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WO2018122980A1 - Dispositif de traitement de film de résine - Google Patents

Dispositif de traitement de film de résine Download PDF

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Publication number
WO2018122980A1
WO2018122980A1 PCT/JP2016/088953 JP2016088953W WO2018122980A1 WO 2018122980 A1 WO2018122980 A1 WO 2018122980A1 JP 2016088953 W JP2016088953 W JP 2016088953W WO 2018122980 A1 WO2018122980 A1 WO 2018122980A1
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WO
WIPO (PCT)
Prior art keywords
resin film
feed roller
resin
processing apparatus
surface portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/088953
Other languages
English (en)
Japanese (ja)
Inventor
誠 高徳
弥一郎 中丸
裕規雄 篠崎
剛毅 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chuo Kikai Co Ltd
JCU Corp
Original Assignee
Chuo Kikai Co Ltd
JCU Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuo Kikai Co Ltd, JCU Corp filed Critical Chuo Kikai Co Ltd
Priority to CN201680091893.2A priority Critical patent/CN110114506B/zh
Priority to KR1020197017929A priority patent/KR102780118B1/ko
Priority to PCT/JP2016/088953 priority patent/WO2018122980A1/fr
Priority to JP2018558581A priority patent/JP6972019B2/ja
Publication of WO2018122980A1 publication Critical patent/WO2018122980A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils

Definitions

  • the present invention relates to a resin film processing apparatus that performs wet processing on a web-like resin film.
  • the thickness of the resin film to be transported tends to be thin, and when a very thin polyimide film having a thickness of 12.5 microns to 25 microns is transported between the sending side roll and the winding side roll.
  • maintaining a delicate tension balance is also required for the resin film being conveyed.
  • wet plating especially when plating on both sides of the resin film to be treated, it is required to send the resin film into the treatment tank while maintaining a certain tension, but immediately before the treatment tank, etc.
  • the surface of the feed roller such as metal disposed on the surface may slip between the resin film and the seed layer of the plating process or the deposited metal film may be defective, resulting in a good plating film. Problems such as inability to form occur.
  • the present invention reliably transports a resin film to a treatment tank even when a relatively thin resin film is transported between a sending-side roll and a winding-side roll.
  • An object of the present invention is to provide a resin film processing apparatus capable of performing good processing.
  • the resin film processing apparatus of the present invention is a resin film processing apparatus that performs a required process by sending a resin film between a sending side roll and a winding side roll, and sends the resin film to which a predetermined tension is applied. And an elastomer resin surface portion that contacts the resin film is formed on the surface of the feed roller.
  • the resin film processing apparatus of the present invention since the elastomer resin surface portion that contacts the resin film is formed on the surface of the feed roller, the resin film and the feed roller are used by the grip force of the elastomer resin surface portion. Can be greatly suppressed.
  • FIG. 1 is a schematic diagram showing a configuration of a resin film processing apparatus according to a first embodiment of the present invention.
  • the resin film processing apparatus 1 is an apparatus in which a web-shaped resin film 4 is sent between a delivery-side roll 8 and a winding-side roll 7 to perform a plating process.
  • the plating treatment is performed by immersing the resin film 4 in a plating treatment tank 9 containing a treatment liquid, and for example, a conductive metal seed layer or a metal thin film layer can be formed.
  • three rollers are used as a configuration for sending the resin film 4 to the plating tank 9, and the feed roller 2 is arranged at a position sandwiched between the upstream roller 5 and the downstream roller 6 in the liquid. It is installed.
  • Each of the rollers 2, 5, 6 has a rotation axis extending in a direction perpendicular to the feeding direction of the resin film 4, and comes into contact with the surface of the resin film 4 from the sending-side roll 8 to the winding-side roll 7.
  • the resin film 4 is conveyed.
  • the feed roller 2 is a metal roller such as a cylindrical stainless steel having a required diameter, and an elastomer resin surface portion 3 that is in contact with the resin film 4 is formed on the peripheral side surface of the feed roller 2.
  • the elastomer resin surface portion 3 is a resin member made of a plurality of strip-shaped elastomer resins arranged at equal intervals on the peripheral side surface of the feed roller 2, and the contact friction of the surface is larger than that of the feed roller 2 made of metal.
  • the elastomer resin surface portion 3 is affixed to the surface of the feed roller 2 with a double-sided tape, fixed with an adhesive, or a groove is formed on the surface of the feed roller 2, and an elastomer resin is formed in the groove. It is also possible to fit the surface portion 3.
  • the elastomer resin surface portion 3 may be made of a porous polyamide-based elastomer resin. If the material is relatively high in chemical resistance and can be made porous, other elastomer materials can be used. Can also be made into the elastomer resin surface portion 3.
  • a porous polyamide-based elastomer resin specifications such as a porosity of 60%, a pore diameter of 10 to 50 microns, a tensile breaking stress of 3.1 MPa, a tensile breaking elongation of 800% GL, and a dropping water absorption speed of 60 seconds are included.
  • Polyamide elastomers having the following can be used:
  • the band-shaped elastomer resin surface portion 3 formed on the surface of the feed roller 2 reliably increases the grip force against the resin film 4, and the friction between the resin film 4 and the feed roller 2 is achieved. The occurrence of defects in the plating film due to the above is prevented in advance.
  • FIG. 2 is a schematic diagram showing a configuration of a resin film processing apparatus according to a second embodiment of the present invention.
  • the resin film processing apparatus 10 is an apparatus for performing a plating process by sending a web-shaped resin film 12 between the delivery side roll 14 and the take-up side roll 16 in the direction of the arrow in the figure. While the resin film 12 is being sent, a non-contact unit 30 that is held in non-contact with the resin film 12 is provided. Further, a feed roller 18 for feeding the resin film 12 and a dancer roll 28 on the upstream side of the non-contact unit 30 in the transport direction of the resin film are provided.
  • the dancer roller 28 has its roller shaft held by a pair of arms 26, and a counterweight 24 is disposed near the dancer roller 28 of the arms 26.
  • the dancer roller 28 functions as a tension regulator for the web-shaped resin film 12 and functions to keep the tension during conveyance of the resin film 12 within a predetermined range.
  • the non-contact unit 30 directs the plating treatment liquid 36 from a plurality of jets 32 formed on the lower peripheral surface of the tip portion 38 of the unit toward one surface of the resin film 12. Erupts.
