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WO2017159611A1 - Liquide de dispersion de fines particules de cuivre, procédé de formation de film électroconducteur, et carte de circuit imprimé - Google Patents

Liquide de dispersion de fines particules de cuivre, procédé de formation de film électroconducteur, et carte de circuit imprimé Download PDF

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Publication number
WO2017159611A1
WO2017159611A1 PCT/JP2017/009960 JP2017009960W WO2017159611A1 WO 2017159611 A1 WO2017159611 A1 WO 2017159611A1 JP 2017009960 W JP2017009960 W JP 2017009960W WO 2017159611 A1 WO2017159611 A1 WO 2017159611A1
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WIPO (PCT)
Prior art keywords
copper fine
fine particles
particle dispersion
mass
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/009960
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English (en)
Japanese (ja)
Inventor
川戸祐一
南原聡
工藤富雄
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Ishihara Chemical Co Ltd
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Ishihara Chemical Co Ltd
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Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd filed Critical Ishihara Chemical Co Ltd
Publication of WO2017159611A1 publication Critical patent/WO2017159611A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • This case relates to a copper fine particle dispersion, a conductive film forming method, and a circuit board.
  • the present invention has been made in view of the above problems, and an object thereof is to provide a copper fine particle dispersion, a method for forming a conductive film, and a circuit board that can achieve both good printing characteristics and low resistance.
  • the copper fine particle dispersion according to the present invention includes a first copper fine particle having a center particle diameter of 1 nm to 100 nm, a second copper fine particle having a center particle diameter of 0.3 ⁇ m to less than 2 ⁇ m, the first copper fine particle, and the first 2.
  • the resin may contain at least one of polyvinyl pyrrolidone, polyester resin, polyvinyl alcohol, terpene phenol resin, acrylic resin, urea-modified medium polarity polyamide, modified urea, and epoxy resin.
  • the ratio of the first copper fine particles to the total mass of the first copper fine particles and the second copper fine particles may be not less than 30 mass% and not more than 70 mass%.
  • the total concentration of the first copper fine particles and the second copper fine particles with respect to the copper fine particle dispersion may be 1 mass% or more and 85 mass% or less.
  • the method for forming a conductive film according to the present invention includes forming a film of the copper fine particle dispersion on the surface of the object, drying the film, and forming the conductive film by light firing that irradiates the dried film with light.
  • a film of the copper fine particle dispersion may be formed on the object surface using a gravure offset printing method.
  • the circuit board according to the present invention is characterized in that a circuit having a conductive film formed by the above conductive film forming method is provided on the substrate.
  • the conductive film forming method and the circuit board according to the present invention both good printing characteristics and low resistance can be achieved.
  • FIG. 1 is a diagram illustrating a gravure offset printing machine 100.
  • the gravure offset printing machine 100 includes a first stage 20 on which an intaglio (gravure plate) 10 is placed, a second stage 40 on which a substrate 30 that is a printing object is placed, A transport device 50 that reciprocates the first stage 20 and the second stage 40 in a predetermined linear direction, a doctor blade 60 that can be pressed against the intaglio 10, and a blanket 70 that can be pressed against the intaglio 10 and the substrate 30. And including.
  • a copper fine particle dispersion is applied to the intaglio 10.
  • the first stage 20 is transported to the doctor blade 60 side by the transport device 50, and the doctor blade 60 is pressed against the intaglio 10 to fill the concave portions of the intaglio 10 with the copper fine particle dispersion.
  • the first stage 20 is further transported to the blanket 70 side by the transport device 50, and the blanket 70 is pressed against the intaglio 10, whereby the copper fine particle dispersion filled in the recesses of the intaglio 10 is sucked into the blanket 70. That is, the printing pattern corresponding to the concave portion of the intaglio 10 is transferred to the blanket 70.
