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WO2018216273A1 - Sonde de type mems et dispositif d'inspection électrique utilisant celle-ci - Google Patents

Sonde de type mems et dispositif d'inspection électrique utilisant celle-ci Download PDF

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Publication number
WO2018216273A1
WO2018216273A1 PCT/JP2018/005387 JP2018005387W WO2018216273A1 WO 2018216273 A1 WO2018216273 A1 WO 2018216273A1 JP 2018005387 W JP2018005387 W JP 2018005387W WO 2018216273 A1 WO2018216273 A1 WO 2018216273A1
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Prior art keywords
mems
plunger
contact
barrel
probe
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PCT/JP2018/005387
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English (en)
Japanese (ja)
Inventor
朋徳 齋藤
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Yamaichi Electronics Co Ltd
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Yamaichi Electronics Co Ltd
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Publication of WO2018216273A1 publication Critical patent/WO2018216273A1/fr
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Definitions

  • the present invention relates to a MEMS probe and an electrical inspection apparatus using the same, and in particular, a part or all of a probe and a MEMS probe in which a barrel is configured with components formed by MEMS element technology, and The present invention relates to an electrical inspection apparatus using the same.
  • FIG. 1A and FIG. 1B show an IC package 110 as an example of an inspection target of a semiconductor inspection apparatus.
  • the IC package 110 is composed of CSP (Chip Size Package), WLCSP (Wafer Level Chip Package), FC (Flip Chip), etc., and solder balls 111 or solder bumps are provided at the contact on the back side. .
  • the interposer 120 (sometimes referred to as a substrate) is a printed circuit board having an Au pad 121 at a contact point on the back side and intended for pitch conversion.
  • FIG. 1E and FIG. 1F show a liquid crystal panel 130 as an example of an inspection target.
  • the liquid crystal panel 130 has indium tin oxide (ITO), which is a transparent electrode, at the contact 131 on the back side.
  • ITO indium tin oxide
  • the inspection target may be an electrical performance check using a flexible printed wiring board or TAB (Tape Automated Automated Bonding) tape as an inspection target.
  • an IC socket 210 in which an IC, an LSI or the like shown in FIG. 2A can be inserted and removed, and a probe card for inspecting a silicon wafer shown in FIG. 220 and the like are known.
  • a probe card for inspecting a silicon wafer shown in FIG. 220 and the like are known.
  • an electrode (or contact) for electrical inspection used in such a semiconductor inspection apparatus a spring probe generally used particularly in a narrow pitch region is also known.
  • a conventional spring probe 300 includes a barrel 301, a first plunger 302 having a first contact 302 a that contacts the inspection object 100, and a second plunger 303 having a second contact 303 a that contacts the inspection substrate 10. And a coil spring 304 (compression coil spring) disposed between the first plunger 302 and the second plunger 303 and accommodated in the barrel 301.
  • a coil spring 304 compression coil spring
  • a contact portion 302b that comes into contact with the first end portion 304a of the coil spring 304 is provided at an end portion on the side facing the first contact member 302a.
  • An annular caulking recess 302c is provided on the first contact 302a side of the contact portion 302b.
  • a contact portion 303b that comes into contact with the second end portion 304b of the coil spring 304 is provided at an end portion on the side facing the second contactor 303a.
  • a step part 303c that engages with an engaging part 301b provided at the end of the barrel 301 on the inspection board 10 side is provided.
  • a first plunger 302 In the barrel 301, a first plunger 302, a coil spring 304, and a second plunger 303 are arranged in this order.
  • the first plunger 302 is held by the barrel 301 by engaging with a locking projection 301 a formed at a position corresponding to the caulking recess 302 c of the first plunger 302 on the outer periphery of the barrel 301.
  • the second plunger 303 is slidably held at the lower end of the barrel 301 by the second contactor 303a.
  • the second plunger 303 is prevented from coming off the barrel 301 by engaging the stepped portion 303 c with the engaging portion 301 b of the barrel 301.
  • the coil spring 304 is in an expanded state (non-contracted state) before the inspection object 100 is installed in the semiconductor inspection apparatus 200 (state before use).
  • the step portion 303 c of the second plunger 303 is engaged with the engagement portion 301 b of the barrel 301.
  • the spring probe 300 can control the required contact pressure by the spring property of the coil spring 304, the inspection of the narrow-pitch inspection object 100 having multiple contacts that are difficult to control the contact pressure is particularly difficult. Often used in.
  • the barrel 301, the first plunger 302, the second plunger 303, and the coil spring 304, which are components of such a conventional spring probe 300, are a so-called automatic lathe, press machine (including mold), coiling. It was produced by a surface treatment such as gold plating.
