HK1260780B - Resin film wet treatment apparatus - Google Patents

Description

Wet processing device for resin film

Technical Field

The present invention relates to a wet processing apparatus for a resin film, which immerses a mesh-shaped resin film in a predetermined processing liquid to perform a predetermined processing on a surface of the resin film.

Background

With the miniaturization and high performance of mobile information terminals and the like, there is an increasing demand for thin flexible circuit boards (FPCs) that can be bent. In response to this, it is also desired to make the FPC itself light, thin, short, and compact, and to miniaturize the circuit and reduce the cost. The FPC currently uses an inexpensive laminate type or cast type Flexible Copper Clad Laminate (FCCL), but is not suitable for formation of a fine circuit and thinning of the circuit. In order to achieve further reduction in thickness and size of FPCs required by the market, for example, a metallized flexible copper clad laminate having a metal film formed thereon needs to be used, but sputtering for forming a metal film on a film is expensive, and the cost of the FPC itself is also high.

As an alternative technique to such expensive sputtering, a method of manufacturing a flexible copper-clad laminate by using a relatively inexpensive electroless plating method is known (for example, see patent document 1). By using this manufacturing method, a flexible copper-clad laminate can be manufactured at low cost with performance equivalent to that of a conventional metallized flexible copper-clad laminate.

Patent document 1: japanese laid-open patent publication No. 2010-159478

In a manufacturing apparatus using an electroless plating method, a polyimide film is selected as a web-like resin film, and a continuous process in a roll-to-roll manner is generally performed, and high productivity is an advantage. Currently, polyimide films transported by a roll-to-roll method are mainly 25 μm to 50 μm in thickness, but a shift to polyimide films of 12.5 μm in thickness required in the FPC market in the future is expected. However, a polyimide film having a thickness of 12.5 μm is very thin and is not easy to handle, and the roll-to-roll plating process is difficult due to damage or breakage of the film by the conventional transfer technique.

In addition, when a metal ion catalyst, which is a catalyst for electroless plating, is adsorbed on a network resin film such as a polyimide film, the metal ion catalyst is activated before being immersed in an electroless plating solution. However, since the bonding force between the metal ion reduction and the carboxylic acid ion on the resin film is weakened by this activation, the metal ion catalyst is easily detached from the surface of the resin film when the roll is brought into contact with the resin film in the conventional roll-to-roll type conveyance, and it is difficult to coat the metal film with a good thickness.

Disclosure of Invention

In view of the above-described technical problems, it is an object of the present invention to provide a wet processing apparatus for a resin thin film, which can perform a surface treatment such as an electroless plating method even for a relatively thin resin thin film.

A wet processing apparatus for a resin film according to the present invention for solving the above technical problem is a wet processing apparatus for performing a predetermined process on a surface of a resin film by immersing the resin film in a predetermined processing liquid, the apparatus comprising: a treatment tank for storing the treatment liquid therein and allowing the resin thin film to pass through the treatment liquid; a pair of conveying members provided at positions higher than a liquid level of the treatment liquid stored in the treatment tank, respectively, on an introduction side of the resin film in the treatment tank and on a discharge side of the resin film; and a jet unit disposed between the pair of conveying members at a position lower than the conveying members, having a plurality of holes on a peripheral surface thereof for jetting the treatment liquid from the peripheral surface, and converting the direction of the resin film in the treatment liquid along the peripheral surface without contact by the jet from the holes.

According to the wet processing apparatus for a resin film of the present invention, the jet unit switches the direction of the resin film along the circumferential surface in the processing liquid without contact between the pair of the transport members, so that damage or breakage of the thin resin film can be avoided. Since the resin film and the jet unit are not in contact with each other in the treatment liquid, the metal ion catalyst can be prevented from falling off from the surface of the resin film.

Drawings

Fig. 1 is a structural diagram of a plating apparatus according to a first embodiment of the present invention.

FIG. 2 is a piping diagram showing piping of the plating apparatus shown in FIG. 1.

Fig. 3 is a schematic view showing an example of a jet unit of a plating apparatus according to a first embodiment of the present invention, and fig. 3(a) to 3(e) show examples of changing the angle of ejection.

Fig. 4 is a schematic diagram showing a control system of a plating apparatus according to a first embodiment of the present invention.

Fig. 5 is a view showing a structure of a wall surface jet portion of a plating apparatus according to a first embodiment of the present invention.

Fig. 6 is a schematic perspective view showing the wall jet part shown in fig. 5.

FIG. 7 is a view showing the structure of a plating apparatus in the case where there is no wall jet.

Fig. 8 is a block diagram showing an example of a modification of the plating apparatus according to the first embodiment of the present invention.

Fig. 9 is a structural view showing another example of a modification of the plating apparatus according to the first embodiment of the present invention.

FIG. 10 is a view showing the structure of a plating apparatus according to a second embodiment of the present invention.

Fig. 11 is a configuration diagram showing an example of a modification of the plating apparatus according to the second embodiment of the present invention.

Fig. 12 is a structural view showing another example of a modification of the plating apparatus according to the second embodiment of the present invention.

Fig. 13A is a front view of a main portion of a plating apparatus according to a third embodiment of the present invention.

Fig. 13B is a side view of a main part of a plating apparatus according to a third embodiment of the present invention.

Fig. 14A is a front view of a main portion of an example of a modification of the plating apparatus according to the third embodiment of the present invention.

Fig. 14B is a main part side view showing an example of a modification of the plating apparatus according to the third embodiment of the present invention.

FIG. 15 is a view showing the structure of a plating apparatus according to a fourth embodiment of the present invention.

Fig. 16 is a configuration diagram showing an example of a modification of the plating apparatus according to the fourth embodiment of the present invention.

Fig. 17 is a side view showing an example of a modification of the plating apparatus shown in fig. 16.

Fig. 18 is a structural view showing another example of a modification of the plating apparatus according to the fourth embodiment of the present invention.

Fig. 19 is a view showing the structure of a plating apparatus according to a fifth embodiment of the present invention.

Fig. 20A is a diagram showing a normal transport state of a thin film in a plating apparatus according to a fifth embodiment of the present invention.

Fig. 20B is a view showing a transport state in meandering of the thin film in the plating apparatus according to the fifth embodiment of the present invention.

FIG. 21 is a view showing the structure of a plating apparatus according to a sixth embodiment of the present invention.

Fig. 22 is a configuration diagram showing an example of a modification of the plating apparatus according to the sixth embodiment of the present invention.