  • the treatment liquid 36 for plating is supplied by a pump or the like (not shown) connected to the upper end portion or the side portion of the non-contact unit 30 and is ejected from the plurality of ejection ports 32 toward the resin film 12 so as to be non-contact.
  • the lower peripheral surface of the unit 30 and the upper surface of the resin film 12 are maintained in non-contact, and the conveyance path of the resin film 12 takes a route that bends downward in this portion.
  • the processing tank 34 holds the processing liquid 36 around the tip 38 of the non-contact unit 30, and the resin film 12 is immersed in the processing liquid 36 in the processing tank 34 immediately before heading to the non-contact unit 30.
  • the resin film 12 that has passed through the front end portion 38 of the non-contact unit 30 takes a route to be taken out from the liquid surface of the processing liquid 36 in the processing tank 34 to the next processing or winding process.
  • the elastomer resin surface portion 20 that contacts the resin film 12 is formed on the surface 18 s of the feed roller 18.
  • the elastomer resin surface portion 20 is a resin member made of a plurality of strip-shaped elastomer resins disposed at equal intervals on the peripheral side surface that is the surface 18 s of the feed roller 18, and contact friction on the surface thereof. Is larger than the feeding roller 18 made of a metal such as stainless steel, and as a result, the gripping force against the resin film 12 is increased, so that the slip between the resin film 12 and the feeding roller 18 is suppressed.
  • the resin members are parallel to each other and extend in the axial direction of the feed roller 18 on the surface 18s of the feed roller 18, and, as will be described later, are attached to the surface 18s of the feed roller 18 with a double-sided tape. It is also possible to fix with an adhesive or to form a groove on the surface 18s of the feed roller 18 and to fit the elastomer resin surface portion 20 into the groove. Further, the elastomer resin surface portion 20 can be structured to be detachable from the surface 18s of the feed roller 18. When the elastomer resin surface portion 20 is worn or deteriorates with time, it is replaced with a new elastomer resin surface portion 20. It can also be done.
  • the elastomer resin surface portion 20 can be made of a porous polyamide-based elastomer resin. If the material has a relatively high chemical resistance and can be made porous, other elastomer materials can be used. Can be made into the elastomer resin surface portion 20.
  • a porous polyamide-based elastomer resin specifications such as a porosity of 60%, a pore diameter of 10 to 50 microns, a tensile breaking stress of 3.1 MPa, a tensile breaking elongation of 800% GL, and a dropping water absorption speed of 60 seconds are included.
  • the elastomer resin surface portion 20 may be a composite structure in which only the surface is made of a porous polyamide-based elastomer resin, and the portion other than the surface layer portion is a resin material that can withstand other wet processing.
  • the surface of the elastomer resin surface portion 20 which is the opposite surface of the elastomer resin surface portion 20, is the surface of the feed roller 18.
  • the amount of protrusion is 0.1 mm to 4.0 mm, and more preferably about 0.2 mm to 2.0 mm, so that the resin film 12 can be reliably conveyed.
  • the resin film 12 is a polyimide resin film having a thin film thickness of, for example, about 25 microns or less, preferably about 12.5 microns or less.
  • an aromatic compound is directly connected by an imide bond.
  • the aromatic polyimide has a conjugated structure of aromatics through its imide bond, and has the highest thermal, mechanical, and chemical properties in the polymer due to the imide bond having the strong intermolecular force.
  • Kapton trade name
  • Upilex (trade name) manufactured by Ube Industries, Ltd.
  • the resin film processing apparatus of the present embodiment that performs such plating treatment is preferably used as a processing apparatus for one process in a continuous production line.
  • the resin film processing apparatus is electrically conductive on the resin film 12. It can use for the formation process of the metal seed layer of the line process which manufactures the flexible copper clad laminated base material which forms the copper layer as a layer.
  • the present applicant has previously formed a seed layer of a conductive metal such as Ni or an alloy thereof, and previously formed a copper conductive layer on the seed layer.
  • JP 2010-159478 A discloses the technology.
  • a simple method for producing a flexible copper-clad laminate will be described.
  • a pretreatment step is performed in which a polyimide resin film surface that is flexible, heat resistant, and excellent in chemical resistance is subjected to surface modification to make it hydrophilic.
  • a polyamic acid modified layer is formed on the surface by an alkali wet modification method.
  • a reduction treatment is performed to form a hydrophilic surface-modified layer obtained by reducing the adsorbed Pd ion to a metal.
  • a series of mutation behaviors by this alkaline wet modification method is that when a polyimide resin is treated with an alkaline aqueous solution, a part of its surface is hydrolyzed and a part of the imide ring is cleaved, resulting in an amide group and a carboxyl group. Generate. This generated carboxyl group is easy to exchange cation ions, so that metal ions can be adsorbed.
  • a conductive metal seed layer is formed on the surface of the resin film thus modified with a hydrophilic surface in advance by plating with a conductive metal such as Ni or an alloy thereof by an electroless plating method.
  • the resin film 12 can be fed by non-contact conveyance using the non-contact unit 30 by using the resin film processing apparatus 10 according to the present embodiment, and the grip force of the feed roller 18 is the elastomer resin surface portion. Therefore, it is possible to realize a process that does not cause slippage on the surface of the feed roller 18 and that does not cause uneven plating of the conductive metal.