  • the spring probe 300 corresponding to a narrow pitch requires fine processing, it is difficult to increase the accuracy of the cutting process, and there is a possibility that the manufacturing man-hour may increase. Further, the press working requires a highly accurate mold, and therefore the manufacturing cost may increase. Furthermore, since the spring probe 300 as a whole has a large number of parts, the number of manufacturing steps and the manufacturing cost may increase.
  • MEMS Micro Electro Mechanical System
  • the electroforming method uses an electrochemical reaction similar to electroplating, electrodeposits electrolyzed metal ions on the surface of the master model, and peels it off to make the master model the same shape as the original model. Is a method to duplicate.
  • a mold is produced by electroforming based on a master made of a fine plastic structure having a high aspect ratio by X-ray lithography. This is a mass production technique for fine three-dimensional structures in which metal, plastic (polymer), etc. are molded using this mold as a mold.
  • Patent Documents 1 and 2 describe inventions that use MEMS element technology for probes.
  • Patent Document 1 discloses an electrical contact formed by integrally forming a contact portion and a deformation portion using a LIGA process method.
  • a bellows-shaped contact (spring) formed by an electroforming method is formed instead of a plate spring contact (spring) stamped and formed by press processing, which is a conventional technique, and a bellows arc portion is formed.
  • the electroforming method is effective when miniaturizing the component parts in order to cope with a narrow pitch.
  • an elastic body that is a bellows-shaped contactor is also used. Since it becomes fine, it becomes difficult to incorporate without deformation or breakage.
  • the present invention by constituting part or all of the probe with components formed by the MEMS element technology, it is resistant to deformation and breakage, and the resistance value can be lowered and the conductive performance is kept high, while maintaining the manufacturing cost and It is an object of the present invention to provide a MEMS type probe capable of suppressing the number of manufacturing steps at low cost, and an electrical inspection apparatus using the same.
  • the present invention has the following features. That is, a first contact having a first contact portion that contacts an inspection object, a second contact having a second contact portion that contacts an inspection substrate, and the first contact and the second contact
  • a MEMS-type plunger that is disposed between and includes a bellows elastic body that spring-biases the first contact and the second contact in directions away from each other, at least one of which is formed by MEMS element technology;
  • the MEMS plunger is housed in a telescopic manner, and includes a MEMS barrel formed by the MEMS element technology.
  • the MEMS plunger is formed in a flat plate shape
  • the MEMMS barrel has a cylindrical shape including a long axis opening and a short axis opening whose inner diameter is formed with a predetermined aspect ratio,
  • the plate width direction of the MEMS plunger is oriented along the long axis opening.
  • the MEMS type plunger further includes a caulking fixing part for preventing the MEMS type barrel from coming off.
  • the caulking fixing part is formed either between the first contactor and the bellows elastic body or between the second contactor and the bellows elastic body.
  • the bellows elastic body has a first elastic region portion connected to the first contactor side and a second elastic region portion connected to the second contactor side,
  • the caulking fixing portion is integrally formed between the first elastic region portion and the second elastic region portion, and both the first contactor and the second contactor are attached to the MEMS barrel. It becomes slidable.
  • the caulking fixing portion includes a first notch portion formed on a side surface in the plate width direction and / or a second notch portion formed on a side surface in the plate thickness direction, and the first notch of the MEMS barrel.
  • a dent of the first locking convex portion that bulges toward the first notch is formed on the outer periphery facing the portion, and a second dent is formed on the outer periphery facing the second notch of the MEMS barrel.
  • the dent of the 2nd latching convex part which bulges toward a notch part is formed.
  • the plate thickness of the bellows elastic body of the MEMS plunger is Tb
  • the plate width is Wb
  • the long axis opening diameter of the MEMS barrel is Dl
  • the short axis opening diameter is Ds
  • the following formula 1-Equation 3 is all satisfied.
  • Plate thickness Tb ⁇ Short axis opening diameter Ds Formula 1
  • Plate width Wb ⁇ major axis opening diameter Dl
  • either the first contactor or the second contactor is welded to the open end side of the M ⁇ ⁇ EMS type barrel.
  • the MEMS plunger is a laminate in which at least two MEMS plunger members are laminated in the thickness direction.
  • the adjacent MEMS type plunger members are laminated so that the bellows elastic bodies have the same phase or the opposite phase.
  • the present invention also includes an electrical inspection apparatus using the MEMS probe described above. That is, a semiconductor inspection device (for example, an IC socket or burn-in socket in a post-process, a probe card in a pre-process), a liquid crystal inspection device (for example, panel lighting inspection, module electrical inspection, etc.), a printed circuit board inspection device (for example, bare board) Inspection, in-circuit inspection, etc.) and electronic component inspection devices (for example, capacitors and resistors) can be used as electrical inspection devices.