Fig. 23 is a structural view showing another example of a modification of the plating apparatus according to the sixth embodiment of the present invention.

FIG. 24 is a view showing the structure of a plating apparatus according to a seventh embodiment of the present invention.

Fig. 25 is a configuration diagram showing an example of a modification of the plating apparatus according to the seventh embodiment of the present invention.

Fig. 26 is a structural view showing another example of a modification of the plating apparatus according to the seventh embodiment of the present invention.

FIG. 27 is a view showing the structure of a plating apparatus according to an eighth embodiment of the present invention.

Fig. 28 is a view showing an example of the structure of a side spray plate disposed in the plating apparatus shown in fig. 27.

Fig. 29 is a configuration diagram showing an example of a modification of the plating apparatus according to the eighth embodiment of the present invention.

Detailed Description

Embodiments of the present invention will be described with reference to the accompanying drawings. The following description is specific examples of the present invention, and the present invention is not limited to the embodiments. The present invention is not limited to the arrangement, size, and the like of the respective components shown in the drawings.

First embodiment

The present embodiment is an example of a vertical transfer type plating apparatus that performs a plating process as a wet processing apparatus for a resin film, and is particularly implemented as an apparatus that is installed in a line for manufacturing a Flexible Copper Clad Laminate (FCCL) in which a copper layer is formed as a conductive layer on a resin film such as a polyimide film, and forms a nickel film as a seed layer by an electroless plating method as an example. In the plating apparatus of the present embodiment, the activated metal catalyst is present on the resin film before the metal film is formed, but the resin film itself is not in contact with the plating bath except the plating bath in the plating bath, and therefore, the metal catalyst can be prevented from falling off from the resin film. Since the flexible copper-clad laminate is provided on a line for manufacturing a flexible copper-clad laminate and a mesh-like resin film is used as a base material, continuous processing is often performed, and the flexible copper-clad laminate is suitable for mass production as compared with a batch-type device.

As shown in fig. 1 and 2, the plating apparatus of the present embodiment is an apparatus that carries out a plating process by conveying a resin film 20 such as a polyimide film in a mesh form, and employs a so-called vertical conveyance system in which the resin film 20 is continuously conveyed so that a direction perpendicular to a conveyance direction is a horizontal direction, and a conveyance path that once descends and ascends again is taken inside a processing tank 10. When passing through the plating liquid, the plating liquid vibrates in the vertical direction without being in the horizontal direction, and bubbles generated in the plating liquid and covering the surface of the resin thin film 20 are released from the surface of the resin thin film 20 in the plating liquid, so that when a metal thin film is formed by plating, adverse effects due to the bubbles can be minimized, and the occupied area of the entire production line can be reduced.

The plating apparatus of the present embodiment includes a treatment tank 10 for storing a plating solution therein and allowing a resin thin film 20 to pass through the plating solution in order to impregnate the plating solution into the resin thin film 20, and includes an introduction roller 14 and a discharge roller 16 as a pair of transport members provided at positions higher than a liquid level of the plating solution stored in the treatment tank 10 on a resin thin film 20 introduction side and a resin thin film 20 discharge side of the treatment tank 10, respectively. Between the introduction roller 14 and the discharge roller 16, a jet unit 12 for converting the resin film 20 in the plating solution along the peripheral surface 13 in a non-contact manner is disposed at a position lower than the introduction roller 14 and the discharge roller 16.

The jet unit 12 is a hollow member having a cylindrical bottom side and a rectangular top side, and is formed by processing a resin such as PVC (polyvinyl chloride), for example. The jet unit 12 is provided so that the width direction of the resin film 20 is larger than the width of the resin film 20. The jet unit 12 may be fixed to the treatment tank 10 at an end in the width direction, may be detachable from the treatment tank 10, may be configured to be movable in the treatment tank 10 without being fixed, or may be suspended from and supported by an upper portion of the treatment tank 10. A plurality of holes 15 for discharging the plating solution from the peripheral surface 13 are formed in the cylindrical peripheral surface 13 on the bottom side of the jet unit 12, and the resin thin film 20 to be transported is transported without contacting the jet unit 12 by the pressure of the plating solution discharged from the holes 15. The holes 15 are through holes that are formed in the cylindrical peripheral surface 13 on the bottom side of the jet unit 12, for example, through plates that are arranged side by side and penetrate the peripheral surface 13, and a plurality of holes 15 having the same diameter may be provided or holes 15 having different diameters may be mixed. The angle of the circumferential surface 13 on which the plurality of holes 15 are provided will be described later.

A plating liquid supply pipe 38 is connected to the jet unit 12, and the plating liquid supplied through the plating liquid supply pipe 38 is discharged from the jet unit 12 at a predetermined liquid pressure in the treatment vessel 10. The jet unit 12 for transporting the resin thin film 20 in a non-contact manner is connected to the lower end of the plating liquid supply pipe 38, and the head tank 18 is disposed at a position higher than the treatment vessel 10 at the upper end of the plating liquid supply pipe 38. The head tank 18 is a tank for temporarily storing the plating liquid supplied by the pump 24 and supplying the plating liquid to the jet unit 12, and can suppress pulsation of the plating liquid caused by operation of the pump 24 with respect to the jet unit 12. The plating liquid supply pipe 38 connecting the head tank 18 and the jet unit 12 is provided with a flow meter 22 and a valve 30, and the flow rate of the plating liquid supplied from the head tank 18 to the jet unit 12 can be adjusted by operating the valve 30, and the flow rate is monitored by the flow meter 22. The plating liquid drops by its own weight from the head tank 18, and is discharged from the jet unit 12 into the treatment vessel 10. In order to stably convey the resin film 20 in a non-contact manner, the control of the valve 30 provided in the middle of the plating liquid supply pipe 38 is also effective, and the angle adjustment of the plating liquid from the discharge unit 12 as described later is also effective. The size of the hole 15 formed in the peripheral surface 13 of the jet unit 12 may be controlled by a known method, or the height of the head tank 18 may be adjusted.