  • a conductive nickel seed layer having a thickness of about 10 to 300 nm may be formed on both surfaces, and Ni alloys such as Ni—P, Ni—B, and Ni—Cu may be used. Can be mentioned.
  • Conditions for performing copper plating on the resin film having a metal film formed on the surface with the acidic copper plating bath composition may be normal copper sulfate plating conditions. That is, plating may be performed at a liquid temperature of about 23 to 27 ° C. and an average cathode current density of about 1 to 3 A / dm 2 for about 0.1 to 250 minutes. In general, it is preferable to perform copper plating under liquid agitation such as aeration.
  • all processes including a seed layer formation by electroless Ni plating that can be made in-line at low cost are obtained by a wet method (all wet process).
  • a layer flexible copper-clad laminate substrate can appropriately cope with fine patterning.
  • the two-layer flexible copper-clad laminate substrate manufactured by thick copper plating without primary copper plating on the resin film surface on which the seed layer of the conductive metal coating has been formed in advance has a smooth gloss. It has an appearance, and the peel resistance of the obtained copper plating layer is remarkably improved.
  • the resin film wet processing apparatus of the present invention is not limited to plating. It can be applied to all wet processes. That is, the wet processing apparatus for the resin film of the present invention may be, for example, a wet etching apparatus, a chemical processing apparatus, a cleaning apparatus, a coating apparatus, a developing apparatus, a coating apparatus, or the like. It may be incorporated as a part of the line, or may be mounted on a part of another processing apparatus.
  • the resin film wet processing apparatus of the present invention is arranged between the pre-processing step and the post-processing step for forming the copper layer, and is premised on the continuous supply of a web-shaped resin film. If the problem such as film peeling does not occur, the resin film once wound after the pretreatment process can be supplied, and the resin film can be wound once before the posttreatment process.
  • a known electroless nickel plating bath can be used as the treatment liquid introduced into the treatment tank 34.
  • the conditions may be the concentration, temperature, time, etc. recommended for the electroless nickel plating bath.
  • electroless nickel plating bath electroless Ni—P plating, electroless Ni—B plating, electroless pure Ni plating, etc. can be used, but there is no particular limitation. It is preferable to use a bath.
  • ES-500 manufactured by JCU Co., Ltd.
  • the processing temperature can be set to 40 ° C., for example.
  • the elastomer resin surface portion 20 formed on the surface 18 s of the feed roller 18 is a resin composed of a plurality of strip-shaped elastomer resins arranged at equal intervals on the circumferential side surface that is the surface 18 s of the feed roller 18. It is possible to form a member, but it is also possible to form it on the surface 18s of the feed roller 18 in another pattern. 4 to 8 show the elastomer resin surface portions 20a to 20e having other patterns, respectively. As shown in FIG. 4, the elastomer resin surface portion 20 a can be a plurality of strip-shaped resin members that are extended in the transport direction of the resin film 12 when the vertical direction of the drawing is the transport direction of the resin film 12. . FIG.
  • FIG. 5 shows an example in which the elastomer resin surface portion 20b is spirally arranged on the surface 18s of the feed roller 18. By adjusting the pitch and the inclination with respect to the axial direction, the elastomer resin surface portion 20b may be single or plural. .
  • FIG. 6 shows an example in which a lattice-shaped elastomer resin surface portion 20c is arranged, and the linear portion of the elastomer resin surface portion 20c may be along the axial direction of the feed roller 18, although illustration is omitted.
  • the lattice-shaped elastomer resin surface portion pattern can be tilted from the axial direction.
  • FIG. 7 and 8 are examples in which a plurality of dot-shaped elastomer resin surface portions 20d and 20e are formed, and the rectangular elastomer resin surface portions 20d can be arranged at predetermined intervals.
  • the surface portions 20d can also be arranged at a predetermined interval.
  • other hexagonal polygons such as a hexagonal shape can be laid as the elastomer resin surface portion.
  • a stripe-shaped groove 44 is formed on the surface of the feed roller 42, and a belt-shaped elastomer resin surface portion 40 is fitted in the groove 44.
  • the width of the groove 44 and the width of the elastomer resin surface portion 40 are approximately the same, and an adhesive layer 41 made of a double-sided tape or an adhesive is formed on the bottom of the elastomer resin surface portion 40.
  • the adhesive layer 41 holds the elastomer resin surface portion 40 against the feed roller 42 so that the elastomer resin surface portion 40 does not fall out of the groove 44.
  • the elastomer resin surface portion 40 can be peeled off against the adhesive force of the adhesive layer 41 and can be easily replaced with a new one. Can do.
  • the groove 48 formed on the surface of the feed roller 46 has a dovetail cross section, a narrow opening on the surface side, and a wide bottom.
  • the elastomer resin surface portion 50 is pushed into the groove 48 while being elastically deformed, and the narrow opening is prevented from coming off, so that the groove 48 is detachably fixed to the elastomer resin surface portion 50.
  • the elastomer resin surface portion 50 is firmly held in the groove 48.
  • the elastomer resin surface portion 50 is peeled off, the elastomer resin surface portion 50 is elastically deformed again.