  • the second stage 40 is transported to the blanket 70 side by the transport device 50, and the blanket 70 is pressed against the substrate 30 to form a printed pattern film on the substrate 30.
  • the coating is dried.
  • the resin, solvent and dispersant in the copper fine particle dispersion are evaporated, leaving copper fine particles.
  • the copper fine particles are fired by irradiating the dried film with light. Thereby, a conductive film is formed.
  • the copper fine particle dispersion includes a first copper fine particle having a center particle diameter of 1 nm to 100 nm, a second copper fine particle having a center particle diameter of 0.3 ⁇ m to less than 2 ⁇ m, a first copper fine particle, and a second copper fine particle.
  • each line width can be printed at once (collective printing) in the gravure offset printing method. That is, good printing characteristics can be obtained.
  • a higher resin concentration is preferable. This is because the amount of the copper fine particle dispersion sucked by the blanket can be suppressed by controlling the rheological characteristics of the copper fine particle dispersion with the resin. Furthermore, it is because the copper fine particle dispersion liquid is less likely to remain on the blanket by using a resin that is difficult to wet the blanket. Therefore, the concentration with respect to the first copper fine particles and the second copper fine particles is set to 0.05 mass% or more.
  • the resin concentration is preferably not excessively high in order to reduce the evaporation amount during the light baking and to lower the resistivity of the conductive film. Therefore, the concentration with respect to the first copper fine particles and the second copper fine particles is set to less than 8 mass%.
  • the concentration with respect to the first copper fine particles and the second copper fine particles is set to less than 8 mass%.
  • the first copper fine particles preferably have a small particle size. Furthermore, it is preferable that the particle diameter of the first copper fine particles is small in order to make a conductor by photo-firing.
  • the center particle diameter of the first copper fine particles is set to 1 nm or more and less than 100 nm.
  • the center particle diameter of the second copper fine particles is preferably sufficiently larger than that of the first copper fine particles. Therefore, the center particle diameter of the second copper fine particles is set to 0.3 ⁇ m or more. If the center particle diameter of the second copper fine particles is too large, good dispersion stability cannot be obtained. Therefore, the center particle diameter of the second copper fine particles is set to less than 2 ⁇ m.
  • the first copper fine particles those having the same center particle diameter may be used alone, or those having two or more kinds of center particle diameters may be mixed and used.
  • the second copper fine particles those having the same center particle diameter may be used alone, or those having two or more kinds of center particle diameters may be mixed and used.
  • the total concentration of the first copper fine particles and the second copper fine particles is preferably 1 mass% or more and 85 mass% or less with respect to the copper fine particle dispersion. By setting the total concentration to 1 mass% or more, a sufficient amount of copper fine particles for forming the conductive film can be obtained. By setting the total concentration to 85 mass% or less, good dispersion stability and printing characteristics of the first copper fine particles and the second copper fine particles can be obtained.
  • the ratio of the first copper fine particles to the total mass of the first copper fine particles and the second copper fine particles is preferably 30 mass% or more and 70 mass% or less.
  • the ratio of the second copper fine particles to the total mass of the first copper fine particles and the second copper fine particles is preferably 30 mass% or more and 70 mass% or less. If the ratio of the first copper fine particles to the total mass of the first copper fine particles and the second copper fine particles is less than 30 mass%, the copper fine particle dispersion may not have sufficient viscosity, and may not be used as a gravure offset ink. Because there is.
  • the ratio of the first copper fine particles to the total mass of the first copper fine particles and the second copper fine particles is larger than 70 mass%, the amount of the copper fine particle dispersion sucked into the blanket varies greatly depending on the line width. It is because there is a possibility that it cannot be done. That is, good printing characteristics may not be obtained.
  • the resin is not particularly limited, and a thermoplastic resin, a thermosetting resin, a thermally decomposable resin, and the like can be used.
  • thermoplastic resin include vinyl-based polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, vinyl chloride / vinyl acetate copolymer, polystyrene-based polystyrene, styrene / acrylonitrile copolymer, styrene / butadiene / acrylonitrile copolymer.
