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WO2016123995A1 - Réfrigérateur de refroidissement à semi-conducteur - Google Patents

Réfrigérateur de refroidissement à semi-conducteur Download PDF

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Publication number
WO2016123995A1
WO2016123995A1 PCT/CN2015/091094 CN2015091094W WO2016123995A1 WO 2016123995 A1 WO2016123995 A1 WO 2016123995A1 CN 2015091094 W CN2015091094 W CN 2015091094W WO 2016123995 A1 WO2016123995 A1 WO 2016123995A1
Authority
WO
WIPO (PCT)
Prior art keywords
main
pipe
pipes
semiconductor refrigerating
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/091094
Other languages
English (en)
Chinese (zh)
Inventor
陶海波
张奎
刘建如
李鹏
李春阳
戚斐斐
姬立胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Co Ltd
Original Assignee
Qingdao Haier Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Co Ltd filed Critical Qingdao Haier Co Ltd
Priority to EP15880937.6A priority Critical patent/EP3255362B1/fr
Priority to US15/533,638 priority patent/US20170328610A1/en
Publication of WO2016123995A1 publication Critical patent/WO2016123995A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/003—General constructional features for cooling refrigerating machinery
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered

Definitions

  • the present invention relates to a refrigerator, and more particularly to a semiconductor refrigeration refrigerator.
  • the semiconductor refrigeration refrigerator also known as the thermoelectric refrigerator, utilizes the semiconductor refrigeration sheet to achieve refrigeration through high-efficiency annular double-layer heat pipe heat dissipation and conduction technology and automatic variable pressure flow control technology, eliminating the need for refrigerant and mechanical moving parts, and solving the medium pollution. And the application of traditional mechanical refrigeration refrigerators such as mechanical vibration.
  • Hot-end heat dissipation generally uses heat pipes and heat sinks to exchange heat with the surrounding environment.
  • Existing sintered heat pipes extend from one end along a single path to the other end.
  • the liquid in the wicking core evaporates and vaporizes, and the steam flows to the other end under a slight pressure difference to release heat to condense into a liquid, and the liquid flows back to the evaporation section along the porous material by the capillary force.
  • This cycle does not allow heat to pass from one end of the sintered heat pipe to the other end.
  • the existing sintered heat pipe does not achieve an ideal heat dissipation effect.
  • An object of the present invention is to overcome at least one of the drawbacks of the conventional semiconductor refrigerating refrigerator and to provide a semiconductor refrigerating refrigerator having high heat dissipation efficiency.
  • the present invention provides a semiconductor refrigerating refrigerator including a semiconductor refrigerating sheet and a hot end heat dissipating device, wherein the hot end heat dissipating device includes a plurality of sintering heat pipes, each of which has a closed end Supervisor, and each of the supervisors has:
  • a second tube section above the first tube section, extends a branching tube at one or more locations thereof to dissipate heat from the hot end of the semiconductor refrigerating sheet to the surrounding environment.
  • the first pipe segment of each of the main pipes is formed by extending a predetermined length vertically upward from the lower end of the main pipe; and the first pipe segments of the plurality of main pipes are located in the same plane in parallel intervals, The plane is parallel to the rear wall of the inner casing of the semiconductor refrigeration refrigerator.
  • the hot end heat sink further comprises: a fixed bottom plate, the front surface of which is thermally connected to the hot end of the semiconductor refrigerating sheet, the rear surface has one or more grooves; and the fixed cover plate, the front side thereof a surface having one or more grooves configured to cooperate with the fixed bottom plate to sandwich a first tube segment of each of the main tubes between a groove of the fixed cover plate and a groove of the fixed bottom plate .
  • the second pipe section of each of the main pipes is formed by extending a predetermined length vertically downward from the upper end of the main pipe; and the second pipe segments of the plurality of main pipes are located in the same plane in parallel intervals.
  • the plane is parallel to a rear wall of the inner casing of the semiconductor refrigeration refrigerator; or
  • a second pipe section of each of the main pipes is formed by extending horizontally longitudinally forward from the upper end of the main pipe by a predetermined length and then extending vertically downward by a predetermined length; and a plurality of the second pipe sections of the main pipe
  • the vertical portions are spaced apart in parallel in the same plane, the plane being parallel to the rear wall of the inner casing of the semiconductor refrigeration refrigerator; the starting end of the furcation tube of each of the sintered heat pipes is located at the vertical of the corresponding second pipe segment section.
  • each furcation tube of each of the sintered heat pipes is perpendicular to the rear wall of the inner casing.
  • the furcation tubes of each of the sintered heat pipes are located on the same side of the corresponding main tubes; or the furcation tubes of each of the sintered heat pipes are respectively located on opposite sides of the corresponding main tubes.
  • the hot end heat sink further comprises: one or two fin sets, each of the fin sets comprising a plurality of corresponding parallel spaced plate fins and passing each of the respective plate fins
  • the through-holes of the sheets are mounted to the furcation tubes on the respective sides of each of the main tubes.
  • the hot end heat dissipating device further includes: a fan disposed on a lateral side or above of the plurality of furcation tubes, configured to: draw airflow from the air inlet region thereof and to each two adjacent plate fins The gap between the sheets is blown, or the airflow is drawn from the gap between each two adjacent plate fins and blown to the air supply area thereof.
  • a fan disposed on a lateral side or above of the plurality of furcation tubes, configured to: draw airflow from the air inlet region thereof and to each two adjacent plate fins The gap between the sheets is blown, or the airflow is drawn from the gap between each two adjacent plate fins and blown to the air supply area thereof.