  • a semiconductor inspection device for example, an IC socket or burn-in socket in a post-process, a probe card in a pre-process
  • a liquid crystal inspection device for example, panel lighting inspection, module electrical inspection, etc.
  • a printed circuit board inspection device for example, bare board Inspection, in-circuit inspection, etc.
  • electronic component inspection devices for example, capacitors and resistors
  • the present invention by constituting a part or all of the probe with the components formed by the MEMS element technology, it is resistant to deformation and breakage, the resistance value can be lowered, and the conductive performance can be enhanced. Manufacturing costs and man-hours can be kept low.
  • FIGS. 1C and 1D are a front view and a plan view of an IC package as an example of an inspection object.
  • FIGS. 1C and 1D are a front view and a plan view of an interposer.
  • FIG. (F) is the front view and top view of a liquid crystal panel.
  • FIG. 2A is a front view of an IC socket as an example of a socket for semiconductor inspection
  • FIG. 2B is a plan view of a probe card.
  • 4A is a longitudinal sectional view in the plate width direction before using the MEMS probe according to the first embodiment of the present invention, and FIG.
  • FIG. 4B is a usage state of the MEMS probe shown in FIG. 4A.
  • FIG. 5A is a longitudinal sectional view in the plate width direction before using the MEMS probe according to the second embodiment of the present invention
  • FIG. 5B is a use state of the MEMS probe shown in FIG.
  • FIG. 6A is a longitudinal sectional view in the plate width direction before using the MEMS probe according to the third embodiment of the present invention
  • FIG. 6B is a view before using the MEMS probe shown in FIG.
  • FIG. 6C is an enlarged cross-sectional view of the VIC portion shown in FIG. 6A.
  • FIG. 7A is a longitudinal sectional view in the plate width direction before using the MEMS probe according to the third embodiment (modified example) of the present invention
  • FIG. 7B is a MEMS type shown in FIG. 7A
  • FIG. 7C is an enlarged cross-sectional view of the VIIC portion shown in FIG. 7A
  • FIG. FIG. 8A is a longitudinal sectional view in the plate width direction before using the MEMS probe according to the fourth embodiment of the present invention
  • FIG. 8B is a usage state of the MEMS probe shown in FIG.
  • 9A is a side view of the cylindrical barrel of the first to fourth embodiments of the present invention
  • FIG. 9B is a front view of the cylindrical barrel shown in FIG. 9A
  • FIG. 9 (d) is a front view of the MEMS barrel shown in FIG. 9 (c), and FIG. 9 (e) is a track-shaped MEMS mold according to the present invention.
  • the side view of a barrel and FIG.9 (f) are front views of the MEMS type
  • FIG. 10A is a side view of a locking projection having a four-point caulking structure as an example of a method for fixing the MEMS plunger to the MEMS barrel.
  • FIG. 10B is a side view of FIG.
  • FIG. 10C is a cross-sectional view along the XC-XC line shown in FIG. 10A
  • FIG. 10D is a two-point caulking structure.
  • FIG. 10A is a side view of a locking projection having a four-point caulking structure as an example of a method for fixing the MEMS plunger to the MEMS barrel.
  • FIG. 10B is a side view of FIG.
  • FIG. 10C is
  • FIG. 10E is a cross-sectional view taken along line XE-XE shown in FIG. 10D
  • FIG. 10F is taken along line XF-XF shown in FIG. 10D.
  • FIG. 11A is a side view of a spot welded structure as an example of a method for fixing the MEMS type plunger to the MEMS type barrel
  • FIG. 11D is a side view of the laser welding structure
  • FIG. 11E is FIG.
  • FIG. 11F is a cross-sectional view taken along line XIE-XIE shown in FIG.
  • FIG. 12A is a perspective view showing a state where the tip shape of the first contactor is a ridge receiving shape
  • FIG. 12B is a perspective view showing a triangular shape
  • FIG.12 (d) is the perspective view which shows the state made into circular arc shape
  • FIG.12 (e) is the perspective view which shows the state made into crown shape.
  • FIG. 13A is a longitudinal sectional view in the plate width direction before using the MEMS probe according to the fifth embodiment of the present invention
  • FIG. 13B is a view before using the MEMS probe shown in FIG. FIG.
  • FIG. 13 (c) is a plan view of the MEMS probe shown in FIG. 13 (a)
  • FIG. 13 (d) is a usage state of the MEMS probe shown in FIG. 13 (a).
