WO2018122980A1 - 樹脂フィルム処理装置 - Google Patents
樹脂フィルム処理装置 Download PDFInfo
- Publication number
- WO2018122980A1 WO2018122980A1 PCT/JP2016/088953 JP2016088953W WO2018122980A1 WO 2018122980 A1 WO2018122980 A1 WO 2018122980A1 JP 2016088953 W JP2016088953 W JP 2016088953W WO 2018122980 A1 WO2018122980 A1 WO 2018122980A1
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- WIPO (PCT)
- Prior art keywords
- resin film
- feed roller
- resin
- processing apparatus
- surface portion
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
Definitions
- the present invention relates to a resin film processing apparatus that performs wet processing on a web-like resin film.
- the thickness of the resin film to be transported tends to be thin, and when a very thin polyimide film having a thickness of 12.5 microns to 25 microns is transported between the sending side roll and the winding side roll.
- maintaining a delicate tension balance is also required for the resin film being conveyed.
- wet plating especially when plating on both sides of the resin film to be treated, it is required to send the resin film into the treatment tank while maintaining a certain tension, but immediately before the treatment tank, etc.
- the surface of the feed roller such as metal disposed on the surface may slip between the resin film and the seed layer of the plating process or the deposited metal film may be defective, resulting in a good plating film. Problems such as inability to form occur.
- the present invention reliably transports a resin film to a treatment tank even when a relatively thin resin film is transported between a sending-side roll and a winding-side roll.
- An object of the present invention is to provide a resin film processing apparatus capable of performing good processing.
- the resin film processing apparatus of the present invention is a resin film processing apparatus that performs a required process by sending a resin film between a sending side roll and a winding side roll, and sends the resin film to which a predetermined tension is applied. And an elastomer resin surface portion that contacts the resin film is formed on the surface of the feed roller.
- the resin film processing apparatus of the present invention since the elastomer resin surface portion that contacts the resin film is formed on the surface of the feed roller, the resin film and the feed roller are used by the grip force of the elastomer resin surface portion. Can be greatly suppressed.
- FIG. 1 is a schematic diagram showing a configuration of a resin film processing apparatus according to a first embodiment of the present invention.
- the resin film processing apparatus 1 is an apparatus in which a web-shaped resin film 4 is sent between a delivery-side roll 8 and a winding-side roll 7 to perform a plating process.
- the plating treatment is performed by immersing the resin film 4 in a plating treatment tank 9 containing a treatment liquid, and for example, a conductive metal seed layer or a metal thin film layer can be formed.
- three rollers are used as a configuration for sending the resin film 4 to the plating tank 9, and the feed roller 2 is arranged at a position sandwiched between the upstream roller 5 and the downstream roller 6 in the liquid. It is installed.
- Each of the rollers 2, 5, 6 has a rotation axis extending in a direction perpendicular to the feeding direction of the resin film 4, and comes into contact with the surface of the resin film 4 from the sending-side roll 8 to the winding-side roll 7.
- the resin film 4 is conveyed.
- the feed roller 2 is a metal roller such as a cylindrical stainless steel having a required diameter, and an elastomer resin surface portion 3 that is in contact with the resin film 4 is formed on the peripheral side surface of the feed roller 2.
- the elastomer resin surface portion 3 is a resin member made of a plurality of strip-shaped elastomer resins arranged at equal intervals on the peripheral side surface of the feed roller 2, and the contact friction of the surface is larger than that of the feed roller 2 made of metal.
- the elastomer resin surface portion 3 is affixed to the surface of the feed roller 2 with a double-sided tape, fixed with an adhesive, or a groove is formed on the surface of the feed roller 2, and an elastomer resin is formed in the groove. It is also possible to fit the surface portion 3.
- the elastomer resin surface portion 3 may be made of a porous polyamide-based elastomer resin. If the material is relatively high in chemical resistance and can be made porous, other elastomer materials can be used. Can also be made into the elastomer resin surface portion 3.
- a porous polyamide-based elastomer resin specifications such as a porosity of 60%, a pore diameter of 10 to 50 microns, a tensile breaking stress of 3.1 MPa, a tensile breaking elongation of 800% GL, and a dropping water absorption speed of 60 seconds are included.
