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WO2016173231A1 - Dispositif d'échange de chaleur et système de réfrigération à semi-conducteurs ayant le dispositif d'échange de chaleur - Google Patents

Dispositif d'échange de chaleur et système de réfrigération à semi-conducteurs ayant le dispositif d'échange de chaleur Download PDF

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Publication number
WO2016173231A1
WO2016173231A1 PCT/CN2015/093660 CN2015093660W WO2016173231A1 WO 2016173231 A1 WO2016173231 A1 WO 2016173231A1 CN 2015093660 W CN2015093660 W CN 2015093660W WO 2016173231 A1 WO2016173231 A1 WO 2016173231A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat exchange
transfer substrate
heat transfer
exchange device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/093660
Other languages
English (en)
Chinese (zh)
Inventor
王定远
唐林强
高希成
张立臣
肖长亮
李鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Special Refrigerator Co Ltd
Qingdao Haier Co Ltd
Qingdao Haier Smart Technology R&D Co Ltd
Original Assignee
Qingdao Haier Special Refrigerator Co Ltd
Qingdao Haier Co Ltd
Qingdao Haier Smart Technology R&D Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Special Refrigerator Co Ltd, Qingdao Haier Co Ltd, Qingdao Haier Smart Technology R&D Co Ltd filed Critical Qingdao Haier Special Refrigerator Co Ltd
Publication of WO2016173231A1 publication Critical patent/WO2016173231A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid

Definitions

  • the present invention relates to heat exchange technology, and more particularly to a heat exchange device and a semiconductor refrigeration device having the same.
  • semiconductor refrigeration equipment has been widely used due to its superior performance, such as semiconductor refrigeration refrigerators, semiconductor refrigeration freezers, and the like.
  • the semiconductor refrigeration equipment utilizes the automatic variable pressure and variable current control technology of the semiconductor refrigeration chip to realize the cooling, and realizes heat dissipation through the heat pipe and the conduction technology, and does not require the refrigerant working medium and the mechanical moving parts. Therefore, semiconductor refrigeration equipment does not have a series of problems in the application of traditional mechanical refrigeration equipment such as working fluid pollution and mechanical vibration.
  • a heat dissipation method in the prior art is to dispose a heat dissipation substrate on the hot end of the semiconductor refrigeration chip for heat dissipation, and a plurality of heat pipes are embedded in the heat dissipation substrate, and the ends of the plurality of heat pipes are disposed in the heat exchange fins to Natural heat dissipation through the heat exchange fins.
  • a further object of the first aspect of the invention is to increase the heat exchange efficiency of the heat exchange device.
  • Still another object of the first aspect of the present invention is to improve the uniformity of heat exchange of the heat exchange device.
  • a heat exchange device comprising:
  • a heat transfer substrate having a heat exchange surface thermally coupled to the heat source to receive heat from the heat source
  • At least one heat pipe having an intermediate section thermally coupled to the heat transfer substrate and two end sections respectively extending from both ends of the intermediate section along a length of the heat transfer substrate;
  • a fan is disposed on the heat transfer substrate to drive the airflow toward the heat exchange fins.
  • a spacing between adjacent ones of the plurality of heat exchange fins is greater than a predetermined minimum spacing threshold.
  • a venting hole is formed in the sheet body of each of the heat exchange fins, and the venting holes of the adjacent two heat exchange fins are opposite to each other.
  • the plurality of heat exchange fins are distributed at two ends of the heat transfer substrate to form two independent heat exchange fin modules, and the fan is configured to face the two heat exchange fins simultaneously The module module blows airflow.
  • the heat exchange device further includes:
  • At least one other heat transfer substrate, the heat transfer substrate and the at least one other heat transfer substrate are juxtaposed and spaced apart in a space between the two heat exchange fin modules, the heat transfer substrate and the One of the fans is disposed on at least one of the other heat transfer substrates.
  • At least one of the heat pipes is disposed on the heat transfer substrate and the at least one other heat transfer substrate, and the heat pipes in the heat transfer substrate and the at least one other heat transfer substrate share the plurality of heat pipes Heat exchange fins.
  • the at least one other heat transfer substrate comprises one of the other heat transfer substrates
  • One of the end sections of at least one of the heat pipes of the heat transfer substrate is located between two end sections of at least one of the other heat transfer substrates; at least one of the other heat transfer substrates One of the end sections of the heat pipe is located between the two end sections of at least one of the heat transfer substrates.