  • FIG. 13E is a partial cross-sectional view in the plate width direction shown in FIG.
  • FIG. 14A is a partial cross-sectional view in the plate width direction before using the MEMS probe according to the sixth embodiment of the present invention
  • FIG. 14B is a usage state of the MEMS probe shown in FIG. It is a fragmentary sectional view of the board width direction which shows.
  • a MEMS probe 400 is used in a semiconductor inspection apparatus that inspects an inspection object 100 shown in FIGS. 1A to 1B.
  • a plurality of MEMS probes 400 are arranged in a predetermined arrangement pattern in the IC socket 210 shown in FIG. 2A, and electrically connect the inspection object 100 and the inspection substrate 10.
  • the IC socket 210 is provided with a number of probe storage holes equal to the number of contacts of the inspection object 100 on a fixing plate formed of an insulating material such as machinable ceramics or engineering plastic. The same number of MEMS probes 400 as the number of contacts of the inspection object 100 are accommodated.
  • the present invention is not limited to this.
  • the MEMS probe 400 of the present invention is applied to the probe card 220 shown in FIG. 2B, the vertical positions of the inspection object 100 and the inspection substrate 10 are reversed.
  • the MEMS probe 400 according to the first embodiment of the present invention includes a MEMS barrel 401 and a MEMS plunger 402.
  • the MEMS type plunger 402 of the first embodiment of the present invention is formed in a plate shape as a whole, and includes a first contactor 402a that contacts the inspection object 100, a second contactor 402b that contacts the inspection substrate 10, and a first contactor 402b.
  • a bellows elastic body 402c disposed between the first contact 402a and the second contact 402b is provided, which are integrally formed by MEMS element technology.
  • the first contactor 402a is formed of a plate having a uniform width, and a contact portion 402a1 that contacts the inspection object 100 is provided in a V shape in this example at the tip (the upper end in FIG. 4A). ing.
  • the second contactor 402b is composed of a plate-shaped piece having an equal width, and a contact part 402b1 that contacts the inspection substrate 10 is provided in a spire shape in this example at the tip (lower end in FIG. 4A).
  • the second contact 402b is slidably disposed in the MEMS barrel 401 so as to be able to appear and retract.
  • the MEMS barrel 401 and the MEMS plunger 402 which are the constituent elements of the MEMS probe 400 of the present invention, are formed by electroforming.
  • the electroforming method uses an electrochemical reaction similar to electroplating, electrodeposits electrolyzed metal ions on the surface of the master model, and peels it off to make the master model the same shape as the original model. Is a method to duplicate. This is an effective method for fine processing.
  • the MEMS type barrel 401 and the MEMS type plunger 402 by an electroforming method, a high-precision fine MEM S type can be obtained without using cutting and pressing with high manufacturing man-hours and manufacturing costs.
  • the probe 400 can be manufactured. Further, the number of parts is reduced from four parts of the conventional spring probe 300 to two parts, and the number of manufacturing steps and the manufacturing cost can be further reduced.
  • both the MEMS type barrel 401 and the MEMS type plunger 402 are formed by the electroforming method, but only the MEMS type plunger 402 may be formed by the electroforming method. It may be formed by other MEMS element technology. The same effect can be obtained also by these.
  • all of the first contact 402a, the second contact 402b, and the bellows elastic body 402c are integrally formed by electroforming.
  • metal ions are electrodeposited on the surface of a master model as an electrode and are peeled off, so that the bellows shape is easier to manufacture than the coil shape.
  • a caulking fixing portion 402d is formed between the first contactor 402a of the MEMS plunger 402 and the bellows elastic body 402c. As shown in FIGS. 10A to 10C, the caulking fixing portion 402d includes a second notch portion 402d1 penetrating in the plate thickness direction and two second notches provided on the side surface of the second notch portion 402d1. It is formed in a shape having one notch 402d2.
  • the caulking fixing portion 402d is fixed by a locking projection 401a formed by driving a needle or the like from the outer periphery of the ME MS barrel 401.
  • the MEMS plunger 402 is held by the MEMS barrel 401, and electrical continuity between the two is ensured.
  • the caulking fixing portion 402d is formed between the first contactor 402a and the bellows elastic body 402c, but is formed between the second contactor 402b and the bellows elastic body 402c. May be. Such an embodiment is also included in the present invention.
  • the flange 402e is formed on the MEMS plunger 402.
  • the flange 402e is configured to engage with the end 401b of the MEMS barrel 401 on the inspection object 100 side at a position close to the first contactor 402a.