  • thermosetting resin examples include, but are not limited to, phenol resin, melamine resin, epoxy resin, unsaturated polyester, and silicone. Further, they may be cured by photoreaction with ultraviolet rays instead of heat.
  • degradable resin examples include polyperoxide, but are not limited thereto. These resins may be used alone or in combination of two or more.
  • the resin it is preferable to use polyvinyl pyrrolidone, polyester resin, epoxy resin, polyvinyl alcohol, terpene phenol resin, acrylic resin, urea-modified medium polar polyamide, modified urea, or the like. Since these resins are relatively high in polarity, they are easily compatible with copper fine particles and a polar dispersion medium, and are not easily compatible with a non-polar blanket. Because the resin is easily compatible with copper fine particles and polar dispersion media, the rheological properties of the copper fine particle dispersion can be changed, and by controlling the rheological properties, the amount of copper fine particle dispersion absorbed by the blanket can be suppressed. . Further, since the resin is not easily adapted to the blanket, the copper fine particle dispersion is less likely to remain on the blanket. For these reasons, these resins are considered to exhibit good printing characteristics.
  • Solvent is not particularly limited.
  • a polar dispersion medium can be used.
  • a protic dispersion medium or an aprotic dispersion medium can be used.
  • the protic dispersion medium is a linear or branched alkyl compound or alkenyl compound having one hydroxyl group and having 5 to 30 carbon atoms. This protic dispersion medium may have 1 to 10 ether bonds and may have 1 to 5 carbonyl groups.
  • By setting the carbon number to 5 or more elution (corrosion) of copper fine particles into the dispersion medium is suppressed, and good dispersion stability is obtained.
  • By setting the number of carbon atoms to 30 or less a decrease in the polarity of the dispersion medium is suppressed, and the dispersant is easily dissolved.
  • protic dispersion medium examples include 3-methoxy-3-methylbutanol, triethylene glycol monomethyl ether, triethylene glycol monobutyl ether, diethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monobutyl ether, and dipropylene.
  • the protonic dispersion medium may be a linear or branched alkyl compound or alkenyl compound having 2 to 30 hydroxyl groups and 2 to 30 carbon atoms.
  • This protic dispersion medium may have 1 to 10 ether bonds and may have 1 to 5 carbonyl groups.
  • protic dispersion medium examples include 2-methylpentane-2,4-diol, ethylene glycol, propylene glycol, 1,5-pentanediol, polyethylene glycol, triethylene glycol, glycerin, sorbitol and the like. However, it is not limited to these.
  • Examples of the aprotic polar dispersion medium having a relative dielectric constant of 30 or more include propylene carbonate, 1,3-dimethyl-2-imidazolidinone, hexamethylphosphoramide, N-methylpyrrolidone, N-ethylpyrrolidone, and nitrobenzene. , N, N-diethylformamide, N, N-dimethylacetamide, furfural, ⁇ -butyrolactone, ethylene sulfite, sulfolane, dimethyl sulfoxide, succinonitrile, ethylene carbonate and the like, but are not limited thereto. .
  • polar dispersion media may be used alone or in combination of two or more.
  • the dispersant is not particularly limited.
  • a compound having at least one acidic functional group and a molecular weight of 200 or more and 100,000 or less or a salt thereof can be used.
  • the acidic functional group of the dispersant is a functional group having acidity, that is, a proton donating property, such as a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, a sulfuric acid group, and a carboxyl group.
  • the concentration of the dispersant is, for example, 0.5 mass% or more and 50 mass% or less with respect to the copper fine particle dispersion. A sufficient dispersion effect can be obtained by setting the concentration of the dispersant to 0.5 mass% or more. By setting the concentration of the dispersant to 50 mass% or less, good printing characteristics can be obtained when the copper fine particle dispersion is used in the printing method.