  • each heat exchange fin module is divided into upper and lower portions, and the heat pipe end portions penetrating in each portion are arranged to be arranged at equal intervals along the length direction of the heat exchange fins.
  • the fan includes an axial fan for driving airflow toward the heat exchange fins and a casing fixed to the heat transfer substrate to accommodate the axial fan.
  • a semiconductor refrigeration apparatus comprising:
  • a cabinet having a storage compartment for storing articles therein;
  • a semiconductor refrigerating sheet having a cold end thermally coupled to the storage compartment to provide a cooling capacity to the storage compartment;
  • the heat exchange surface of the heat transfer substrate is thermally connected to the hot end of the semiconductor refrigeration chip to dissipate heat generated by the hot end.
  • the heat exchange device of the present invention can blow airflow to the heat exchange fins located at the end of the heat transfer substrate by providing a fan on the heat transfer substrate, increasing the air flow of the heat exchange fins and increasing the air flowing through the heat exchange fins.
  • the flow rate is used to force the convection heat exchange between the air and the heat exchange fins to improve the heat exchange efficiency of the heat exchange device.
  • the heat exchange capacity of the heat exchange device is small, the natural heat exchange can be performed only by the heat exchange fins, so that the heat exchange device can flexibly select the heat exchange mode and improve the working performance.
  • the venting holes are formed in the sheet of the heat exchange fin, and the venting holes of the adjacent two heat exchange fins are opposite each other, so that the air can pass through the heat exchange fins.
  • the circulation of the ventilating holes enhances the heat exchange capacity of the heat exchange fins, thereby improving the heat exchange efficiency of the heat exchange device.
  • the spacing between adjacent two heat exchange fins is greater than a predetermined minimum spacing threshold, which ensures sufficient contact between each heat exchange fin and the air, further enhancing the exchange
  • the heat exchange capacity of the heat fins improves the heat exchange efficiency of the heat exchange device.
  • a plurality of heat exchange fins are distributed at both ends of the heat transfer substrate, and two independent heat exchange fin modules are formed, so that heat in the heat transfer substrate can pass
  • the heat pipe is evenly distributed to the two heat exchange fin modules, which improves the uniformity of heat exchange of the heat exchange device.
  • FIG. 1 is a schematic structural view of a heat exchange device according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a heat transfer substrate of a heat exchange device according to an embodiment of the present invention
  • Figure 3 is a schematic structural view of a heat exchange device according to another embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a heat pipe of a heat exchange device according to an embodiment of the present invention.
  • the heat exchange device 100 includes a heat transfer substrate 11, at least one heat pipe, and a plurality of heat exchange fins 30.
  • the heat transfer substrate 11 has a heat exchange surface that is thermally coupled to a heat source to receive heat from the heat source.
  • the heat pipes each have an intermediate section connected to the heat transfer substrate 11 and two end sections each extending from the both ends of the intermediate section along the length direction of the heat transfer substrate 11.
  • a plurality of heat exchange fins 30 are disposed on the end section of the heat pipe to disperse The heat transferred from the intermediate section to the end section.
  • the heat transfer substrate 11 is further provided with a fan 112 to drive the airflow toward the plurality of heat exchange fins 30, thereby forcibly convective heat exchange between the air and the plurality of heat exchange fins 30, thereby improving heat exchange efficiency.
  • the heat exchange device 100 in the embodiment of the present invention can increase the air flow amount of the heat exchange fins 30 and increase the air flow rate flowing through the heat exchange fins 30 by the fan 112 to force the air and the heat exchange fins 30.
  • the convective heat transfer improves the heat exchange efficiency of the heat exchange device 100.
  • the heat exchange amount of the heat exchange device 100 is small, the natural heat exchange can be performed only by the heat exchange fins 30, so that the heat exchange device 100 can flexibly select the heat exchange mode and improve the work performance.
  • the venting holes 31 are formed in the sheets of each of the heat exchange fins 30, and the venting holes of the adjacent two heat exchange fins 30 are opposed to each other.
  • a plurality of vent holes 31 may be formed in each of the heat exchange fins 30, and the vent holes at the same position of the adjacent two heat exchange fins 30 are opposed to each other. That is to say, the vent holes of the plurality of heat exchange fins 30 at the same position are located on the same straight line, so that the air flows through the vent holes of the plurality of heat exchange fins 30, and the heat exchange capability of the heat exchange fins 30 is enhanced. Thereby, the heat exchange efficiency of the heat exchange device 100 is improved.