  • the flange 402e By providing the flange 402e, relative alignment between the MEMS plunger 402 and the MEMS barrel 401 is performed. Further, the flange 402e has a function of retaining the MEMS type probe 400 when the MEMS probe 400 is disposed in the probe housing hole of the IC socket 210 and being locked to the housing of the probe housing hole.
  • the MEMS barrel 401 is manufactured using the MEMS element technology and is cylindrical as shown in FIGS. 9 (a) and 9 (b) described later. It is formed into a shape.
  • the case where the MEMS barrel 401 has a cylindrical shape will be described as an example. However, it is only necessary to satisfy all the conditions of Equation 1 to Equation 3 described later.
  • the bellows elastic body 402c In the state before use shown in FIG. 4A, the bellows elastic body 402c is in an expanded state (non-contracted state). On the other hand, in the state of use shown in FIG. 4B, the bellows elastic body 402c is in a compressed (contracted) state.
  • the MEMS-type plunger 402 is held by the MEMS-type barrel 401 in a state where the locking projection 401a of the MEMS-type barrel 401 is engaged with the caulking fixing portion 402d, and the second contactor 402b is in contact with the inner wall of the MEMS-type barrel 401. In this state, it can slide freely.
  • the MEMS plunger 402 By covering the MEMS plunger 402 with the MEMS barrel 401, the MEMS plunger 402 is deformed as compared with the method of holding the contact formed by electroforming described in Patent Document 2 in the housing by light press fitting. It is resistant to breakage and can be easily replaced. Further, as described above, a plurality of conduction paths are ensured for the MEMS barrel 401, the resistance value of the entire probe can be lowered, and the conduction performance can be enhanced.
  • the MEMS type plunger 402 or the MEMS type barrel 401 formed by the MEMS element technology such as electroforming is used, and the MEMS type plunger 402 is surrounded by the MEMS type barrel.
  • the MEMS type plunger 402 is covered by 401, it is resistant to deformation and breakage, and the manufacturing cost and the number of manufacturing steps can be reduced at a low cost while maintaining a low resistance value as a whole and a high conductive performance.
  • the MEMS probe 500 includes a locking projection 501a provided on the MEMS barrel 501 and a MEMS plunger as compared to the MEMS probe 400 shown in FIG.
  • the position of the caulking fixing portion 502d provided in 502 is different, and the other configurations are the same. Similar components are denoted by the same reference numerals, and description thereof is omitted.
  • the bellows elastic body 502c includes a first elastic region portion 502c1 connected to the first contact 502a side and a second contact.
  • a second elastic region portion 502c2 connected to the 502b side is provided, and a caulking fixing portion 502d is integrally formed between the first elastic region portion 502c1 and the second elastic region portion 502c2.
  • the caulking fixing portion 502d is provided near the middle stage of the bellows elastic body 502c of the MEMS plunger 502. Similar to the caulking fixing portion 402d shown in FIGS. 4 and 10, the caulking fixing portion 502d includes a second notch portion 502d1 penetrating in the plate thickness direction and two first notches provided on the side surfaces of the second notch portion 502d1. A shape having a portion 502d2 is formed.
  • a locking projection 501a is provided at a position corresponding to the caulking fixing portion 502d.
  • the caulking fixing portion 502 d is formed by driving a needle or the like from the outer periphery of the MEMS barrel 501, and the MEMS plunger 502 is held by the MEMS barrel 501.
  • the first contact 502 a and the second contact 502 b become both movable pins.
  • the formation position and the holding position of the caulking fixing portion 502d may be arbitrarily changed according to the design of the contact pressure (load) for the inspection object 100 and the inspection substrate 10.
  • the same effect as that of the first embodiment of the present invention can be obtained by the MEMS probe 500 of the second embodiment of the present invention.
  • the MEMS probe 600 has the same configuration in plan view as compared with the MEMS probe 400 shown in FIG. 4.
  • the MEMS type plunger 402 is formed by stacking two plunger members 602A and 602B having the same shape in the thickness direction.
  • the two plunger members 602A and 602B are overlapped in the same direction, and are overlapped so that the bellows elastic bodies 602Ac and 602Bc are in phase with each other.
  • symbol is attached
  • the two thin plunger members 602A and 602B having the same shape are arranged inside the MEMS barrel 601 in a state of being stacked in the same direction.
  • MEMS elemental technology such as electroforming
  • fine processing can be performed with high accuracy.
  • even the plunger members 602A and 602B of the MEMS probe 600 corresponding to the narrow pitch can be manufactured with high accuracy.
  • the plate thickness of each plunger member is controlled as shown in FIG. 6 (c).
  • the MEMS probes 600 can be configured by stacking them.