  • the elastomer resin surface portion 50 can be easily detached from the feed roller 46 by passing through the narrow opening.
  • This embodiment is an example of a resin film processing apparatus in which the feed roller has an opening.
  • the feed roller 54 shown in FIG. 11 has slits 58 in which the feed roller 54 itself functions as a plurality of openings, and an elastomer resin surface portion 56 is formed on the surface of the feed roller 54 between the slits 58. .
  • the peripheral surface portion of the elastomer resin surface portion 56 and the feed roller 54 has a structure that extends in parallel to the axial direction of the feed roller 54.
  • an elastomer resin surface portion is formed on the surface of a hollow feed roller, a liquid supply mechanism portion that supplies liquid to the surface of the resin film outside the feed roller, and an elastomer resin surface portion This is an example in which the cleaning liquid is supplied to the resin film from the opening between the two.
  • the resin film processing apparatus of the present embodiment has a hollow feed roller 64, and the feed roller 64 rotates around the shaft 60 in the clockwise direction in the drawing,
  • the film 62 is configured to be conveyed.
  • the feed roller 64 itself is made of, for example, a metal member, and an elastomer resin surface portion 66 is formed on the surface portion thereof.
  • the elastomer resin surface portion 66 has a surface contact friction larger than that of a metal roller such as stainless steel, and as a result, the grip force with respect to the resin film 62 is increased, so that slip between the resin film 62 and the feed roller 64 is suppressed.
  • a belt-like porous polyamide-based elastomer resin can be used for the elastomer resin surface portion 66, and the same material as the elastomer resin surface portion 20 described above can be used.
  • the elastomer resin surface portion 66 is a belt-like shape and extends on the peripheral side surface of the feed roller 64 in the longitudinal direction of the shaft 60, and is fixed by a method such as bonding using an adhesive or a double-sided tape.
  • a cleaning liquid shower portion 74 is also formed at a portion where the resin film 62 is separated from the feed roller 64, and the lower surface side of the resin film 62 is cleaned.
  • a plurality of slits 68 having a rectangular opening that is an opening except for a portion where the elastomer resin surface portion 66 is formed are formed. Internal and external communication.
  • the resin film 62 passes above the feed roller 64, and the elastomer resin surface portion 66 of the feed roller 64 contacts the resin film 62.
  • a liquid supply mechanism unit 70 that ejects the cleaning liquid in a mist-like manner in a direction perpendicular to the shaft 60 of the feed roller 64 is disposed.
  • the liquid supply mechanism 70 has a nozzle 72 connected to a pump and compressed air (not shown), and is controlled so that the cleaning liquid is ejected from the nozzle 72 toward the inside of the feed roller 64 through the slit 68. Is done.
  • the cleaning liquid that has reached the inside of the feed roller 64 through the slit 68 reaches the lower surface of the resin film 62 through the slit 68 that opens on the upper side.
  • the resin film 62 has an advantage that the lower surface of the resin film 62 is washed while being fed by the feed roller 64, and as a result, the effect of eliminating the cloudy pattern generated on the lower surface of the resin film is also obtained. ing.
  • an elastomer resin surface portion is formed on the surface of a hollow feed roller, a liquid supply mechanism portion that supplies liquid to the surface of the resin film inside the feed roller, and an elastomer resin surface portion This is an example in which the cleaning liquid is supplied to the resin film from the opening between the two.
  • the resin film processing apparatus of this embodiment has a hollow feed roller 84, and the feed roller 84 rotates around the shaft 80 in the clockwise direction in FIG.
  • the film 82 is configured to be conveyed.
  • the feed roller 84 itself is made of, for example, a metal member, and an elastomer resin surface portion 86 is formed on the surface portion thereof.
  • the elastomer resin surface portion 86 has the same material and function as the elastomer resin surface portion 66 of the previous embodiment, and can increase the grip force on the resin film 82.
  • slits 88 that are rectangular openings are formed in regions between the plurality of elastomer resin surface portions 86, respectively, and the feed roller 84 has a slit 88.
  • the resin film 82 is configured such that the front and back surfaces of the resin film 82 receive both the plating solution and the cleaning solution by the plating solution shower unit 94 and the cleaning solution shower unit 96 disposed in the middle of the conveyance path. ing.
  • a hollow fixed portion 92 having the shaft 80 is formed in the vicinity of the shaft 80.
  • the shaft 80 and the feed roller 64 rotate when feeding the resin film 82, and the feed roller
  • the conveyance such that there is no slip on the surface of 84 is realized.
  • a cleaning liquid is supplied from a pump (not shown) to the gap between the inside of the fixed portion 92 and the shaft 80.
  • Three liquid supply mechanism portions 90a, 90b, and 90c are formed on the radially outer side of the fixed portion 92.
  • a spray-like cleaning liquid is ejected toward the slit 88 of the feed roller 84.
  • the spray-like cleaning liquid that has passed through the slit 88 reaches the back surface of the resin film 82 that is conveyed with high frictional force by the elastomer resin surface portion 86 of the feed roller 84, and the bottom surface of the resin film 82 is cleaned.
  • An effect of eliminating the cloudy pattern generated on the lower surface of the film can also be obtained.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

