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WO2018141621A3 - Module de puissance - Google Patents

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Publication number
WO2018141621A3
WO2018141621A3 PCT/EP2018/051816 EP2018051816W WO2018141621A3 WO 2018141621 A3 WO2018141621 A3 WO 2018141621A3 EP 2018051816 W EP2018051816 W EP 2018051816W WO 2018141621 A3 WO2018141621 A3 WO 2018141621A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact piece
power module
electric component
frame
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2018/051816
Other languages
German (de)
English (en)
Other versions
WO2018141621A2 (fr
Inventor
Michael Kaspar
Kai Kriegel
Stefan Stegmeier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2018141621A2 publication Critical patent/WO2018141621A2/fr
Publication of WO2018141621A3 publication Critical patent/WO2018141621A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Le module de puissance comporte au moins un composant électrique pourvu d'une surface de contact. Le composant électrique est mis en contact électrique au moyen de la surface de contact avec au moins une pièce de contact, formée d'une matière à pores ouverts, du module de puissance et l'au moins un composant électrique et l'au moins une pièce de contact sont immobilisés au moins par complémentarité de formes l'un par rapport à l'autre au moins dans les directions d'extensions planes de l'au moins une surface de contact.
PCT/EP2018/051816 2017-02-06 2018-01-25 Module de puissance Ceased WO2018141621A2 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE102017201821 2017-02-06
DE102017201821.6 2017-02-06
DE102017001249.0 2017-02-09
DE102017001249 2017-02-09
DE102017203132.8 2017-02-27
DE102017203132.8A DE102017203132A1 (de) 2017-02-06 2017-02-27 Leistungsmodul

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Publication Number Publication Date
WO2018141621A2 WO2018141621A2 (fr) 2018-08-09
WO2018141621A3 true WO2018141621A3 (fr) 2018-10-25

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PCT/EP2018/051816 Ceased WO2018141621A2 (fr) 2017-02-06 2018-01-25 Module de puissance

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WO (1) WO2018141621A2 (fr)

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DE102019204847A1 (de) * 2019-04-04 2020-10-08 Siemens Aktiengesellschaft Vorrichtung zum Entwärmen elektrischer und/oder elektronischer Bauteile
TWI719517B (zh) * 2019-06-27 2021-02-21 立昌先進科技股份有限公司 一種貼片式單顆小尺寸及陣列型之晶片半導體元件之封裝方法
DE102020134563A1 (de) 2020-12-22 2022-06-23 Danfoss Silicon Power Gmbh Leistungsmodul und Verfahren zur Herstellung eines Leistungsmoduls
DE102021209482A1 (de) * 2021-08-30 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Elektronisches Modul mit wenigstens einem Leistungshalbleiter und Verfahren zu dessen Herstellung

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