  • the spring load of the bellows elastic bodies 602Ac and 602Bc can be controlled with high accuracy.
  • This method is an effective method for designing a thin plate-shaped bellows elastic body such as the MEMS probe 600.
  • the plunger members 602A and 602B are overlapped so that the bellows elastic bodies 602Ac and 602Bc have the same phase.
  • the bellows elastic bodies 702Ac and 702Bc may be overlapped so as to be in opposite phases.
  • the number of plunger members may be two or more, and when three or more plunger members are laminated, for example, the odd numbered sheets are in the same phase and the even numbered sheets are in reverse phase so that they are alternated. You may laminate.
  • the same effects as those of the first embodiment of the present invention can be obtained by the MEMS probes 600 and 700 of the third embodiment of the present invention.
  • the MEMS type probe 700 has a plurality of conduction paths SL1 and SL2 formed when the plunger members 702A and 702B come into contact with each other, the plunger alone has a low resistance value and high conductivity without using the barrel. Can be obtained.
  • the MEMS probe 800 includes a MEMS plunger 802 and a general plunger 803 that is not a MEMS type, instead of the MEMS plunger 402, as compared with the MEMS probe 400 shown in FIG. 4. However, the rest of the configuration is the same. Similar components are denoted by the same reference numerals, and description thereof is omitted.
  • the MEMS plunger 802 includes a second contact 802 b that contacts the inspection substrate 10 and a bellows-shaped bellows elastic body 802 c, and is a MEMS element such as an electroforming method as an integral unit. Formed by technology. That is, the MEMS type plunger 802 has a shape obtained by removing the plunger 803 from the MEMS type plunger 402 of the first embodiment.
  • the plunger 803 is fixed to the MEMS barrel 801 by engaging the caulking concave portion 803b with the engaging convex portion 801a ′.
  • the MEMS plunger 802 is fixed to the MEMS barrel 801 by engaging the caulking fixing portion 802d provided at the upper end of the bellows elastic body 802c with the locking projection 801a.
  • the plunger 803 and the MEMS plunger 802 are in contact with each other here, but a conduction path is formed through the MEMS barrel 801.
  • the plunger 803 is formed by cutting a conductive metal into a shape having the first contact 803a.
  • a palladium alloy is preferably used, but a general SK material or a BeCu alloy is used. It may be a plating specification product.
  • the shape of the part is formed using electrolysis, and therefore an alloy such as a palladium alloy cannot be formed.
  • the MEMS probe 800 of this embodiment is advantageous when inspecting the inspection object 100 that requires high-precision inspection and solder adheres (transfers) and causes contact problems.
  • the MEMS probe 800 according to the fourth embodiment of the present invention can provide the same effects as those of the first embodiment.
  • the palladium alloy can be used suitably as a contact metal because the unused alloy surface is exposed by polishing with a cleaning sheet or the like, in addition to the above advantages.
  • the cylindrical barrels 401, 501, 601, 701 described in the first to fourth embodiments have high slidability in the probe receiving hole of the semiconductor inspection apparatus 200, but are similar to the MEMS plunger 402.
  • a large gap G may be formed between the inner wall of the cylindrical barrel 900 and the left and right side surfaces in the thickness direction (left and right direction in FIG. 9A).
  • the MEMS plunger 402 is easily bent toward the gap G, and is likely to be deformed or cracked. Moreover, since the contact area with each MEMS type
  • a cylindrical MEMS barrel 910, 920 having a non-cylindrical inner diameter that satisfies the formulas 1 to 3 described later, such as a square, a rectangle, or an ellipse. is preferably used.
  • the MEMS barrel 910 shown in FIGS. 9C and 9D has a square shape.
  • the MEMS barrel 920 shown in FIGS. 9E and 9F has a track shape.
  • the MEMS barrel 1301 has a non-cylindrical opening that includes a long axis opening and a short axis opening whose inner diameter is formed with a predetermined aspect ratio.
  • the plate width direction of the MEMS type plunger 1302 is oriented along the opening.
  • the MEMS probe The 1300 is configured to satisfy all of the following formulas 1 to 3.
  • Plate thickness Tb ⁇ Short axis opening diameter Ds Formula 1
  • Plate width Wb ⁇ major axis opening diameter Dl
  • Plate width Wb > Short axis opening diameter Ds Formula 3
  • the side surface (the bellows body) of the MEMS plunger 1302 is oriented in the arc direction of the MEMS barrel 1301, even if the bellows body buckles during use and contacts the inner wall of the barrel, sliding is not hindered.
  • the MEMS plunger 1302 cannot be inserted into the MEMS barrel 1301 due to mutual interference.