- Polyamide elastomers having the following can be used:
- the band-shaped elastomer resin surface portion 3 formed on the surface of the feed roller 2 reliably increases the grip force against the resin film 4, and the friction between the resin film 4 and the feed roller 2 is achieved. The occurrence of defects in the plating film due to the above is prevented in advance.
- FIG. 2 is a schematic diagram showing a configuration of a resin film processing apparatus according to a second embodiment of the present invention.
- the resin film processing apparatus 10 is an apparatus for performing a plating process by sending a web-shaped resin film 12 between the delivery side roll 14 and the take-up side roll 16 in the direction of the arrow in the figure. While the resin film 12 is being sent, a non-contact unit 30 that is held in non-contact with the resin film 12 is provided. Further, a feed roller 18 for feeding the resin film 12 and a dancer roll 28 on the upstream side of the non-contact unit 30 in the transport direction of the resin film are provided.
- the dancer roller 28 has its roller shaft held by a pair of arms 26, and a counterweight 24 is disposed near the dancer roller 28 of the arms 26.
- the dancer roller 28 functions as a tension regulator for the web-shaped resin film 12 and functions to keep the tension during conveyance of the resin film 12 within a predetermined range.
- the non-contact unit 30 directs the plating treatment liquid 36 from a plurality of jets 32 formed on the lower peripheral surface of the tip portion 38 of the unit toward one surface of the resin film 12. Erupts.
- the treatment liquid 36 for plating is supplied by a pump or the like (not shown) connected to the upper end portion or the side portion of the non-contact unit 30 and is ejected from the plurality of ejection ports 32 toward the resin film 12 so as to be non-contact.
- the lower peripheral surface of the unit 30 and the upper surface of the resin film 12 are maintained in non-contact, and the conveyance path of the resin film 12 takes a route that bends downward in this portion.
- the processing tank 34 holds the processing liquid 36 around the tip 38 of the non-contact unit 30, and the resin film 12 is immersed in the processing liquid 36 in the processing tank 34 immediately before heading to the non-contact unit 30.
- the resin film 12 that has passed through the front end portion 38 of the non-contact unit 30 takes a route to be taken out from the liquid surface of the processing liquid 36 in the processing tank 34 to the next processing or winding process.
- the elastomer resin surface portion 20 that contacts the resin film 12 is formed on the surface 18 s of the feed roller 18.
- the elastomer resin surface portion 20 is a resin member made of a plurality of strip-shaped elastomer resins disposed at equal intervals on the peripheral side surface that is the surface 18 s of the feed roller 18, and contact friction on the surface thereof. Is larger than the feeding roller 18 made of a metal such as stainless steel, and as a result, the gripping force against the resin film 12 is increased, so that the slip between the resin film 12 and the feeding roller 18 is suppressed.
- the resin members are parallel to each other and extend in the axial direction of the feed roller 18 on the surface 18s of the feed roller 18, and, as will be described later, are attached to the surface 18s of the feed roller 18 with a double-sided tape. It is also possible to fix with an adhesive or to form a groove on the surface 18s of the feed roller 18 and to fit the elastomer resin surface portion 20 into the groove. Further, the elastomer resin surface portion 20 can be structured to be detachable from the surface 18s of the feed roller 18. When the elastomer resin surface portion 20 is worn or deteriorates with time, it is replaced with a new elastomer resin surface portion 20. It can also be done.
- the elastomer resin surface portion 20 can be made of a porous polyamide-based elastomer resin. If the material has a relatively high chemical resistance and can be made porous, other elastomer materials can be used. Can be made into the elastomer resin surface portion 20.
- a porous polyamide-based elastomer resin specifications such as a porosity of 60%, a pore diameter of 10 to 50 microns, a tensile breaking stress of 3.1 MPa, a tensile breaking elongation of 800% GL, and a dropping water absorption speed of 60 seconds are included.
- the elastomer resin surface portion 20 may be a composite structure in which only the surface is made of a porous polyamide-based elastomer resin, and the portion other than the surface layer portion is a resin material that can withstand other wet processing.
- the surface of the elastomer resin surface portion 20 which is the opposite surface of the elastomer resin surface portion 20, is the surface of the feed roller 18.