  • each of the plate fins is provided with a receiving through hole, so that each of the fin groups defines an receiving space extending along an axis of the receiving through hole; the hot end heat sink further Included in one or two fans, disposed in the receiving space of the respective fin group, configured to draw airflow from the air inlet region thereof and to a gap between each two adjacent plate fins of the corresponding fin group Blowing.
  • the hot end heat sink further includes: a plurality of spiral fins respectively rotatably mounted to a corresponding one of the furcation tubes; and a fan disposed on a lateral side or above the plurality of the furcation tubes So that the furcation tubes of each of the sintered heat pipes are located in the air supply area or the suction air area of the fan.
  • the semiconductor refrigerating refrigerator of the present invention since a plurality of branching tubes for heat dissipation or cooling are extended on the second pipe section of the main pipe of each sintering heat pipe, the heat dissipation or cooling efficiency is remarkably improved, so that the sintering heat pipe is particularly It is suitable for heat dissipation of a heat source having a high heat flux density such as a semiconductor refrigerating sheet, thereby further improving the energy efficiency of the semiconductor refrigerating refrigerator of the present invention.
  • FIG. 1 is a schematic right side view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention
  • FIG. 2 is a schematic structural view of a sintered heat pipe in a semiconductor refrigeration refrigerator according to an embodiment of the present invention
  • FIG. 3 is a schematic rear view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention.
  • FIG. 4 is a schematic right side view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention.
  • Figure 5 is a schematic right side view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention.
  • Figure 6 is a schematic left side view of a semiconductor refrigeration refrigerator in accordance with one embodiment of the present invention.
  • FIG. 1 is a schematic right side view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention.
  • an embodiment of the present invention provides a semiconductor refrigeration refrigerator.
  • the semiconductor refrigeration refrigerator may generally include a liner 100, a semiconductor refrigerating sheet 150, a cold end cooling device 180, and a hot end heat sink and an outer casing.
  • the semiconductor refrigerating sheet 150 may be installed between the rear wall of the inner liner 100 and the rear wall of the outer casing.
  • the cold-end cold transfer device 180 is configured to transfer the cold amount from the cold end of the semiconductor refrigerating sheet 150 to the storage compartment of the inner liner 100.
  • the cold-end cooling device 180 may include a cooling block, a cooling fin, and a cooling fan.
  • the rear surface of the cooling block is thermally connected to the cold end of the semiconductor refrigerating sheet 150, and the front surface of the cooling block is mounted on the front surface.
  • a cold fin, a cold fin and a cooling fan are installed in the air duct of the semiconductor refrigeration refrigerator to pass the cold to the storage room.
  • the hot end heat sink is configured to dissipate heat from the hot end of the semiconductor fin 25 to ambient air.
  • the hot end heat sink can include a plurality of sintered heat pipes 200, each having a main tube 210 that is closed at both ends.
  • Each main pipe 210 can have a first pipe section 211 and a second pipe section 212 located above the first pipe section 211.
  • the first tube segment 211 is thermally coupled to the hot end of the semiconductor refrigerating sheet 150.
  • a furcation tube 220 is extended at one or more portions of the second tube section 212 to dissipate heat from the hot end of the semiconductor refrigerating sheet 150 to the surrounding environment, which significantly improves the heat dissipation efficiency of the semiconductor refrigerating refrigerator.
  • each furcation tube 220 can be in communication with the working chamber of the respective main tube 210 to facilitate the flow of steam within the sintered heat pipe 200.
  • the wick in each furcation tube 220 is connected to the wick in the main tube 210.
  • the wick in each furcation tube 220 and the wick in the main tube 210 are in close contact with the inner wall of the corresponding tube to facilitate the flow of the working liquid.
  • the diameter of each furcation tube 220 may be equal to the diameter of the main tube 210. In some alternative embodiments of the invention, each furcation tube The diameter of 220 can also be less than the diameter of the main tube 210.
  • the first pipe section 211 of each main pipe 210 is formed by extending a predetermined length vertically upward from the lower end of the main pipe 210; and the first pipe sections 211 of the plurality of main pipes 210 are located at the same interval in parallel In the plane, the plane is parallel to the rear wall of the inner liner 100 of the semiconductor refrigeration refrigerator.
  • the hot end heat sink of the semiconductor refrigerating sheet 150 further includes a fixed bottom plate 310 and a fixed cover plate 320.
  • the fixed bottom plate 310 has one or more recesses on the rear surface thereof; its front surface can abut against the hot end of the semiconductor refrigerating sheet 150 to be thermally connected to the hot end of the semiconductor refrigerating sheet 150, or through the heat transfer block and the semiconductor cooling The hot end of the sheet 150 is thermally connected.
  • the front cover 320 also has one or more recesses on the front surface thereof, configured to cooperate with the fixed bottom plate 310 to sandwich the first pipe section 211 of each main pipe 210 to the recess of the fixed cover plate 320 and the fixed bottom plate 310. Between the grooves. After the fixed bottom plate 310 and the fixed cover plate 320 are clamped to the sintering heat pipe 200, the three are firmly fixed together by a welding process or a mechanical extrusion process for effective heat transfer, usually in the sintering heat pipe 200 and the fixed bottom plate 310/fixed cover plate 320. Apply thermal grease or the like to the contact surface.
  • the second pipe section 212 of each main pipe 210 is formed by extending horizontally longitudinally forward from the upper end of the main pipe 210 by a predetermined length and then extending vertically downward by a predetermined length; and
  • the vertical portions 2121 of the second tube section 212 are spaced apart in parallel in the same plane that is parallel to the rear wall of the inner liner 100 of the semiconductor refrigeration refrigerator. That is, the second pipe section 212 of each main pipe 210 may include a vertical portion 2121 whose lower end is in communication with the corresponding first pipe section 211 and an end extending from the upper end of the vertical portion 2121 in a direction perpendicular to the vertical portion 2121.