  • the plate width Wb the short axis opening diameter Ds
  • the plate width direction of the MEMS plunger 1302 is not oriented along the long axis opening of the MEMS barrel 1301, and the MEMS type is not performed without relative alignment.
  • the plunger 1302 may rotate within the MEMS barrel 1301. Therefore, if any one of them is not satisfied, the assembly itself is impossible.
  • the MEMS barrel 1301 has an example in which the opening has a track shape and is continuous in the same cross-sectional shape from the upper end to the lower end. As shown in FIGS. 9C and 9D, a regular square MEMS barrel 910 may be used.
  • the MEMS-type plunger 1302 has a configuration other than the caulking fixing portion 1302d1 similar to the caulking fixing portion 402Ad shown in FIGS. 10D to 10F described later. Since this is the same as the first embodiment shown in FIGS. 4A and 4B, the description thereof is omitted.
  • the MEMS probe 1400 shown in FIG. 14 includes a second contactor 1402b shown on the lower side of FIGS. 14A and 14B and a caulking fixing part 1402d provided between the bellows elastic bodies 1402c.
  • the other configuration is the same as that of the MEMS probe 400 shown in FIG. Similar components are denoted by the same reference numerals, and description thereof is omitted.
  • a flange 1402e for retaining is provided at an intermediate position of the first contact 1402a shown on the upper side of FIGS. 14 (a) and 14 (b).
  • the relative positioning of the MEMS plunger 1402 with respect to the MEMS barrel 1401 requires adjustment during caulking work. According to this, the flange 1402e is locked to the housing of the probe housing hole, the jumping out of the first contact 1402a can be suppressed, and a preload can be loaded on the MEMS probe 1400.
  • the MEMS probe 1400 according to the sixth embodiment of the present invention can achieve the same effects as those of the first embodiment of the present invention.
  • a needle or the like is provided from the outer periphery of the MEMS barrel 401 to a position facing the second notch 402d1 penetrating in the plate thickness direction of the caulking fixing portion 402d.
  • the locking projection 401a is formed.
  • the vertical caulking process shown in FIG. 10C is performed.
  • a locking projection 401a is formed by driving a needle or the like into a position facing the two first notches 402d2 provided on the side surface of the second notch 402d1.
  • the vertical caulking process shown in FIG. 10B is performed.
  • the MEMS plunger 402 is firmly fixed to the MEMS barrel 401.
  • the position is opposed to the second notch 402Ad1 penetrating in the plate thickness direction of the caulking fixing portion 402Ad of the MEMS plunger 402A.
  • the locking projection 401Aa is formed by driving a needle or the like from the outer periphery of the MEMS barrel 401A.
  • the vertical caulking process shown in FIG. 10 (f) is performed.
  • the caulking fixing portion 402Ad does not need to be provided with the first notch on the side surface of the second notch 402Ad1.
  • Such a two-point caulking structure can reduce the number of steps for caulking adjustment, and is therefore effective when there is no problem in the caulking strength. Furthermore, since the load concerning the MEMS barrel 401 is small, the barrel itself is not easily deformed.
  • the inner wall of the MEMS barrel 401B and the outer surface of the MEMS plunger 402 B are melted / solidified by spot welding and integrated from above and below in two directions. .
  • both the MEMS barrel 401B and the heel MEMS plunger 402B do not need to appear on the surface, and both need only be in contact with each other, so that the fixing position can be changed. Also by such a method, the MEMS barrel 401B and the MEMS plunger 402B can be fixed.
  • the end surface of the MEMS barrel 401C and the outer surface of the MEMS plunger 402C are laser-treated from the upper and lower directions shown in FIG. It is melted / solidified by welding and integrated.
  • the MEMS barrel 401C and the MEMS plunger 402C need to appear on the surface and can be welded only at the end of the MEMS barrel 401C. Since there is a wider range of melting and solidification than spot welding, there is an advantage that it can be joined more firmly. Also by such a method, the MEMS barrel 401B and the MEMS plunger 402B can be fixed.
  • FIG. 12 shows a variation of the first contactor 402a as an example of the tip shape of the MEMS plunger 402 or the like.
  • the tip shape of the plunger 803 may be used.
  • the MEMS plunger 402 and the like are formed by MEMS element technology such as electroforming, they are formed in a flat plate shape instead of a cylindrical shape.
  • the peak receiving shape 402Da shown in FIG. 12A and the crown shape 402Ha shown in FIG. 12E are the solder balls or the IC package having the solder bumps shown in FIG. 1A and FIG. Suitable for contacts such as 110.