  • the heat exchange fins 30 may extend along the width direction of the heat transfer substrate 11 and be in a plane perpendicular to the heat exchange surface of the heat transfer substrate 11, so that the vent holes in the plurality of heat exchange fins 30 are located along the pass.
  • the heat substrate 11 is in a longitudinal direction and parallel to the heat exchange surface, so that the fan disposed on the heat transfer substrate 11 blows airflow along the vent hole 31 to the heat exchange fins 30, thereby increasing the flow velocity of the airflow, facilitating air and air. Forced convection heat transfer between the heat exchange fins 30.
  • the spacing between adjacent ones of the plurality of heat exchange fins is greater than a predetermined minimum spacing threshold. That is, two of the plurality of heat exchange fins 30 are disposed at a distance apart to form a predetermined gap between the adjacent two heat exchange fins.
  • the predetermined minimum spacing threshold is preferably 10 to 20 mm.
  • FIG. 2 is a schematic structural view of a heat transfer substrate of a heat exchange device according to an embodiment of the present invention.
  • the structure and working principle of the fan 112 and the other fan 122 are the same.
  • the fan 112 is disposed on the surface 111 of the heat transfer substrate 11 facing away from the heat exchange surface thereof.
  • the fan 112 may include an axial flow fan 1121 for driving the airflow toward the heat exchange fins 30 and a casing 1122 fixed to the heat transfer substrate 11 to accommodate the axial flow fan 1121, and the casing 1122 is fastened by screws or the like.
  • the piece is secured to a leg 114 that projects from the surface 111.
  • At least one of the through holes 113 extending through the width direction thereof may be disposed in the heat transfer substrate 11, and at least a portion of the intermediate portion of the at least one heat pipe is embedded in the through hole 113.
  • the heat exchange device 100 includes a plurality of heat pipes, and the heat transfer substrate 11 A plurality of perforations extending through the width direction thereof may be provided therein for a plurality of heat pipes to be embedded therein. In some embodiments of the invention, the plurality of perforations may be disposed adjacent to one another.
  • the plurality of perforations are arranged at equal intervals, on the one hand, the heat pipes can be conveniently arranged, and on the other hand, the heat in the heat transfer substrate 11 can be uniformly transmitted to the plurality of heat pipes.
  • the size of the perforations can be matched to the outer diameter of the heat pipe to bring the outer surface of the heat pipe into intimate contact with the heat transfer substrate located in the perforation after the heat pipe is embedded in the perforation, thereby enabling efficient heat transfer.
  • the heat transfer substrate 11 may include two combined portions, which are an upper substrate 11a having a surface 111 and a lower substrate 11b having a heat exchange surface, respectively.
  • the two opposite surfaces of the upper substrate 11a and the lower substrate 11b are respectively provided with correspondingly sized grooves.
  • the grooves on the opposite surfaces of the two are combined to form heat.
  • a card slot extending through the width direction of the heat transfer substrate 11 may be formed on the heat exchange surface of the heat transfer substrate 11 to allow the heat pipe to be embedded therein.
  • the card slot is sized such that the heat pipe can be snap-fitted therein by an external force and the heat pipe is kept from being automatically disengaged from the card slot.
  • a plurality of heat exchange fins 30 are distributed at both ends of the heat transfer substrate 11 to form two independent heat exchange fin modules, thereby increasing the exchange.
  • the array area of the heat fins ensures effective natural heat dissipation.
  • the heat exchange device 100 includes at least two heat pipes, whereby at least two heat pipes embedded in the heat transfer substrate 11 can be divided into two groups extending along the longitudinal direction of the heat transfer substrate 11 toward the ends of the heat transfer substrate 11 respectively. Heat pipe.
  • the end sections of each set of heat pipes are disposed in the heat exchange fin modules located at the respective ends of the heat transfer substrate 11, thereby facilitating the arrangement and installation of at least two heat pipes, and also making full use of the two exchanges Heat exchange space between the heat fin modules.
  • At least two heat pipes can be interlaced and disposed in a heat exchange space between the two heat exchange fin modules, and the heat exchange space is filled in an irregular or regular form, thereby effectively utilizing the heat exchange. Space increases heat transfer and reduces the number of heat pipes.
  • the heat exchange device 100 further includes at least one other heat transfer substrate, and the heat transfer substrate 11 and the at least one other heat transfer substrate are juxtaposed and spaced apart at the two heat exchange fins.