  • a leveling agent, a surface conditioner, an antifoaming agent, an anticorrosive, a light baking conditioner, and the like can be appropriately added within a range not impairing the dispersion stability.
  • the dispersant has compatibility with the dispersion medium. Furthermore, when the dispersion medium is a protic dispersion medium, it has a proton donating property, so that a hydrogen bond is formed between the dispersion medium molecules and interacts with the acidic functional group of the dispersant. When the dispersion medium is an aprotic polar dispersion medium, it has no proton donating property, but has a high relative dielectric constant of 30 or more, so that the acidic functional group of the dispersant can dissociate protons (H + ).
  • the surface of the copper fine particles is covered with the dispersant molecule, it is dispersed in the dispersion medium by the electrostatic interaction between the dispersant and the dispersion medium. Since the copper fine particles have a small particle size, aggregation is prevented if the electrostatic interaction between the dispersant and the dispersion medium is large, and if the particles do not aggregate, they do not settle and the dispersion stability of the copper fine particle dispersion becomes high. .
  • the protic dispersion medium has an ether bond or a carbonyl group
  • the polarity is increased, so that the compatibility with the dispersant is increased and the dispersion stability of the copper fine particle dispersion is increased.
  • the conductive film forming method according to the present embodiment will be described with reference to FIG. 1 again.
  • the intaglio 10 for example, an intaglio in which a photosensitive resin on a glass plate is formed by exposure, development and washing, an intaglio in which a glass plate, a metal plate, a metal roll or the like is formed by chemical etching and laser etching, or the like can be used.
  • a known and commonly used intaglio can be used as the intaglio 10.
  • the blanket 70 for example, a sheet having a layer structure such as a silicone rubber layer, a PET layer, or a sponge layer can be used.
  • These sheets are used, for example, in a state of being wound around a rigid cylinder called a blanket cylinder.
  • a blanket cylinder As the substrate 30, polyimide, glass, polycarbonate, PET, PEN, cycloolefin polymer, metal plate, or the like can be used.
  • a printed pattern film is formed on the substrate 30 in accordance with the description of FIG.
  • the film is dried.
  • the resin, solvent and dispersant in the copper fine particle dispersion are evaporated, leaving copper fine particles.
  • the drying time of the film is completed in about 30 minutes in an air atmosphere at 100 ° C., for example.
  • an air flow or a nitrogen flow may be applied to the film.
  • the copper fine particles are fired by irradiating the dried film with light.
  • firing by light irradiation photo-firing
  • reduction of the surface oxide film of the copper fine particles and sintering of the copper fine particles occur.
  • the copper fine particles are melted together in the sintering and welded to the substrate 30.
  • the light baking is performed, for example, in the atmosphere and at room temperature.
  • the light source used for light baking is, for example, a xenon lamp.
  • a laser device may be used as the light source.
  • Energy range of the light irradiated from the light source for example, 0.1 J / cm 2 or more and 100 J / cm 2 or less.
  • the irradiation time is, for example, 0.1 ms or more and 100 ms or less.
  • the number of times of irradiation may be one time or multiple times of multistage irradiation.
  • the photo-fired film has conductivity. Thereby, a conductive film having a printed pattern is formed.
  • the form of the formed conductive film is a continuous film.
  • the resistivity of the conductive film is, for example, 2 ⁇ ⁇ cm to 9 ⁇ ⁇ cm.
  • the circuit board has a circuit on the board.
  • the substrate may be made of a semiconductor such as a silicon wafer.
  • the substrate may be one coated with a hard coat layer or primer layer for improving heat resistance, preventing scratches and improving optical properties.
  • the circuit has a conductive film formed by this conductive film forming method.
  • the conductive film constitutes, for example, a conductive wire that electrically connects circuit elements.
  • the conductive film may constitute a circuit element or a part thereof, for example, a coil, a capacitor electrode, or the like.