The treatment tank 10 has a rectangular structure with an upper side opened for the transfer of the resin film 20, and as shown in fig. 2, an overflow tank 48 for storing the plating liquid overflowing from the treatment tank 10 is formed at an upper end portion, and a drain pipe 50 is connected from the bottom of the overflow tank 48 to the reservoir tank 26. Therefore, even if the plating liquid is supplied to the treatment vessel 10 at any time or at all times, the plating liquid does not flow out from the treatment vessel 10 to the outside of the apparatus. The plating liquid in the reservoir 26 is pumped up by the pump 24 through the valve 28, and the plating liquid pumped up by the pump 24 is supplied to the head tank 18. A drain valve 32 is provided at the bottom of the head tank 18, and the plating solution in the head tank 18 can be returned to the sump 26 by opening the drain valve 32.

Wall surface jet portions 40 and 42 as second jet portions for applying jets to the wall surface are disposed on the side wall in the treatment tank 10. The wall surface jet portions 40 and 42 are tubular members disposed on the inner wall of the processing bath 10, and are provided so that the horizontal direction, which is the width direction of the resin film 20, is the longitudinal direction. As shown in fig. 6, a plurality of orifices 43 are formed in parallel in the horizontal direction between the main body 41 of the wall-surface spouting portions 40 and 42 and the end 45, and the flow of liquid spouted from the plurality of orifices 43 can control the feed path of the resin film 20 at an appropriate position as will be described later. The wall surface jet portions 40 and 42 provide jets to the surface of the resin film 20 opposite to the surface of the resin film 20 that receives the hydraulic pressure by the jet unit 12. The plurality of spouting holes 43 formed in the main body 41 of the wall-surface spouting portions 40 and 42 are provided so as to spout from the main body 41 toward the inner wall of the treatment vessel 10, instead of being directed directly toward the inside of the treatment vessel 10, and the pressure of the plating solution is indirectly applied to the resin thin film 20. By indirectly supplying the plating liquid from the wall surface spouting portions 40 and 42 to the surface of the resin thin film 20, the resin thin film 20 to be transferred can be prevented from sticking to the edge and the inner wall of the treatment vessel 10, and the transfer of the resin thin film 20 can be stabilized.

Fig. 5 is a view showing the structure of a plating apparatus having wall jets 40 and 42, and fig. 7 is a view showing the structure of a plating apparatus without wall jets 40 and 42 for comparison. As shown in fig. 7, in the apparatus having the structure in which the wall surface spouts 40 and 42 are not provided on the side wall of the treatment vessel 10, the resin thin film 20 to be transferred is a transfer path in a portion close to the wall surface along the side wall of the treatment vessel 10 by the force received from the plating liquid supplied from the spout unit 12. Therefore, the resin film 20 sticks to the edge and the inner wall of the processing bath 10, and particularly, it is obvious that the resin film 20 having a thin film thickness of, for example, 12.5 μm is used. In contrast, as shown in fig. 5, in the configuration in which the wall surface jets 40 and 42 are disposed on the side surfaces of the processing bath 10, even when the thin resin film 20 is used, the resin film 20 does not stick to the edges or inner walls of the processing bath 10 and passes through an appropriate conveyance path, and stable film conveyance is possible.

As described above, the resin film 20 is, for example, a polyimide resin film having a relatively thin film thickness of about 25 micrometers or less, preferably about 12.5 micrometers or less, and is generally an aromatic polyimide in which aromatic compounds are directly connected by imide bonds, and has a conjugated structure of aromatic compounds via the imide bonds, and has the highest thermal, mechanical and chemical properties among polymers by the imide bonds having strong intermolecular forces. In the present embodiment, for example, polyimide (trade name) manufactured by Tollio DuPont and biphenyl type polyimide (trade name) manufactured by Utsui Kaisha can be used.

Such a plating apparatus is preferably used as a processing apparatus used in one step of a continuous production line, and can be used, for example, in a metal seed layer forming step in a line step of manufacturing a flexible copper-clad laminate in which a copper layer is formed as a conductive layer on a resin film 20. As a method for producing such a flexible copper-clad laminate, the present applicant has previously proposed a method for producing a two-layer flexible copper-clad laminate substrate (two-layer FCCL) characterized by performing all steps of forming a seed layer containing a conductive metal such as Ni or an alloy thereof in advance by a wet process and performing a thick plating process on the seed layer for a copper conductive layer, the all-copper-clad step being one step, and japanese patent application laid-open No. 2010-159478, for example, discloses the technique.

To briefly explain the method for producing a flexible copper-clad laminate, first, a pretreatment step of modifying the surface of a polyimide resin film having excellent flexibility, heat resistance and chemical resistance to make it hydrophilic is performed. The surface modification method is to form a polyamic acid modified layer on the surface by an alkaline wet modification method. Next, Pd ions are adsorbed on the surface of the substrate by a palladium (Pd) -based catalyst, and then reduction treatment is performed to reduce and metallize the adsorbed Pd ions. In the series of modification behavior by the alkaline wet modification method, in general, when a polyimide resin is treated with an alkaline aqueous solution, a part of the surface thereof is hydrolyzed to crack a part of an imide ring, thereby forming an amide group and a carboxyl group. The carboxyl group thus formed is easily cation-exchanged and can adsorb metal ions.

The surface of the resin film thus modified to have a hydrophilized surface is previously plated with a conductive metal such as Ni or an alloy thereof by an electroless plating method, thereby forming a seed layer of the conductive metal. At this time, the plating apparatus according to the present embodiment is used to convey the resin film 20 by non-contact conveyance using the jet unit 12. In the wet electroless nickel plating treatment, a conductive nickel seed layer of about 10 to 300nm may be formed on both surfaces, and examples of the alloy of Ni include alloys such as Ni-P, Ni-B, Ni-Cu.

Then, wet plating is performed in an acidic copper plating bath composition, and a copper conductive layer is subjected to thick plating while freely controlling the layer thickness in one step on the seed layer of the resin film, thereby producing a flexible copper-clad laminate substrate having a copper coating thickness in the range of 0.05 to 50 μm. The conditions for copper plating of a resin thin film having a metal film formed on the surface thereof with an acidic copper plating bath composition may be the conditions for ordinary copper sulfate plating. Namely, the average cathode current density is 1 to 3A/dm at a liquid temperature of about 23 to 27 DEG C²Electroplating is carried out for about 0.1-250 minutes. In general, it is preferable to perform copper plating under liquid agitation by aeration or the like.

In the above method for producing a two-layer flexible copper-clad laminate base material, all steps including seed layer formation by electroless Ni plating which is inexpensive and can be formed on line are wet methods (wet-through steps), and the resulting two-layer flexible copper-clad laminate base material can appropriately correspond to micropatterning. In addition, a two-layer flexible copper-clad laminate substrate produced by thick copper plating on the surface of a resin film formed in advance of a seed layer of a conductive metal coating without primary copper plating has a smooth glossy appearance, and the peeling resistance of the resulting copper-clad layer is remarkably improved.

