｎめっき部材、前記部材の製造方法、および前記部材が用いられた電気電子機器用部品
JP2003073883A (ja) 高周波用鉄電析膜、高周波コイル用絶縁電線およびこれらの製造方法
JP3346535B2 (ja) めっきアルミニウム電線、絶縁めっきアルミニウム電線およびこれらの製造方法
JP2002231060A (ja) 磁性線
JP2000040417A (ja) 銅被覆アルミニウム線および絶縁銅被覆アルミニウム線
JP7123578B2 (ja) 高周波コイル用絶縁電線
JP2000030538A (ja) 銅被覆アルミニウム線および絶縁銅被覆アルミニウム線
JP2008027696A (ja) コネクタ用部品
JPH10237673A (ja) めっきアルミニウム電線、絶縁めっきアルミニウム電線およびそれらの製造方法
JP7109938B2 (ja) 高周波コイル用線材及び絶縁電線並びに高周波コイル用線材の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18824898

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18824898

Country of ref document: EP

Kind code of ref document: A1