  • Example 2 In the following, experiments were conducted on printing characteristics of the copper fine particle dispersions according to the above-described embodiments (Samples 1 to 16 and Comparative Samples 1 to 6). Specifically, batch printing 1 and 2 were performed for a plurality of different line widths using the gravure offset printing method. Then, the electrically conductive film was formed by drying and light baking. In batch printing 1, a line width of 10 ⁇ m between 10 ⁇ m and 50 ⁇ m was used. In batch printing 2, a line width of 7 ⁇ m and a line width of about 10 ⁇ m between 10 ⁇ m and 100 ⁇ m were used.
  • Table 1 and Table 2 show the particle size range of the first copper fine particles.
  • Tables 1 and 2 show the center particle diameters of the second copper fine particles.
  • Tables 1 and 2 show the ratios of the second copper fine particles of the first copper fine particles to the total mass of the first copper fine particles and the second copper fine particles.
  • Tables 1 and 2 show the types of resins contained in the copper fine particle dispersion and the resin concentration (mass%) relative to the total mass of the first copper fine particles and the second copper fine particles.
  • the results of batch printing 1 and 2 are shown in Tables 1 and 2.
  • Tables 1 and 2 show the results of resistance tests of the conductive films formed by drying and light baking.
  • PVP 2500 is a reagent polyvinyl pyrrolidone having a weight average molecular weight of about 2500.
  • VYLON220 is an amorphous polyester resin (100%) manufactured by Toyobo, and has a number average molecular weight of about 3000.
  • PVP K90 is a reagent polyvinylpyrrolidone having a weight average molecular weight of about 360000.
  • PVA is a reagent polyvinyl alcohol and has a molecular weight of about 2000.
  • PSK125 is a terpene phenol resin having a weight average molecular weight of about 650, which is YS Polystar K125 manufactured by Yasuhara Chemical.
  • XZ # 7157 is Toei Kasei Acrynal, which is an acrylic resin.
  • BYK-430 is a urea-modified medium polar polyamide manufactured by Big Chemie.
  • BYK-410 is a modified urea manufactured by Big Chemie.
  • YX8100BH30 is an epoxy resin having a weight average molecular weight of about 38000 manufactured by Mitsubishi Chemical.
  • the total concentration of the first copper fine particles and the second copper fine particles in the copper fine particle dispersion is about 80 mass%. In Samples 10 and 11, the total concentration of the first copper fine particles and the second copper fine particles in the copper fine particle dispersion is about 85 mass%.
  • the other composition of the copper fine particle dispersion is as follows. Solvent: 20% by mass of ⁇ -butyrolactone and 80% by mass of tripropylene glycol monomethyl ether in the balance of the total weight of the copper fine particles and the dispersant. Dispersant: 4 mass% with respect to the total concentration of DISPERBYK-111 manufactured by Big Chemie, the first copper fine particles and the second copper fine particles.
  • a blank in the batch printing 2 column of Tables 1 and 2 indicates that only batch printing 1 is performed and batch printing 2 is not performed.
  • the numerical range in the column of batch printing 1 and 2 indicates the range of the line width at which good printing was obtained.
  • Good printing means that the copper fine particle dispersion did not remain in the blanket 70.
  • 10-50 indicates that good printing was obtained for each line width of 10 ⁇ m to 50 ⁇ m.
  • X indicates that good printing could not be obtained at any line width. The wider the line width range, the better the printing characteristics.
  • “ ⁇ ” in the resistance column of Tables 1 and 2 means that resistance on the order of ⁇ ⁇ cm was obtained by photo-baking on a polyimide Kapton 150ENA substrate manufactured by Toray DuPont.
  • Comparative Sample 1 Although good resistivity was obtained, good printing characteristics were not obtained. This is presumably because the copper fine particle dispersion did not contain a resin.