- the amount of protrusion is 0.1 mm to 4.0 mm, and more preferably about 0.2 mm to 2.0 mm, so that the resin film 12 can be reliably conveyed.
- the resin film 12 is a polyimide resin film having a thin film thickness of, for example, about 25 microns or less, preferably about 12.5 microns or less.
- an aromatic compound is directly connected by an imide bond.
- the aromatic polyimide has a conjugated structure of aromatics through its imide bond, and has the highest thermal, mechanical, and chemical properties in the polymer due to the imide bond having the strong intermolecular force.
- Kapton trade name
- Upilex (trade name) manufactured by Ube Industries, Ltd.
- the resin film processing apparatus of the present embodiment that performs such plating treatment is preferably used as a processing apparatus for one process in a continuous production line.
- the resin film processing apparatus is electrically conductive on the resin film 12. It can use for the formation process of the metal seed layer of the line process which manufactures the flexible copper clad laminated base material which forms the copper layer as a layer.
- the present applicant has previously formed a seed layer of a conductive metal such as Ni or an alloy thereof, and previously formed a copper conductive layer on the seed layer.
- JP 2010-159478 A discloses the technology.
- a simple method for producing a flexible copper-clad laminate will be described.
- a pretreatment step is performed in which a polyimide resin film surface that is flexible, heat resistant, and excellent in chemical resistance is subjected to surface modification to make it hydrophilic.
- a polyamic acid modified layer is formed on the surface by an alkali wet modification method.
- a reduction treatment is performed to form a hydrophilic surface-modified layer obtained by reducing the adsorbed Pd ion to a metal.
- a series of mutation behaviors by this alkaline wet modification method is that when a polyimide resin is treated with an alkaline aqueous solution, a part of its surface is hydrolyzed and a part of the imide ring is cleaved, resulting in an amide group and a carboxyl group. Generate. This generated carboxyl group is easy to exchange cation ions, so that metal ions can be adsorbed.
- a conductive metal seed layer is formed on the surface of the resin film thus modified with a hydrophilic surface in advance by plating with a conductive metal such as Ni or an alloy thereof by an electroless plating method.
- the resin film 12 can be fed by non-contact conveyance using the non-contact unit 30 by using the resin film processing apparatus 10 according to the present embodiment, and the grip force of the feed roller 18 is the elastomer resin surface portion. Therefore, it is possible to realize a process that does not cause slippage on the surface of the feed roller 18 and that does not cause uneven plating of the conductive metal.
- a conductive nickel seed layer having a thickness of about 10 to 300 nm may be formed on both surfaces, and Ni alloys such as Ni—P, Ni—B, and Ni—Cu may be used. Can be mentioned.
- Conditions for performing copper plating on the resin film having a metal film formed on the surface with the acidic copper plating bath composition may be normal copper sulfate plating conditions. That is, plating may be performed at a liquid temperature of about 23 to 27 ° C. and an average cathode current density of about 1 to 3 A / dm 2 for about 0.1 to 250 minutes. In general, it is preferable to perform copper plating under liquid agitation such as aeration.
- all processes including a seed layer formation by electroless Ni plating that can be made in-line at low cost are obtained by a wet method (all wet process).
- a layer flexible copper-clad laminate substrate can appropriately cope with fine patterning.
- the two-layer flexible copper-clad laminate substrate manufactured by thick copper plating without primary copper plating on the resin film surface on which the seed layer of the conductive metal coating has been formed in advance has a smooth gloss. It has an appearance, and the peel resistance of the obtained copper plating layer is remarkably improved.
- the resin film wet processing apparatus of the present invention is not limited to plating. It can be applied to all wet processes. That is, the wet processing apparatus for the resin film of the present invention may be, for example, a wet etching apparatus, a chemical processing apparatus, a cleaning apparatus, a coating apparatus, a developing apparatus, a coating apparatus, or the like. It may be incorporated as a part of the line, or may be mounted on a part of another processing apparatus.
- the resin film wet processing apparatus of the present invention is arranged between the pre-processing step and the post-processing step for forming the copper layer, and is premised on the continuous supply of a web-shaped resin film. If the problem such as film peeling does not occur, the resin film once wound after the pretreatment process can be supplied, and the resin film can be wound once before the posttreatment process.