  • a fan is disposed on the heat transfer substrate 11 and at least one other heat transfer substrate.
  • at least one heat pipe is disposed on the heat transfer substrate 11 and the at least one other heat transfer substrate, and the heat transfer substrate 11 and the heat pipes in the at least one other heat transfer substrate share the plurality of heat exchange fins 30.
  • the heat exchange device 100 further includes one other heat transfer substrate 12, and the other heat transfer substrate 12 is provided with other fans 122.
  • the other heat transfer substrate 12 and the heat transfer substrate 11 are aligned in the longitudinal direction and the width direction.
  • the heat transfer substrate 11 and the other heat transfer substrates 12 are arranged side by side in the width direction of the heat transfer substrate 11 at a predetermined distance.
  • At least one end section of the heat pipe embedded in the heat transfer substrate 11 is located between at least two end sections of the heat pipe embedded in the other heat transfer substrate 12. That is, the heat pipe embedded in the heat transfer substrate 11 and at least a portion of the heat pipes embedded in the other heat transfer substrate 12 are interleaved and disposed in a heat exchange space between the two heat exchange fin modules.
  • the heat transfer substrate 11 is provided with a first heat pipe 21, and the other heat transfer substrate 12 is provided with a second heat pipe 22.
  • the end section 212 of the first heat pipe 21 is located between the end section 222 of the second heat pipe 22 and the other end section 223, and the end section 222 of the second heat pipe 22 is located at the end zone of the first heat pipe 21. Between the segment 212 and the other end segment 213.
  • each heat exchange fin module is divided into upper and lower portions, and the end portions of the heat pipes passing through each portion are disposed along the heat exchange fins.
  • the length directions are arranged at equal intervals. That is to say, the end portion of the heat pipe can divide each portion of each heat exchange fin module into equal length portions along its length direction, so that the heat of the end portion of the heat pipe is uniformly transmitted to the heat exchange tube.
  • Hot fins That is, the heat received by the heat exchange fins is more uniform, which facilitates more uniform heat exchange and improves heat exchange efficiency.
  • the upper part of the heat exchange fins of the two heat exchange fin modules are located at the left and right ends of the heat transfer substrate 11, and the lower heat exchange fins of the two heat exchange fin modules are located on the other heat transfer substrate 12 Left and right ends.
  • the first heat pipe 21 and the second heat pipe 22 may each have a substantially U shape such that the two end sections of each heat pipe extend in parallel from the opposite ends of the middle section thereof in the same direction.
  • the two end sections of each heat pipe are disposed in the same heat exchange fin module.
  • the end section 212 and the other end section 213 of the first heat pipe 21 are directed from the opposite ends of the intermediate section 211 toward the same end of the heat transfer substrate 11 along the length of the heat transfer substrate 11.
  • the right end of the state shown in Figure 1 extends such that both the end section 212 and the other end section 213 are threaded into the heat exchange fin module at the end.
  • the first heat pipe 21 and the second heat pipe 22 may each be substantially Z-shaped. That is, the two end sections of each heat pipe are respectively extended from the two ends of the intermediate section along the length direction of the heat transfer substrate 11 toward the two different ends of the heat transfer substrate 11, thereby making each heat pipe Two end sections are respectively disposed at both ends of the heat transfer substrate 11 In the two heat exchange fin modules.
  • the first heat pipe 21 may be substantially U-shaped
  • the second heat pipe 22 may be substantially Z-shaped
  • the first heat pipe 21 and the second heat pipe 22 are interleaved.
  • the intermediate section 211 of the first heat pipe 21 has a first linear subsection 2111 and a second straight line which are sequentially connected in the width direction of the heat transfer substrate.
  • the first linear subsection 2111, the second linear subsection 2112, and the third linear subsection 2113 may be located on the same straight line, or may be located on different straight lines, or may be adjacent two sub-segments.
  • the segments are located on two straight lines with a certain angle.
  • the lengths of the first linear subsection 2111, the second linear subsection 2112, and the third linear subsection 2113 may be equal or unequal.
  • the present invention also provides a semiconductor refrigeration apparatus including a case, a semiconductor refrigerating sheet, and a heat exchange device 100.
  • a storage compartment for storing items is defined within the cabinet.
  • the cold end of the semiconductor refrigerating sheet is thermally coupled to the storage compartment to provide refrigeration for the storage compartment.