  • a closed horizontal portion 2122 is formed by extending horizontally longitudinally forward from the upper end of the main pipe 210 by a predetermined length and then extending vertically downward by a predetermined length; and
  • the vertical portions 2121 of the second tube section 212 are spaced apart in parallel in the same plane that is parallel to the rear wall of the inner liner 100 of the semiconductor
  • the starting end of the furcation tube 220 of each of the sintered heat pipes 200 is located at the vertical portion 2121. of the respective second pipe section 212.
  • the projection of the furcation tube 220 of each sintering heat pipe 200 in a plane perpendicular to the corresponding vertical portion 2121 coincides with the projection of the corresponding horizontal portion 2122 in the plane, which can also be understood as the meaning of each sintering heat pipe 200.
  • the furcation tubes 220 are all located on the same side of the respective main tube 210.
  • each main pipe 210 further includes a connecting pipe section connected between the first pipe section 211 and the second pipe section 212. 213, which is disposed at an angle of 100 to 170 with both the first pipe section 211 and the vertical portion 2121 of the second pipe section 212.
  • the hot-end heat dissipating device of the embodiment of the present invention may include four sintering heat pipes 200.
  • the main pipes 210 of the four sintering heat pipes 200 are symmetrically in the same plane with respect to a geometric symmetry plane, and one sintering heat pipe 200 located on the same side of the geometric symmetry plane.
  • the length of the connecting pipe section 213 is smaller than the length of the connecting pipe section 213 of the other sintering heat pipe 200 to facilitate the rational layout of the four sintering heat pipes 200.
  • the number of the branching tubes 220 of each of the sintered heat pipes 200 may be one.
  • each of the furcation tubes 220 of each of the sintered heat pipes 200 is perpendicular to the rear wall of the inner liner 100.
  • the hot end heat sink further includes a fin set 400, the fin set 400 includes a plurality of corresponding parallel fins arranged in parallel, and is mounted to each of the main tubes 210 through the through holes of each of the plate fins.
  • the fin set 400 can also be mounted to the horizontal portion 2122 of the second tube section 212 of each main tube 210 through the through-hole of each plate fin.
  • the central portion of each of the plate fins is provided with a receiving through hole such that each of the fin sets 400 defines an accommodation space extending along an axis of the receiving through hole.
  • the hot end heat sink further includes a fan 500 disposed in the receiving space of the respective fin set 400, configured to draw airflow from its inlet region and to a gap between each two adjacent plate fins of the respective fin set 400 Blowing.
  • the fan 500 may be a centrifugal fan whose axis of rotation coincides with the axis of each of the receiving through holes to draw airflow from the axial direction of the centrifugal fan and use centrifugal force to direct the airflow to each of the two adjacent plate fins.
  • Each plate fin can be rectangular.
  • each main pipe 210 is formed by extending a predetermined length vertically downward from the upper end of the main pipe 210; and the second pipe sections 212 of the plurality of main pipes 210 are parallel to each other in the same plane. This plane is parallel to the rear wall of the inner liner 100 of the semiconductor refrigeration refrigerator.
  • the furcation tubes 220 of each of the sintered heat pipes 200 are respectively located on opposite sides of the respective main pipes 210.
  • the hot end heat sink further includes two fin sets 400 and a fan 500, each fin set 400 including a plurality of corresponding parallel spaced plate fins and mounted through the perforation holes of each of the plate fins
  • the furcation tube 220 on the corresponding side of each main tube 210.
  • the fan 500 may be disposed on one side or above the lateral side of the plurality of furcation tubes 220, configured to: draw airflow from the air inlet region thereof and to each The gap between two adjacent plate fins is blown, or the airflow is drawn from the gap between each two adjacent plate fins and blown to the air supply area thereof.
  • the fan 500 is an axial fan that is fixed to the two fin sets 400 and is located above the two fin sets 400.
  • FIG. 5 is a schematic right side view of a semiconductor refrigeration refrigerator in accordance with one embodiment of the present invention.
  • each of the furcation tubes 220 of each of the sintered heat pipes 200 is perpendicular to the rear wall of the inner liner 100.
  • the furcation pipes 220 of each of the sintering heat pipes 200 are located on the same side of the respective main pipes 210; or the furcation pipes 220 of each of the sintering heat pipes 200 are respectively located on opposite sides of the respective main pipes 210.
  • the hot end heat sink further includes a plurality of spiral fins 450 and a fan 500. A plurality of spiral fins 450 are spirally mounted to a respective furcation tube 220, respectively.
  • the fan 500 is disposed on one side or above the lateral side of the plurality of furcation tubes 220 such that the furcation tubes 220 of each of the sintering heat pipes 200 are located in the air supply area or the suction air area of the fan 500.
  • the fan 500 can be an axial fan located on a lateral side of the plurality of furcation tubes 220.
  • each of the branching tubes 220 of each of the sintering heat pipes 200 and the branching tubes 220 of the other sintering heat pipes 200 are independent from each other, in order to avoid deformation of the sintering heat pipes 200 and the spiral fins 450, transportation is avoided.
  • the hot end heat sink further comprising one and/or two retaining members 600, one of which is retained The pieces 600 may be sequentially secured to the ends of the second tube section 212 of a respective main tube 210 that are remote from the respective first tube section 211 at different locations along its length.
  • the other retaining members 600 may be sequentially secured to the ends of the second tubular section 212 of a respective main tube 210 adjacent the respective first tubular section 211 at different locations along its length.
  • the retaining member 600 can be a retaining steel strip, a retaining steel wire, a retaining tubular member, or the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