  • Comparative Sample 2 although good resistivity was obtained, good printing characteristics were not obtained. This is presumably because the copper fine particle dispersion did not contain the second copper fine particles.
  • Comparative Sample 3 although good resistivity was obtained, good printing characteristics were not obtained. This is presumably because the first copper fine particles were not included in the copper fine particle dispersion.
  • Comparative Sample 4 although good printing characteristics were obtained, the resistivity was not measured because it was blown off during light firing. This is presumably because a large amount of resin decomposed and vaporized when heat was instantaneously applied during photo-baking.
  • Comparative Sample 5 the copper fine particles could not be dispersed in the copper fine particle dispersion. This is presumably because the amount of the second copper fine particles having a large particle size has increased.
  • Comparative Sample 6 although good printing characteristics were obtained, the resistance was not lowered by light baking, and a resistance of ⁇ ⁇ cm order was not obtained. This is thought to be due to the large amount of resin that could not be decomposed by light baking and remained.
  • good printing characteristics and good resistivity were obtained in any of the samples.
  • good printing characteristics were obtained by including the second copper fine particles having a center particle size of 0.3 ⁇ m or more and less than 2 ⁇ m and the resin in the copper fine particle dispersion.
  • a favorable resistivity was obtained by setting the resin concentration with respect to the first copper fine particles and the second copper fine particles to 0.05 mass% or more and less than 8 mass%.
  • a hard coat PET (polyethylene terephthalate) base material (MKZ-GPMP manufactured by Higashiyama Film Co., Ltd.) is used, and the mesh pattern is formed by gravure offset printing so that a line having a width of 7 ⁇ m and a thickness of about 1 ⁇ m has a space interval of 300 ⁇ m. Formed.
  • the 7 ⁇ m mesh resistance in Table 3 is a value obtained by pressing a copper plate against a printed and light-fired mesh pattern so that the distance is 1 cm 2 and measuring the resistance between them with a tester.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Un liquide de dispersion de fines particules de cuivre est caractérisé en ce qu'il comprend : des premières particules fines de cuivre ayant un diamètre médian de particules de 1 à 100 nm ; des secondes particules fines de cuivre ayant un diamètre médian de particules qui est supérieur ou égal à 0,3 µm et inférieur à 2 µm ; une résine en une concentration supérieure ou égale à 0,05 % en masse et inférieure à 8 % en masse par rapport aux premières particules fines de cuivre et aux secondes particules fines de cuivre ; un solvant ; et un agent de dispersion pour disperser les premières particules fines de cuivre et les secondes particules fines de cuivre dans le solvant.
PCT/JP2017/009960 2016-03-15 2017-03-13 Liquide de dispersion de fines particules de cuivre, procédé de formation de film électroconducteur, et carte de circuit imprimé Ceased WO2017159611A1 (fr)

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JP2016050801A JP2017168248A (ja) 2016-03-15 2016-03-15 銅微粒子分散液、導電膜形成方法および回路基板
JP2016-050801 2016-03-15

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6348241B1 (ja) * 2017-02-14 2018-06-27 バンドー化学株式会社 グラビアオフセット印刷用導電性ペースト、導電性パターンの形成方法、及び、導電性基板の製造方法
WO2018150697A1 (fr) * 2017-02-14 2018-08-23 バンドー化学株式会社 Pâte conductrice pour impression offset par gravure, procédé de formation d'un motif conducteur, et procédé de fabrication d'un substrat conducteur
WO2020008693A1 (fr) * 2018-07-04 2020-01-09 石原ケミカル株式会社 Pâte de cuivre et procédé de formation de film conducteur
WO2021192523A1 (fr) * 2020-03-25 2021-09-30 石原ケミカル株式会社 Encre de cuivre et procédé de formation d'un film électro-conducteur

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WO2025239223A1 (fr) * 2024-05-15 2025-11-20 株式会社村田製作所 Composant électronique et procédé de fabrication de composant électronique

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