- a known electroless nickel plating bath can be used as the treatment liquid introduced into the treatment tank 34.
- the conditions may be the concentration, temperature, time, etc. recommended for the electroless nickel plating bath.
- electroless nickel plating bath electroless Ni—P plating, electroless Ni—B plating, electroless pure Ni plating, etc. can be used, but there is no particular limitation. It is preferable to use a bath.
- ES-500 manufactured by JCU Co., Ltd.
- the processing temperature can be set to 40 ° C., for example.
- the elastomer resin surface portion 20 formed on the surface 18 s of the feed roller 18 is a resin composed of a plurality of strip-shaped elastomer resins arranged at equal intervals on the circumferential side surface that is the surface 18 s of the feed roller 18. It is possible to form a member, but it is also possible to form it on the surface 18s of the feed roller 18 in another pattern. 4 to 8 show the elastomer resin surface portions 20a to 20e having other patterns, respectively. As shown in FIG. 4, the elastomer resin surface portion 20 a can be a plurality of strip-shaped resin members that are extended in the transport direction of the resin film 12 when the vertical direction of the drawing is the transport direction of the resin film 12. . FIG.
- FIG. 5 shows an example in which the elastomer resin surface portion 20b is spirally arranged on the surface 18s of the feed roller 18. By adjusting the pitch and the inclination with respect to the axial direction, the elastomer resin surface portion 20b may be single or plural. .
- FIG. 6 shows an example in which a lattice-shaped elastomer resin surface portion 20c is arranged, and the linear portion of the elastomer resin surface portion 20c may be along the axial direction of the feed roller 18, although illustration is omitted.
- the lattice-shaped elastomer resin surface portion pattern can be tilted from the axial direction.
- FIG. 7 and 8 are examples in which a plurality of dot-shaped elastomer resin surface portions 20d and 20e are formed, and the rectangular elastomer resin surface portions 20d can be arranged at predetermined intervals.
- the surface portions 20d can also be arranged at a predetermined interval.
- other hexagonal polygons such as a hexagonal shape can be laid as the elastomer resin surface portion.
- a stripe-shaped groove 44 is formed on the surface of the feed roller 42, and a belt-shaped elastomer resin surface portion 40 is fitted in the groove 44.
- the width of the groove 44 and the width of the elastomer resin surface portion 40 are approximately the same, and an adhesive layer 41 made of a double-sided tape or an adhesive is formed on the bottom of the elastomer resin surface portion 40.
- the adhesive layer 41 holds the elastomer resin surface portion 40 against the feed roller 42 so that the elastomer resin surface portion 40 does not fall out of the groove 44.
- the elastomer resin surface portion 40 can be peeled off against the adhesive force of the adhesive layer 41 and can be easily replaced with a new one. Can do.
- the groove 48 formed on the surface of the feed roller 46 has a dovetail cross section, a narrow opening on the surface side, and a wide bottom.
- the elastomer resin surface portion 50 is pushed into the groove 48 while being elastically deformed, and the narrow opening is prevented from coming off, so that the groove 48 is detachably fixed to the elastomer resin surface portion 50.
- the elastomer resin surface portion 50 is firmly held in the groove 48.
- the elastomer resin surface portion 50 is peeled off, the elastomer resin surface portion 50 is elastically deformed again.
- the elastomer resin surface portion 50 can be easily detached from the feed roller 46 by passing through the narrow opening.
- This embodiment is an example of a resin film processing apparatus in which the feed roller has an opening.
- the feed roller 54 shown in FIG. 11 has slits 58 in which the feed roller 54 itself functions as a plurality of openings, and an elastomer resin surface portion 56 is formed on the surface of the feed roller 54 between the slits 58. .
- the peripheral surface portion of the elastomer resin surface portion 56 and the feed roller 54 has a structure that extends in parallel to the axial direction of the feed roller 54.
- an elastomer resin surface portion is formed on the surface of a hollow feed roller, a liquid supply mechanism portion that supplies liquid to the surface of the resin film outside the feed roller, and an elastomer resin surface portion This is an example in which the cleaning liquid is supplied to the resin film from the opening between the two.