La présente invention concerne un réfrigérateur de refroidissement à semi-conducteur comprenant une plaque de refroidissement à semi-conducteur (150) et un appareil de dissipation de chaleur côté chaud. L'appareil de dissipation de chaleur côté chaud peut comprendre de multiples tubes de chauffe frittés (200). Chaque tuyau de chauffe fritté (200) est doté d'un tuyau principal (210) fermé aux deux extrémités. Chaque tuyau principal (210) est doté d'une première section de tuyau (211) thermiquement connectée au côté chaud de la plaque de refroidissement à semi-conducteur (150), d'une seconde section de tuyau (212) placée au-dessus de la première section de tuyau (211), et d'un tuyau de dérivation (220) s'étendant d'une partie ou de chacune d'une pluralité de parties de la seconde section de tuyau (212) pour dissiper la chaleur provenant du côté chaud de la plaque de refroidissement à semi-conducteur (150) vers le milieu environnant. Dans le réfrigérateur de refroidissement à semi-conducteur, comme les multiples tuyaux de dérivation (220), utilisés pour la dissipation de chaleur ou le transfert de réfrigération, s'étendent depuis la seconde section de tuyau (212) du tuyau principal (210) de chaque tuyau de chauffe fritté (200), l'efficacité de la dissipation de chaleur ou du transfert de réfrigération augmente de façon significative, rendant ainsi les tuyaux frittés particulièrement bien adaptés à la dissipation de chaleur pour des sources de chaleur à flux de chaleur élevé, telles que la plaque de refroidissement à semi-conducteur, et permettant en outre de fournir au réfrigérateur de refroidissement à semi-conducteur une efficacité énergétique renforcée.
PCT/CN2015/091094 2015-02-03 2015-09-29 Réfrigérateur de refroidissement à semi-conducteur Ceased WO2016123995A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP15880937.6A EP3255362B1 (fr) 2015-02-03 2015-09-29 Réfrigérateur de refroidissement à semi-conducteur
US15/533,638 US20170328610A1 (en) 2015-02-03 2015-09-29 Semiconductor refrigerator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510055838.5 2015-02-03
CN201510055838.5A CN104729182B (zh) 2015-02-03 2015-02-03 半导体制冷冰箱