The method for producing the flexible copper-clad laminate substrate is merely an example of an application example of the plating apparatus according to the present embodiment, and the wet processing apparatus for a resin film according to the present invention is not limited to plating, and can be applied to other wet processing as a whole. That is, the wet processing apparatus for a resin film of the present invention may be, for example, a wet etching apparatus, a chemical processing apparatus, a cleaning apparatus, a coating apparatus, a developing apparatus, a coating apparatus, or the like, or may be incorporated as a part of a large-scale production line, or may be attached to a part of another processing apparatus, instead of an independent apparatus. The wet processing apparatus for a resin film according to the present invention is arranged between the pretreatment step and the post-treatment step for forming a copper layer, and is premised on continuously supplying a mesh-like resin film, but may be configured to supply a temporarily wound resin film after the pretreatment step or temporarily wind a resin film before the post-treatment step, as long as problems such as film peeling do not occur.

As the plating liquid to be introduced into the treatment vessel 10, a known electroless nickel plating bath can be used in the present embodiment, for example. The conditions may be the concentration, temperature, time, etc. recommended for the electroless nickel plating bath. The electroless nickel plating bath that can be used is not particularly limited, and electroless Ni — P plating, electroless Ni — B plating, electroless pure Ni plating, and the like are preferably used. As an example of the agent, ES-500 (manufactured by JCU Co., Ltd.) was used, and the treatment temperature could be set to 40 ℃.

In the plating apparatus of the present embodiment, when the ejection flow from the jet unit 12 is ejected to the resin thin film 20 in a large amount, the conveyance can be stabilized, and on the contrary, palladium on the plating deposition surface is dropped off, and the plating film thickness on the surface of the resin thin film 20 on the ejection side becomes thin, and a difference in film thickness from the plating film thickness on the back surface of the resin thin film where no ejection flow is ejected occurs, and the plating film thickness is not uniform on the front and back surfaces. Therefore, in the plating apparatus of the present embodiment, the discharge amount is limited, and the jet flow from the hole 15 of the jet unit 12 is, for example, 100 liters per minute or less, preferably 75 liters per minute or less, and more preferably 50 liters per minute or less. This is a result of experiments conducted by the inventors of the present invention that a positive and negative film thickness is almost uniform at a low ejection rate of 100 liters or less per minute, preferably 75 liters or less per minute, and more preferably 50 liters or less per minute.

Next, the ejection angle of the jet unit 12, which changes the direction of the resin film 20 along the peripheral surface 13, will be described with reference to fig. 3. The jet unit 12 of the plating apparatus of the present embodiment is configured such that the lower half thereof has a cylindrical shape and discharges the plating liquid through the holes 15 radially formed in the peripheral surface 13 from the center thereof. The distribution of the holes 15 that cut the cross section of the jet unit 12 in the film conveyance direction determines the ejection angle of the jet unit 12. (a) The discharge angle θ of the jet unit 12 is 180 degrees, (b) the discharge angle θ of the jet unit 12 is 90 degrees, (c) the discharge angle θ of the jet unit 12 is 120 degrees, (d) the discharge angle θ of the jet unit 12 is 150 degrees, and (e) the jet unit 12 has a discharge angle θ of 180 degrees and has a rectangular portion in the cylindrical portion in which a hole is formed. By comparing these shapes, in the jet units 12 (a) and (e) having the ejection angles θ of 180 degrees, for example, the distance from the peripheral surface 13 to the resin film 13 is about 3mm, and a good and almost constant transfer stability of the resin film 20 can be obtained. Even in the jet unit 12 in which the ejection angle θ of the jet unit 12 in (b) to (d) is 90 to 150 degrees, a desired conductive nickel seed layer of about 10 to 300nm can be formed on both surfaces.

The plating apparatus of the present embodiment is extremely important to prevent meandering and stabilize the transport speed in order to treat the resin thin film 20 having a film thickness smaller than that of the conventional resin thin film, and can form plated films uniformly on both surfaces of the resin thin film 20 by a feedback control system as shown in fig. 4. The conveyance state of the resin film 20 is constantly monitored by the transmission sensors 44 and 46, and a signal as a result of the monitoring is sent to the conveyance controller 60. One of the transmission sensors 44 and 46 is a light emitting element, and the other is a light receiving element. The sensors 44 and 46 monitor whether or not the resin film 20 blocks the light emitted from the light emitting element from the mounting position. For example, the position at which the sensors 44 and 46 monitor the position of the resin film 20 is a position 1mm to 15mm, preferably about 3mm to 10mm, from the bottom of the jet unit 12. The conveyance controller 60 is configured to control a motor 64 that drives the introduction roller 14 and a motor 66 that drives the discharge roller 16.

As an example of the feedback control, when the resin film 20 approaches the jet unit 12, light is transmitted between the sensors 44 and 46, and the conveyance controller 60 receiving the signal transmits a signal to the motor 64 to control the rotation speed of the introduction roller 14 at the entrance of the processing tank 10 to be increased. In this way, the resin film 20 is separated from the bottom of the jet unit 12. Conversely, when the resin film 20 is separated from the jet unit 12, the sensors 44 and 46 are blocked, and the transfer controller 60 receiving the signal transmits a signal to the motor 64 to slow the rotation speed of the introducing roller 14 on the inlet side of the processing bath 10. As a result, the resin film 20 and the bottom of the jet unit 12 approach each other. The motor 66 may be controlled by the motor of the conveyance controller 60, and in this case, the rotation speed of the discharge roller 16 may be controlled. Further, the motors 64 and 66 can be controlled by the conveyance controller 60, and by controlling one of the rotational speeds to be faster and the other rotational speed to be slower, rapid feedback control can be performed. Therefore, the feedback control can appropriately maintain the gap between the jet unit 12 and the resin film 20, and thus stable film conveyance can be performed.