- the resin film processing apparatus of the present embodiment has a hollow feed roller 64, and the feed roller 64 rotates around the shaft 60 in the clockwise direction in the drawing,
- the film 62 is configured to be conveyed.
- the feed roller 64 itself is made of, for example, a metal member, and an elastomer resin surface portion 66 is formed on the surface portion thereof.
- the elastomer resin surface portion 66 has a surface contact friction larger than that of a metal roller such as stainless steel, and as a result, the grip force with respect to the resin film 62 is increased, so that slip between the resin film 62 and the feed roller 64 is suppressed.
- a belt-like porous polyamide-based elastomer resin can be used for the elastomer resin surface portion 66, and the same material as the elastomer resin surface portion 20 described above can be used.
- the elastomer resin surface portion 66 is a belt-like shape and extends on the peripheral side surface of the feed roller 64 in the longitudinal direction of the shaft 60, and is fixed by a method such as bonding using an adhesive or a double-sided tape.
- a cleaning liquid shower portion 74 is also formed at a portion where the resin film 62 is separated from the feed roller 64, and the lower surface side of the resin film 62 is cleaned.
- a plurality of slits 68 having a rectangular opening that is an opening except for a portion where the elastomer resin surface portion 66 is formed are formed. Internal and external communication.
- the resin film 62 passes above the feed roller 64, and the elastomer resin surface portion 66 of the feed roller 64 contacts the resin film 62.
- a liquid supply mechanism unit 70 that ejects the cleaning liquid in a mist-like manner in a direction perpendicular to the shaft 60 of the feed roller 64 is disposed.
- the liquid supply mechanism 70 has a nozzle 72 connected to a pump and compressed air (not shown), and is controlled so that the cleaning liquid is ejected from the nozzle 72 toward the inside of the feed roller 64 through the slit 68. Is done.
- the cleaning liquid that has reached the inside of the feed roller 64 through the slit 68 reaches the lower surface of the resin film 62 through the slit 68 that opens on the upper side.
- the resin film 62 has an advantage that the lower surface of the resin film 62 is washed while being fed by the feed roller 64, and as a result, the effect of eliminating the cloudy pattern generated on the lower surface of the resin film is also obtained. ing.
- an elastomer resin surface portion is formed on the surface of a hollow feed roller, a liquid supply mechanism portion that supplies liquid to the surface of the resin film inside the feed roller, and an elastomer resin surface portion This is an example in which the cleaning liquid is supplied to the resin film from the opening between the two.
- the resin film processing apparatus of this embodiment has a hollow feed roller 84, and the feed roller 84 rotates around the shaft 80 in the clockwise direction in FIG.
- the film 82 is configured to be conveyed.
- the feed roller 84 itself is made of, for example, a metal member, and an elastomer resin surface portion 86 is formed on the surface portion thereof.
- the elastomer resin surface portion 86 has the same material and function as the elastomer resin surface portion 66 of the previous embodiment, and can increase the grip force on the resin film 82.
- slits 88 that are rectangular openings are formed in regions between the plurality of elastomer resin surface portions 86, respectively, and the feed roller 84 has a slit 88.
- the resin film 82 is configured such that the front and back surfaces of the resin film 82 receive both the plating solution and the cleaning solution by the plating solution shower unit 94 and the cleaning solution shower unit 96 disposed in the middle of the conveyance path. ing.
- a hollow fixed portion 92 having the shaft 80 is formed in the vicinity of the shaft 80.
- the shaft 80 and the feed roller 64 rotate when feeding the resin film 82, and the feed roller
- the conveyance such that there is no slip on the surface of 84 is realized.
- a cleaning liquid is supplied from a pump (not shown) to the gap between the inside of the fixed portion 92 and the shaft 80.
- Three liquid supply mechanism portions 90a, 90b, and 90c are formed on the radially outer side of the fixed portion 92.
- a spray-like cleaning liquid is ejected toward the slit 88 of the feed roller 84.
- the spray-like cleaning liquid that has passed through the slit 88 reaches the back surface of the resin film 82 that is conveyed with high frictional force by the elastomer resin surface portion 86 of the feed roller 84, and the bottom surface of the resin film 82 is cleaned.