  • a triangular shape 402Ea shown in FIG. 12 (b) and an arc shape 402Ga shown in FIG. 12 (d) are suitable for contacts such as the interposer 120 shown in FIGS. 1 (c) and 1 (d).
  • a flat shape 402Fa shown in FIG. 12C is suitable for a contact point such as the liquid crystal panel 130 in FIGS. 1E and 1F.
  • the examples of all the tip shapes are merely examples, and other shapes may be used.
  • the plunger 802 has been described.
  • the present invention is not limited to this, and a MEMS spring that includes only the bellows-shaped bellows elastic body without including any contact portion may be formed by MEMS element technology such as electroforming. Also in this case, the effect of the present invention can be obtained.
  • the MEMS probe of the present invention includes a semiconductor inspection device (for example, an IC socket or burn-in socket in a post-process, a probe card in a pre-process), a liquid crystal inspection device (for example, a panel lighting inspection, a module electrical inspection, etc.), It can be used as an electrical inspection device such as a printed circuit board inspection device (for example, a bare board inspection or in-circuit inspection) or an electronic component inspection device (for example, a capacitor or a resistor).
  • a semiconductor inspection device for example, an IC socket or burn-in socket in a post-process, a probe card in a pre-process
  • a liquid crystal inspection device for example, a panel lighting inspection, a module electrical inspection, etc.
  • an electrical inspection device such as a printed circuit board inspection device (for example, a bare board inspection or in-circuit inspection) or an electronic component inspection device (for example, a capacitor or a resistor).
  • the present invention by constituting a part or all of the probe with the components formed by the MEMS element technology, it is resistant to deformation and breakage, the resistance value can be lowered, and the conductive performance is enhanced. In addition, the manufacturing cost and the number of manufacturing steps can be suppressed at a low cost.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

Grâce à la configuration d'une partie ou de la totalité d'une sonde à partir de composants formés à l'aide d'une technologie d'élément MEMS, la présente invention concerne une sonde de type MEMS qui est résistante à la déformation et aux dommages et qui est capable de maintenir un faible coût de fabrication et une faible charge de travail de fabrication tout en obtenant une valeur de résistance faible et en maintenant une conductivité élevée. La présente invention concerne également un dispositif d'inspection électrique utilisant cette sonde. La présente invention est pourvue d'un plongeur de type MEMS 402 dans lequel au moins un élément parmi un premier contact 402a, un second contact 402b, et un corps élastique de soufflet 402c pour une poussée de ressort du premier contact 402a et du second contact 402b dans des directions amenant le premier contact 402a et le second contact 402b à se séparer l'un de l'autre a été formé à l'aide d'une technologie d'élément MEMS, et un barillet de type MEMS 401 qui a été formé à l'aide d'une technologie d'élément MEMS.
PCT/JP2018/005387 2017-05-24 2018-02-16 Sonde de type mems et dispositif d'inspection électrique utilisant celle-ci Ceased WO2018216273A1 (fr)

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WO2020153114A1 (fr) * 2019-01-23 2020-07-30 株式会社日本マイクロニクス Sonde et son procédé de fabrication
JP2020118667A (ja) * 2019-01-23 2020-08-06 株式会社日本マイクロニクス プローブ及びその製造方法
JP2021042974A (ja) * 2019-09-06 2021-03-18 山一電機株式会社 コンタクトプローブ及びこれを備えた検査用ソケット
CN113287023A (zh) * 2019-01-10 2021-08-20 日本电产理德股份有限公司 接触端子、检查治具以及检查装置
WO2024137854A1 (fr) * 2022-12-20 2024-06-27 Formfactor, Inc. Sondes mems présentant une conception électrique et mécanique découplée

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JP7620385B2 (ja) * 2019-04-25 2025-01-23 オムロン株式会社 プローブピン、検査治具および検査ユニット
JP7702233B2 (ja) * 2019-11-27 2025-07-03 株式会社日本マイクロニクス プローブ
KR20230032062A (ko) * 2021-08-30 2023-03-07 (주)포인트엔지니어링 수직형 프로브 카드
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Publication number Priority date Publication date Assignee Title
CN113287023A (zh) * 2019-01-10 2021-08-20 日本电产理德股份有限公司 接触端子、检查治具以及检查装置
WO2020153114A1 (fr) * 2019-01-23 2020-07-30 株式会社日本マイクロニクス Sonde et son procédé de fabrication
JP2020118667A (ja) * 2019-01-23 2020-08-06 株式会社日本マイクロニクス プローブ及びその製造方法
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WO2024137854A1 (fr) * 2022-12-20 2024-06-27 Formfactor, Inc. Sondes mems présentant une conception électrique et mécanique découplée

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