Fig. 8 and 9 show modifications of the plating apparatus according to the first embodiment. The modification of the plating apparatus according to the first embodiment shown in fig. 8 has a configuration in which the processing bath 11a is set to a narrower span W1 than in the previous embodiment, the distance between the introduction roller 14 and the discharge roller 16 is also shortened, and the occupied area of the entire production line is also reduced. If the distance between the introduction roller 14 and the discharge roller 16 is shortened and the position of the jet unit 12a in the processing bath 11a is the same as that of the plating apparatus shown in fig. 1, the transport path of the resin thin film 20 from the introduction roller 14 to the jet unit 12a is more steeply lowered, and the transport path of the resin thin film 20 from the jet unit 12a to the discharge roller 16 is more steeply raised, so that the installation area can be reduced, and the discharge of air bubbles from the surface of the resin thin film 20 is also favorable, and a plated film can be formed with a uniform film thickness.

A modification of the plating apparatus according to the first embodiment shown in fig. 9 is an example in which a treatment tank 11b having a narrower span W2 is used, and the cross section of the jet flow unit 12b disposed inside has a spindle shape and a size corresponding to the narrower span W2. By using such a spindle-shaped jet unit 12b, the resin film 20 can be prevented from contacting the side wall of the discharge unit 12b, and a liquid pool can be formed in the shoulder portion of the spindle shape, thereby stabilizing the gap between the resin film 20 and the jet unit 12 b. In addition, the jet unit 12b can be prevented from contacting the resin film 20, and the resin film 20 can be stably conveyed. In the case of treating with a weak liquid flow, it is preferable to further reduce the diameter of the liquid flow in addition to the spindle shape. As a result, the capacities of the head tank, the treatment tank 11b, and the storage tank 26 can be reduced, the amount of the required chemical can be reduced, and the treatment cost, the waste liquid treatment cost, and the environmental load can be reduced.

Second embodiment

The present embodiment is an example of a plating apparatus in which a jet unit has two or more separate chambers, and has the configurations shown in fig. 10 to 12, respectively. In addition, when the plating apparatus of the present embodiment has the same components as those of the plating apparatus of the previous embodiment, the same reference numerals are given, and redundant description is omitted.

The plating apparatus of the present embodiment shown in fig. 10 has a treatment tank 70 with a relatively narrow span W1, and a jet unit 81 disposed inside the treatment tank is composed of a first chamber 80 disposed on the upper side of the treatment tank and a second chamber 82 disposed on the lower side of the treatment tank. The first chamber 80 and the second chamber 82 are not communicated with each other, but are connected to the head tank 18 via separate plating liquid supply pipes 92, 96, respectively. The first chamber 80 is connected to the head tank 18 via a plating liquid supply pipe 92 and a valve 94. The second chamber 82 is connected to the head tank 18 via a plating liquid supply pipe 96 and a valve 98. The first chamber 80 has holes for discharging the plating liquid in the upper half of the jet unit 81, and can discharge jets in the horizontal direction from the holes. The second chamber 82 has a hole for discharging the plating solution in the lower half of the jet unit 81, and can discharge jets radially along the circumferential surface of the jet unit 81.

Since the plating liquid supply pipes 92 and 96 are independent supply lines, the flow rates in the supply pipes can be independently controlled by operating the valves 94 and 98, respectively, and the treatment can be performed by a combination of the first chamber 80 and the second chamber 82, which is advantageous for forming a uniform plating film. Further, by controlling the flow rate of the first chamber 80 and the second chamber 82 in the jet unit 81, respectively, the position of the jet unit with respect to the resin film 20 can be stabilized. Further, it is preferable that the liquid is supplied from the high-level tank 18 to the chambers 80 and 82. According to the plating apparatus of the present embodiment shown in fig. 10, the jet unit 81 can be prevented from contacting the resin film 20, and the conveyance can be stabilized.

The cross section of the jet unit 85 disposed inside the plating apparatus of the present embodiment shown in fig. 11 is a spindle shape and has a size corresponding to the narrower span W2, and the relatively small jet unit 85 is constituted by a first chamber 84 disposed on the upper side of the unit and a second chamber 86 disposed on the lower side of the unit. The first chamber 84 and the second chamber 86 are not communicated with each other, but are connected to the head tank 18 via separate plating liquid supply pipes 92, 96, respectively. The first chamber 84 is connected to the head tank 18 via a plating liquid supply pipe 92 and a valve 94. The second chamber 86 is connected to the head tank 18 via a plating liquid supply pipe 96 and a valve 98. The first chamber 84 has holes for discharging the plating liquid in the upper half of the jet unit 85, and jets can be radially discharged upward from the holes. The second chamber 82 has a hole for discharging the plating liquid in the lower half of the jet unit 85, and is capable of discharging a jet radially downward along the circumferential surface of the jet unit 85.

In the plating apparatus shown in fig. 11, since the plating liquid supply pipes 92 and 96 are independent supply lines, as in the plating apparatus shown in fig. 10, the flow rates in the supply pipes can be independently controlled by operating the valves 94 and 98, respectively, and the treatment can be performed with a combination of the first chamber 84 and the second chamber 86, which is advantageous for the formation of a uniform plating film, and the position of the resin thin film 20 passing therethrough can be stabilized during the treatment.

The plating apparatus shown in fig. 12 has a spindle-shaped jet unit 87 having the same cross-sectional shape as the plating apparatus shown in fig. 11, and is composed of a first chamber 88 disposed on the upper side of the unit and a second chamber 90 disposed on the lower side of the unit, but the first chamber 88 disposed on the upper side of the unit is extended to the bottom side and the second chamber 90 is disposed so that the bottom is smaller than the plating apparatus shown in fig. 11. With this configuration, since the plating liquid supply pipes 92 and 96 are also independent supply lines, the flow rates in the supply pipes can be independently controlled by operating the valves 94 and 98, respectively, and the treatment can be performed in a combination of the first chamber 88 and the second chamber 90, which is advantageous in forming a uniform plating film, and the position of the resin thin film 20 passing therethrough can be stabilized during the treatment.

In the above-described embodiment, the number of chambers is two, but three or more chambers may be provided. Further, although the supply pipes for supplying the plating liquid to the respective chambers supply the plating liquid from the same high-level tank 18, a plurality of high-level tanks may be provided separately, or the high-level tanks themselves may be subdivided by partition walls or the like. Further, the supply pipes for supplying the plating liquid to the respective chambers may all have the same diameter, but different supply pipes may have different diameters.

Third embodiment

As shown in fig. 13A, 13B, 14A, and 14B, the present embodiment is a plating apparatus including a mechanism in which a rudder member 102 is provided in a jet unit 100 and a plating liquid discharged from the jet unit 100 is controlled. In addition, when the plating apparatus of the present embodiment has the same components as those of the plating apparatus of the previous embodiment, the same reference numerals are given, and redundant description is omitted.