- An effect of eliminating the cloudy pattern generated on the lower surface of the film can also be obtained.
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Abstract
Description
図1は、本発明の第1の実施形態にかかる樹脂フィルム処理装置の構成を示す模式図である。樹脂フィルム処理装置1は、送出側ロール8と巻取側ロール7の間でウエブ状の樹脂フィルム4が送られてめっき処理を行う装置である。めっき処理は処理液を入れためっき処理槽9に樹脂フィルム4を浸漬することで行われ、例えば導電性の金属シード層や金属薄膜層を形成することができる。めっき処理槽9に樹脂フィルム4を送る構成として、本実施形態では、3つのローラーが使用されており、上流側ローラー5と液中の下流側ローラー6に挟まれた位置に送りローラー2が配設されている。これらローラー2、5、6は、それぞれその回転軸が樹脂フィルム4の送り方向と垂直な方向に延長されており、樹脂フィルム4の表面に当接して送出側ロール8から巻取側ロール7へ樹脂フィルム4を搬送させる。
図2は、本発明の第2の実施形態にかかる樹脂フィルム処理装置の構成を示す模式図である。樹脂フィルム処理装置10は、送出側ロール14と巻取側ロール16の間でウエブ状の樹脂フィルム12が図中矢印方向に送られてめっき処理を行う装置である。この樹脂フィルム12が送られる途中には、樹脂フィルム12とは非接触に保持される非接触ユニット30が設けられている。また、この非接触ユニット30の樹脂フィルムの搬送方向の上流側には、樹脂フィルム12を送るための送りローラー18と、さらにその上流側にはダンサーロール28が設けられている。
図7、図8はそれぞれ複数のドット状のエラストマー樹脂表面部20d、20eを形成した例であり、矩形状のエラストマー樹脂表面部20dを所定の間隔で配列させることもでき、円形状のエラストマー樹脂表面部20dを所定の間隔で配列させることもできる。また、図示を省略しているが、エラストマー樹脂表面部として他の六角形の如き多角形を敷くようにすることもでき、円形ではなく楕円や角丸な形状のエラストマー樹脂表面部を所定の間隔で配列させることもできる。また、六角形や四角形のエラストマー樹脂表面部を離間させずにタイル貼りのように敷き詰めることも可能である。さらに、大きな平面状のエラストマー樹脂表面部を送りローラー18の表面18sの全面に形成することも可能である。
本実施形態は、その送りローラーが開口部を有する樹脂フィルム処理装置の例である。図11に示す送りローラー54は、送りローラー54自体が複数の開口部として機能するスリット58を有しており、スリット58の間の送りローラー54の表面にエラストマー樹脂表面部56が形成されている。エラストマー樹脂表面部56及び送りローラー54の周面部分は、当該送りローラー54の軸方向に平行に延長される構造を有している。このような構造の送りローラー54を先に説明した送りローラー18の代わりに用いた場合には、スリット58によって処理液等が溜まることがなく、さらに樹脂フィルムを搬送している間に、樹脂フィルムの送りローラー当接面に対して洗浄液やその他の処理液を噴きかけて洗浄或いは処理を進めことができるという利点を有する。
本実施形態は、中空状の送りローラーの表面にエラストマー樹脂表面部が形成され、送りローラーの外部に樹脂フィルムの面に液体を供給する液体供給機構部され、エラストマー樹脂表面部の間の開口部から洗浄液が樹脂フィルムに対して供給される例である。
本実施形態は、中空状の送りローラーの表面にエラストマー樹脂表面部が形成され、送りローラーの内部に樹脂フィルムの面に液体を供給する液体供給機構部され、エラストマー樹脂表面部の間の開口部から樹脂フィルムに対して洗浄液が供給される例である。
2 送りローラー
3 エラストマー樹脂表面部
4 樹脂フィルム
5、6 ローラー
7 巻取側ロール
8 送出側ロール
9 めっき処理槽
10 樹脂フィルム処理装置
12 樹脂フィルム
14 送出側ロール
16 巻取側ロール
18 送りロール
18s 表面
20、20a~20e エラストマー樹脂表面部
24 カウンターバランス
26 アーム
28 ダンサーローラー
30 非接触ユニット
32 噴出口
34 処理槽
36 処理液
38 先端部
40 エラストマー樹脂表面部
41 接着層
42 送りローラー
44 溝
46 送りローラー
48 溝
50 エラストマー樹脂表面部
52 軸
54 送りローラー
56 エラストマー樹脂表面部
58 スリット
60 軸