Publications (1)

Publication Number Publication Date
WO2016123995A1 true WO2016123995A1 (fr) 2016-08-11

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US (1) US20170328610A1 (fr)
EP (1) EP3255362B1 (fr)
CN (1) CN104729182B (fr)
WO (1) WO2016123995A1 (fr)

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CN104729182B (zh) * 2015-02-03 2016-11-23 青岛海尔股份有限公司 半导体制冷冰箱
WO2018183731A1 (fr) * 2017-03-29 2018-10-04 Rockwell Collins, Inc. Unité cuisine-bar refroidie par liquide
JP6640401B1 (ja) * 2019-04-18 2020-02-05 古河電気工業株式会社 ヒートシンク
CN112856615B (zh) * 2021-01-07 2022-06-24 施斌卿 除湿机防结冰控制方法及除湿机
CN115164493B (zh) * 2022-07-15 2024-11-01 青岛海容商用冷链股份有限公司 风冷式半导体冷冻柜及其控制方法
CN117073293A (zh) * 2023-08-28 2023-11-17 浙江汉恒热电科技有限公司 通风式热电温控装置及具备该装置的抽屉式车载冷暖箱

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EP3255362B1 (fr) 2019-11-13
EP3255362A4 (fr) 2018-08-29
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CN104729182B (zh) 2016-11-23
US20170328610A1 (en) 2017-11-16

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