Le problème abordé par la présente invention est de pourvoir à un dispositif de traitement de film de résine pour le transport fiable d'un film de résine vers une cuve de traitement et la mise en œuvre d'un traitement satisfaisant même quand un film de résine mince est transporté. La solution selon l'invention porte sur un dispositif de traitement de film de résine permettant d'acheminer un film de résine entre un rouleau côté distribution et un rouleau côté enroulement et de lui appliquer un traitement nécessaire, où le dispositif de traitement de film de résine est caractérisé en ce qu'il comprend un rouleau d'acheminement pour acheminer le film de résine auquel une tension prédéfinie est appliquée, et une partie de surface en résine élastomère conçue pour être en contact avec le film de résine formée sur la surface du rouleau d'acheminement.
PCT/JP2016/088953 2016-12-27 2016-12-27 Dispositif de traitement de film de résine Ceased WO2018122980A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201680091893.2A CN110114506B (zh) 2016-12-27 2016-12-27 树脂膜处理装置
KR1020197017929A KR102780118B1 (ko) 2016-12-27 2016-12-27 수지 필름 처리 장치
PCT/JP2016/088953 WO2018122980A1 (fr) 2016-12-27 2016-12-27 Dispositif de traitement de film de résine
JP2018558581A JP6972019B2 (ja) 2016-12-27 2016-12-27 樹脂フィルム処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/088953 WO2018122980A1 (fr) 2016-12-27 2016-12-27 Dispositif de traitement de film de résine

Publications (1)

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WO2018122980A1 true WO2018122980A1 (fr) 2018-07-05

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PCT/JP2016/088953 Ceased WO2018122980A1 (fr) 2016-12-27 2016-12-27 Dispositif de traitement de film de résine

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JP (1) JP6972019B2 (fr)
KR (1) KR102780118B1 (fr)
CN (1) CN110114506B (fr)
WO (1) WO2018122980A1 (fr)

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CN111441040B (zh) * 2018-12-26 2024-06-11 株式会社杰希优 树脂膜的湿式处理装置

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JP6972019B2 (ja) 2021-11-24
JPWO2018122980A1 (ja) 2019-10-31
KR20190097059A (ko) 2019-08-20
CN110114506A (zh) 2019-08-09
KR102780118B1 (ko) 2025-03-11
CN110114506B (zh) 2021-08-03

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