Fig. 13A and 13B are a main part front view and a main part side view of the plating apparatus according to the present embodiment. A plate-shaped rudder member 102 is attached to an end of the plating liquid supply pipe 38 in the jet unit 100 having a rectangular upper side and a semi-cylindrical lower side so as to be rotatable about the vicinity of the end of the plating liquid supply pipe 38 as a fulcrum. The rudder member 102 can control the flow direction of the plating liquid flowing into the jet unit 100 from the end of the plating liquid supply pipe 38 by the direction of the rudder member 102. The rudder member 102 may be fixed at a predetermined angle by a screw or the like, or the angle of the rudder member 102 may be changed by control of a motor or the like, not shown.

By using the rudder member 102 for controlling the flow direction of the plating liquid, the plating liquid spouted from the peripheral surface 101 of the spout unit 100 can also be made directional, and for example, the hydraulic pressure of the plating liquid can be increased on the right side of the resin thin film, and the hydraulic pressure of the plating liquid can be relatively decreased on the left side of the thin film, and the resin thin film can be corrected when it is inclined. In addition, for example, the liquid pressure of the plating liquid can be increased on the upstream side and decreased relatively on the downstream side in the resin film conveyance direction. By this control, the meandering of the resin film 20 can be prevented, and stable conveyance can be realized.

Fig. 14A and 14B have the same configuration as the jet unit 100 which is a main part of the plating apparatus of the present embodiment shown in fig. 13A and 13B, and a partition plate 104 is provided so as to protrude on the circumferential surface side inside the jet unit 100, and the partition plate 104 is disposed so as to divide the circumferential surface into two parts at a substantially central portion of the circumferential surface and so as to face the rudder member 102. The partition plate 104 can be divided into the right side portion 101a and the left side portion 101b in the width direction of the resin film inside the jet unit 100, and when the rudder member 102 is operated, the discharge amount of the plating liquid can be increased between the right side portion 101a and the left side portion 101 b. Therefore, the jet unit 100 can be prevented from contacting the resin film, and the resin film can be stably conveyed.

Fourth embodiment

As shown in fig. 15 to 18, the plating apparatus according to the present embodiment includes a jet unit having two or more separate chambers, and a mechanism for controlling the plating liquid discharged from the jet unit by providing a rudder member in the jet unit. In addition, when the plating apparatus of the present embodiment has the same components as those of the plating apparatus of the previous embodiment, the same reference numerals are given, and redundant description is omitted.

As shown in fig. 15, the plating apparatus of the present embodiment is similar to the plating apparatus shown in fig. 10 in that a treatment tank 70 having a relatively narrow span W1 is provided, and a jet unit 81 disposed inside the treatment tank is composed of a first chamber 80 disposed above the treatment tank and a second chamber 82 disposed below the treatment tank. These first and second chambers 80, 82 are connected to the head tank 18 via separate plating solution supply pipes 92, 96 and valves 94, 98, respectively. The first chamber 80 has holes for discharging the plating liquid in the upper half of the jet unit 81, and can discharge jets in the horizontal direction from the holes. The second chamber 82 has a hole for discharging the plating solution in the lower half of the jet unit 81, and can discharge jets radially along the circumferential surface of the jet unit 81.

In the plating apparatus of the present embodiment, the flow rate in the supply pipe can be independently controlled by operating the valves 94 and 98, respectively, so that the position of the resin thin film 20 from the jet unit can be stabilized, and a uniform plated film can be favorably formed. In the plating apparatus of the present embodiment, a plate-shaped rudder member 106 is attached to an end of the plating liquid supply pipe 96 in the jet unit 81 so as to be rotatable about the vicinity of the end of the plating liquid supply pipe 96 as a fulcrum. The rudder member 106 controls the flow direction of the plating liquid flowing from the end of the plating liquid supply pipe 96 into the second chamber 82 of the jet unit 81 by the direction of the rudder member 106. Therefore, when the resin film is inclined, the rudder member 106 can be operated to correct the inclination.

In the plating apparatus shown in fig. 16 and 17, the jet unit 85 disposed inside has a spindle-shaped cross section and has a size corresponding to the narrower span W2, as in the plating apparatus shown in fig. 11, and the relatively small jet unit 85 is constituted by a first chamber 84 disposed on the upper side of the unit and a second chamber 86 disposed on the lower side of the unit. These first and second chambers 84, 86 are connected to the head tank 18 via separate plating solution supply pipes 92, 96 and valves 94, 98, respectively. The first chamber 84 has holes for discharging the plating liquid in the upper half of the jet unit 85, and jets can be radially discharged upward from the holes. The second chamber 82 has a hole for discharging the plating liquid in the lower half of the jet unit 85, and is capable of discharging a jet radially downward along the circumferential surface of the jet unit 85.

In the plating apparatuses shown in fig. 16 and 17, similarly to the plating apparatus shown in fig. 11, the flow rates in the supply pipes can be independently controlled by operating the valves 94 and 98, respectively, and the position of the resin thin film 20 from the jet unit can be stabilized, whereby a uniform plated film can be favorably formed. In the plating apparatus of the present embodiment, a plate-shaped rudder member 108 is attached to an end of the plating liquid supply pipe 96 in the jet unit 85 so as to be rotatable about the vicinity of the end of the plating liquid supply pipe 96 as a fulcrum. The rudder member 108 controls the flow direction of the plating liquid flowing from the end of the plating liquid supply pipe 96 into the second chamber 86 of the jet unit 85 by the direction of the rudder member 108. Therefore, when the resin film 20 is inclined, the rudder member 108 can be operated to correct the inclination.

The plating apparatus shown in fig. 18 includes a partition plate 110 in addition to the structure of the plating apparatus shown in fig. 17, and the partition plate 110 can divide the interior of the jet unit into, for example, the right side portion and the left side portion in the width direction of the resin film, and when the steering member 108 is operated, the discharge amount of the plating liquid can be increased between the right side portion and the left side portion. Therefore, the jet unit can be prevented from contacting the resin film, and the resin film can be stably conveyed.