62 樹脂フィルム
64 送りローラー
66 エラストマー樹脂表面部
68 スリット
70 液体供給機構部
72 ノズル
74 洗浄液シャワー部
80 軸
82 樹脂フィルム
84 送りローラー
86 エラストマー樹脂表面部
88 スリット
90a,90b,90c 液体供給機構部
92 固定部
94 めっき液シャワー部
96 洗浄液シャワー部
Claims (10)
- 送出側ロールと巻取側ロールの間で樹脂フィルムが送られ所要の処理を行う樹脂フィルム処理装置であって、
所定の張力が付与された前記樹脂フィルムを送るための送りローラーを有し、前記送りローラーの表面には前記樹脂フィルムと接触するエラストマー樹脂表面部が形成されていることを特徴とする樹脂フィルム処理装置。 - 請求項1記載の樹脂フィルム処理装置であって、前記所要の処理に用いられる処理用液剤を前記樹脂フィルムの一方面に噴出する非接触ユニットを有し、前記非接触ユニットの前若しくは後に前記送りローラーが配設されることを特徴とする樹脂フィルム処理装置。
- 請求項1記載の樹脂フィルム処理装置であって、前記エラストマー樹脂表面部は、所定の間隔で離間して前記送りローラー表面に配されることを特徴とする樹脂フィルム処理装置。
- 請求項1記載の樹脂フィルム処理装置であって、前記エラストマー樹脂表面部は多孔質構造を有することを特徴とする樹脂フィルム処理装置。
- 請求項1記載の樹脂フィルム処理装置であって、前記エラストマー樹脂表面部はポリアミド系エラストマーを主な材料とすることを特徴とする樹脂フィルム処理装置。
- 請求項1記載の樹脂フィルム処理装置であって、前記送りローラー表面に形成される前記エラストマー樹脂表面部は、前記送りローラー表面に着脱可能に取り付けられることを特徴とする樹脂フィルム処理装置。
- 請求項2記載の樹脂フィルム処理装置であって、前記非接触ユニットは処理槽内に処理用液剤を噴出する噴出口を有することを特徴とする樹脂フィルム処理装置。
- 請求項2記載の樹脂フィルム処理装置であって、前記非接触ユニットから噴出される処理液は、めっき処理用の液体であることを特徴とする樹脂フィルム処理装置。
- 請求項1記載の樹脂フィルム処理装置であって、前記送りローラーは中空体であり、且つその送りローラーの表面には前記エラストマー樹脂表面部以外の部分に開口部が形成されていることを特徴とする樹脂フィルム処理装置。
- 請求項9記載の樹脂フィルム処理装置であって、前記送りローラーの内部若しくは外部には前記開口部を介して前記樹脂フィルムの面に液体を供給する液体供給機構部が形成されることを特徴とする樹脂フィルム処理装置。
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| KR1020197017929A KR102780118B1 (ko) | 2016-12-27 | 2016-12-27 | 수지 필름 처리 장치 |
| PCT/JP2016/088953 WO2018122980A1 (ja) | 2016-12-27 | 2016-12-27 | 樹脂フィルム処理装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111441040A (zh) * | 2018-12-26 | 2020-07-24 | 株式会社杰希优 | 树脂膜的湿式处理装置 |
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- 2016-12-27 CN CN201680091893.2A patent/CN110114506B/zh active Active
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| CN111441040B (zh) * | 2018-12-26 | 2024-06-11 | 株式会社杰希优 | 树脂膜的湿式处理装置 |
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| JP6972019B2 (ja) | 2021-11-24 |
| JPWO2018122980A1 (ja) | 2019-10-31 |
| KR20190097059A (ko) | 2019-08-20 |
| CN110114506A (zh) | 2019-08-09 |
| KR102780118B1 (ko) | 2025-03-11 |
| CN110114506B (zh) | 2021-08-03 |
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