  • the heat exchange surface of the heat transfer substrate 11 of the heat exchange device 100 is thermally connected to the hot end of the semiconductor refrigerating sheet to dissipate the heat generated by the hot end.
  • the cold end of the semiconductor refrigerating sheet may abut against the inner or outer wall of the storage compartment, and the hot end of the semiconductor refrigerating sheet may abut the heat exchange surface of the heat transfer substrate 11.
  • the side of the heat transfer substrate 11 facing the heat exchange surface is provided with a screw fixing hole for fixing the hot end of the semiconductor refrigerating sheet to ensure reliable thermal connection of the hot end to the heat exchange device 100.
  • the heat exchange device 100 may be a heat sink device. In other embodiments of the present invention, the heat exchanger device 100 may also be a heat sink device.
  • the semiconductor refrigeration device involved in the embodiments of the present invention may be a refrigerator, a freezer, a refrigerated refrigerating can or other device that uses a semiconductor refrigeration sheet for cooling.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif (100) d'échange de chaleur et un système de réfrigération à semi-conducteurs comportant le dispositif (100) d'échange de chaleur. Le dispositif (100) d'échange de chaleur comprend un substrat (11, 12) de transfert de chaleur, au moins un caloduc (21, 22) et une pluralité d'ailettes (30) d'échange de chaleur. Le caloduc (21, 22) présente un segment intermédiaire (211) relié thermiquement au substrat (11, 12) de transfert de chaleur et deux segments d'extrémité (212, 213) s'étendant respectivement à partir des deux extrémités du segment intermédiaire (211) dans le sens de la longueur du substrat (11, 12) de transfert de chaleur. La pluralité d'ailettes (30) d'échange de chaleur sont disposées sur les segments d'extrémité (212, 213) du caloduc (21, 22) afin de dissiper la chaleur transférée du segment intermédiaire (211) aux segments d'extrémité (212, 213). Un ventilateur (112, 122) est disposé sur le substrat (11, 12) de transfert de chaleur afin de faire couler un flux d'air vers les ailettes (30) d'échange de chaleur, de manière à ce que l'échange de chaleur à convection forcée entre les ailettes (30) d'échange de chaleur et l'air et l'échange de chaleur naturel des ailettes (30) d'échange de chaleur soient combinés afin d'améliorer l'efficacité d'échange de chaleur du dispositif (100) d'échange de chaleur. L'invention concerne en outre un système de réfrigération à semi-conducteurs comprenant un corps de boîtier délimité par un compartiment de stockage, une plaque de réfrigération à semi-conducteurs et le dispositif (100) d'échange de chaleur relié thermiquement à une extrémité chaude de la plaque de réfrigération à semi-conducteurs.
PCT/CN2015/093660 2015-04-30 2015-11-03 Dispositif d'échange de chaleur et système de réfrigération à semi-conducteurs ayant le dispositif d'échange de chaleur Ceased WO2016173231A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510219598.8A CN106197099A (zh) 2015-04-30 2015-04-30 换热装置及具有该换热装置的半导体制冷设备
CN201510219598.8 2015-04-30

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CN115264938A (zh) * 2022-06-27 2022-11-01 青岛海尔空调器有限总公司 用于空调器的换热组件以及具有其的空调器

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CN107172854B (zh) * 2017-05-17 2019-04-02 南京林业大学 基于板翅式热管散热器的车载集成控制器冷却系统
CN111326649B (zh) * 2018-12-17 2024-01-19 青岛海尔智能技术研发有限公司 翅片散热器及制冷柜机
CN110749122A (zh) * 2019-10-10 2020-02-04 青岛海尔智能技术研发有限公司 散热器和制冷设备
CN110749123A (zh) * 2019-10-10 2020-02-04 青岛海尔智能技术研发有限公司 散热器和制冷设备
CN115264592A (zh) * 2022-06-27 2022-11-01 青岛海尔空调器有限总公司 空调器室内机及其控制方法

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US20150075184A1 (en) * 2013-09-16 2015-03-19 Phononic Devices, Inc. Enhanced heat transport systems for cooling chambers and surfaces
CN204134455U (zh) * 2014-07-24 2015-02-04 青岛海尔洗衣机有限公司 除湿装置
CN204612555U (zh) * 2015-04-30 2015-09-02 青岛海尔智能技术研发有限公司 换热装置及具有该换热装置的半导体制冷设备

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