Fifth embodiment

As shown in fig. 19 and fig. 20A and 20B, the present embodiment is a mechanism for preventing meandering of the resin film 20 during conveyance, and can correct meandering during conveyance by controlling the rotation shaft 17 of the discharge roller 16 to rotate at the angle θ at one end side. Fig. 19 shows a plating apparatus according to the present embodiment, in which a pair of photosensors 21 and 23 for detecting meandering are provided near the discharge roller 16 on the discharge side of the resin film 20. These optical sensors 21 and 23 are light emitting elements on one side and light receiving elements on the other side, as in the transmissive sensors 44 and 46 described above. In addition, when the plating apparatus of the present embodiment has the same components as those of the plating apparatus of the previous embodiment, the same reference numerals are given, and redundant description is omitted.

The optical sensors 21 and 23 can monitor whether or not the resin film 20 is conveyed in a deviated manner by monitoring the mounting positions thereof. That is, as shown in fig. 20A, in the case of the normal conveyance state, the rotation shaft 17 of the discharge roller 16 is not moved, but when meandering occurs, the detection of this is made by the pair of photosensors 21 and 23, and the actuator, not shown, of the rotation shaft 17 is operated. By the operation of the actuator, the discharge roller 16 is controlled so that the rotary shaft 17 rotates at the angle θ on one end side. Such feedback control can correct meandering of the film, and can realize stable film conveyance even when handling is not easy, such as a polyimide film having a thin resin film.

Sixth embodiment

As shown in fig. 21 to 23, in the present embodiment, U-shaped guide portions 120, 122, 124, and 126 are formed on the bottom side of the conveyance path. The U-shaped guide portion 120 shown in fig. 21 has a U shape along the shape of the peripheral surface of the jet unit 12, and effectively prevents the position of the thin film from being disturbed in the vicinity of the inlet and the outlet of the jet unit by the rising flow of the liquid discharged from the jet unit, thereby enabling stable conveyance of the thin film to be reliably performed. The U-shaped guide portion 122 shown in fig. 22 has holes 124 or a mesh structure on the bottom side, and allows the liquid flow near the membrane and the liquid flow outside the guide portion 122 to freely flow in and out through the holes 124, thereby stabilizing the front and back liquid flows near the membrane. In addition, the U-shaped guide portion 126 shown in fig. 23 can form a smooth flow near the inlet and outlet of the jet unit by the side feather portion extending obliquely, and can perform stable conveyance.

Seventh embodiment

As shown in fig. 24 to 26, this embodiment is an example in which bottom discharge portions 130, 132, 134, and 136 for supplying the plating liquid to the surface where the jet unit 12 is not provided as viewed from the resin film 20 are provided. The bottom discharge unit 130 shown in FIG. 24 is a device for supplying the plating liquid from the bottom side surface of the plating device. The bottom discharge section 132 shown in fig. 25 is a device for supplying the plating liquid from the bottom of the plating device. The pair of bottom discharge portions 134 and 136 shown in FIG. 26 are devices for supplying the plating liquid from the bottom of the plating apparatus, respectively. The plating liquid is supplied from the head tank 18 to the bottom discharge portions 130, 132, 134, and 136 through valves. By providing both the liquid flows on the front side (inside of the turn portion) and the reverse side (outside of the turn portion) to the resin film 20, in other words, by supplying the plating solution from the plating solution supply unit 12 to the front side of the film and also supplying the plating solution from the bottom discharge portions 130, 132, 134, and 136 to the reverse side of the film, the effect of uniform plating film thickness can be obtained, and by carrying out the film transfer in the liquid flows that receive the liquid pressures from both sides, the film transfer is stable, and by appropriately setting the directions of the liquid flows, the transfer can be carried out more stably.

Eighth embodiment

As shown in fig. 27 to 29, in the present embodiment, the plating apparatus is provided with side flow plates 140, 142, 150, and 152 as transport units between the jet unit 12 and the introduction roller 14 and between the jet unit 12 and the discharge roller 16, respectively. Fig. 27 and 29 show the structure of the plating apparatus, respectively, and fig. 28 shows a cross-sectional structure of the side current plate 140.

As shown in fig. 28, the side jet plate 140 has a pair of casing parts 144 and 146 made of a resin such as PVC, for example, and has a structure in which the resin film 20 passes through a gap between the pair of casing parts 144 and 146. The pair of casing portions 144 and 146 are hollow, and the plating liquid is supplied from the head tank 18 through a valve. In the gap portion through which the resin film 20 passes, a plurality of holes 148 and 154 in which the direction inclined with respect to the film transport direction is the discharge direction are formed in the entire gap portion between the pair of casing portions 144 and 146, and stable film transport is enabled by discharging the plating liquid from the plurality of holes 148 and 154. In the pair of casing parts 144 and 146, a unit disposed inside the resin film is referred to as an inner unit, and a unit disposed outside the resin film is referred to as an outer unit.

When the resin film 20 is in a relaxed state without being stretched in the vicinity of the entrance and exit of the resin film 20 to the jet unit 12, the film conveyance tends to become unstable. Therefore, by providing the side jet plates 140, 142, 150, and 152 near the inlet and outlet of the jet unit 12, such unstable elements can be eliminated. The side jet plates 140, 142, 150, and 152 are preferably provided so that the liquid discharge angle and the liquid flow can be appropriately adjusted, and the resin film 20 can be fed into and discharged from the jet unit 12 without loosening.

The plating apparatus shown in fig. 27 includes side spray plates 140 and 142, and the side spray plates 140 and 142 are disposed so as to have the same spray direction on the inlet side and the outlet side of the spray unit 12. The plating apparatus shown in fig. 29 includes side spray plates 150 and 152, and the side spray plates 150 and 152 are arranged so as to have opposite spray directions on the inlet side and the outlet side of the spray unit 12. The direction of the side jet plates is selected based on the overall balance of the flow. By discharging the plating liquid from the plurality of holes 148, 154 of the side current plates 140, 142, 150, 152, stable thin film transfer can be performed.

Further, by making the liquid flow in the outer unit of the side spray plates 140, 142, 150, 152 larger than that in the inner unit, the liquid flow sprayed on the thin film as a whole can be made the same in both directions, and the plating film thickness can be made uniform. That is, the inner side of the film has the jet flow from the jet flow unit 12, so that the jet flow from the side jet plate can be reduced. The side jet plates are of the type sandwiching the film, but it is also possible to provide side jet plates disposed only on one surface of the film. Further, stable film feeding can be performed by monitoring the feeding state of the resin film, moving the side jet plates, or controlling the pressure of the plating liquid fed from the jet plates. When the film thickness is different between the front side (inside of the turn portion) and the back side (outside of the turn portion) of the resin film, the film may be stably transferred by providing both the liquid flows on the front side (inside of the turn portion) and the back side (outside of the turn portion) to the film and performing the film transfer in the liquid flows jetted from both sides.

The present invention is not limited to the above-described embodiments, and various modifications can be made to the embodiments based on the gist of the present invention, and the modified embodiments are not excluded from the scope of the present invention.

Description of the reference numerals

10 … treatment tank, 12 … jet unit, 14 … lead-in roller, 16 … discharge roller, 18 … high water tank, 20 … resin film, 21, 23 … sensor, 22 … flow meter, 24 … pump, 26 … storage tank, 28, 30 … valve, 32 … drain valve, 38 … plating solution supply pipe, 40, 42 … wall surface jet part, 44, 46 … sensor, 48 … overflow tank, 50 … drain pipe, 60 … delivery controller, 64, 66 … motor, 70 … treatment tank, 80 … first chamber, 82 … second chamber, 84 … first chamber, 85 … jet unit, 86 … second chamber, 92, 96 … plating solution supply pipe, 94, 98 … valve, 106, 108 … rudder unit.

Claims (20)

1. A wet treatment apparatus for a resin film, which performs a predetermined treatment on a surface of a mesh-shaped resin film by immersing the resin film in a predetermined treatment liquid, the wet treatment apparatus comprising:

a treatment tank for storing the treatment liquid therein and allowing the resin thin film to pass through the treatment liquid;

a pair of conveying members provided at positions higher than a liquid level of the treatment liquid stored in the treatment tank, respectively, on an introduction side of the resin film in the treatment tank and on a discharge side of the resin film; and

a jet unit disposed at a position lower than the conveying members between the pair of conveying members, having a plurality of holes for jetting the treatment liquid from the peripheral surface, on the peripheral surface thereof, and converting the resin film in the treatment liquid along the peripheral surface thereof by the jet flow from the holes in a non-contact manner,

the thickness of the net-like resin film is 25 μm or less,

the jet unit causes the treatment liquid supplied from a high level tank disposed at a position higher than the treatment tank to be ejected from the holes on the peripheral surface by the weight of the treatment liquid.

2. The wet processing apparatus for a resin film according to claim 1,

the jet unit is connected to the head tank via one or more pipes, and each pipe can adjust the flow rate of the treatment liquid.

3. The wet processing apparatus for a resin film according to claim 1,

a bottom discharge portion is formed near the bottom of the treatment tank, and the bottom discharge portion supplies the treatment liquid from the head tank.

4. The wet processing apparatus for a resin film according to claim 1,

a part of the peripheral surface of the jet unit has a cylindrical shape.

5. The wet processing apparatus for a resin film according to claim 4,

the holes formed in the peripheral surface of the jet unit cause the treatment liquid to be radially ejected from the jet unit.

6. The wet processing apparatus for a resin film according to claim 1,

the treatment solution is provided with a wall surface jet unit which ejects the treatment solution from a plurality of holes provided in the peripheral surface, at a position higher than the jet unit.

7. The wet processing apparatus for a resin film according to claim 6,

the plurality of holes of the wall surface jet unit are provided so as to discharge the effluent to the inner wall of the treatment tank.

8. The wet processing apparatus for a resin film according to claim 1,

a second jet portion that gives a jet flow to a surface of the resin thin film opposite to a surface of the resin thin film that receives a hydraulic pressure by the jet unit is provided in the treatment tank.

9. The wet processing apparatus for a resin film according to claim 1,

a conveyance sensor for detecting a conveyance state of the resin film being conveyed is provided in the processing tank, and the pair of conveyance members is controlled based on a signal from the conveyance sensor.

10. The wet processing apparatus for a resin film according to claim 1,

a movable member capable of changing an ejection rate of the processing liquid ejected from the jet unit in a film width direction perpendicular to a transport direction of the resin film is formed in the jet unit.

11. The wet processing apparatus for a resin film according to claim 1,

the jet flow unit has a partition wall portion for dividing the treatment liquid ejected from the jet flow unit in the film width direction.

12. The wet processing apparatus for a resin film according to claim 1,

at least one of the pair of conveying members is a conveying roller whose rotating shaft extends in the film width direction and whose axial direction is controlled to be inclined at the time of adjustment.

13. The wet processing apparatus for a resin film according to claim 1,

the resin film is conveyed in a non-contact manner by a jet flow from a conveying unit provided between a pair of the conveying members and the jet flow unit.

14. A wet processing apparatus for a resin film, which is a wet processing apparatus for performing a coating processing of a conductive metal on a surface of a net-shaped resin film having a metal ion catalyst adsorbed on the surface thereof by immersing the resin film in a predetermined processing liquid, the wet processing apparatus comprising:

a treatment tank for storing the treatment liquid therein and allowing the resin thin film to pass through the treatment liquid;

a pair of conveying members provided at positions higher than a liquid level of the treatment liquid stored in the treatment tank, respectively, on an introduction side of the resin film in the treatment tank and on a discharge side of the resin film; and

a jet unit disposed at a position lower than the conveying members between the pair of conveying members, the jet unit having a plurality of holes on a peripheral surface thereof for jetting the treatment liquid from the peripheral surface, the jet unit being configured to convert the resin film in the treatment liquid along the peripheral surface thereof in a non-contact manner by jets from the holes,

the thickness of the net-like resin film is 25 μm or less,

the jet unit causes the treatment liquid supplied from a high level tank disposed at a position higher than the treatment tank to be ejected from the holes on the peripheral surface by the weight of the treatment liquid.

15. The wet processing apparatus of a resin film according to claim 14,

the treatment liquid is an electroless metal plating liquid, and the metal film formed by the electroless metal plating liquid functions as a seed layer for forming a wet metal film.

16. The wet processing apparatus of a resin film according to claim 14,

the resin film is a polyimide film or another high heat-resistant insulating resin film.

17. The wet processing apparatus for a resin film according to claim 16,

the thickness of the polyimide film is 12.5 μm or less.

18. The wet processing apparatus of a resin film according to claim 14,

the jet flow from the holes of the jet unit is 100 liters per minute or less.

19. The wet processing apparatus of a resin film according to claim 14,

the jet flow from the holes of the jet unit is 75 liters per minute or less.

20. The wet processing apparatus of a resin film according to claim 14,

the jet flow from the holes of the jet unit is 50 liters per minute or less.